This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2017-063057, filed Mar. 28, 2017, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to a flexible liquid crystal display device.
Liquid crystal display devices include a pair of substrates aligned and overlapped with each other. On both or one of the substrates, an optical film such as a polarizer is adhered. If one of the substrates is pulled by a device which apples the optical film or a device which peels off a protection film from the substrate before applying the optical film, one of the substrates may be shifted from the other substrate. Furthermore, if adjacent edges of the flexible display device are curved, one of the substrates may be diagonally shifted from the other substrate. The flexible display device includes substrates formed of a flexible material such as a resin. As above described examples, the flexible substrates are bent or extended when being pulled, and thus, a positional shift tends to occur with a weak force as compared to a rigid material substrate such as a glass substrate.
The present application provides a display device which can suppress a positional shift of a pair of substrates.
In general, according to one embodiment, a display device comprises a first flexible substrate, a second flexible substrate, a liquid crystal layer, a first spacer, and a second spacer. The first flexible substrate includes a first surface and a second surface opposite to the first surface. The second flexible substrate includes a third surface facing the first surface and a fourth surface opposite to the third surface. The liquid crystal layer is disposed between the first surface and the third surface. The first spacer is disposed on the first surface. The second spacer is disposed on the third surface. One of the first spacer and the second spacer has a concave and the other of the first spacer and the second spacer has a convex. The tip of the convex contacts the concave.
Embodiments will be described hereinafter with reference to the accompanying drawings. Incidentally, the disclosure is merely an example, and proper changes within the spirit of the invention, which are easily conceivable by a skilled person, are included in the scope of the invention as a matter of course. In addition, in some cases, in order to make the description clearer, the widths, thicknesses, shapes, and the like of the respective parts are schematically illustrated in the drawings, compared to the actual modes. However, the schematic illustration is merely an example, and adds no restrictions to the interpretation of the invention. Besides, in the specification and drawings, the structural elements having functions, which are identical or similar to the functions of the structural elements described in connection with preceding drawings, are denoted by like reference numerals, and an overlapping detailed description is omitted unless otherwise necessary.
In this specification, the expressions “a includes A, B or C”, “α includes one of A, B and C” and “α includes one selected from the group consisting of A, B and C” does not exclude a case where α includes a plurality of combinations of A to C unless otherwise specified. Further, these expressions do not exclude a case where α includes other elements.
In the following description, the display device is a liquid crystal display device DSP. The display device DSP may be used for a smartphone tablet terminal, mobile phone, personal computer, television, car-equipped device, gaming device, wearable device, and the like.
The display panel PNL displays an image on a display surface by selectively passing the light incident on the rear surface. The display surface of the display panel PNL may be a flat surface or a curved surface. Note that the display panel PNL may be a reflective type display panel which displays an image on a display surface by selectively reflecting the light incident on the display surface of the display panel PNL. If the display panel PNL is of reflective type, the illumination device BL may be omitted. In the following description, viewing the display panel PNL from its display surface to its rear surface is defined as a plan view.
The display panel PNL includes a first substrate (array substrate) SUB1, second substrate (counter substrate) SUB2, sealant 3, liquid crystal layer LC, and control module CTR. The first substrate SUB1 includes first to fourth sides E1, E2, E3, and E4. For example, the first and third sides E1 and E3 are short sides and the second and fourth sides E2 and E4 are long sides.
The second substrate SUB2 faces the first substrate SUB1 in a thickness direction D0 of the display panel PNL. The first substrate SUB1 is formed to be greater than the second substrate SUB2 in, for example, a longitudinal direction of the display panel PNL and includes a terminal area NDAt exposed from the second substrate SUB2. The control module CTR is provided with the terminal area NDAt. Note that the control module CTR may be provided with an external circuit board connected to the terminal area NDAt.
The sealant 3 is formed of an organic material such as acrylic resin or epoxy resin. The sealant 3 corresponds to a hatched part in
The display panel PNL includes, in a plan view, a display area DA for image display and a non-display area (bezel area) NDA surrounding the display area DA. The display area DA includes a plurality of subpixels SPX in an m×n matrix. For example, a color display pixel PX including three subpixels SPX corresponding red (R), green (G), and blue (B) can be formed. Note that the pixel PX may include a subpixel SPX of different color such as white and may include some subpixels SPX of same color.
