BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention generally relates to a display device and a manufacturing method thereof. More particularly, this invention relates to a display device with a flexible substrate and a manufacturing method thereof.
2. Description of the Prior Art
With the progress of manufacturing technique, various display devices are provided. Considering the requirement of being light, thin, short, small, and portable, the next generation display devices tend to be rollable and easily to carry, thus the flexible display devices are very common. Generally speaking, flexible display devices are soft and rollable, hence could be rolled up or folded for storage or transportation when not in use. Moreover, flexible display devices could be easily disposed on a non-planar surface to provide different visual experiences.
As the prior art shown in FIG. 1A, a conventional flexible display device 80 includes a flexible substrate 10, a display layer 30, a protecting layer 50, and an electronic unit 70. The flexible substrate 10 has a carrying surface 11. The display layer 30 is disposed on the carrying surface 11. The protecting layer 50 is disposed on the opposite side of the display layer 30 with respect to the carrying surface 11. The electronic unit 70 is disposed on the carrying surface 11. In the manufacturing process, the flexible display device 80 is usually carried by a glass substrate 20 and is picked up after the process is complete.
As shown in FIGS. 1B and 1C, because the flexible substrate is flexible and a space 40 exists between the display layer 30 and the electronic unit 70, over-bending of the flexible substrate 10 in local area due to its insufficient strength may occur when picking up the flexible display device from the glass substrate 20. The local area could be, for example but not limited to, the boundary between the flexible substrate 10 and the side of the electronic unit 70 that faces the display layer 30 as shown in FIG. 1B, and the boundary between the display layer 30 and the flexible substrate 10 as shown in FIG. 1C. Thus, the conventional flexible display device 80 breaks down easily in the manufacturing process. The conventional flexible display device 80 and the manufacturing method thereof are still improvable.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a display device not easily breaking down during the manufacturing process.
It is an object of the present invention to provide a display device manufacturing method for reducing the breaking down of the display device in the manufacturing process.
The display device of the present invention includes a flexible substrate, a display layer, a protecting layer, an electronic unit, and a filling glue. The flexible substrate has a carrying surface.
The display layer is disposed on the carrying surface, wherein the display layer has an end surface. The protecting layer is disposed on the opposite side of the display layer corresponding to the carrying surface. The electronic unit is disposed on the carrying surface, wherein the electronic unit forms a space with the end surface of the display layer. The filling glue is filled in the space and connected with the end surface of the display layer, the electronic unit, and the carrying surface.
The Young's modulus of the filling glue and the Young's modulus are substantially the same or less than 15% in the difference between the two. The Young's modulus of the filling glue could be between the Young's modulus of the display layer and the Young's modulus of the flexible substrate.
The protecting layer has an end surface not exceeding the end surface of the display layer, wherein the filling glue covers a portion of the protecting layer. The filling glue covers a portion of the electronic unit. The filling glue surrounds the electronic unit. A circuit is formed on the carrying surface, wherein the circuit is coupled to the circuit, wherein the circuit within the space is covered by the filling glue. The display device further comprises a circuit board coupled to the circuit, wherein the electronic unit is disposed between the circuit board and the end surface of the display layer, wherein the filling glue is filled between the electronic unit and the circuit board. The filling glue covers a portion of the circuit board.
The protecting layer includes an end surface extending out of the end surface of the display layer, the portion of the end surface of the protecting layer extending out of the end surface of the display layer forms an interlayer channel with the carrying surface along the extending direction of the end surface of the display layer, a portion of the filling glue is contained in the interlayer channel. The ratio between the length of the portion of the end surface of the protecting layer extending out of the end surface of the display layer and the thickness of the display layer is between 9.31 and 12.42. The display device further comprises a first isolating glue strip at least partially disposed along one side of the interlayer channel, wherein the isolating glue strip connects the portion of the end surface of the protecting layer extending out of the end surface of the display layer with the carrying surface to isolate the filling glue within the interlayer channel from the filling glue out of the interlayer channel, wherein the viscosity of the first isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening.
In the process of manufacturing the display device, a dicing line is formed on the carrying surface, wherein one end of the interlayer channel intersects the dicing line, wherein the filling glue contained in the interlayer channel does not reach the dicing line. The display device further comprises a second isolating glue strip surrounding the electronic unit, wherein one end of the first isolating glue strip closer to the electronic unit extends to connect with the second isolating glue strip, wherein the viscosity of the second isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening. The end surface of the display layer includes two protruding parts disposed apart and facing to each other, wherein the electronic unit is disposed between the protruding parts, wherein the interlayer channel and the first isolating glue strip are disposed along the sides of the protruding parts facing the electronic unit. The display device further comprises a third isolating glue strip disposed on the carrying surface, wherein the two opposite ends of the third isolating glue strip respectively connect to the first isolating glue strip extending from the side of the two protruding parts to enclose an area, wherein the viscosity of the third isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening.
