Disk drives comprise a disk and a head connected to a distal end of an actuator arm which is rotated about a pivot by a voice coil motor (VCM) to position the head radially over the disk. The disk typically comprises a number of concentric data tracks each partitioned into a number of data sectors. Access operations are performed by seeking the head to a target data track, and performing a write/read operation on the data sectors within the data track. The disk typically comprises embedded servo sectors having position information recorded therein, such as coarse position information (e.g., a track address) and fine position information (e.g., servo bursts). A servo controller processes the servo sectors to position the head over the target data track.
Each data sector is typically assigned a physical block address (PBA) which is accessed indirectly through a logical block address (LBA) to facilitate mapping out defective data sectors. A PBA associated with defective data sectors may simply remain unmapped if found during manufacturing, or if a data sector becomes defective while in-the-field (grown defect), the LBA may be remapped to the PBA of a spare data sector (and the data relocated to the spare data sector). The process of initially mapping the LBAs to PBAs and mapping out defective PBAs is referred to as “formatting” the disk. The head may be fabricated with a suitable touchdown sensor, such as a suitable magnetoresistive sensor, which may be used to detect defects on the disk, such as thermal asperities.
In the embodiment of
In the embodiment of
In one embodiment, the bias signal 10 is applied to the touchdown sensor 6 in order to achieve a desired sensitivity during the defect scan operation. Any suitable touchdown sensor 6 may be employed in the embodiments of the present invention, such as a magnetoresistive sensor that exhibits a change in resistance relative to temperature. Since a defect on the disk 4 induces a temperature change in the touchdown sensor 6, in one embodiment the resulting change in resistance can be transduced into a defect detection signal, such as by measuring a change in current flowing through the touchdown sensor 6 while applying a constant voltage across the touchdown sensor 6.
In one embodiment, the touchdown sensor 6 is fabricated with a thermoresistive material having a thermal coefficient of resistance (TCR) that specifies the change in temperature relative to a change in the resistance of the material. In one embodiment the bias signal 10 applied to the touchdown sensor 6 will raise the temperature of the thermoresistive material (with a corresponding change in resistance); however, the degree to which the temperature of the touchdown sensor 6 rises depends on its geometry which varies due to tolerances in the fabrication process. For a particular setting of the bias signal 10, a larger (or thicker) touchdown sensor 6 may exhibit a lower temperature response (and corresponding resistance response) as compared to a smaller (or thinner) touchdown sensor 6. In addition, if a fly height actuator is employed to achieve a target fly height during the defect scan, the fly height control signal may vary from drive to drive due to various manufacturing tolerances, such as tolerances in the geometry of the head, the fly height actuator, the head gimbal assembly, etc. In one embodiment, the heating of the fly height actuator may affect the temperature of the touchdown sensor 6, and therefore may affect the behavior of the touchdown sensor 6 for a given value of the bias signal 10. In one embodiment, in order to achieve a consistent performance for the defect scan operation (accurately detect true defects and minimizes false detections) across a family of disk drives, an operating value for the bias signal 10 is calibrated so as to achieve a target operating temperature for each touchdown sensor 6, thereby compensating for the differences in behavior. That is, with each touchdown sensor 6 biased to achieve a target operating temperature (and corresponding bias resistance), the response to the defects on the disk will be relatively consistent across the disk drives.
This embodiment is illustrated in
After measuring the reference resistance, in one embodiment an operating resistance of the touchdown sensor 6 is estimated according to (block 40):
R—Op=R—Ref*(1+(T—Op−T—Ref)*TCR)
where:
After estimating the operating resistance of the touchdown sensor 6, the fly height control signal is configured to achieve a target fly height (block 41), and a loop is executed in order to identify the operating value for the bias signal 10 that will achieve the operating resistance at the predetermined operating temperature (which takes into account the heating effect of the fly height actuator). The bias signal 10 is applied to the touchdown sensor 6 at an interim value and a corresponding interim resistance of the touchdown sensor is measured (block 42). If the interim resistance does not match the operating resistance (block 44), the interim value for the touchdown signal 10 is scaled based on a ratio of the operating resistance to the measured interim resistance (block 46). The flow diagram is then repeated starting at block 42 until the measured interim resistance substantially matches the operating resistance (block 44). The operating value for the bias signal 10 is then selected based on the ending interim value (block 48), such as by setting the operating value equal to the ending interim value or by adding or subtracting a predetermined offset. The defect scan of the disk is then executed using the calibrated operating value for the bias signal 10 in order to detect defects on the disk, such as thermal asperities (block 50).