The non-display area NDA includes first to fourth non-display areas NDA1, NDA2, NDA3, and NDA4. The non-display area NDA1 is disposed between the display area DA and the first side E1. Similarly, the second non-display area NDA2 is disposed between the display area DA and the second side E2. The third non-display area NDA3 is disposed between the display area DA and the third side E3. The fourth non-display area NDA4 is disposed between the display area DA and the fourth side E4. The first non-display area NDA1 includes the terminal area NDAt.
The first substrate SUB1 includes, in the display area DA, a plurality of scan signal lines GL (GL1, GL2, GL3, . . . GLm+1) and a plurality of video signal lines SL (SL1, SL2, SL3, . . . SLn+1) crossing the scan signal lines GL. The subpixel SPX corresponds to an area defined by two adjacent scan signal lines GL and two adjacent video signal lines SL.
A direction to which the scan signal lines GL extend is defined as first direction D1 and a direction to which the video signal lines SL extend is defined as second direction D2. Note that, in the example of
In the example of
The first and second directions D1 and D2, and a third direction (for example, crossing direction D3, and third A and third B directions D3A and D3B) and a diagonal direction D4, which are explained later, are all along the display surface of the display panel PNL and orthogonal to the thickness direction D0 of the display panel PNL.
The first substrate SUB1 includes a scan driver GD connected to the scan signal lines GL and a video driver SD connected to the video signal lines SL. The scan driver GD is provided with, for example, the second and fourth non-display areas NDA2 and NDA4. The video driver SD is provided with, for example, the first non-display area NDA1 in an inner position than is the terminal area NDAt. Note that the scan driver GD and the video driver SD may be provided with the control module CTR, or may be provided with an external circuit board connected to the display panel PNL.
The first substrate SUB1 includes, in each subpixel SPX, a switching element SW and a pixel electrode PE. The switching element SW is formed of, for example, a thin film transistor (TFT) and is electrically connected to a scan signal line GL, video signal line SL, and pixel electrode PE. A common electrode CE extends to face the subpixels SPX. The common electrode CE may be provided with the first substrate SUB1 or with the second substrate SUB2.
The control module CTR controls the scan driver GD and the video driver SD. The scan driver GD supplies a scan signal to the scan signal lines GL, and the video driver SD supplies a video signal to the video signal lines SL. When the scan signal is supplied to the scan signal line GL corresponding to the switching element SW, the video signal line SL corresponding to the switching element SW and the pixel electrode PE are electrically connected, and the video signal of the video signal line SL is supplied to the pixel electrode PE. The pixel electrode PE forms a field with the common electrode CE to change the orientation of the liquid crystal molecules of the liquid crystal layer LC. Capacitance CS is formed between the common electrode Ce and the pixel electrode PE, for example.
The semiconductor layer SC extends from the first contact hole CH1 to the scan signal line GL overlapping the video signal line SL, crosses the scan signal line GL, and then, bends in a U-letter shape to extend in the second contact hole CH2. The relay electrode SLr contacts the pixel electrode PE in a third contact hole CH3. In this example, the switching element SW is of double gate type in which the semiconductor layer SC crosses the scan signal lien GL twice; however, the switching element may be of single gate type.
The area depicted with a single-dotted line in
The display device DSP of each embodiment further includes first and second spacers 31 and 32. One of the first and second spacers 31 and 32 includes a concave 33 and the other of the first and second spacers 31 and 32 includes a convex 34, and the concave 33 and the convex 34 form a stopper 30 which controls positional shifting of the first and second substrates SUB1 and SUB2. The first and second spacers 31 and 32 will be described later with reference to
As described above, the first substrate SUB1 includes the scan signal line GL, video signal line SL, switching element SW, pixel electrode PE, and common electrode CE. In addition thereto, the first substrate SUB1 includes, as shown in
The first flexible substrate 10 is, for example, formed of a polyimide resin and is flexible, transmissive, and insulative. The first flexible substrate 10 includes a first surface 10A facing the second flexible substrate 20 and a second surface 105 in the opposite side to the first surface 10A. The first insulating layer 11 covers the first surface 10A of the first flexible substrate 10.
The semiconductor layer SC is formed on the first insulating layer 11. The second insulating layer 12 covers the first insulating layer 11 and the semiconductor layer SC. The scan signal line GL is formed on the second insulating layer 12. The third insulating layer 13 covers the second insulating layer 12 and the scan signal line GL.