A dicing line is formed on the carrying surface, wherein one end of the interlayer channel extends toward the dicing line, wherein the protecting layer and the display layer are cut to even at or close to the intersection of the interlayer channel and the dicing line to break off the interlayer channel. The end surface of the display layer includes two protruding parts disposed apart and facing to each other, wherein the electronic unit is disposed between the protruding parts, wherein the interlayer channel is disposed along the sides of the protruding parts facing the electronic unit and is broke off at the bottom end of the protruding parts. The display device further comprises a third isolating glue strip disposed on the carrying surface, wherein the two opposite ends of the third isolating glue strip respectively connect to the places that the interlayer channel extending along the sides of the two protruding parts breaks off to enclose an area, wherein the viscosity of the third isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening.
A dicing line is formed on the carrying surface, wherein one end of the interlayer channel extends toward the dicing line, wherein the protecting layer forms an opening at or close to the intersection of the interlayer channel and the dicing line to break off the interlayer channel. The end surface of the display layer includes two protruding parts disposed apart and facing to each other, wherein the electronic unit is disposed between the protruding parts, wherein the interlayer channel is disposed along the sides of the protruding parts facing the electronic unit and is broke off at the bottom end of the protruding parts.
The display device further comprises an isolating glue block disposed on the carrying surface, wherein one end of the interlayer channel extends toward the dicing line, wherein the isolating glue block is disposed at or close to the intersection of the interlayer channel and the dicing line to break off the interlayer channel, wherein the viscosity of the isolating glue block before hardening is greater than the viscosity of the filling glue before hardening.
The protecting layer has an end surface, wherein the end surface of the display layer exceeds the end surface of the protecting layer, wherein the filling glue covers a portion of the display layer. The ratio between the length of the portion of the end surface of the display layer extending out of the end surface of the protecting layer and the thickness of the display layer is between 18.63 and 31.05.
The filling glue is a glue body capable of absorbing energy to transform from liquid state to solid state. The filling glue can be a film capable of bended and inserted into to fill the space. The film forms a concave part in the space when the film is inserted into to fill the space, wherein the top face of the concave part is as high as the protecting layer.
The filling glue includes a glue body and a film. The glue body is filled in the space and connected with the end surface of the display layer, the electronic unit, and the carrying surface, wherein the glue body is capable of absorbing energy to transform from liquid state to solid state. The film covers and adheres to a portion of the protecting layer and the glue body.
The display device manufacturing method, comprising: forming a dicing line on a carrying surface of a flexible substrate; disposing a display layer on the carrying surface, wherein the display layer has an end surface; forming a protecting layer on the opposite side of the display layer corresponding to the carrying surface, wherein the protecting layer has an end surface; disposing an electronic unit on the carrying surface to form a space with the display layer, wherein the electronic unit and the display layer are disposed at the same side of the dicing line; filling a filling glue in the space, wherein the filling glue is connected with the end surface of the display layer, the electronic unit, and the carrying surface; and taking a portion of the flexible substrate carrying the display layer and the electronic unit out form the dicing line.
The step of forming the protecting layer includes making the end surface of the protecting layer not exceed the end surface of the display layer, wherein the step of filling the filling glue includes making the filling glue partially overflow the space and covers the protecting layer. The step of filling the filling glue includes making the filling glue partially overflow the space and covers the electronic unit. The step of filling the filling glue includes making the filling glue surround the electronic unit. The step of forming the protecting layer includes making the end surface of the protecting layer extend out of the end surface of the display layer, wherein the portion of the end surface of the protecting layer extending out of the end surface of the display layer forms an interlayer channel with the carrying surface along the extending direction of the end surface of the display layer, wherein the step of filling the filling glue includes making the filling glue contained in the interlayer channel.
The method further comprises disposing a first isolating glue strip at least partially along one side of the interlayer channel, wherein the isolating glue strip connects the portion of the end surface of the protecting layer extending out of the end surface of the display layer with the carrying surface to isolate the filling glue within the interlayer channel from the filling glue out of the interlayer channel, wherein the viscosity of the first isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening. The step of filling the filling glue includes determining the filling amount of the filling glue to control the amount of the filling glue filled into the interlayer channel. The method further comprises disposing a second isolating glue strip surrounding the electronic unit, wherein one end of the first isolating glue strip closer to the electronic unit extends to connect with the second isolating glue strip, wherein the viscosity of the second isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening.
The end surface of the display layer includes two protruding parts disposed apart and facing to each other, wherein the electronic unit is disposed between the protruding parts, wherein the interlayer channel and the first isolating glue strip are disposed along the sides of the protruding parts facing the electronic unit, wherein the method further comprising disposing a third isolating glue strip on the carrying surface, wherein the two opposite ends of the third isolating glue strip respectively connect to the first isolating glue strip extending from the side of the two protruding parts to enclose an area, wherein the viscosity of the third isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening.
