This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2016-190736, filed on Sep. 29, 2016, the entire contents of which are incorporated herein by reference.
An embodiment according to the present invention relates to a display device.
As display devices usable for electric appliances and electronic devices, a liquid crystal display device using an electro-optical effect of a liquid crystal material and an organic EL (electroluminescence) display device including an organic electroluminescence (EL) element have been developed and put into actual products. In the meantime, a touch panel, which is a display device including a display element and a touch sensor provided on the display element, has been rapidly spread recently. Such a touch panel is now indispensable for mobile information terminals such as smartphones and the like, and is progressively developed worldwide for further improvement in the information society.
Methods for manufacturing such a touch panel are classified into two systems: one is an out-cell system, by which a touch sensor is manufactured separately from a display device and then the touch sensor and the display device are bonded together, and the other is an in-cell system, by which a touch panel is incorporated into a display device. Japanese Laid-Open Patent Publication No. 2012-212076 discloses a structure of a display device including a touch sensor.
An embodiment according to the present invention provides a display device including a plurality of scanning lines provided on a first insulating surface, the plurality of scanning lines extending in a first direction and arrayed in a second direction crossing the first direction; a plurality of signal lines provided on a second insulating surface provided on first insulating surface, the plurality of signal lines extending in a third direction crossing the first direction and arrayed in a fourth direction crossing the third direction; a plurality of pixel electrodes respectively provided in correspondence with intersections of the plurality of scanning lines and the plurality of signal lines; a plurality of first touch lines provided on the first insulating surface, the plurality of first touch lines extending in the first direction and arrayed in the second direction; a plurality of second touch lines provided on the second insulating surface, the plurality of second touch lines extending in the third direction and arrayed in the fourth direction; a first touch electrode provided on a third insulating surface provided on the second insulating surface, the first touch electrode being provided between pixel electrodes adjacent to each other as seen in a plan view, among the plurality of pixel electrodes, and electrically connected with at least one of the first touch lines; and a second touch electrode provided on the third insulating surface, the second touch electrode being provided between pixel electrodes adjacent to each other as seen in a plan view, among the plurality of pixel electrodes, and electrically connected with at least one of the second touch lines.
Hereinafter, embodiments according to the present invention will be described with reference to the drawings. This disclosure merely provides an example, and modifications or alterations thereof readily conceivable by a person of ordinary skill in the art without departing from the gist of the present invention are duly encompassed in the scope of the present invention. In the drawings, components may be shown schematically regarding the width, thickness, shape and the like, instead of being shown in accordance with the actual sizes, for the sake of clearer illustration. The drawings are merely examples and do not limit the interpretations of the present invention in any way. In the specification and the drawings, components that have substantially the same functions as those described before with reference to a previous drawing(s) bear the identical reference signs thereto (or identical numerals with “a”, “b” or the like provided after the numerals), and detailed descriptions thereof may be omitted. The words “first”, “second” or the like provided for components are used merely to distinguish the components from each other, and do not have any further meaning unless otherwise specified.
In the specification and the claims, an expression that a component or a region is “on” another component or region encompasses a case where such a component or region is in direct contact with the another component or region and also a case where such a component is above or below the another component or region, namely, a case where still another component or region is provided between such a component or region and the another component or region, unless otherwise specified.
In this specification, the terms “conductive layer”, “electrode” and “line” refer to substantially the same element and are replaceable in accordance with the situation.
There are cases where for manufacturing a touch panel, a new line or electrode for a touch sensor is required. This may undesirably increase the number of manufacturing steps of the touch panel or decrease the detection precision of the touch sensor.
An embodiment of the present invention described below discloses a display device suppressing the process load imposed to form a touch sensor from increasing while improving the detection precision.
As shown in
The scanning lines 145a, the first touch lines 146, the signal lines 147a and the second touch lines 148 are provided below the pixel electrodes 155, the first touch electrodes 156a and the second touch electrodes 156b. The first touch electrodes 156a each have a function of a transmission electrode of the touch sensor, and the second touch electrodes 156b each have a function of a receiving electrode of the touch sensor.
As shown in
The first touch electrode 156a is electrically connected with the first touch line 146 via an opening 181a. The first touch line 146 is provided on a first insulating surface (e.g., on a gate insulating layer 143 described below), namely, at the same level as the scanning line 145a. Similarly, the second touch electrode 156b is electrically connected with the second touch line 148 via an opening 181b. The second touch line 148 is provided on a second insulating surface (e.g., on an insulating layer 149 described below), namely, at the same level as the signal line 147a. The first touch electrode 156a and the second touch electrode 156b are provided on a third insulating surface (e.g., on an insulating layer 154 described below). In each of four corner regions where two first touch electrodes 156a and two second touch electrodes 156b are close to each other, an opening 161 of a counter electrode 160 described below is provided.
