This application claims priority from Korean Patent Application No. 10-2017-0181524, filed on Dec. 27, 2017, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
Apparatuses consistent with example embodiments relate to a microphone, and more particularly, to a directional microphone having increased sensitivity.
Microphones are devices that convert an acoustic signal into an electric signal. Microphones may be used as sensors for recognizing a voice by being attached to mobile phones, household appliances, video display devices, virtual reality devices, augmented reality devices, or artificial intelligent speakers. Recently, a directional microphone having a resonator array of resonators having different center frequencies and arranged on a substrate in which cavity is formed has been developed.
One or more example embodiments may provide a directional microphone having increased sensitivity.
Additional example aspects and advantages will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented example embodiments.
According to an aspect of an example embodiment, a directional microphone includes a substrate having a cavity that penetrates therethrough, a resonator array comprising at least one resonator and covering a first portion of the cavity, and a cover member covering at least a part of a second portion of the cavity not covered by the resonator array.
The cover member may comprise a thin film form.
One end portion of each of the at least one resonator may be fixed to the substrate.
The at least one resonator may include a fixed portion fixed to the substrate, a movable portion extending from the fixed portion and moveable in response to an acoustic signal, and a sensing portion configured to sense movement of the movable portion.
The cover member may substantially cover an entirety of the second portion of the cavity.
The directional microphone may further include a fixing covering at least a part of the second portion of the cavity, where one end portion of each of the at least one resonator is fixed to the fixed portion.
The fixing member may comprise a thin film and may move in association with the at least one resonator.
The fixing member may include a same material as the resonator.
The fixing member may substantially cover an entirety of the second portion of the cavity.
According to an aspect of another example embodiment, a directional microphone includes a substrate having a cavity that penetrates therethrough, a resonator array comprising at least one resonator and covering a first portion of the cavity, and a fixing member to which one end portion of each of the at least one resonator is and covering at least a part of a second open portion of the cavity not covered by the resonator array.
The fixing member may comprise a thin film and may move in association with the at least one resonator.
The fixing member may substantially cover an entirety of the second portion of the cavity.
The directional microphone may further include a cover member covering at least a part of the second portion of the cavity.
The cover member may comprise a thin film.
The cover member and the fixing member may, together, substantially cover an entirety of the second portion of the cavity.
According to an aspect of another example embodiment, a directional microphone includes a substrate having a cavity that penetrates therethrough, a resonator array comprising at least one resonator and covering a first portion of the cavity, and a filing member covering a second portion of the cavity not covered by the resonator array.
The filling member may substantially cover an entirety of the second portion of the cavity.
The filling member may comprise a fixing member to which one end portion of each of the at least one resonator is fixed and covering at least a part of the second portion of the cavity.
The filling member may further include a cover member covering at least a part of the second portion of the cavity.
These and/or other example aspects and advantages will become apparent and more readily appreciated from the following description of the example embodiments, taken in conjunction with the accompanying drawings in which:
Reference will now be made in detail to example embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. Also, the size of each layer illustrated in the drawings may be exaggerated for convenience of explanation and clarity. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein.
In the following description, when a constituent element is disposed “above” or “on” to another constituent element, the constituent element may be only directly on the other constituent element or above the other constituent elements in a non-contact manner. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.
The use of the terms “a” and “an” and “the” and similar referents in the context of describing the disclosure (especially in the context of the following claims) are to be construed to cover both the singular and the plural. Also, the steps of all methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The present disclosure is not limited to the described order of the steps. The use of any and all examples, or language (e.g., “such as”) provided herein, is intended merely to better illuminate the disclosure and does not pose a limitation on the scope of the disclosure unless otherwise claimed.
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The resonator array may include a plurality of resonators 120 arranged in a certain form above the cavity 115 of the substrate 110. The resonators 120 may be arranged to be co-planar without overlapping. Each of the resonators 120 has a fixed portion 121, at one end thereof, fixed to the substrate 110 and may extend toward the cavity 115 from the one end portion. Each of the resonators 120 may include the fixed portion 121 fixed to the substrate 110, a movable portion 122 moveable in response to an acoustic signal, and a sensing portion 123 for sensing a movement of the movable portion 122. The sensing portion may include a sensor layer, such as a piezoelectric element for sensing the movement of the moveable portion. Furthermore, each of the resonators 120 may further include a mass 124 for providing a certain amount of weight to the movable portion 122.
The resonators 120 forming the resonator array may be configured to sense, for example, acoustic frequencies of different bands. In other words, the resonators 120 may have different center frequencies. To this end, the resonators 120 may have different dimensions. For example, the resonators 120 may have different lengths, widths, or thicknesses. The number of the resonators 120 provided above the cavity 115 may be variously changed according to design conditions.