The step of forming the protecting layer includes: making one end of the interlayer channel extend toward the dicing line; and cutting the protecting layer and the display layer to even at or close to the intersection of the interlayer channel and the dicing line to break off the interlayer channel. The end surface of the display layer includes two protruding parts disposed apart and facing to each other, wherein the electronic unit is disposed between the protruding parts, wherein the interlayer channel is disposed along the sides of the protruding parts facing the electronic unit and is broke off at the bottom end of the protruding parts, wherein the method further comprising disposing a third isolating glue strip on the carrying surface, wherein the two opposite ends of the third isolating glue strip respectively connect to the places that the interlayer channel extending along the sides of the two protruding parts breaks off to enclose an area, wherein the viscosity of the third isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening.
The step of forming the protecting layer includes: making one end of the interlayer channel extend toward the dicing line; and forming an opening on the protecting layer at or close to the intersection of the interlayer channel and the dicing line to break off the interlayer channel.
The step of forming the protecting layer includes making the end surface of the protecting layer shrink from the end surface of the display layer, wherein the step of filling the filling glue includes making the filling glue cover the display layer. The step of filling the filling glue includes filling a glue body in the space and connecting with the end surface of the display layer, the electronic unit, and the carrying surface, wherein the glue body is capable of absorbing energy to transform from liquid state to solid state. The step of filling the filling glue includes taking a film capable of bended as the filling glue and inserting the film into to fill the space. The step of filling the filling glue includes: filling a glue body in the space and connecting with the end surface of the display layer, the electronic unit, and the carrying surface; applying energy onto the glue body to transform the glue body from liquid state to solid state; and covering and adhering a film to a portion of the protecting layer and the glue body.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A to 1C are schematic views of prior arts;
FIG. 2A is a schematic view of the preferred embodiment of the display device of the present invention;
FIG. 2B is a schematic view of an embodiment of the display device of the present invention disposed on a carrying substrate;
FIG. 3 is a schematic view of an embodiment of the display device of the present invention picked up from the carrying substrate;
FIG. 4 is a top view of the preferred embodiment of the display device of the present invention;
FIG. 5 is a schematic view of an embodiment of the display device of the present invention, wherein the end surface of the protecting layer extends out of the end surface of the display layer;
FIG. 6A is a schematic view of an embodiment of the display device of the present invention after the filling of the filling glue;
FIG. 6B is a cross-sectional view of an embodiment of the display device of the present invention after the filling of the filling glue;
FIG. 7 is a schematic view of an embodiment of the display device of the present invention, wherein the end surface of the display layer includes two protruding parts disposed apart and facing to each other;
FIG. 8A is a schematic view of an embodiment of a display device of the present invention;
FIG. 8B is a schematic view of another embodiment of a display device of the present invention;
FIG. 9 is a schematic view of another embodiment of a display device of the present invention;
FIG. 10 is a schematic view of another embodiment of a display device of the present invention;
FIGS. 11A-11C are schematic views of different embodiments of the display device of the present invention, wherein the protecting layer retreats from the end surface of the display layer;
FIG. 12 is a flow chart of the preferred embodiment of the display device manufacturing method of the present invention; and
FIGS. 13A and 13B are flow charts of different embodiments of the display device manufacturing method of the present invention
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
The present invention provides a display device and a manufacturing method thereof, wherein the display device is a flexible display using a flexible substrate. More particularly, the flexible substrate is made of materials such as tin, 430 stainless steel, or polyimide (PI). The flexible display is a display device having flexibility such as OLED display or electronic paper.
As the preferred embodiment shown in FIG. 2A, the display device 800 of the present invention includes a flexible substrate 100, a display layer 300, a protecting layer 500, an electronic unit 700, and a filling glue 900. The flexible substrate 100 has a carrying surface 110. The display layer 300 is disposed on the carrying surface 110, wherein the display layer 300 has an end surface 310. The protecting layer 500 is disposed on the opposite side of the display layer 300 with respect to the carrying surface 110. The electronic unit 700 is disposed on the carrying surface 110, wherein a space 400 is formed between the electronic unit 700 and the end surface 310 of the display layer 300. The filling glue 900 is filled in the space 400 and connected with the end surface 310 of the display layer 300, the electronic unit 700, and the carrying surface 110. In other words, the end surface 310 of the display layer 300, the electronic unit 700, and one side of the carrying surface 110 respectively form three faces of the space 400, wherein the filling glue 900 filled in the space 400 is connected with the three faces. The filling glue 900 is a glue body capable of absorbing energy to transform from liquid state to solid state. In other words, the filling glue 900 is a liquid that can be solidified by methods such as UV light illuminating or heating. More particularly, in the manufacturing process, the filling glue 900 is filled into the space 400 in liquid state and then solidified. During the manufacturing process, as shown in FIG. 2B, the display device 800 is preferably disposed on a carrying substrate 200. When the carrying substrate is a light-transmittable substrate such as a glass substrate, light is able to transmit through the carrying substrate 200 to solidify the filling glue 900.