The video signal line SL and the relay electrode SLr are formed on the third insulating layer 13. The video signal line SL and the relay electrode SLr are formed in a single process. The fourth insulating layer 14 covers the third insulating layer 13, video signal line SL, and relay electrode SLr. The common electrode CE is formed on the fourth insulating layer 14. The fifth insulating layer 15 covers the fourth insulating layer 14 and the common electrode CE.
The pixel electrode PE is formed on the fifth insulating layer 15. Note that the pixel electrode PE may be formed below the fifth insulating layer 15, and the common electrode CE may be formed above the fifth insulating layer 15. The fifth insulating layer 15 is an example of an interlayer insulating layer which insulates the pixel electrode PE and the common electrode CE. The first alignment film AL1 covers the fifth insulating layer 15 and the pixel electrode PE.
The scan signal line GL and the video signal line SL are formed of, for example, a metal material of single-layered structure or of layered structure. The video signal line SL may be thinner than the scan signal line GL. The relay electrode SLr is formed of the same metal material used for the video signal line SL, for example. The semiconductor layer SC is formed of a low or high temperature polysilicon (LTPS or HIPS). The pixel electrode PE and the common electrode CE are transparent conductive films formed of indium tin oxide (ITO) or indium zinc oxide (IZO).
The first to third and fifth insulating layers 11, 12, 13, and 15 are inorganic insulating layers formed of silicon oxide, silicon nitride, alumina, or the like. The fourth insulating layer 14 is an organic insulating layer formed of a photosensitive resin such as acrylic resin. The fourth insulating layer 14 has a function to flatten the unevenness of the switching element SW, and is formed to be thicker than the first to third and fifth insulating layers 11, 12, 13, and 15 and the first alignment film AL1. The fourth insulating layer 14 may be referred to as an organic flattening film.
The first and second contact holes CH1 and CH2 pass through the second and third insulating layers 12 and 13. The video signal line SL contacts the semiconductor layer SC through the first contact hole CH1. The relay electrode SLr contacts the semiconductor layer SC through the second contact hole CH2. One of the video signal line SL and the relay electrode SLr is a source electrode and the other thereof is a drain electrode.
The third contact hole CH3 passes the fourth and fifth insulating layers 14 and 15. The pixel electrode PE contacts the relay electrode SLr through the third contact hole CH3 and is electrically connected to the semiconductor layer SC. The third contact hole CH3 is an example of the contact hole through which the pixel electrode PE and the transistor (switching element SW) are electrically connected.
The second substrate SUB2 includes, in addition to the light shielding layer 21, the second flexible substrate 20, color filter layer 22, overcoat layer 23, and second alignment film AL2. The second flexible substrate 20 is formed of the same resin material used for the first flexible substrate 10. The second flexible substrate 20 includes a third surface 20A facing the first surface 10A of the first flexible substrate 10 and a fourth surface 20B which is in the opposite side of the third surface 20A.
The light shielding layer 21 is formed in the third surface 20A of the second flexible substrate 20 and covers the non-display area NDA shown in
The liquid crystal layer LC is disposed between the first and second alignment films AL1 and AL2. The first and second alignment films AL1 and AL2 align liquid crystal molecules of the liquid crystal layer LC while no voltage is applied to the pixel electrode PE. The first and second alignment films AL1 and AL2 are formed of a polyimide resin or the like applied by, for example, ink jet printing or flexography.
On the second surface 10B of the first flexible substrate 10, a first polarizer PL1 is adhered. On the fourth surface 20B of the second flexible substrate 20, a second polarizer PL2 is adhered. Note that, if the illumination device BL which irradiates polarized light is used, the first polarizer PL1 may be omitted.
The first and second polarizer PL1 and PL2 are examples of optical films adhered to the second surface 10B of the first flexible substrate 10 and the fourth surface 20B of the second flexible substrate 20. Note that the optical film is not limited to a polarizer which selectively passes desired polarized light of the incident light. As different examples of the optical films, there are a phase differential plate which compensates a phase difference of a circular polarizer and a light transmissive film which protects the display panel PNL.
