Patent Application
20250098506
The present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method therefor.
At present, in order to reduce the width of the frame of the display panel, the circuit board used for driving the display panel is usually provided on the back side of the display panel, so that the space for providing the circuit board on the edge of the display panel is omitted, and the width of the frame is reduced. However, since the circuit board is provided with a circuit including an electronic device and a wiring circuit, the circuit board is easily interfered by static electricity, thus affecting normal display.
It should be noted that the information disclosed in the above background part is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the related art known to those of ordinary skill in the art.
An object of the present disclosure is to provide a display apparatus and a manufacturing method therefor.
According to an aspect of the present disclosure, there is provided a display apparatus, including:
In some embodiments of the present disclosure, an orthographic projection of the first insulation layer on the display panel is located within the orthographic projection of the circuit board on the display panel;
In some embodiments of the present disclosure, the circuit board includes:
In some embodiments of the present disclosure, a material of the conductive layer includes at least one of a conductive adhesive or a conductive fabric.
In some embodiments of the present disclosure, the shielding layer further includes:
In some embodiments of the present disclosure, the shielding layer further includes:
In some embodiments of the present disclosure, the wave-absorbing material includes graphite.
In some embodiments of the present disclosure, the shielding layer further includes:
In some embodiments of the present disclosure, a material of the heat dissipation layer includes copper.
In some embodiments of the present disclosure, the display panel is provided with a display region and a peripheral region located outside the display region; the display panel includes a driving back plate and a light-emitting layer located on a side of the driving back plate, and the light-emitting layer is located in the display region;
In some embodiments of the present disclosure, a distance between the leading-out portion and the supporting layer is smaller than a distance between the shielding portion and the supporting layer.
In some embodiments of the present disclosure, the conductive layer located at the leading-out portion is directly attached to the supporting layer or electrically connected to the supporting layer through a conductive medium.
According to an aspect of the present disclosure, there is provided a method for manufacturing a display apparatus, including:
It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the present disclosure.
The accompanying drawings here, which are incorporated in and constitute a part of the description, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure. Obviously, the drawings in the following description are some embodiments of the present disclosure, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative efforts.
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments, however, can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; by contrast, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are merely schematic illustrations of the present disclosure, and are not necessarily drawn to scale.
The terms “a”, “an”, “the”, “said” and “at least one” are used to indicate the presence of one or more elements/components/etc.; the terms “comprising” and “including” are used to indicate an open inclusion and means that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms “first”, “second” and “third” etc. are only used as a marker, not a limitation on the number of its objects.
According to embodiments of the present disclosure, there is provided a display apparatus, which may be used for an electronic device having a display function, such as a mobile phone, a tablet computer, a television, or the like. As shown in
The supporting layer 2 is provided on the backlight side of the display panel 1, and the supporting layer 2 is made of a conductive material.
The circuit board 3 is provided on a side of the supporting layer 2 away from the display panel 1, and is connected to the display panel 1.
The shielding layer 5 is overlaid on a side of the circuit board 3 away from the display panel 1, and includes a first insulation layer 51 and a conductive layer 52 that are distributed along a direction away from the display panel 1. The conductive layer 52 includes a shielding portion 521 and a leading-out portion 522 that are electrically connected to each other, and the first insulation layer 521 exposes at least partial region of the leading-out portion 522. The orthographic projection of the shielding portion 521 on the display panel 1 is located within the orthographic projection of the circuit board 3 on the display panel 1, the orthographic projection of the leading-out portion 522 on the display panel 1 is located outside the orthographic projection of the circuit board 3 on the display panel 1, and the leading-out portion 522 is electrically connected to the supporting layer 2.
According to the display apparatus of the embodiment of the present disclosure, the circuit board 3 is configured to drive the display panel 1 to emit light, so as to display an image. Since the shielding layer 5 is overlaid on the side of the circuit board 3 away from the display panel 1, the first insulation layer 51 is located between the conductive layer 52 and the circuit board 3, and the conductive layer 52 is electrically connected to the supporting layer 2, static electricity can be exported to the supporting layer 2 through the conductive layer 52, and the conducting path of static electricity from the outside of the display device to the circuit board 3 is blocked by the conductive layer 52 and the supporting layer 2, thus preventing interference of external static electricity on the circuit board 3, avoiding display abnormality caused by static electricity interference on the display apparatus, and ensuring the display effect. Meanwhile, since the leading-out portion 522 of the conductive layer 52 is located on the outside of the circuit board 3, and is opposite to the supporting layer 2, there is a relatively low requirement for alignment accuracy, which is convenient to install.