Since the space 400 between the display layer 30 and the electronic unit 70 is filled with the filling glue 900, over-bending of the flexible substrate 100 in local area due to its insufficient strength can be prevented when the flexible display device 800 is picked up from the substrate 200, which can be made of glass or aluminum, for example. The local area could be, for example but not limited to, the boundary between the end surface 310 of the display layer 300 and the flexible substrate 100, and the boundary between the flexible substrate 100 and the side of the electronic unit 700 that faces the end surface 310 of the display layer 300. Thus, the breaking down of the display device in the manufacturing process can be reduced.
The Young's modulus of the filling glue 900 and the Young's modulus of the display layer 300 are substantially the same or less than 15% in difference between the two, or the Young's modulus of the filling glue 900 could be between the Young's modulus of the display layer 300 and the Young's modulus of the flexible substrate 100.
More specifically, the filling glue 900 is preferably an object having a certain elasticity, hence the display layer 300 and the protecting layer 500 can shift toward the space 400 to a limited extent. In other words, the display device 800 can bend to a limited extent, instead of losing flexibility due to the disposition of the filling glue 900 in the space 400. On the other hand, by connecting with the end surface 310 of the display layer 300, the electronic unit 700, and the carrying surface 110, the position of the filling glue 900 with respect to the end surface 310 of the display layer 300, the electronic unit 700, and the carrying surface 110 can be maintained. As such, the flexible substrate 100 can further form a continuous unity with the end surface 310 of the display layer 300, the electronic unit 700, and the carrying surface 110 by such a connection relationship among them.
As the preferred embodiment shown in FIG. 2, the protecting layer 500 has an end surface 510 not exceeding the end surface 310 of the display layer 300, wherein the filling glue 900 covers a portion of the top surface of the protecting layer 500. More particularly, in the preferred embodiment, the end surface 510 of the protecting layer 500 is flush with the end surface 310 of the display layer 300, wherein the filling glue 900 covers the end surface of the protecting layer 500 that is close to the electronic unit 700, i.e. covers the top of the end surface 310 of the display layer 300. By contacting the filling glue 900 with the top surface of the protecting layer 500, the strength of the unity structure can be further enhanced. Similarly, the filling glue 900 preferably covers a portion of the top surface of the electronic unit 700 to reduce the bending of the flexible substrate 100. In other embodiments, however, in order to decrease the material cost of the filling glue 900 or to control the filling amount of the filling glue 900, the filling glue 900 can be filled in the space 400 only, instead of covers on the top surface of the protecting layer 500 and/or the electronic unit 700.
As the preferred embodiment shown in FIG. 4, the filling glue 900 surrounds the electronic unit 700. A circuit 140 is formed on the carrying surface 110, wherein the electronic unit 700 is coupled to the circuit 140. The circuit 140 within the space 400 (shown in FIG. 2) is covered by the filling glue 900 to decrease the possibility of oxidization or damage of the circuit 140 caused by contacting with oxygen, moisture, or other materials. As the preferred embodiment shown in FIGS. 2 and 4, the display device 800 further includes a circuit board 600 coupled to the circuit 140 (shown in FIG. 4), wherein the electronic unit 700 is disposed between the circuit board 600 and the end surface 310 of the display layer 300 (shown in FIG. 2). Similarly, the filling glue 900 is filled between the electronic unit 700 and the circuit board 600 to decrease the possibility of oxidization or damage of the circuit 140 caused by contacting with oxygen, moisture, or other materials. The filling glue 900 covers a portion of the top surface of the circuit board 600 to decrease the bending of the flexible substrate 100.
In a different embodiment, the position of the end surface 510 of the protecting layer 500 with respect to the end surface 310 of the display layer 300 can differ in accordance with different design requirements. As shown in FIG. 5, the protecting layer 500 includes an end surface 510 of the protecting layer 500 extending out of the end surface 310 of the display layer 300. The portion of the of the protecting layer 500510 that extends out of the end surface 310 of the display layer 300 forms an interlayer channel 320 with the carrying surface 110 along the extending direction of the end surface 310 of the display layer 300, wherein a portion of the filling glue 900 is contained in the interlayer channel 320. More particularly, the end surface 310 of the display layer 300, the bottom side 511 of the end surface 510 of the protecting layer 500 that extends out of the of the display layer 300310, and the carrying surface 110 of the flexible substrate 100 respectively form three faces of the interlayer channel 320. In the manufacturing process, when liquid filling glue 900 contacts a portion of the interlayer channel 320, it flows to the other portions of the interlayer 320 due to capillary attraction. The ratio of the length of the portion of the end surface 510 of the protecting layer 500 that extends out of the end surface 310 of the display layer 300 to the thickness of the display layer 300 is preferably between 9.31 and 12.42 to obtain better capillary attraction.
