Patent Application
20190237531
The described embodiments relate to a display technology, and more particularly, to a display device and a manufacturing method thereof, and a display panel.
Referring to
In order to achieve a higher screen ratio and improve the appearance quality of the product, it has become an industry trend to design a borderless and bezel free for the display device using the above-mentioned display panel 10. For this trend, some of the driving wiring 13 may be hidden behind the active area 11, but it is difficult to meet high resolution (high pixels per inch) design requirements. Here, the industry also offers the following two borderless designs.
So that the existing borderless and bezel free designs still need to be improved.
The present disclosure provides a display device and a manufacturing method thereof, and a display panel. The borderless and bezel free designs may be improved.
In order to solve the above-mentioned technical problem, a technical solution adopted by the present disclosure is to provide a display panel including: a substrate defining a through hole; a driving wiring carried on the substrate; a solder pad being arranged on a back surface of the substrate; wherein a first end of the driving wiring is located on a front surface of the substrate, and a second end of the driving wiring is connected to the solder pad via the through hole.
In order to solve the above-mentioned technical problem, a technical solution adopted by the present disclosure is to provide a display device including a circuit board and a display panel; the display panel including: a substrate defining a through hole; a driving wiring carried on the substrate; a solder pad being arranged on a back surface of the substrate; wherein a first end of the driving wiring is located on a front surface of the substrate, and a second end of the driving wiring is connected to the solder pad via the through hole; wherein the circuit board is connected to the solder pad of the display panel.
In order to solve the above-mentioned technical problem, a technical solution adopted by the present disclosure is to provide a manufacturing method for a display device including: providing a base substrate; forming a first conductive pattern on the base substrate; forming a substrate defining a through hole, and the substrate covering the first conductive pattern on the base substrate; and the through hole being configured to expose the first conductive pattern; forming a second conductive pattern on the substrate, and the second conductive pattern filling the through hole to connect to the first conductive pattern; forming a thin-film transistor on the second conductive pattern, and the thin-film transistor being connected to the second conductive pattern; forming a light emitting unit connected to the thin-film transistor; separating the substrate from the base substrate; arranged a circuit board on a surface of the substrate opposite to the second conductive pattern, and the circuit board being connected to the first conductive pattern.
Advantages of the disclosure may follow. As compared with the related art, the present disclosure may provide a through hole opened on a substrate, and a driving wiring is guided to be connected a back surface of the substrate via the through hole, i.e., a wiring bonding portion may be arranged on the back surface of the substrate, instead of a non-active area of the display panel. So that the borderless and bezel free designs may be improved.
The detailed description set forth below is intended as a description of the subject technology with reference to the appended figures and embodiments. It is understood that the embodiments described herein include merely some parts of the embodiments of the present disclosure, but do not include all the embodiments. Based on the embodiments of the present disclosure, all other embodiments that those skilled in the art may derive from these embodiments are within the scope of the present disclosure.
In the non-active area 42, the substrate 43 may define a plurality of through holes 431, and the plurality of through holes 431 may be arranged around the active area 41. A solder pad 432 may be arranged on a back surface of the substrate 43. A first end 441 of the driving wiring 44 may be located on a front surface of the substrate 41, and a second end 442 of the driving wiring 44 may be connected to the solder pad 432 via the through hole 431, i.e., the driving wiring 44 may be passed out the through 431 and may be guided to the back surface of the substrate 43.
As shown in
In the present embodiment, the display device 60 may be a flexible active-matrix organic light emitting diode (AMOLED) display device. The display panel 40 may be a flexible display, and the substrate 43 may be a bendable flexible substrate made of a material of the substrate is polyimide (PI).
The strain sensor 433 may adopt a conductive wiring arranged in a serpentine route manner. The conductive wiring may include a third end 4331 and a fourth end 4332; and the solder pad 432 may include a first solder pad 4321 and a second solder pad 4322. The third end 4331 of the conductive wiring may be connected to the first solder pad 4321, and the fourth end 4332 of the conductive wiring may be connected to the second solder pad 422. A material of the conductive wiring may be metal, when the conductive wiring is stressed, a length of the conductive wiring may be changed, and a resistance value of the conductive wiring may be also changed. As long as the resistance value of the conductive wiring is measured, a deformation of the display panel 40 may be determined in time.
The present disclosure also provides a manufacturing method for a display device in accordance with an embodiment. Referring to
S81: a base substrate may be provided.
