The following relates to the lighting arts. It finds application for example in general illumination, accent lighting, architectural lighting, and so forth.
The combination of light emitting diode (LED) devices with wavelength-converting phosphor has well understood advantages. LED devices generally emit light over a relatively narrow spectral range, which is not suitable for typical illumination applications. By coupling LED devices with wavelength converting phosphor, light of broader spectrum can be generated, including various spectrums corresponding to white light.
However, it has also been recognized that a difficulty with this combination is that the phosphor can degrade over time. Phosphor degradation has been observed in various LED/phosphor combinations, and is particularly problematic in white devices that combine an LED emitting in the blue, violet, or ultraviolet range with a white phosphor composition. Phosphor degradation typically results from heating. A known solution is to place the phosphor remotely from the LED die. An example of such a device is set forth in U.S. Pat. No. 7,224,000.
Remotely positioned phosphor address the problem of heat-induced phosphor degradation. Additionally, for most applications the arrangement has the further advantage of spreading out the illumination over the area of the remote phosphor, so as to provide wide angle illumination.
For some applications, however, narrow angle illumination is desired. Such applications include, for example, accent lighting intended to “wash” a wall with light, lighting intended to track a walkway, formation of a free-standing planar “wall” of light, or so forth. Existing LED/phosphor combinations are generally not well-suited for such applications. For example, providing a linear array of phosphor coated LEDs or of LED/remote phosphor combinational elements such as those disclosed in U.S. Pat. No. 7,224,000 would provide a linear light source, but one which emits illumination over a relatively broad angular range.
In accordance with certain illustrative embodiments shown and described as examples herein, an illumination apparatus is disclosed, comprising: a linear array of light emitting diode (LED) chips; an elongate phosphor element parallel with and spaced apart from the linear array of LED chips, the linear array of LED chips being optically coupled with the elongate phosphor element to optically energize the elongate phosphor element to emit wavelength-converted light; and a linear focusing or collimating reflector parallel with the elongate phosphor element and arranged to one-dimensionally focus or collimate the wavelength-converted light.
In accordance with certain illustrative embodiments shown and described as examples herein, an illumination apparatus is disclosed, comprising: an elongate phosphor element; a linear array of light emitting diode (LED) chips spaced apart from and arranged to optically energize the elongate phosphor element, the elongate phosphor element and the linear array of LED chips defining a common plane; and a linear focusing or collimating reflector arranged to one-dimensionally focus or collimate wavelength converted light generated by the elongate phosphor element responsive to energizing by the linear array of LED chips.
In accordance with certain illustrative embodiments shown and described as examples herein, an illumination apparatus is disclosed, comprising: a linear array of light emitting diode (LED) chips disposed on a support; a linear reflector assembly having a light coupling reflector portion and a one-dimensional light collimation or focusing portion, the linear reflector assembly being secured to the support parallel with the linear array of LED chips; an encapsulant disposed in the light coupling reflector portion of the linear reflector assembly and potting the LED chips; and an elongate phosphor element disposed over the encapsulant such that the light coupling reflector portion and the encapsulant enhance light coupling between the LED chips and the elongate phosphor element and the one-dimensional light collimation or focusing portion one-dimensionally collimates or focuses light emitted by the combination of the LED chips and the elongate phosphor element.
Numerous advantages and benefits of the present invention will become apparent to those of ordinary skill in the art upon reading and understanding the present specification.
The invention may take form in various components and arrangements of components, and in various process operations and arrangements of process operations. The drawings are only for purposes of illustrating preferred embodiments and are not to be construed as limiting the invention.