As the top view of the embodiment shown in FIG. 6A and the corresponding P-P′ cross-sectional view shown in FIG. 6B, the end surface 510 of the protecting layer 500 extends out of the end surface 310 of the display layer 300, and the display device 800 further includes a first isolating glue strip 910 at least partially disposed along one side of the interlayer channel 320. The isolating glue strip 910 connects the protecting layer 500 that extends out of the end surface 310 of the display layer 300, such as the end surface 510 of the protecting layer 500, with the carrying surface 110 to isolate the filling glue 900 within the interlayer channel 320 from the filling glue 900 outside the interlayer channel 320. The viscosity of the first isolating glue strip 910 before hardening is greater than the viscosity of the filling glue 900 before hardening. More particularly, in the manufacturing process, a dicing line 120 will be formed on the carrying surface 100 before filling the filling glue, which is benefit to separate and pick up the plurality products (i.e. the display devices) from the carrying substrate 200 after the process is complete. In other words, no dicing line will be shown on the products. When liquid filling glue 900 contacts a portion of the interlayer channel 320, it flows to other portions of the interlayer channel 320 due to capillary attraction. Thus, the dicing line 120 might be covered by the filling glue 900 and the separating and picking up of the plurality products (i.e. the display devices) from the carrying substrate 200 after the process is complete might be effected. The first isolating glue strip 910 can prevent the filling glue 900 from flow to and cover the dicing line 120. Further, as the embodiment shown in FIG. 6A, one end of the first isolating glue strip 910 close to the electronic unit 700 extends to connect electronic unit 700. By extending and connecting to the electronic unit 700, the first isolating glue strip 910 forms a first glue filling area 121 on the carrying surface 100 for filling the filling glue in the manufacturing process. When liquid filling glue 900 contacts a portion of the interlayer channel 320, it flows to other portions of the interlayer 320 due to capillary attraction. Since the range of the first glue filling area 121 is fixed, the filling amount of the liquid filling glue can be controlled by directly filling the filling glue 900 into the first glue filling area 121, to prevent the filling glue 900 from flowing to and covering the dicing line 120 due to excess filling amount of the filling glue 900.
In different embodiments, the shape of the display can differ in accordance with the design requirements. For example, as the embodiment shown in FIG. 7, the end surface 310 of the display layer 300 includes two protruding parts 311 disposed apart and facing to each other, wherein the electronic unit 700 is disposed between the protruding parts 311. In other words, the area of the display layer 300 is increased by the disposition of the protruding parts 311, hence the display area of the display device can be increased.
As the embodiment shown in FIG. 7, the interlayer channel 320 and the first isolating glue strip 910 are disposed along the sides of the protruding parts 311 that face the electronic unit 700. The display device 800 further includes a second isolating glue strip 920 surrounding the electronic unit 700, wherein the viscosity of the second isolating glue strip 920 before hardening is greater than the viscosity of the filling glue 900 before hardening. One end of the first isolating glue strip 910 closer to the electronic unit 700 extends to connect with the second isolating glue strip 920. By extending and connecting to the second isolating glue strip 920, the first isolating glue strip 910 forms a first glue filling area 121 on the carrying surface 100 for filling the filling glue in the manufacturing process. More particularly, when liquid filling glue 900 contacts a portion of the interlayer channel 320, it flows to other portions of the interlayer 320 due to capillary attraction. Since the range of the first glue filling area 121 is fixed, the filling amount and the distribution area of the liquid filling glue can be controlled by directly filling the filling glue 900 into the first glue filling area 121.
As the embodiment shown in FIG. 7, the display device 800 further includes a third isolating glue strip 930 disposed in the area enclosed by the dicing line 120 on the carrying surface 110, wherein the third isolating glue strip 930 does not overlap the dicing line. Two opposite ends of the third isolating glue strip 930 respectively connect to the first isolating glue strip 910 extending along the side of the two protruding parts 311 to enclose an area, such as the second glue filling area 122 shown in FIG. 7. The viscosity of the third isolating glue strip 930 before hardening is greater than the viscosity of the filling glue 900 before hardening. Since the range of the second glue filling area 122 is fixed, the filling amount and the distribution area of the liquid filling glue can be controlled by directly filling the filling glue 900 into the second glue filling area 122.