As shown in
As shown in
A capacitance element 120 is a region where a source or drain region of the semiconductor layer 142 and a capacitor electrode layer 145c overlap each other while having the gate insulating layer 143 acting as a dielectric layer therebetween. A capacitance element 121 is a region where a conductive layer 153 and the pixel electrode 155 overlap each other while having the insulating layer 154 acting as a dielectric layer therebetween.
A light emitting element 130 includes the pixel electrode 155, an organic EL layer 159 and the conductive layer 160. The light emitting element 130 has a so-called top emission structure, in which light emitted by the organic EL layer 159 is output toward the counter electrode 160. The light emitting element 130 is not limited to having a top emission structure, and may have a bottom emission structure.
The substrate 100 and a substrate 101 are each formed of glass or an organic resin material.
An insulating layer 141 is provided on the substrate 100 and acts as an underlying layer. The insulating layer 141, with this function, may suppress impurities, typically, an alkaline metal material, water, hydrogen or the like from being diffused from the substrate 100 into the semiconductor layer 142.
The semiconductor layer 142 is provided on the insulating layer 141, and is formed of silicon, an oxide semiconductor, an organic semiconductor or the like.
The gate insulating layer 143 is provided on the insulating layer 141 and the semiconductor layer 142. The gate insulating layer 143 may be formed of silicon oxide, silicon oxide nitride, silicon nitride or any other inorganic material having a high dielectric constant.
The gate electrode 145b is provided on the gate insulating layer 143, and is connected with the scanning line 145a shown in
The insulating layer 149 is formed of substantially the same material as any of those usable for the gate insulating layer 143, and is provided on the gate insulating layer 143, the gate electrode 145b and the capacitance electrode 145c. The insulating layer 149 may have a single layer structure or a stack structure formed of any of the above-listed materials.
The source/drain electrode 147b is provided on the insulating layer 149, and is connected with the signal line 147a shown in
An insulating layer 150 has a function of a flattening layer, and is provided on the insulating layer 149 and the source/drain electrode 147b. The insulating layer 150 is mainly formed of an organic insulating material such as acrylic resin or the like. Although not shown, the insulating layer 150 may have a stack structure of, for example, an organic insulating material and an inorganic insulating material.
The conductive layer 153 is provided on the insulating layer 150. The conductive layer 153 may be formed of the same material as, or a different material from, that of the gate electrode 145b. Although not shown, the conductive layer in which the conductive layer 153 is provided is also used to form other lines joined with the source/drain electrode 147b. Therefore, this conductive layer needs to, for example, have a low resistance and joins well with the conductive material used to form the source/drain electrode 147b.
The insulating layer 154 is provided on the insulating layer 150 and the conductive layer 153, and is formed of substantially the same material as any of those usable for the gate insulating layer 143.
The pixel electrode 155 has a function of an anode of the display element 130, and preferably has a property of reflecting light. Preferable examples of material for the former function include oxide conductive materials such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) and the like. Preferable examples of material for the latter function include conductive materials having a high surface reflectance such as aluminum, silver and the like. In order to provide both of the functions, the pixel electrode 155 is formed of a stack structure of the above-described materials, specifically, a stack structure including a conductive layer having a high surface reflectance formed of aluminum, silver or the like and an oxide conductive layer formed of ITO, IZO or the like provided on the conductive layer.
The organic EL layer 159 is provided on the pixel electrode 155, and contains a light emitting material such as an organic electroluminescence material or the like.
The counter electrode 160 has a function of a cathode of the display element 130, and is provided for the plurality of pixel electrodes 155 so as to cover the plurality of pixel electrodes 155. The counter electrode 160 is formed of a material that is conductive and light-transmissive in order to transmit light emitted by the organic EL layer 159. The opening 161 is provided in the counter electrode 160.
In addition to being light-transmissive, the counter electrode 160 needs to be reflective in order to form a microcavity with a reflective surface of the pixel electrode 155. Therefore, the counter electrode 160 is formed as a semi-transmissive film.
Specifically, the counter electrode 160 is formed of silver, magnesium or an alloy thereof and has such a thickness of as to transmit light.
A bank layer 157 is formed of an organic resin material to cover a periphery of the pixel electrode 155 and to form a smooth step at an edge of the pixel electrode 155.
The bank layer 157 may be formed of an organic resin material containing a black pigment in order to increase the contrast of a displayed image.
An inorganic insulating layer 162, an organic insulating layer 164 and an inorganic insulating layer 166 are sequentially stacked in this order and act as a sealing layer. The inorganic insulating layer 162 and the inorganic insulating layer 166 are formed of substantially the same material as any of those usable for the gate insulating layer 143. The organic insulating layer 164 is formed of substantially the same material as any of those usable for the insulating layer 150 or the bank layer 157.