Steps ST1 to ST3 will be explained now. Initially, a material for the first flexible substrate 10 is applied on the upper surface of a rigid glass substrate, and the applied material is cured to form the first flexible substrate 10 (first flexible substrate formation ST1).
Photolithography or the like is repeatedly performed on the first flexible substrate 10 to form a circuit layer in which, for example, the scan signal line GL, scan driver GD, video signal line SL, video driver SD, switching element SW, common electrode CE, pixel electrode PE, first to fifth insulating layers 11, 12, 13, 14, and 15, and first spacer 31 are layered with high positional accuracy (circuit layer formation ST2).
A material of the first alignment film AL1 is applied on the circuit layer, and the applied material is cured to form the first alignment film AL1 (first alignment film formation ST3). A mother board including a plurality of first substrates SUB1 is obtained through steps ST1 to ST3.
Now, steps ST4 to ST6 will be explained. In a similar manner to step ST1, the second flexible substrate 20 is formed (second flexible substrate formation ST4). Photolithography or the like is repeatedly performed on the second flexible substrate 20 to form a color layer in which, for example, the light shielding layer 21, color filter layer 22, overcoat layer 23, and second spacer 32 are layered with high positional accuracy (color layer formation ST5). In a similar manner to step ST3, the second alignment film AL2 is formed (second alignment film formation ST6). Through steps ST4 to ST6, a mother board including a plurality of second substrates SUB2 is obtained.
Now, steps ST7 to ST11 will be explained. A sealant 3 is applied to one of the mother boards, and a liquid crystal material of the liquid crystal layer LC is dropped into the area surrounded by the sealant 3 (liquid crystal drop ST7). Two mother boards are aligned and adhered together, and the sealant 3 is cured (substrate adhesion ST8).
The glass substrate is separated from the second surface 10B of the first flexible substrate 10 (glass substrate separation ST9), and a protection film is adhered to the second surface 10B (protection film adhesion ST10). When laser is irradiated to the second surface 10B of the first flexible substrate 10 through the transmissive glass substrate, the first flexible substrate 10 absorbs the laser and slightly dissolves. Gaps are formed between the first flexible substrate 10 and the glass substrate, and thus, the glass substrate is separated from the first flexible substrate 10.
In a similar manner, the glass substrate is separated from the fourth surface 20B of the second flexible substrate 20, and a protection film is adhered to the fourth surface 20B. The protection film is a film formed of a polyethylene terephthalate resin or the like. The mother boar with the protection film is cut into a plurality of panels (cell cut ST11).
Now, steps ST12 to ST15 will be explained. The protection film is peeled off from the fourth surface 20B of the second flexible substrate 20 (protection film peeling ST12), and the second polarizer PL2 is adhered (optical film adhesion ST13). Similarly, the protection film is peeled off from the second surface 10B of the first flexible substrate 10, and the first polarizer PL1 is adhered.
An external circuit board is mounted in the terminal area NDAt (external circuit board mount ST14). Note that, after the external circuit board is mounted, the protection film may be peeled off and the first polarizer PL1 may be adhered (protection film peeling ST12 and optical film adhesion ST13). By attaching the illumination device BL to the display panel PNL, the display device DSP is formed (finishing ST15). Note that, after step ST 15, a process of curving the edges of the display device DSP, or a step of attaching the display panel PNL to a cover such as a cover glass may be added.
The adhesion device 42 includes a lightly adhesive belt 43 which holds the optical film and a main body 44 which rotates the belt 43. The belt 43 is wrapped around the main body 44. The adhesion device 42 moves the main body 44 in the long side direction or the short side direction of the display panel PNL; that is, the first direction D1 or the second direction D2, and rotates the belt 43 such that the optical film such as the second polarizer PL2 is adhered to the substrate such as the second substrate SUB2.
At that time, if the moving speed of the main body 44 and the film feeding speed of the rotating belt 43 are not well synchronized, the second substrate SUB2 which is pulled by the adhesion device 42 may be shifted from the first substrate SUB1 which is fixed by the vacuum suction stage 41.
Now, the display device DSP of the first embodiment will be explained with reference to
Note that, as shown in
The first spacer 31 of the first substrate SUB1 includes the concave 33, and the second spacer 32 of the second substrate SUB2 includes the convex 34. Note that, as in a variation which will be described later, the first spacer 31 may include the convex 34, and the second spacer 32 may include the concave 33.
