1. Field of the Invention
The invention relates to a discharge lamp of the short arc type which is used as the light source of a projection device.
2. Description of the Related Art
Conventionally, the discharge lamp of the short arc type shown in
In such a discharge lamp of the short arc type, the internal pressure of the arc tube 1 is very high during operation in order to increase the radiance. Therefore, it is necessary to design the lamp such that the hermetically sealed tubes 2 are not damaged even at a high internal pressure. Furthermore, since a high current flows in the lamp, it is necessary for the respective lead pin 4 which supports the electrode 3 to project directly to the outside from the hermetically sealed tube 2 which adjoins the arc tube 1. For hermetic sealing of the hermetically sealed tube 2 on the lead pin 4, there is a hermetically sealed arrangement in which graded glass 5 is used.
However, as is shown in
The light which has been emitted onto the hermetically sealed tube 2 passes through the hermetically sealed tube 2 and is emitted onto the lead pin 4 and the graded glass 5 since the hermetically sealed tube 2 is made of transparent glass. In particular, when the light is emitted onto the lead pin 4, the lead pin 4 is heated by the light, which causes its temperature to rise because the lead pin 4 is a component which does not transmit light.
Some of the light which has been formed in the arc at the location which deviates from the focal point of the reflector 71 is reflected by means of the reflector 71, is emitted directly onto the hermetically sealed tube 2 and heats the lead pin 4 (the light beam is, however, not shown in the drawings). Furthermore, part of the light which has been reflected by the surface of the light exit window 8 is emitted directly onto the hermetically sealed tube 2 and heats the lead pin 4 (not shown in the drawings either).
As shown in
If the temperature of the lead pin 4 increases in this way by the irradiation of the lead pin 4 with light, the heat of the lead pin 4 is conducted to the graded glass 5 which is sealed on the lead pin 4. In this way, the disadvantage occurs that the temperature of the graded glass 5 rises, which results in stress in the graded glass 5 such that eventually cracks form and that the hermetically sealed arrangement is destroyed.
Furthermore, there is the following disadvantage that the end of the lead pin 4 projects to the outside from the end of the hermetically sealed tube 2. Since the projecting part is exposed to outside air, oxidation of the lead pin 4 continues when the lead pin 4 reaches a high temperature. As a result, expansion of the lead pin 4 occurs, and cracks form in the graded glass 5 in contact with the lead pin 4. The hermetically sealed arrangement is therefore destroyed.
The discharge lamp of the short arc type of the invention eliminates the above described disadvantages in the prior art. A primary object of the invention is to construct a discharge lamp of the short arc type in which the disadvantages mentioned above are suppressed such that when the lead pin, which is located within the hermetically sealed tube, is irradiated with light a rise in temperature of the lead pin is prevented, and thus, fracturing of the graded glass and destruction of the hermetically sealed arrangement is also prevented.
According to a first embodiment of the invention, in a discharge lamp of the short arc type having hermetically sealed tubes adjoining opposite ends of the arc tube and having lead pins supporting the electrodes sealed in the hermetically sealed tubes by graded glass, the object is achieved by providing the outside surface of the above described respective hermetically sealed tube with a heat absorption film and providing the surface of this heat absorption film with a light reflection film.
The object of the invention is achieved according to one manner in the short arc type described in the first embodiment where the above described heat absorption film is a high emissivity material which has an emissivity greater than or equal to 0.5 of the light in a wavelength range from 200 nm to 1500 nm and 2500 nm to 5000 nm.
The object of the invention is achieved according to another manner in the discharge lamp of the short arc type in that where the above described light reflection film is a reflectivity material which reflects light in the wavelength range from 200 nm to 1500 nm and transmits light in the wavelength range from 2500 nm to 5000 nm.
The invention is further described below via one embodiment illustrated in the drawings.
Upon installation of the discharge lamp of the short arc type of the invention into a projection device, as shown in
In
The arc tube 1 is filled with xenon as the emission gas of 8.5 MPa at 25° C. with respect to atmospheric pressure. Operation takes place with nominal values of 70 A and 28 V. During operation, the lamp light is produced principally in the visible range.
As is shown in
The surface of the high emissivity material 91 is then provided with the reflectivity material 92. The reflectivity material 92 reflects light in a wavelength range from 200 nm to 1500 nm and transmits light in a wavelength range from 2500 nm to 5000 nm. Such a reflectivity material 92 can be a film which contains light-reflecting, metallic particles. Specifically, the film is formed by mixing silver particles, as the light-reflecting metallic particles, into silicone resin, applying the film and drying the film.
The high emissivity material 91 can also be a vitreous coating in which metallic particles are dispersed, or a vitreous coating in which carbon particles are dispersed. The reflectivity material 92 can also be a dielectric, multi-layer film of TiO2—SiO2.
This light L1 is emitted from outside onto the hermetically sealed tube 2, but since a reflectivity material 92 on the hermetically sealed tube 2 reflects light in a wavelength range from 200 nm to 1500 nm emitted from the lamp, as is shown in
Next, the high emissivity material 91 is described. If, during lamp operation, light is being transmitted in the arc tube 1 and in the hermetically sealed tube 2, as was described using
In order to prevent this from occurring, it is necessary to place a high emissivity material 91 between the surface of the hermetically sealed tube 2 and the reflectivity material 92. This high emissivity material 91 absorbs and emits light in a wavelength range from 200 nm to 1500 nm. The emissivity of the high emissivity material 91 is preferably at least 0.5, more preferably at least 0.9.
If, therefore, the reflectivity material 92 is arranged so that the light L1 is not emitted from outside the lamp onto the lead pin 4, the light L2 which emerges from the lamp from the inside of the hermetically sealed tube 2 is not emitted onto the lead pin 4 due to the absorption of this light L2 by the high emissivity material 91, then the amount of light emitted onto the lead pin 4 can be reduced and the temperature increase of the lead pin 4 can be suppressed.