An adhesive layer 174 may be formed of an inorganic material, an organic material, or a composite material of an organic material and an inorganic material.
As shown in
Now, with reference to
As shown in
In the structure of this embodiment, the first touch electrode 156a and the second touch electrode 156b are provided in the same layer. Therefore, even a small capacitance change is detected, and thus the detection precision is improved.
As shown in
In the structure of this embodiment, the first touch line 146 and the second touch line 148 are provided in different layers. Therefore, the restrictions on the circuit design are alleviated.
Hereinafter, a method for manufacturing the display device 10 will be described with reference to
First, as shown in
In the case where, for example, the substrate 100 is to be an organic resin substrate, a polyimide substrate is used. An organic resin substrate may have a thickness of several micrometers to several ten micrometers, so that the display device 100 is a flexible sheet display. The substrate 100 may occasionally need to be transparent to allow light, emitted by the display element 130 (described below), to be output outside. A substrate provided on the side on which the light from the display element 130 is not output does not need to be transparent, and thus may include a metal substrate and an insulating layer formed on the metal substrate.
The insulating layer 141 is formed of silicon oxide, silicon oxide nitride, silicon nitride or the like. The insulating layer 141 may have a single layer structure or a stack structure. The insulating layer 141 may be formed by CVD, spin-coating, printing or the like.
In the case where the semiconductor layer 142 is to be formed of silicon, for example, amorphous silicon, polycrystalline silicon or the like is usable. In the case where the semiconductor layer 142 is to be formed of an oxide semiconductor, for example, a metal material such as indium, gallium, zinc, titanium, aluminum, tin, cerium or the like is usable. The semiconductor layer 142 may be formed of, for example, an oxide semiconductor containing indium, gallium and zinc (IGZO). The semiconductor layer 142 may be formed by sputtering, vapor deposition, plating, CVD or the like.
The gate insulating layer 143 is formed of an insulating film containing at least one of silicon oxide, silicon oxide nitride, silicon nitride, silicon nitride oxide, aluminum oxide, magnesium oxide, hafnium oxide and the like. The gate insulating layer 143 may be formed by substantially the same method as that of the insulating layer 141.
The gate electrode 145b is formed of a metal material selected from tungsten, aluminum, chromium, copper, titanium, tantalum, molybdenum, nickel, iron, cobalt, indium and zinc, an alloy containing one of the above-listed metal materials, an alloy of a combination of any of the above-listed metal materials, or the like. Alternatively, the gate electrode 145b may be formed of any of the above-listed materials containing nitrogen, oxygen, hydrogen or the like. For example, the gate electrode 145b may have a stack structure including an aluminum (Al) layer and a titanium (Ti) layer that are formed by sputtering. At the same time as the gate electrode 145b, the scanning line 145a, the first touch line 146 and the capacitance electrode 145c are formed.
Next, as shown in
Next, the source/drain electrode 147b is formed on the insulating layer 149 (see
Next, as shown in
For example, the insulating layer 150 may be formed of acrylic resin by spin-coating. The insulating layer 150 is formed until having a flat top surface. It is preferable that the insulating layer 150 has a thickness of 1 μm or greater.
Next, as shown in
First, the conductive layer 153 is formed on the insulating layer 150. The conductive layer 153 may be formed of substantially the same material as that of, and by substantially the same method as that of, the gate electrode 145b. For example, the conductive layer 153 may be formed of a stack structure of molybdenum, aluminum and molybdenum by sputtering.
Next, the insulating layer 154 is formed on the conductive layer 153. The insulating layer 154 may be formed of substantially the same material as that of, and by substantially the same method as that of, the gate insulating layer 143. For example, the insulating layer 154 may be formed of silicon nitride by plasma CVD.
Next, the pixel electrode 155 is formed on the insulating layer 154 (see
At the same time as the pixel electrode 155, the first touch electrode 156a and the second touch electrode 156b are formed. The first touch electrode 156a is electrically connected with the first touch line 146 via an opening formed in the insulating layer 149 and the insulating layer 150. Similarly, the second touch electrode 156b is electrically connected with the second touch line 148 via an opening formed in the insulating layer 150.
Next, as shown in
Next, the organic EL layer 159 is formed on the pixel electrode 155 and the bank layer 157. The organic EL layer 159 is formed of a low molecular weight-type or high-molecular weight-type organic material. In the case of being formed of a low molecular weight-type organic material, the organic EL layer 159 may include a light emitting layer containing a light emitting organic material and also include a hole injection layer and an electron injection layer or may further include a hole transfer layer and an electron transfer layer. The hole injection layer and the electron injection layer, or the hole transfer layer and the electron transfer layer, when being included, are provided so as to have the light emitting layer therebetween.