With reference to
The LED chips 10 are arranged in a linear array and are optically coupled with a parallel elongate phosphor element 20 spaced apart from the LED chips 10. The elongate phosphor element 20 may, for example, be a deposition or coating of an epoxy or other matrix or host material containing one or more phosphor components, or may be an elongate plate of glass, plastic, or another transparent material having one or more phosphor components coated thereon or embedded therein, or so forth. The elongate phosphor element 20 may be continuous along the direction of elongation, or in some contemplated embodiments may be in the form of a discontinuous chain or linear array of component phosphor elements arranged parallel with the direction of elongation L. The optical coupling is provided or enhanced by a linear coupling element, such as an illustrated linear coupling reflector 22 having reflective sides extending between the LED chips 10 and the phosphor element 20 to redirect side-emitted light toward the phosphor element 20. Additionally or alternatively, the linear coupling element can include a parallel linear light-transmissive encapsulant that encapsulates the LED chips 10 and bridges the gap or spacing between the linear array of LED chips 10 and the parallel elongate remote phosphor element 20. In the illustrated embodiment, for example, a linear light-transmissive encapsulant 24 comprises a material such as silicone, epoxy, or so forth filling the linear coupling reflector 22, encapsulating the LED chips 10, and providing a support surface for the linear phosphor strip or other elongate phosphor element 20. In some manufacturing embodiments, the LED chips 10 and the linear coupling reflector 22 are both mounted on the support 12, the mounted linear coupling reflector 22 is filled with the encapsulant 24 so as to pot or encapsulate the LED chips 10, and the elongate phosphor element 20 is deposited by spray coating, painting, vacuum deposition, or another process onto the upper surface of the encapsulant 24. Optionally, the surface of the encapsulant distal from the LED chips 10 is leveled, mechanically shaped, or otherwise prepared prior to deposition or other application of the elongate phosphor element 20.
As used herein, the term “light” is to be broadly construed as encompassing radiation having a wavelength (or, equivalently, a frequency) located anywhere in the visible spectrum or anywhere in the ultraviolet or infrared spectral regions. The elongate phosphor element 20 includes a material that converts light generated by the LED chips 10 into light of a desired spectrum. As some illustrative examples, the LED chips 10 can be configured to emit in the violet or ultraviolet light (for example, by including a group III-nitride active region having a suitable bandgap or energy levels for facilitating electron-hole recombination generating violet or ultraviolet light) and the elongate phosphor element 20 can include a combination of fluorescent or phosphorescent components (for example, red, blue, and green or yellow fluorescent or phosphorescent components) that convert the violet or ultraviolet light into a spectrum of light that appears visually as white light. As another illustrative example, the LED chips 10 can be configured to emit blue light and the elongate phosphor element 20 configured to emit yellow or yellowish light that is combinable in suitable proportion with the blue light to appear visually as white light. As yet another illustrative example, the LED chips 10 can be configured to emit violet or ultraviolet light and the elongate phosphor element 20 configured to convert the violet or ultraviolet light to light of a selected color such as red light.
The elongate phosphor element 20 has a thickness d selected to provide the desired amount of light conversion while allowing the converted light, and optionally some of the direct light from the LED chips 10, to be emitted from the side of the phosphor 20 remote from the LED chips 10. For example, in a combination of violet or ultraviolet LED chips and a white-emitting phosphor, the thickness d is suitably selected to be sufficiently thick to convert substantially all of the violet or ultraviolet light to white light, while being sufficiently thin to mitigate loss of white light by reabsorption, scattering, or other loss processes that may occur in the phosphor 20. For complete conversion, the elongate phosphor element 20 preferably includes phosphor conversion material continuously along the length of the phosphor element 20, without any gaps through which direct light from the LED chips 10 could escape. On the other hand, in embodiments in which blue emission from the LED chips 10 is combined with yellow emission from the phosphor 20 to generate light appearing as white, the thickness d is suitably selected to be sufficiently thick to convert a selected fraction of the blue light to yellow light such that the combination of blue and yellow light output from the side of the phosphor 20 distal from the LED chips 10 is of a proportion suitably appearing as white light. Alternatively or additionally, the elongate phosphor element 20 in these embodiments may have gaps in the continuity of the phosphor conversion material along the direction of elongation, through which gaps a selected portion of direct light from the LED chips 10 can escape without conversion. Although the elongate phosphor element 20 is shown in
The illustrated linear coupling reflector 22 defines a linear source region and has reflective sides extending from the linear source region and defining a linear light aperture oriented parallel with the linear source region. The linear array of LED chips 10 is disposed parallel with and in or proximate to the linear source region and distal from the linear light aperture, while the elongate phosphor element 20 disposed at or proximate to the linear light aperture and distal from the linear source region. The linear coupling reflector 22 optically couples the LED chips 10 and the linear phosphor 20. Optionally, the parallel linear encapsulant 24 also contributes to the optical coupling.