The electrode 3, during lamp operation, reaches a very high temperature, i.e., its tip areas reaches roughly 2000° C. As a result, heat is also transferred to the inner lead pin 4 which supports the electrode 3 and transmitted to the lead pin 4 which is present in the hermetically sealed tube 2. Since the heat radiated here by the lead pin 4 is emitted as light in the wavelength range from 2500 nm to 5000 nm, the high emissivity material 91 absorbs the light in the wavelength range from 2500 nm to 5000 nm and emits it from the lamp.
On the other hand, the reflectivity material 92 transmits the light in the wavelength range from 2500 nm to 5000 nm which is emitted by the high emissivity material 91 and radiates it from the lamp. The reflectivity material 92 therefore transmits the light in the wavelength range from 2500 nm to 5000 nm.
Placing the high emissivity material 91 on the surface of the hermetically sealed tube 2 and the reflectivity material 92 on the surface of the high emissivity material 91 in this manner will prevent the lead pin 4, located in the hermetically sealed tube 2, from being irradiated with the light L1 from outside the hermetically sealed tube 2. The high emissivity material 91 can absorb the light L2 which emerges from the inside of the hermetically sealed tube 2 of the lamp, and can also absorb the heat which has been radiated from the lead pin 4 and radiate this heat via the reflectivity material 92. Therefore, a temperature increase of the lead pin 4 and thus a temperature increase of the graded glass 5 which is sealed on the lead pin 4 can be prevented. Therefore crack formation is prevented in the graded glass 5.
Since the temperature increase of the lead pin 4 can be prevented, the oxidation of the lead pin 4 can be suppressed in the area which projects to the outside from the end of the hermetically sealed tube 2. Thus, the formation of cracks in the graded glass 5 by oxidation of the lead pin 4 can also be prevented. With a discharge lamp of the short arc type of this embodiment of the invention, a discharge lamp of the short arc type is obtained in which the hermetically sealed arrangement is not destroyed.
Next, an experiment was run in which the temperature of the lead pin during operation was studied using the discharge lamp of the short arc type of the invention in which in the hermetically sealed tube is provided with the high emissivity material and the reflectivity material, and using a conventional discharge lamp of the short arc type with neither a material with high emissivity nor a reflectivity material.
The discharge lamp of the short arc type of the invention and the conventional discharge lamp of the short arc type have exactly the same lamp specifications except for the presence of the high emissivity material and the reflectivity material of the invention on the hermetically sealed tube. These lamps have a nominal value of 1.9 kW.
The high emissivity material is the above described film which was formed by applying and drying a black, heat-resistant dye. The reflectivity material is the above described film which has been formed by silver particles as light-reflecting metallic particles being mixed into silicone resin, applied and dried.
The area in which the surface of the hermetically sealed tube is provided with high emissivity material and reflectivity material is the area from the end A of the hermetically sealed tube 2 to the area B in which the hermetically sealed tube 2 begins to contract, as is illustrated in FIG. 3.
The temperature of the lead pin 10 minutes after reaching a stable state after the start of lamp operation was measured. The measurement point of the lead pin is shown as the area P in FIG. 3. This point is located on the side of the outer end of the lead pin 4 and is adjacent to the area in which the graded glass 5 and the lead pin 4 are sealed against one another. Table 1 shows the measurement results.
As is apparent from the Table 1 above, in the lamp of the invention, the temperature of the lead pin compared to the conventional lamp has dropped by 87° C. As a result, in the lamp of the invention, the temperature increase of the graded glass is reliably suppressed and crack formation as a result of the temperature increase of the graded glass is prevented. This also prevents the hermetically sealed arrangement from being destroyed.
The surface area of the hermetically sealed tube provided with the high emissivity material and the reflectivity material, besides the above described area, can also be an area which extends proceeding from the end A of the hermetically sealed tube 2 via the area B in which the hermetically sealed tube 2 begins to contract to as far as the boundary area C between the hermetically sealed tube 2 and the arc tube 1, as is shown using
The most effective area in which the surface of the hermetically sealed tube is provided with a high emissivity material and a reflectivity material is, however, the entire surface area of the hermetically sealed tube 2 which extends proceeding from the end A of the hermetically sealed tube 2 via the area B in which the hermetically sealed tube 2 begins to contract as far as the boundary area C between the hermetically sealed tube 2 and the arc tube 1.
As was described above, in the discharge lamp of the short arc type in accordance with the invention there are the following effects. Placing a high emissivity material on the surface of the hermetically sealed tube and a reflectivity material on the surface of the high emissivity material can prevent the light from outside the hermetically sealed tube from irradiating the lead pin located within the hermetically sealed tube. The high emissivity material can absorb the light which emerges from the inside of the hermetically sealed tube from the lamp and can also absorb the heat which has been radiated from the lead pin and radiate this heat through the reflectivity material 92. Therefore, a temperature increase of the lead pin and thus a temperature increase of the graded glass which is sealed on the lead pin can be prevented. As a result, crack formation is prevented in the graded glass. Thus, a discharge lamp of the short arc type is obtained in which the hermetically sealed arrangement is not destroyed.
Number | Date | Country | Kind |
---|---|---|---|
2002-178778 | Jun 2002 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
6356018 | Higashimoto et al. | Mar 2002 | B1 |
20010010447 | Yamane et al. | Aug 2001 | A1 |
20020185972 | Matsushima et al. | Dec 2002 | A1 |
20030001503 | Higashimoto et al. | Jan 2003 | A1 |
Number | Date | Country | |
---|---|---|---|
20030234615 A1 | Dec 2003 | US |