The organic EL layer 159 is formed to at least overlap the pixel electrode 155.
The organic EL layer 159 is formed by, for example, vacuum vapor deposition, printing, spin-coating or the like. In the case of being formed by vacuum vapor deposition, the organic EL layer 159 may be formed by use of a shadow mask optionally, so that the organic EL layer 159 is not formed on the entirety of the bank layer 157. The organic EL layer 159 may be formed of different materials among pixels adjacent to each other, or may be formed of the same material in all the pixels.
Next, as shown in
Next, as shown in
Next, as shown in
The inorganic insulating layer 162 and the inorganic insulating layer 166 may be formed of an insulating material containing at least one of aluminum oxide, silicon oxide, silicon nitride and the like. It is preferable that the display region 103 is covered with the inorganic insulating layer 162. The inorganic insulating layer 162 and the inorganic insulating layer 166 may each be formed by plasma CVD, thermal CVD, vapor deposition, spin-coating, spraying, or printing. For example, the inorganic insulating layer 162 and the inorganic insulating layer 166 may each be formed of a stack structure of silicon nitride and silicon oxide by plasma CVD. The inorganic insulating layer 162 and the inorganic insulating layer 166 may each have a thickness of several ten nanometers to several micrometers.
The organic insulating layer 164 may be formed of acrylic resin, polyimide resin, epoxy resin or the like. The organic insulating layer 164 may be formed by spin-coating, vapor deposition, spraying, ink-jetting, printing or the like to have a thickness of approximately several micrometers to approximately several ten micrometers.
(2-4. Bonding with the Counter Substrate)
Next, as shown in
The display device 10 is manufactured by the above-described method. In the structure of this embodiment, the scanning line 145a, the gate electrode 145b and the first touch line 146 are provided in the same layer. The signal line 147b, the source/drain electrode 147b and the second touch line 148 are provided in the same layer. The pixel electrode 155, the first touch electrode 156a and the second touch electrode 156b are provided in the same layer. Because of such a structure, no additional step is required to form the touch sensor. Therefore, the process load imposed in the manufacturing of the display device 10 is suppressed, and the detection precision is improved.
In this embodiment, the first touch line 146 and the second touch line 148 are respectively provided on the insulating layer 143 and the insulating layer 149. The present invention is not limited to this. For example, the first touch line 146 or the second touch line 148 may be provided on another insulating layer. Alternatively, such structures may be combined together.
In this embodiment, the opening 161 is formed in the counter electrode 160. The present invention is not limited to this. For example, it may not be necessary that the counter electrode 160 has the opening 161 formed therein.
In this embodiment, the first direction and the second direction are perpendicular to each other. The present invention is not limited to this. For example, the first direction and the second direction may cross each other at an angle other than 90 degrees.
In this embodiment, the pixel electrode 155, the first touch electrode 156a and the second touch electrode 156b are provided on the same insulating layer, specifically, on the insulating layer 154. The present invention is not limited to this. For example, the first touch electrode 156a and the second touch electrode 156b may be provided on an insulating layer different from the layer on which the pixel electrode 155 is provided.
Hereinafter, a display device including a touch sensor having a different shape as that in embodiment 1 will be described with reference to the drawings. Substantially the same elements and substantially the same steps as those in embodiment 1 will not be described again, and the descriptions thereof in embodiment 1 will be incorporated by reference.
The first touch electrode 256a and the second touch electrode 256b may each be provided to surround a greater number of pixel electrodes. For example, the first touch electrode 256a and the second touch electrode 256b may be provided as shown in
Alternatively, as shown in
Still alternatively, as shown in
Still alternatively, as shown in
With any of the above-described structures, touch sensors of various shapes with an improved detection sensitivity are provided.
In this embodiment, the present invention is applied to an organic EL display device as an example. The present invention is also applicable to a liquid crystal display device, any other self-light emitting display device, an electronic paper-type display device including an electrophoretic display element or the like, or any other flat panel display device. The present invention is applicable to any size of display device from a small or middle display device to a large scale display device, needless to say.
A person of ordinary skill in the art would readily conceive various alterations or modifications of the present invention, and such alterations and modifications are construed as being encompassed in the scope of the present invention. For example, the display devices in the above-described embodiments may have an element added thereto, or deleted therefrom, or may be changed in design optionally by a person of ordinary skill in the art. The methods in the above-described embodiments may have a step added thereto, or deleted therefrom, or may be changed in the condition optionally by a person of ordinary skill in the art. Such devices and methods are encompassed in the scope of the present invention as long as including the gist of the present invention.
Number | Date | Country | Kind |
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2016-190736 | Sep 2016 | JP | national |