In different embodiments, the protecting layer is flush with the display layer at or close to the intersection of the interlayer channel and the dicing line to interrupt the interlayer channel, preventing the filling glue from flowing to and covering the dicing line. As the embodiment shown in FIG. 8A, a dicing line 120 is formed on the carrying surface 110, wherein one end of the interlayer channel 320 extends toward the dicing line 120. The end surface 310 of the display layer 300 includes two protruding parts 711 disposed apart and facing to each other, wherein the electronic unit 700 is disposed between the protruding parts 311. The interlayer channel 320 is disposed along the sides of the protruding parts 311 facing the electronic unit 700 and stops at the bottom end of the protruding parts 311. More particularly, as shown in FIG. 5, the bottom side 511 of the end surface 510 of the protecting layer 500 that extends out of the of the display layer 300310, the end surface 310 of the display layer 300, and the carrying surface 110 of the flexible substrate 100 respectively form three faces of the interlayer channel 320. However, as shown in FIG. 8A, the end surface 510 of the protecting layer 500 is flush with the end surface 310 of the display layer 300 at the bottom end of the protruding parts 311 before the interlayer channel 320 intersects the dicing line 120. That is, the end surface 510 of the protecting layer 500 does not extend out of the end surface 310 of the display layer 300 in this position. As such, one face (the bottom side 511 of the end surface 510 of the protecting layer 500 extending out of the end surface 310 of the display layer 300) of forming the interlayer channel 320 no longer exists, therefore the interlayer channel 320 is interrupted at this position, and the capillary attraction does not occur. The display device 800 further includes a third isolating glue strip 930 disposed on the carrying surface 110, wherein the two opposite ends of the third isolating glue strip 930 respectively connect to where the interlayer channel 320 extending along the sides of the two protruding parts 311 is interrupted to enclose an area, e.g. the third glue filling area 123 shown in FIG. 8A. The viscosity of the third isolating glue strip 930 before hardening is greater than the viscosity of the filling glue 900 before hardening. Since the range of the third glue filling area 123 is fixed, the filling amount and the distribution area of the liquid filling glue can be controlled by directly filling the filling glue 900 into the third glue filling area 123.
The above approach that the protecting layer is flush with the display layer at a place close to the intersection of the interlayer channel and the dicing line to interrupt the interlayer channel can also be applied to the embodiment having no protruding parts shown in FIG. 8B. In this embodiment, bevel angles are formed at two corners in the bottom of the protecting 500, wherein the protecting layer 500 is flush with the display layer 300 at the bevel angles and a place close to the intersection of the interlayer channel 320 and the dicing line 120 to interrupt the interlayer channel 320. Accordingly, this approach not only controls the amount of the filling glue filled in to the first glue filling area in the process, but also prevents the filling glue from flowing to and covering the dicing line by interrupting the interlayer channel.
In different embodiments, the protecting layer forms an opening at or close to the intersection of the interlayer channel and the dicing line to interrupt the interlayer channel for preventing the filling glue from flowing to and covering the dicing line. More particularly, as the embodiment shown in FIG. 9, a dicing line 120 is formed on the carrying surface 110, wherein one end of the interlayer channel 320 extends toward the dicing line 120, wherein the protecting layer 500 forms an opening 520 at or close to the intersection of the interlayer channel 320 and the dicing line 120. As shown in FIG. 5, the bottom side 511 of the end surface 510 of the protecting layer 500 that extends out of the end surface 310 of the display layer 300, the end surface 310 of the display layer 300, and the carrying surface 110 respectively form three faces of the interlayer channel 320. Forming the opening 520 will cause that one face (the bottom side 511 of the end surface 510 of the protecting layer 500 extending out of the of the display layer 300310) of forming the interlayer channel 320 no longer exists, the interlayer channel 320 is interrupted, and therefore the capillary attraction does not occur. The end surface 310 of the display layer 300 includes two protruding parts 311 disposed apart and facing to each other, wherein the electronic unit 700 is disposed between the protruding parts 311. The interlayer channel 320 is disposed along the sides of the protruding parts 311 facing the electronic unit 700 and is interrupted by the opening 520 at the bottom end of the protruding parts 311. The display device 800 further includes a third isolating glue strip 930 disposed on the carrying surface 110, wherein the two opposite ends of the third isolating glue strip 930 respectively connect to the openings 520 at the bottom end of the protruding parts 311 to enclose an area, e.g. the third glue filling area 123 shown in FIG. 9. The viscosity of the third isolating glue strip 930 before hardening is greater than the viscosity of the filling glue 900 before hardening. Since the range of the third glue filling area 123 is fixed, the filling amount and the distribution area of the liquid filling glue can be controlled by directly filling the filling glue 900 into the third glue filling area 123.
In different embodiments, the display device further includes an isolating glue block disposed at or close to the intersection of the interlayer channel and the dicing line on the carrying surface to interrupt the interlayer channel for preventing the filling glue from flowing to and covering the dicing line. More particularly, as the embodiment shown in FIG. 10, a dicing line 120 is formed on the carrying surface 110, wherein one end of the interlayer channel 320 extends toward the dicing line 120. The isolating glue block 940 is disposed before the intersection of the interlayer channel 320 and the dicing line 120 to interrupt the interlayer channel 320. The viscosity of the isolating glue block 940 before hardening is greater than the viscosity of the filling glue 900 before hardening.
As a different embodiment shown in FIG. 11A, the protecting layer 500 of the display device 800 has an end surface 510, wherein the end surface 310 of the display layer 300 exceeds the end surface 510 of the protecting layer 500, and the filling glue 900 covers a portion of the top surface of the display layer 300. In other words, the space 400 is completely exposed. Thus, the filling glue 900 can be disposed more conveniently. The ratio of the length of the portion of the end surface 310 of the display layer 300 exceeding the end surface 510 of the protecting layer 500 and the thickness of the display layer 300 is between 18.63 and 31.05 for enhancing the fixing effect between the filling glue 900 and the covered portion of the display layer 300.