The structure for implementing the display function of the display apparatus in the present disclosure will be described in detail below.
As shown in
The display panel 1 may include a driving back plate 11 and a light-emitting layer 12, and the light-emitting layer 12 is provided on a side of the driving back plate 11. The light-emitting layer 12 includes a plurality of light-emitting devices, and the side of the driving back plate 11 away from the light-emitting layer 12 is the backlight side of the display panel 1.
The driving back plate 11 may include a substrate and a driving circuit layer. The substrate is of a plate-like structure. The material of the substrate may be a hard material such as glass, or may be a soft material such as polyimide. The substrate is away from the light-emitting layer 12, and the driving circuit layer may be provided on a side of the substrate and includes a driving circuit. As shown in
The peripheral circuit is located in the peripheral region 102, and the peripheral circuit is connected to the pixel circuit and configured to input a driving signal to the pixel circuit, so as to control the light-emitting device to emit light. The peripheral circuit is connected to the pixel circuit, and includes a light-emitting control circuit, a gate driving circuit, a source driving circuit, and a power circuit, etc. The structure of the peripheral circuit is not specifically limited here.
The above driving circuit layer may include a plurality of thin film transistors and a capacitor, where the thin film transistor may be a top gate type thin film transistor or a bottom gate type thin film transistor. Each thin film transistor may include an active layer, a gate, a source, and a drain, where the gate may be a dual gate or a single gate. The active layer of each thin film transistor is provided on the same layer. The gates are provided on the same layer, and both the source and the drain are provided on the same layer, so as to simplify the process.
Taking the top gate type thin film transistor as an example, the driving circuit layer may include an active layer, a first gate insulation layer, a gate, a second gate insulation layer, an interlayer dielectric layer, a source and drain layer, and a flat layer. The active layer is provided on a side surface of the substrate, and the first gate insulation layer covers the active layer and the substrate; the gate is provided on the surface of the first gate insulation layer away from the substrate, and is opposite to the active layer; the second gate insulation layer covers the gate and the first gate insulation layer; the interlayer dielectric layer covers the second gate insulation layer; the source and drain layer is provided on the surface of the interlayer dielectric layer away from the substrate, and includes a source and a drain; the source and the drain are connected to two ends of the active layer through contact holes; and, the flat layer covers the source and drain layer and the interlayer dielectric layer. Certainly, the driving circuit layer may further include other film layers, as long as the light-emitting device can be driven to emit light, which is not described in detail here.
As shown in
The first electrode may be provided on a side of the flat layer away from the substrate and connected to a pixel circuit through a contact hole. The light-emitting functional layer may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer, and an electron injection layer that are sequentially stacked along a direction away from the driving back plate 11. The second electrode may cover the light-emitting functional layer, and extend to the peripheral region 102. The specific principle of the OLED to emit light will not be described in detail here.
In addition, in order to conveniently define the range of each light-emitting device, the light-emitting layer 12 may further include a pixel definition layer. The pixel definition layer may be provided together with the first electrode on the surface of the driving circuit layer away from the substrate, and provided with a plurality of openings exposing each first electrode in one-to-one correspondence. The light-emitting function layer is stacked on a region of the first electrode that is located within the opening. The light-emitting functional layers of each light-emitting device are spaced apart from each other. The light-emitting colors of different light-emitting functional layers may be different. The second electrode covers the light-emitting functional layer, so that each light-emitting device may share the same second electrode. Each light-emitting device may be defined by the above plurality of openings, and the boundary of any light-emitting device is the boundary of the light-emitting functional layer within the opening corresponding to the light-emitting device.
In some embodiments of the present disclosure, the light-emitting functional layer of each light-emitting device may belong to the same continuous light-emitting film layer. The light-emitting film layer covers each first electrode and the surface of the pixel definition layer away from the substrate simultaneously. The light-emitting film layer is located in the opening, the region of the light-emitting film layer stacked on the first electrode is the light-emitting functional layer of the light-emitting device, and the two adjacent light-emitting functional layers are connected to each other through other regions of the light-emitting film layer. That is, each light-emitting device may share the light-emitting film layer, so that the light-emitting color of each light-emitting device is the same. Correspondingly, in order to achieve color display, a color film layer may be provided on a side of the light-emitting layer 12 away from the driving back plate 11. The color film layer has a plurality of light-filtering portions, each light-filtering portion is provided in one-to-one correspondence with the light-emitting unit, and the colors of lights that may be transmitted through different light-filtering portions may be different, so that color display may be achieved through the color film layer matching with the light-emitting layer 12.