With respect to the cavity 115 formed in the substrate 110, an open portion thereof, remaining otherwise uncovered by the resonator array, may be filled with a filling member. In the present example embodiment, the filling member may include the cover member 150 that is provided to cover at least a part of the open portion of the cavity 115 that is left uncovered by the resonator array. The cover member 150 may increase a pressure gradient between an upper portion and a lower portion of the resonator array by increasing acoustic resistance. As such, as the pressure gradient between the upper portion and the lower portion of the resonator array increases, displacements of the resonators 120 forming the resonator array increase, and thus the sensitivity of the microphone 100 may be increased.
The cover member 150 may be provided in the form of a thin film. For example, the cover member 150 may be provided in the form of a thin film having a thickness similar to that of the resonators 120. In this case, although the cover member 150 may include the same material as the resonators 120, the present disclosure is not limited thereto. The cover member 150 may be provided to substantially cover an entirety of the open portion of the cavity 114, otherwise uncovered by the resonator array, to increase the pressure gradient between the upper portion and the lower portion of the resonator array.
According to the microphone 100 according to the present example embodiment, since the cover member 150 is provided to cover the open portion in the cavity 115 remaining otherwise uncovered, the pressure gradient between the upper portion and the lower portion of the resonator array may be increased, and thus the sensitivity of the microphone 100 may be increased.
Although, in the above description, the resonator array is described as including the resonators 120 having different center frequencies, this is merely exemplary. For example, at least some of the resonators forming the resonator array may be configured to have the same center frequency or the resonator array may be configured to have only a single resonator.
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It may be seen from the results of actual measurements as illustrated in
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The resonator array may include a plurality of resonators 320 arranged in a certain form above the cavity 315 of the substrate 310. The resonators 320 may have, for example, different lengths, and different center frequencies.
The fixing member 370 for fixing one end portion of each of the resonators 320 is provided between the substrate 310 and the resonator array. One side of the fixing member 370 is fixed to the substrate 310, and the one end portion of each of the resonators 320 is fixed to the other side of the fixing member 370. Furthermore, the fixing member 370 may be provided to cover a portion of the cavity 315 otherwise uncovered by the resonators 320. The fixing member 370 may cover at least part of the open portion of the cavity 315 not otherwise covered by the resonator array. As such, the fixing member 370 may serve as a filling member for filling the otherwise open portion of the cavity 315.
The fixing member 370 may increase displacements of the resonators 320 by a coupling effect as described below, and increase the pressure gradient between the upper portion and the lower portion of the resonator array by covering the otherwise open portion of the cavity 315, thereby increasing the sensitivity of the microphone 300.
The fixing member 370 may move in association with movements of resonators 320, and may cover at least part of the cavity 315. The fixing member 370 may be provided in the form of a thin film. For example, the fixing member 370 may be provided in the form of a thin film having a thickness similar to that of the resonators 320. Although the fixing member 370 may include the same material as the resonators 320, the present disclosure is not limited thereto.
When the fixing member 370 moves in association with movement of the resonators 320, the displacements of the resonators 320 forming the resonator array may be increased by the coupling effect. Accordingly, the sensitivity of the microphone 300 may be increased. In detail, when a specific one of the resonators 320 of the resonator array moves, the fixing member 370 moves in association with the movement of the specific one of the resonators 320. Also, as the movement of the fixing member 370 affects the movements of the resonators 320 adjacent to the specific one of the resonators 320, the displacements of the resonators 320 may be increased, and thus the sensitivity of the microphone 300 may be increased.
Furthermore, as the fixing member 370 covers the otherwise open portion of the cavity 315, the pressure gradient between the upper portion and the lower portion of the resonator array is increased, and thus the sensitivity of the microphone 300 may be further increased. In detail, the fixing member 370 covers at least part of the otherwise open portion of the cavity 315. Accordingly, since the pressure gradient between the upper portion and the lower portion of the resonator array may be increased, the sensitivity of the microphone 300 may be increased. The fixing member 370 may entirely cover the otherwise open portion of the cavity 315, in order to increase the pressure gradient between the upper portion and the lower portion of the resonator array.
With respect to the microphone 300 according to the present example embodiment, as the fixing member 370 that fixes the one end portion of each of the resonators 320 is configured to move in association with the resonators 320, the displacements of the resonators 320 may be increased by the coupling effect. Accordingly, the sensitivity of the microphone 300 may be increased. Furthermore, as the fixing member 370 covers the otherwise open portion of the cavity 315 formed in the substrate 310, the pressure gradient between the upper portion and the lower portion of the resonator array may be increased. Accordingly, the sensitivity of the microphone 300 may be further increased.