In the preferred embodiment, the filling glue is a glue body capable of absorbing energy to transform from liquid state to solid state. However, as the different embodiment shown in FIG. 11B, the filling glue 900 can be a film capable of being bent and inserted into to the space 400. The film could be implemented as a plurality of films (as shown in FIG. 11B) or a single film. The film preferably forms a concave part in the space 400 when the film is inserted into the space 400, wherein the top face of the concave part is as high as the protecting layer 500 to facilitate a vacuum sucking action in the manufacturing process.
As the different embodiment shown in FIG. 11C, the filling glue 900 includes a glue body 901 and a film 902. The glue body 901 is filled in the space 400 and connected with the end surface 310 of the display layer 300, the electronic unit 700, and the carrying surface 110, wherein the glue body 901 is capable of absorbing energy to transform from liquid state to solid state. The film 902 covers and adheres to a portion of the top surface of the protecting layer 500 and the top surface of the glue body 901 for enhancing the fixing effect between the protecting layer 500 and the glue body 901.
As a preferred embodiment shown in FIG. 12, the display device manufacturing method of the present invention includes the following steps.
Step 1010 involves forming a dicing line on a carrying surface of a flexible substrate. More particularly, a flexible substrate 100 disposed on the carrying substrate 200 as shown in FIG. 2 is provided, wherein the dicing lines 120 on the carrying surface 110 of the flexible substrate shown in FIG. 6A are formed by approaches such as laser cutting.
Step 1030 involves disposing a display layer on the carrying surface, wherein the display layer has an end surface. More particular, the display layer 300 having an end surface 310 is disposed on the carrying surface 110 as shown in FIG. 2 by semiconductor processing steps such as deposition, photolithography, etching, thermal processes, etc.
Step 1050 involves forming a protecting layer on the opposite side of the display layer with respect to the carrying surface, wherein the protecting layer has an end surface. More particular, the protecting layer 500 having an end surface 510 is disposed on the opposite side of the display layer 300 with respect to the carrying surface 110 as shown in FIG. 2 by semiconductor processing steps such as deposition, photolithography, etching, thermal processes, etc.
Step 1070 involves disposing an electronic unit on the carrying surface to form a space between the electronic unit and the display layer, wherein the electronic unit and the display layer are disposed on the same side of the dicing line. More particular, the electronic unit 700 is disposed on the carrying surface 110 as shown in FIG. 2 by semiconductor processing steps such as deposition, photolithography, etching, thermal processes, etc. As shown in FIG. 6A, the electronic unit 700 and the display layer 300 are on the same side of the dicing line 120.
Step 1090 involves filling a filling glue in the space, wherein the filling glue is connected with the end surface of the display layer, the electronic unit, and the carrying surface. More particularly, the filling glue can be a liquid that can be solidified by approaches such as UV light illuminating or heating. In this step, the filling glue 900 is filled into the space 400 by approaches such as injecting, dripping, spraying, and then be solidified.
Step 1110 involves taking out a portion of the flexible substrate carrying the display layer and the electronic unit according to the dicing line. More particularly, the flexible substrate 100 as well as the carried display layer 300 and the electronic unit 700 in the area enclosed by the dicing line 120 as shown in FIG. 6A is taken out.
In the preferred embodiment, step 1050 includes making the end surface 510 of the protecting layer 500 not exceed the end surface 310 of the display layer 300 as shown in FIG. 2. Step 1090 includes making the filling glue 900 partially overflow the space 400 and covers a portion of the top surface of the protecting layer 500 as shown in FIG. 2. Step 1090 includes making the filling glue 900 partially overflow the space 400 and covers a portion of the top surface of the electronic unit 700 as shown in FIG. 2. Step 1090 includes making the filling glue 900 surround the electronic unit 700 as shown in FIG. 4.
In different embodiments, step 1050 includes making the end surface 510 of the protecting layer 500 extend out of the end surface 310 of the display layer 300, wherein the portion of the end surface 510 of the protecting layer 500 that extends out of the end surface 310 of the display layer 300 forms an interlayer channel 320 with the carrying surface 110 along the extending direction of the of the display layer 300310 as shown in FIG. 5. Step 1090 includes making the filling glue 900 contained in the interlayer channel 320 as shown in FIG. 5. At this time, as the flow charts of different embodiments shown in FIGS. 13A-13B, the display device manufacturing method further includes step 1081 of disposing a first isolating glue strip at least partially along one side of the interlayer channel, wherein the isolating glue strip connects the portion of the end surface of the protecting layer extending out of the end surface of the display layer with the carrying surface to isolate the filling glue within the interlayer channel from the filling glue outside the interlayer channel. The viscosity of the first isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening. More particularly, the first isolating glue strip 910 is preferably sticky semi-solid/semi-liquid material before hardening. The first isolating glue strip 910 can be disposed at least partially along one side of the interlayer channel 320 by approaches such as smearing, and connects the portion of the end surface 510 of the protecting layer 500 that extends out of the end surface 310 of the display layer 300 with the carrying surface 110 to isolate the filling glue 900 within the interlayer channel 320 from the filling glue 900 outside the interlayer channel 320 as shown in FIG. 6B. Step 1090 includes determining the filling amount of the filling glue to control the amount of the filling glue filled into the interlayer channel.