The bias signal 10 applied to the touchdown sensor 6 may comprise any suitable signal, such as a current or a voltage, or a combination of a current and a voltage. In addition, the bias signal 10 may be generated as a constant (DC) signal, or as an alternating (AC) signal, or as a combination of a DC signal plus an AC signal. In one embodiment, the control circuitry 8 comprises a suitable digital-to-analog converter (DAC) operable to convert a digital value into an analog bias signal 10 applied to the touchdown sensor 6.
Any suitable control circuitry may be employed to implement the flow diagrams in the embodiments of the present invention, such as any suitable integrated circuit or circuits. For example, the control circuitry may be implemented within a read channel integrated circuit, or in a component separate from the read channel, such as a disk controller, or certain operations described above may be performed by a read channel and others by a disk controller. In one embodiment, the read channel and disk controller are implemented as separate integrated circuits, and in an alternative embodiment they are fabricated into a single integrated circuit or system on a chip (SOC). In addition, the control circuitry may include a suitable preamp circuit implemented as a separate integrated circuit, integrated into the read channel or disk controller circuit, or integrated into a SOC.
In one embodiment, the control circuitry comprises a microprocessor executing instructions, the instructions being operable to cause the microprocessor to perform the flow diagrams described herein. The instructions may be stored in any computer-readable medium. In one embodiment, they may be stored on a non-volatile semiconductor memory external to the microprocessor, or integrated with the microprocessor in a SOC. In another embodiment, the instructions are stored on the disk and read into a volatile semiconductor memory when the disk drive is powered on. In yet another embodiment, the control circuitry comprises suitable logic circuitry, such as state machine circuitry.
Number | Name | Date | Kind |
---|---|---|---|
5450747 | Flechsig et al. | Sep 1995 | A |
5666237 | Lewis | Sep 1997 | A |
5790334 | Cunningham | Aug 1998 | A |
5808184 | Boutaghou et al. | Sep 1998 | A |
5825181 | Schaenzer et al. | Oct 1998 | A |
5901001 | Meyer et al. | May 1999 | A |
6004030 | Abraham et al. | Dec 1999 | A |
6019503 | Abraham et al. | Feb 2000 | A |
6130793 | Ohmori et al. | Oct 2000 | A |
6175457 | Flynn | Jan 2001 | B1 |
6262858 | Sugiyama et al. | Jul 2001 | B1 |
6310739 | McEwen et al. | Oct 2001 | B1 |
6311551 | Boutaghou | Nov 2001 | B1 |
6494085 | Wakefield et al. | Dec 2002 | B2 |
6504662 | Sobey | Jan 2003 | B2 |
6556366 | Patti et al. | Apr 2003 | B2 |
6608728 | Sugiyama | Aug 2003 | B1 |
6724550 | Teo et al. | Apr 2004 | B2 |
6751039 | Ngo et al. | Jun 2004 | B1 |
6920001 | Chua et al. | Jul 2005 | B2 |
6940669 | Schaenzer et al. | Sep 2005 | B2 |
7027263 | Ottesen et al. | Apr 2006 | B2 |
7097110 | Sheperek et al. | Aug 2006 | B2 |
7271967 | Shi et al. | Sep 2007 | B2 |
7595948 | Oberg | Sep 2009 | B1 |
7760458 | Trinh | Jul 2010 | B1 |
7804657 | Hogg et al. | Sep 2010 | B1 |
7872824 | Macchioni et al. | Jan 2011 | B1 |
8031420 | Mathew et al. | Oct 2011 | B2 |
8045283 | Yang et al. | Oct 2011 | B2 |
8259406 | Kazusawa et al. | Sep 2012 | B2 |
8427770 | O'Dell et al. | Apr 2013 | B1 |
8477455 | Furukawa et al. | Jul 2013 | B2 |
20030210486 | Ottesen et al. | Nov 2003 | A1 |
20110157736 | Contreras et al. | Jun 2011 | A1 |
20120120982 | Anaya-Dufresne et al. | May 2012 | A1 |
20120158349 | Lee et al. | Jun 2012 | A1 |
20130083430 | Chiu et al. | Apr 2013 | A1 |
20130163110 | Garzon et al. | Jun 2013 | A1 |