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The fixing member 670 is provided at a center portion of the cavity 615 between the resonators 620 arranged at both sides of the cavity 615. Each of both sides of the fixing member 670 fixes one end portion of each of the resonators 620. The fixing member 670 may cover the center portion of the cavity 615.
The fixing member 670 may move in association with movements of the resonators 620, and may cover at least a part of the cavity 615. The fixing member 670 may be provided in the form of a thin film. The fixing member 670 may entirely cover the open portion in the cavity 615, otherwise uncovered by the resonator array, in order to increase the pressure gradient between the upper portion and the lower portion of the resonator array.
With respect to the microphone 600 according to the present example embodiment, as the fixing member 670 fixes one end portion of each of the resonators 620 and moves in association with the resonators 620, the displacements of the resonators 620 may be increased by the coupling effect. Accordingly, the sensitivity of the microphone 600 may be increased. Furthermore, as the fixing member 670 covers an otherwise open portion of the cavity 615 not covered by the resonators 620, the pressure gradient between the upper portion and the lower portion of the resonator array may be increased. Accordingly, the sensitivity of the microphone 600 may be increased.
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The filling member may be provided to fill an open portion of the cavity 715, otherwise uncovered by the resonator array in. The filling member may include a cover member 750 and a fixing member 770. In
Each of both sides of the fixing member 770 is provided to fix one end portion of each of the resonators 720. The fixing member 770 may be provided in the form of a thin film to be capable of moving in association with the movements of the resonators 720. The cover member 750 may cover the open portion of the cavity 715 not otherwise covered by the resonator array or the fixing member 770. Together, fixing member 770 and the cover member 750 may entirely cover the otherwise open portion of the cavity 175 not covered by the resonator array, in order to increase the pressure gradient between the upper portion and the lower portion of the resonator array.
With respect to the microphone 700 according to the present example embodiment, since the cover member 750 covers a part of the otherwise open portion of the cavity 715 not covered by the resonator array, the pressure gradient between the upper portion and the lower portion of the resonator array may be increased. Accordingly, the sensitivity of the microphone 700 may be increased. Furthermore, since the fixing member 770 fixes the one end portion of each of the resonators 720 and covers the otherwise open portion of the cavity 715 not covered by the resonator array or the cover member 750, the displacements of the resonators 720 may be increased and simultaneously the pressure gradient between the upper portion and the lower portion of the resonator array may be increased. Accordingly, the sensitivity of the microphone 700 may be increased.
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The filling member may fill the otherwise open portion of the cavity 815 not covered by the resonator array. The filling member may include a cover member 850 and a fixing member 870. In
One side of the fixing member 870 fixes one end portion of each of the resonators 820 and the other side of the fixing member 870 is fixed to the substrate 810. The fixing member 870 may be provided in the form of a thin film to be capable of moving in association with the movements of the resonators 820. The cover member 850 may cover an otherwise open portion of the cavity 815 not covered by the resonator array or the fixing member 870. Together, the fixing member 870 and the cover member 850 may entirely cover the otherwise open portion of the cavity 815 to increase the pressure gradient between the upper portion and the lower portion of the resonator array.
With respect to the microphone 800 according to the present example embodiment, since the cover member 850 covers a part of the otherwise open portion of the cavity 815 not covered by the resonator array, the pressure gradient between the upper portion and the lower portion of the resonator array may be increased. Accordingly, the sensitivity of the microphone 800 may be increased. Furthermore, since the fixing member 870 fixes the one end portion of each of the resonators 820 and cover the otherwise open portion of the cavity 815 not covered by the resonator array or the cover member 850, the displacements of the resonators 820 may be increased and simultaneously the pressure gradient between the upper portion and the lower portion of the resonator array may be increased. Accordingly, the sensitivity of the microphone 800 may be increased.
Although in the above-described example embodiments the resonator array is described to include a plurality of resonators having different center frequencies, the present disclosure is not limited thereto. Accordingly, for example, at least some of the resonators forming the resonator array may have the same center frequency or the resonator array may include only a single resonator.
According to the above-described example embodiments, since the cover member covers the otherwise open portion of the cavity formed in the substrate, the pressure gradient between the upper portion and the lower portion of the resonator array may be increased, and thus the displacements of the resonators may be increased. Accordingly, the sensitivity of the microphone may be increased. Furthermore, since the fixing member fixes one end portion of the resonator array and simultaneously covers the otherwise open portion of the cavity, the displacements of the resonators may be increased by the coupling effect, and the pressure gradient between the upper portion and the lower portion of the resonator array may be increased. Accordingly, the sensitivity of the microphone may be further increased.
It should be understood that exemplary embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each example embodiment should typically be considered as available for other similar features or aspects in other example embodiments.
While one or more example embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the following claims.
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Communication dated Apr. 10, 2019, issued by the European Patent Office in counterpart European Application No. 18194340.8. |
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