In order to form the concave 33 in the first spacer 31, the thickness of the first spacer 31 is adjusted part by part by a multi-tone process such as a half-tone process, for example. The concave 33 includes, for example, inner surfaces 33A, 33B, and 33C. In the example of
When the second substrate SUB2 moves in the diagonal direction D4 with respect to the first substrate SUB1, the surface of the concave 33 contacting the tip 34A of the convex 34 is given the inner surface 33A or the inner surface 33C, and a gap between the inner surfaces 33A and 33C is given a width of the concave 33. The width of the tip 34A in the diagonal direction D4 is less than the width of the concave 33.
As shown in
In order to secure the tolerance of engagement of the concave 33 and the convex 34, the third A and third B directions D3A and D3B are slightly shifted. Note that, the concave 33 and the convex 34 may be formed such that the third A and third B directions D3A and D3B completely match. An angle formed by the crossing direction D3 and the third A direction D3A is, for example, 30° or less. Similarly, an angle formed by the crossing direction D3 and the third B direction D3B is, for example, 30° or less.
In the first and second directions D1 and D2 and the diagonal direction D4, the inner surfaces 33A and 33C of the concave 33 and the tip 34A of the convex overlap with each other. In other words, the inner surface 33A of the concave 33, tip 34A of the convex 34, and the inner surface 33C of the concave 33 substantially extending in the crossing direction D3 are aligned in a single line in the diagonal direction D4 orthogonal to the crossing direction D3. On the other hand, the concave 33 includes the open ends 33D and 33E, and the inner surfaces 33A and 33C of the concave 33 and the tip 34A of the concave 34 do not overlap in the crossing direction D3.
In step ST12, when the second substrate SUB2 is pulled in the diagonal direction D4 by the protection film PR, the tip 34A of the convex 34 contacts the inner surface 33A or the inner surface 33C as shown in
Similarly, in step ST13, when the second substrate SUB2 is pulled in the first direction D1 or the second direction D2 by the adhesion device 42, the tip 34A of the convex 34 contacts the inner surface 33A or the inner surface 33C of the concave 33 as shown in
The first and second spacers 31 and 32 are disposed to overlap the light shielding layer 21 formed in the display area DA in a plan view. In the examples of
The first spacer 31 is, for example, a photosensitive acrylic resin, and thus, has a low adhesion to the fifth insulating layer 15 which is an inorganic insulating layer. In the examples of
Note that, in a structure where the pixel electrode PE is formed below the fifth insulating layer 15 and the common electrode CE is formed above the fifth insulating layer 15, at least a part of the material used for the first protrusion 51 contacts the upper surface of the common electrode CE which is a transparent conductive film. In a plan view, when a part of the bottom surface of the first protrusion 51 overlaps with the transparent conductive film, the first protrusion 51 can be tightly adhered to the first substrate SUB1.
The display device DSP of the first embodiment structured as above includes the first spacer 31 of the first substrate SUB1 and the second spacer 32 of the second substrate SUB2, and one of the first and second spacers 31 and 32 includes the concave 33 and the other of the first and second spacers 31 and 32 includes the convex 34. The inner surfaces 33A and 33C of the concave 33 and the tip 34A of the convex 34 extend in the crossing direction D3 crossing the first and second directions D1 and D2 and the diagonal direction D4.
Between the first and second substrates SUB1 and SUB2, if one substrate is pulled in the first and second directions D1 and D2 and the diagonal direction D4 with respect to the other substrate, the tip 34A of the convex 34 contacts the inner surface 33A or 33C of the concave 33 and the movement of the other substrate is prevented as shown in
Furthermore, in the first embodiment, the concave 33 passes through the first spacer 31 in the crossing direction D3. Since the concave 33 includes the open ends 33D and 33E, the tolerance of engagement of the concave 33 and convex 34 in the crossing direction D3 can be secured greatly. In the example of
Now, the first and second spacers 31 and 32 of variations of the first embodiment will be explained with reference to
In order to form the concave 33 in the fourth insulating layer 14, the thickness of the fourth insulating layer 14 is adjusted part by part by a multi-tone process such as a half-tone process, for example. The thickness of the fourth insulating layer 14 in a part where a multi-tone process is not performed is, for example, 3 μm. The thickness of the fourth insulating layer 14 in a part where a half-tone process is performed is, for example, 1.5 μm.
