Disc package for semiconductor wafers

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Information

Patent Grant
D344891

References
Source

Patent Number
D344,891
Date Filed
Monday, February 3, 1992
33 years ago
Date Issued
Tuesday, March 8, 1994
30 years ago

Inventors
- Larry Dressen
Original Assignees
- Empak, Inc.
Examiners
- Ansher; Bernard
- Shelton; Richelle
Agents
- Haugen and Nikolai

US Classifications
- D09 - Packages and containers for goods
- 206 - Special receptacle or package
Field of Search
- US
- 211 40
- 206 334
- 206 328
- 206 444
- 206 454
- 206 455
- 206 508
- D09 337
- D09 424
- D09 425
- D14 299
- Term of Grant
  14Years

Information

Abstract

Description

Claims

The ornamental design for the disc package for semiconductor wafers, as shown and described.

US Referenced Citations (4)

Number	Name	Date	Kind
D260237	Fuzere	Aug 1981
4588086	Coe	May 1986
4793488	Mortensen	Dec 1988
4966284	Gregerson et al.	Oct 1990