In another embodiment, step 1050 includes making the end surface 510 of the protecting layer 500 retreat from the end surface 310 of the display layer 300 as shown in FIG. 11A-11C. Step 1090 includes making the filling glue 900 cover the top surface of the display layer 300. Step 1090 includes filling a glue body which is taken as the filling glue 900 in the space 400 and respectively connecting with the end surface 310 of the display layer 300, the electronic unit 700, and the carrying surface 110 as shown in FIG. 11A, wherein the glue body is capable of absorbing energy to transform from liquid state to solid state. Step 1090 includes taking a film capable of being bent as the filling glue 900 and inserting the film into to fill the space 400 as shown in FIG. 11B. On the other hand, step 1090 can includes: filling a glue body 901 in the space 400 and respectively connecting with the end surface 310 of the display layer 300, the electronic unit 700, and the carrying surface 110 as shown in FIG. 11C; applying energy onto the glue body 901 to transform the glue body 901 from liquid state to solid state; and covering and adhering a film 902 to a portion of the protecting layer 500 and the glue body 901 as shown in FIG. 11C.
As different embodiments shown in FIG. 13A-13B, the display device manufacturing method of the present invention further includes step 1082 of disposing a second isolating glue strip surrounding the electronic unit, wherein one end of the first isolating glue strip closer to the electronic unit extends to connect with the second isolating glue strip, wherein the viscosity of the second isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening. More particularly, the second isolating glue strip 920 is preferably sticky semi-solid/semi-liquid material before hardening. The second isolating glue strip 920 can surround the electronic unit 700 and connect with the extended end of the first isolating glue strip 910 close to the electronic unit 700 as shown in FIG. 7.
As the embodiment shown in FIG. 7, the end surface 310 includes two protruding parts 311 disposed apart and facing to each other, wherein the electronic unit 700 is disposed between the protruding parts 311, and wherein the interlayer channel 320 and the first isolating glue strip 910 are disposed along the sides of the protruding parts 311 facing the electronic unit 700. As the different embodiments shown in FIGS. 13A-13B, the display device manufacturing method of the present invention further includes step 1083 of disposing a third isolating glue strip on the carrying surface, wherein the two opposite ends of the third isolating glue strip respectively connect to the first isolating glue strip extending from the side of the two protruding parts to enclose an area. The viscosity of the third isolating glue strip before hardening is greater than the viscosity of the filling glue before hardening. More particularly, the third isolating glue strip 930 is preferably sticky semi-solid/semi-liquid material before hardening. The third isolating glue strip 930 can surround the electronic unit 700 by approaches such as smearing, be disposed on the carrying surface 110, making the two opposite ends of the third isolating glue strip 930 respectively connect to the first isolating glue strip 910 extending from the side of the two protruding parts 311 to enclose an area.
As the different embodiments shown in FIGS. 13A-13B, step 1050 includes: making one end of the interlayer channel extend toward the dicing line; and cutting the protecting layer and the display layer so that the protecting layer is flush with the display layer at or close to the intersection of the interlayer channel and the dicing line to interrupt the interlayer channel. More particularly, as the embodiment shown in FIG. 8, the end surface 310 of the display layer 300 includes two protruding parts 311 disposed apart and facing to each other, wherein the electronic unit 700 is disposed between the protruding parts 311. The interlayer channel 320 is disposed along the sides of the protruding parts 311 facing the electronic unit 700 and is interrupted at the bottom end of the protruding parts 311. The method further includes step 1083 of disposing a third isolating glue strip 930 on the carrying surface 110 as shown in FIG. 8, wherein the two opposite ends of the third isolating glue strip 930 respectively connect to where the interlayer channel 320 extending along the sides of the two protruding parts 311 stops to enclose an area. The viscosity of the third isolating glue strip 930 before hardening is greater than the viscosity of the filling glue 900 before hardening.
In different embodiments, step 1050 includes: making one end of the interlayer channel 320 extend toward the dicing line 120; and forming an opening 520 on the protecting layer 500 at or close to the intersection of the interlayer channel 320 and the dicing line 120 to interrupt the interlayer channel 320. FIG. 9 is a schematic view of an embodiment of forming an opening 520 on the protecting layer 500 close to the intersection of the interlayer channel 320 and the dicing line 120 and is above the interlayer channel 320.
Although the preferred embodiments of the present invention have been described herein, the above description is merely illustrative. Further modification of the invention herein disclosed will occur to those skilled in the respective arts and all such modifications are deemed to be within the scope of the invention as defined by the appended claims.
Patent Application
20130135830