The light output from the elongate phosphor element 20 on the side distal from the LED chips 10 is of the desired spectrum and is linear parallel with the linear direction L. However, the light is not collimated or focused transverse to the linear direction L.
A second reflector 30 is disposed to receive and collimate output light IL from the linear light aperture of the linear coupling reflector 22, that is, from the side of the phosphor element 20 distal from the LED chips 10. The illustrative second reflector 30 of
With reference to
The elongate phosphor element 20 is secured together with the focusing or collimating reflector 30, 30′ at a focus or light input aperture of the linear focusing or collimating reflector 30, 30′. The focusing or collimating reflector 30, 30′ has a linear focus arranged parallel with the linear direction L, and serves to efficiently collimate or focus the wavelength converted light emanating from the elongate phosphor element 20 disposed at the focus or light input aperture. Moreover, if direct light from the LED chips 10 contributes to the light output, the linear focusing or collimating reflector 30, 30′ serves to collimate or focus that light as well. Optionally, the elongate phosphor element 20 may contain light scattering particles to scatter the portion of direct light from the LED chips 10 that is not wavelength converted by the phosphor 20. By such scattering, the direct light is also emitted as if generated in or at the phosphor element 20, and so is efficiently collimated or focused.
A light transmissive cover plate 32 is optionally disposed over the light emitting aperture of the collimating second reflector 30, as shown in
The illustrative collimating second reflector 30 is a symmetric collimating reflector that produces the generally planar collimated beam of light IL arranged symmetrically respective to the linear light source. In such a symmetric arrangement, the light IL is collimated in a common plane 34 that also contains the linear array of LED chips 10 and the elongate phosphor element 20. The illustrative focusing second reflector 30′ is an asymmetric focusing reflector that focuses the light to the focal line F disposed asymmetrically respective to the linear light source. In this embodiment, the light IL′ is focused at the focus line F which is outside of the common plane 34 containing both the linear array of LED chips 10 and the elongate phosphor element 20. These are illustrative examples, and it is to be understood that the second reflector can also be configured as an asymmetric collimating reflector, or as a symmetric focusing reflector. Moreover, the coupling reflector and the collimating or focusing reflector can employ reflective surfaces, total internal reflection (TIR), holographic or diffractive reflection, or some combination of such reflective mechanisms.
With reference to
The disclosed linear light sources advantageously provide one-dimensionally collimated or focused light. The elongate phosphor element 20 is advantageously arranged spaced apart or remote from the LED chips 10 to reduce likelihood of phosphor degradation over time, yet the phosphor element 20 remains closely optically coupled with the LED chips 10 through the coupling elements 22, 24. Moreover, the optional light transmissive encapsulant 24 may provide waveguiding of light emitted by the LED chips 10 along the linear direction L, so as to reduce or eliminate non-uniformity of the output light IL, IL′ along the linear direction L by providing excitation of portions of the elongate phosphor element 20 located between neighboring LED chips 10. Thus, the light transmissive encapsulant 24 can serve as a linear waveguiding element disposed in a gap between the elongate phosphor element 20 and the spaced apart linear array of LED chips 10, the linear waveguiding element spreading light from the LED chips 10 and coupling said light substantially uniformly along the elongate phosphor element 20.
The disclosed linear light sources have further advantages in terms of manufacturability and robustness.
With reference to
With brief reference back to
Robustness of the resulting linear light source is enhanced by the optional potting of the sensitive LED chips 10, by the limited number of component pieces, and by the optional sealing of the phosphor element 20 by the combination of the single piece 40 and the optional light transmissive cover plate 32. (Although not shown, complete sealing of the volume containing the elongate phosphor element 20 can be achieved in the embodiment of
The manufacturing process described with reference to
The preferred embodiments have been illustrated and described. Obviously, modifications and alterations will occur to others upon reading and understanding the preceding detailed description. It is intended that the invention be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.