Claims
- 1. A dispenser for an air or moisture sensitive adhesive material to be melted comprising heat conductive cartridge means comprising a hermetically sealed chamber storing said material to be melted and preventing contact of said material with air or moisture, heat conductive chamber means receiving the cartridge means, heating means for melting the material stored in the cartridge means, outlet means communicating with the cartridge means for dispensing the melted material and plunger means for advancing the melted material into the outlet means, said cartridge means, chamber means and heating means being in thermal contact with each other, wherein said material stored in said chamber is an adhesive selected from the group consisting of polyamide adhesives, moisture cure hot melt urethane, cyanoacrylate, epoxy adhesive, and acrylate adhesives.
- 2. A dispenser of claim 1 wherein the cartridge means comprises a heat-conductive casing.
- 3. A dispenser of claim 2 wherein the heat-conductive casing is a metal casing.
- 4. A dispenser of claim 1 wherein the cartridge means further comprises plunger means.
- 5. A dispenser of claim 1 wherein the outlet means comprises valve means.
- 6. A dispenser of claim 5 wherein the valve means comprises a ball valve.
- 7. A dispenser of claim 1 wherein the plunger means comprises pressure sealing means.
- 8. A dispenser of claim 7 wherein the pressure sealing means comprises an O-ring.
- 9. A cartridge for a hot melt material dispensing device comprising a heat conductive casing containing said hot melt material and adapted to be received in a heating chamber, outlet means communicating with the interior of said casing for allowing melted material to be dispensed, and plunger means for forcing melted material through said outlet means, said casing, outlet means, and plunger means being hermetically sealed to prevent the introduction of air or moisture into said hot melt material, and wherein said hot melt material is an adhesive selected from the group consisting of polyamide adhesives, moisture cure hot melt urethane, cyanoacrylate, epoxy adhesive, and acrylic adhesives.
Parent Case Info
This application is a continuation of Ser. No. 889,519, filed July 25, 1986, now abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (2)
Number |
Date |
Country |
729851 |
Aug 1932 |
FRX |
2090921 |
Jul 1982 |
GBX |
Continuations (1)
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Number |
Date |
Country |
Parent |
889519 |
Jul 1986 |
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