Number | Date | Country | Kind |
---|---|---|---|
1-145623 | Jun 1989 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
3825803 | Budde | Jul 1974 | |
4127321 | Koyama et al. | Nov 1978 | |
4643526 | Watanabe et al. | Feb 1987 | |
4687300 | Kubo et al. | Aug 1987 | |
4810061 | Nakanowatari et al. | Mar 1989 | |
4826297 | Kubo et al. | May 1989 | |
4917466 | Nakamura et al. | Apr 1990 |
Number | Date | Country |
---|---|---|
0167033 | Aug 1986 | EPX |
0247893 | Dec 1987 | EPX |
3025784 | Feb 1982 | DEX |
2179103 | Nov 1973 | FRX |
0086031 | May 1984 | JPX |
0130721 | Jul 1985 | JPX |
0300224 | Dec 1988 | JPX |
Entry |
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IBM Technical Disclosure Bulletin, vol. 15, No. 1, Jun. 1972, p. 308, Honn, "Eighty-Pin Package for Field-Effect Transistor Chips". |
IBM Technical Disclosure Bulletin, vol. 30, No. 7, Dec. 1987, p. 49, "Low Thermal Resistance Package Design for Semiconductor Devices". |