In addition, the display panel 1 may further include a encapsulation layer, which may be overlaid on the surface of the light-emitting layer 12 away from the driving back plate 11 and cover all the light-emitting devices, thus protecting the light-emitting layer 12 and preventing external water and oxygen from eroding the light-emitting devices. At the same time, the boundary of the encapsulation layer extends into the peripheral region 102, but does not exceed the peripheral region 102, and may protect the peripheral circuit of the peripheral region 102.
In some embodiments of the present disclosure, the encapsulation may be implemented by using thin-film encapsulation (TFE). The encapsulation layer may include a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer is overlaid on the surface of the light-emitting layer 12 away from the driving back plate 11, the organic layer may be provided on the surface of the first inorganic layer away from the driving back plate 11, and the boundary of the organic layer is defined on the inner side of the boundary of the first inorganic layer. The second inorganic layer covers the organic layer and the first inorganic layer that is not covered by the organic layer, thus blocking intrusion of water and oxygen through the second inorganic layer, and achieving planarization through the flexible organic layer.
In addition, the display panel 1 may further include a transparent cover plate, which may be overlaid on the side of the encapsulation layer away from the driving back plate 11; or, if the color film layer is present in the display panel 1, the transparent cover plate is overlaid on the side of the color film layer away from the driving back plate 11.
As shown in
As shown in
In order to realize that the circuit board 3 is provided on the side of the supporting layer 2 away from the display panel 1 when the peripheral region 102 of the display panel 1 is connected to the circuit board 3, as shown in
As shown in
Certainly, in other embodiments of the present disclosure, the circuit board 3 may be electrically connected to the display panel 1 in other manners, as long as the circuit board 3 can be located on the side of the supporting layer 2 away from the display panel 1 while the electrical connection is realized.
As shown in
The substrate 31 may be made of an insulating material, and for the flexible printed circuit 3, the substrate 31 may be made of a flexible material such as polyimide. The circuit layer 32 may be provided on the side of the substrate 31 close to the display panel 1, and the pattern of and the electronic device included in the circuit layer 32 are not specifically limited here. The protecting layer 33 may cover the circuit layer 32, and the protecting layer 33 is made of an insulating material to prevent the circuit layer 32 from contacting the outside.
The solution for implementing the electrostatic shielding function of the display panel 1 of the present disclosure will be described in detail below.
As shown in
As shown in
The first insulation layer 51 is overlaid on at least partial region of the surface of the circuit board 3 away from the display panel 1; the material of the first insulation layer 51 may be a polyester material, such as polyimide, or, it may also be other insulating materials. The first insulation layer 51 may completely cover the circuit board 3, and may also only cover a partial region of the circuit board 3. Furthermore, in some embodiments of the present disclosure, the orthographic projection of the first insulation layer 51 on the display panel 1 is located within the orthographic projection of the circuit board 3 on the display panel 1; that is, the boundary of the first insulation layer 51 is limited by the boundary of the circuit board 3, and the boundary of the first insulation layer 51 is at most aligned with the boundary of the circuit board 3 without exceeding the boundary of the circuit board 3.
The conductive layer 52 is provided on the side of the first insulation layer 51 away from the display panel 1, and the conductive layer 52 can be separated from the circuit board 3 by the first insulation layer 51, thus avoiding that the circuit board 3 is short-circuited by the conductive layer 52 due to the fact that the circuit board 3 is electrically connected to the conductive layer 52. At the same time, the conductive layer 52 may be electrically connected to the supporting layer 2 to export external static electricity. Specifically, the conductive layer 52 may include a shielding portion 521 and a leading-out portion 522.