A base substrate 90 may be a light transmissive substrate such as a glass substrate, a plastic substrate, and a flexible substrate.
S82: a first conductive pattern may be formed on the base substrate.
In the present embodiment, a whole surface metal layer covering the base substrate 90 may be formed by a physical vapor deposition (PVD) process. A material of the metal layer may be metal, such as molybdenum (Mo), titanium (Ti), aluminum (Al), and silver (Ag). Then, a first conductive pattern 91 may be formed by etching the metal layer by a patterning process.
S83: a substrate defining a through hole and covering the first conductive pattern may be formed on the base substrate, and the through hole may be configured to expose the first conductive pattern.
In the present embodiment, a PI layer may be coated on the base substrate 90 by a chemical vapor deposition (CVD) process, and a substrate 92 may be formed by baking the PI layer. The substrate 92 may be a flexible structure covering a whole surface of the base substrate 90, and the substrate 92 may have a uniform thickness. The substrate 92 may completely cover the base substrate 90 and the first conductive pattern 91, simultaneously. In the present embodiment, a through hole 921 may be defined on a predetermined position above the first conductive pattern 91 by any one of methods of laser drilling, dry etching, or chemical etching.
In an application scenario in which the through hole 921 is formed by an etching process, in the present embodiment, the etching process may be regarded as a selective etching process, i.e., etching solution or etching gas may only react with the PI layer on the substrate 92. In the etching process, when the substrate 92 is completely penetrated to reach the first conductive pattern 91, the etching process may be stopped.
S84: a second conductive pattern may be formed on the substrate, and the second conductive pattern may fill the through hole to connect to the first conductive pattern.
A material of a second conductive pattern 93 and a material of the first conductive pattern 91 may be same, and a forming process of the second conductive pattern 93 and a forming process of the first conductive pattern 91 may be same. The second conductive pattern 93 may further fill the through hole 921 to connect the first conductive pattern 91, so that an upper and a lower sides of the substrate 92 may be electrically connected.
S85: a thin-film transistor may be formed on the second conductive pattern, and the thin-film transistor may be connected to the second conductive pattern.
Structures and processes of the TFT may be referred to the related art. A source, a drain, and a gate of the TFT may be both connected to the second conductive pattern 93. In the present embodiment, a through hole may be defined on a predetermined position of a structural layer 94 by etching, and the structural layer 94 is where the TFT is located. Then, a metal depositing process and a patterning process may be performed in the through hole, so that a driving wiring located on a front surface of the substrate 92 may be guided to a back surface of the substrate 92.
S86: a light emitting unit may be formed to be connected to the thin-film transistor.
In the present embodiment, a light emitting unit 95 may be formed by an evaporation process.
S87: the substrate may be separated from the base substrate.
In the present embodiment, before the block S82, fluoroalkyl silanes (FAS) may be coated on the base substrate 90, to be a peeling film. A mechanical de-bonding method may be adopted to separate the substrate 92 from the base substrate 90. Further, after the substrate 92 is separated from the base substrate 90, because of the peeling film, the first conductive pattern 91 may attach to the substrate 92 without remaining on the base substrate 90.
S88: a circuit board may be arranged on a surface of the substrate opposite to the second conductive pattern, and the circuit board may be connected to the first conductive pattern.
The substrate 92 may be flipped by 180 degrees, and the circuit board 96 may be soldered to the first conductive pattern 91 on a back surface of the substrate 92. Then, a back plate 97, a polarizer 98 and a cover window 99 may be assembled, to obtain the display device.
In the present embodiment, the first conductive pattern 91 may correspond to a portion of the driving wiring 44 located on the back surface of the substrate 43 shown in
It is understood that the descriptions above are only embodiments of the present disclosure. It is not intended to limit the scope of the present disclosure. Any equivalent transformation in structure and/or in scheme referring to the instruction and the accompanying drawings of the present disclosure, and direct or indirect application in other related technical field, are included within the scope of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201810083305.1 | Jan 2018 | CN | national |
The present application is a continuation-application of International (PCT) Patent Application No. PCT/CN2018/092108, filed on Jun. 21, 2018, which claims foreign priority of Chinese Patent Application No. 201810083305.1, filed on Jan. 29, 2018 in the State Intellectual Property Office of China, the entire contents of which are hereby incorporated by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2018/092108 | Jun 2018 | US |
| Child | 16109803 | US |