According to the first variation, positional shifting of the first and second substrates SUB1 and SUB2 can be suppressed as in the first embodiment. Furthermore, in the first variation, a step of layering the first spacer 31 can be omitted and step ST2 can be simplified. Furthermore, a material of low adhesion is not layered on the fifth insulating layer 15, and thus, the first spacer 31 is not required to be disposed to overlap the transparent conductive film such as the pixel electrode PE, and the freedom of design of the first substrate SUB1 can be increased.
According to the second to fourth variations, positional shifting of the first and second substrates SUB1 and SUB2 in steps ST12 and ST13 can be suppressed as in the first embodiment. In addition, a multi-tone process such as a half-tone process is not required, and thus, step ST2 can be simplified.
In the second variation, the second spacer 32 has a height which is substantially the same as a gap between the first and second substrates SUB1 and SUB2 (cell gap). In the second variation, a gap between the first and second substrates SUB1 and SUB2 can be maintained by the second spacer 32 supporting the second substrate SUB2 even if the display surface of the display panel PNL is pressed by a finger.
In the third variation, the second spacer 32 has a height which is less than a gap between the first and second substrates SUB1 and SUB2. In the third variation, scratch on the first alignment film AL1 by the second spacer 32 can be prevented. For example, if the first and second spacers 31 and 32 are higher than a half of the gap between the first and second substrates SUB1 and SUB2, the stopper 30 can be formed by bringing the inner surfaces 33A and 33C of the concave 33 and the tip 34A of the convex 34 into contact. In the third variation, the first spacer 31 is not formed integrally, but in this case, two projections functioning as walls form a first spacer 31.
In the fourth variation, the first spacer 32 has a height which is substantially the same as a gap between the first and second substrates SUB1 and SUB2. In the fourth variation, a gap between the first and second substrates SUB1 and SUB2 can be maintained by the first spacer 31 supporting the second substrate SUB2 even if the display surface of the display panel PNL is pressed by a finger. Note that, if the first spacer 31 is enlarged, the light shielding layer 21 must be enlarged as well. If the light shielding layer 21 is enlarged, the aperture ratio decreases, and in consideration of the aperture ratio, the second variation is preferred to the fourth variation.
The display device DSP with the wall electrode 35 can uniform the transmissivity of the liquid crystal layer LC by forming the transverse field applied to the liquid crystal layer LC to be substantially parallel to the first substrate SUB1. With the display device DSP of the sixth variation, positional shifting of the first and second substrates SUB1 and SUB2 in steps ST12 and ST13 can be suppressed as in the first embodiment. Furthermore, since a part of the wall electrode 35 is used as the first spacer 31, an additional step of forming the first spacer 31 is not required.
Furthermore, as shown in
As shown in
Now, the second embodiment will be explained with reference to
The first protrusion 51 is, for example, formed in the layer where the first spacer 31 is formed, and the first protrusion 51 and the first spacer 31 can be formed in the same process. On the other hand, the first protrusion 51 does not face the second spacer 32 and does not contact the second spacer 32, and in this respect, the first protrusion 51 differs from the first spacer 31.
Similarly, in the example of
That is, the first and second protrusions 51 and 52 are not members to suppress positional shifting of the first and second substrates SUB1 and SUB2 or to maintain a gap between the first and second substrates SUB1 and SUB2. In the example of
Similarly, the second protrusion 52 extends along the video signal line SL. Note that the second protrusion 52 may extend in a direction crossing the video signal line SL. The length of the long side of the second protrusion 52 is greater than the length of the long side of the second spacer 32.
In step ST13 of
Furthermore, the flexible display device DSP includes the first and second flexible substrates 10 and 20 which are formed of a flexible material. The first and second flexible substrates 10 and 20 are deformed with a weak force as compared to a rigid material such as a glass substrate. In the flexible display device DSP, the momentum of the liquid crystal material toward the sealant 3 is increased by the deformation of the first and second flexible substrates 10 and 20 in step ST13. With the second embodiment, the momentum of the liquid crystal material flowing to the sealant 3 can be eased by the first and second protrusions 51 and 52 extending in the first direction D1 or the second direction D2, and thus, the damage to the sealant 3 can be prevented.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Number | Date | Country | Kind |
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2017-063057 | Mar 2017 | JP | national |