The orthographic projection of the shielding portion 521 on the display panel 1 is located within the orthographic projection of the circuit board 3 on the display panel 1; that is, the range of the shielding portion 521 does not exceed the boundary of the circuit board 3. Meanwhile, the boundary of the shielding portion 521 may be aligned with the boundary of the first insulation layer 51, or may be located within the boundary of the first insulation layer 51; that is, the first insulation layer 51 completely covers the shielding portion 521, thus avoiding that the shielding portion 521 is in direct contact with the circuit board 3, and preventing the circuit board 3 from being short-circuited due to the contact of the shielding portion 521 with the circuit board 3.
As shown in
The material of the conductive layer 52 may be at least one of a conductive adhesive or a conductive fabric; the conductive adhesive may include a base material and conductive particles in the base material such as metal particles; and, the conductive fabric may be a conductive cloth. The conductive layer 52 may also adopt other materials as long as the conductive effect can be achieved.
The leading-out portion 522 not covered by the first insulation layer 51 may be electrically connected to the supporting layer 2 to form a path for conducting the electrostatic. Furthermore, in order to facilitate the connection, the leading-out portion 522 may be bent toward a direction close to the supporting layer 2, so that the distance between the leading-out portion 522 and the supporting layer 2 is less than the distance between the shielding portion 521 and the supporting layer 2, and the leading-out portion 522 may be directly attached to the supporting layer 2 to achieve electrical connection; or the leading-out portion 522 may be electrically connected to the supporting layer 2 through the conductive medium 6. For example, if the material of the conductive layer 52 is a conductive adhesive, the leading-out portion 522 may be directly bent toward the supporting layer 2, so that the leading-out portion 522 is attached and bonded to the supporting layer 2. If the material of the conductive layer 52 is a conductive cloth or other conductive material, the leading-out portion 522 may be electrically connected to the supporting layer 2 through the conductive medium 6, and the conductive medium 6 may be a conductive adhesive. No matter whether the leading-out portion 522 and the supporting layer 2 are electrically connected using the conductive medium 6, the leading-out portion 522 may be bent toward the supporting layer 2.
On the basis of shielding external static electricity through the shielding layer 5 in the above embodiments, static electricity inside the circuit board 3 can also be exported, thus preventing interference to the circuit board 3. Therefore, as shown in
The shielding layer 5 of the present disclosure may further include other film layers, and examples will be described below.
As shown in
As shown in
As shown in
According to embodiments of the present disclosure, there is further provided a method for manufacturing a display apparatus, the display apparatus may be a display apparatus according to any of the above embodiments, and the structure of the display apparatus is not described in detail here. The manufacturing method may include steps S110 to S150.
In step S110, a display panel, a circuit board and a shielding layer are formed. The shielding layer includes a first insulation layer and a conductive layer located on a side of the first insulation layer. The conductive layer includes a shielding portion and a leading-out portion that are electrically connected to each other. The first insulation layer exposes at least partial region of the leading-out portion.
In step S120, a supporting layer is formed on the backlight side of the display panel.
In step S130, the circuit board is connected to the display panel, and the circuit board is provided on the backlight side of the display panel.
In step S140, the shielding layer is overlaid on a side of the circuit board away from the display panel, so that the first insulation layer and the conductive layer are distributed along a direction away from the display panel. The orthographic projection of the shielding portion on the display panel is located within the orthographic projection of the circuit board on the display panel, and the orthographic projection of the leading-out portion on the display panel is located outside the orthographic projection of the circuit board on the display panel.
In step S150, the leading-out portion is electrically connected to the supporting layer.
The specific structure and beneficial effects of the display apparatus involved in the above steps have been described in detail in the embodiments of the above display apparatus, and details are not described here again.
It should be noted that, although the various steps of the manufacturing method in the present disclosure are described in a specific order in the drawings, however, this does not require or imply that these steps must be performed in this specific order, or that all of the illustrated steps must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, a plurality of steps may be combined into one step to be performed, and/or one step may be decomposed into a plurality steps to be performed, etc.
Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure following the general principles of the present disclosure and including common general knowledge or conventional technical means in the art not disclosed in the present disclosure. The specification and embodiments may be considered as examples only, with a true scope and spirit of the disclosure being indicated by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202110856050.X | Jul 2021 | CN | national |
The present disclosure is based upon International Application No. PCT/CN2022/103740, filed on Jul. 4, 2022, and claims priority to Chinese Patent Application No. 202110856050.X entitled “Display apparatus and manufacturing method therefor”, filed on Jul. 28, 2021, and the entire contents of both of which are incorporated herein by reference.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2022/103740 | 7/4/2022 | WO |
