Patent Application
20190326384
The described embodiments relate to display technologies, and more particularly, to a display panel and a display device including the display panel.
With the development of electronic products trending to high resolution and portable devices, pitches between pads for connecting display panels and components are becoming smaller and smaller, it brings opportunities and challenges to the design and production of display panel products.
In general, a screen of an organic light-emitting diode (OLED) display panel may be simply divided into an active area (AA) and an outer lead bonding (OLB) portion, and the OLB portion may include a bonding pad portion. A peripheral circuit including the outer leads may include an integrated circuit (IC), a chip on flex (COF), a flexible circuit board (FPC), and a printed circuit board (PCB) or the like, which are bonded to a corresponding bonding pad portion of the display panel via an anisotropic conductive film (ACF). It may achieve a display control of the AA of the display by external signals sending from the peripheral circuit.
The design of a bonding pad in the bonding pad portion mainly considers two aspects for a bonding process. First, an overlap between the peripheral circuit and the display panel; second, a distance between bonding pads. A size of the overlap needs to be large enough to capture more conductive particles, to make an upper and a lower electrodes to be a conductive path, and the distance between two adjacent bonding pads needs to be large enough to prevent from a short circuit occurring between the adjacent bonding pads. However, a shape of the bonding pad and an arrangement of the bonding pad widely used in the bonding pad portion of the OLED display, are in general regular rectangles. When the bonding pad wants to be formed to a small fine pitch design, it will bring greater challenges in display panel processes and designs.
The present disclosure provides a display panel and a display device. An area of an overlap where a peripheral circuit is contacted the display panel may be increased, and a distance between two bonding pads may be ensured, so that an efficiency of a production yield of bonding process may be increased and a cost may be reduced.
In order to solve the above-mentioned technical problem, a technical solution adopted by the present disclosure is to provide a display device comprising a display panel; the display panel comprising an active area and a non-active area arranged around the active area; the non-active area comprising an outer lead bonding pad portion; the outer lead bonding pad portion comprising a bonding pad portion; a bonding pad arranged in the bonding pad portion; the bonding pad comprising a bonding pad body, a plurality of first bonding pad units, and a plurality of second bonding pad units; the bonding pad body being a shape of a longitudinal rectangle having a first long side and a second long side opposite to the first long side; the first long side and the second long side of the longitudinal rectangle being substantially parallel to a vertical direction; the plurality of first bonding pad units being arranged on the first long side, and the plurality of second bonding pad units being arranged on the second long side; wherein the plurality of first bonding pad units arranged on the first long side and the plurality of second bonding pad units arranged on the second long side, are arranged in the longitudinal direction of longitudinal rectangle, alternately, to form a boundary with a concave and convex changing; wherein a shape of the boundary with the concave and convex changing is one of a square wave shape, a sawtooth wave shape, a triangle wave shape, and a sine wave shape; wherein the display panel further comprises a flexible circuit board; the flexible circuit board is bonded with the bonding pad portion, and the flexible circuit board is directly connected to the bonding pad.
In order to solve the above-mentioned technical problem, another technical solution adopted by the present disclosure is to provide a display panel comprising an active area and a non-active area arranged around the active area; the non-active area comprising an outer lead bonding pad portion; the outer lead bonding pad portion comprising a bonding pad portion; a bonding pad arranged in the bonding pad portion; the bonding pad comprising a bonding pad body, a plurality of first bonding pad units, and a plurality of second bonding pad units; the bonding pad body being a shape of a longitudinal rectangle having a first long side and a second long side opposite to the first long side; the first long side and the second long side of the longitudinal rectangle being substantially parallel to a vertical direction; the plurality of first bonding pad units being arranged on the first long side, and the plurality of second bonding pad units being arranged on the second long side; wherein the plurality of first bonding pad units arranged on the first long side and the plurality of second bonding pad units arranged on the second long side, are arranged in the longitudinal direction of longitudinal rectangle, alternately, to form a boundary with a concave and convex changing.
In order to solve the above-mentioned technical problem, further another technical solution adopted by the present disclosure is to provide a display device comprising a display panel; the display panel comprising an active area and a non-active area arranged around the active area; the non-active area comprising an outer lead bonding pad portion; the outer lead bonding pad portion comprising a bonding pad portion; a bonding pad arranged in the bonding pad portion; the bonding pad comprising a bonding pad body, a plurality of first bonding pad units, and a plurality of second bonding pad units; the bonding pad body being a shape of a longitudinal rectangle having a first long side and a second long side opposite to the first long side; the first long side and the second long side of the longitudinal rectangle being substantially parallel to a vertical direction; the plurality of first bonding pad units being arranged on the first long side, and the plurality of second bonding pad units being arranged on the second long side;
wherein the plurality of first bonding pad units arranged on the first long side and the plurality of second bonding pad units arranged on the second long side, are arranged in the longitudinal direction of longitudinal rectangle, alternately, to form a boundary with a concave and convex changing.
Advantages of the disclosure may follow. As compared with the related art, the present disclosure may provide a display panel and a display device. By processing a bonding pad to form a boundary with a concave and convex changing, an area of an overlap where a peripheral circuit is contacted the display panel may be increased, and a distance between two bonding pads may be ensured, an efficiency of a production yield of bonding process may be increased and a cost may be reduced.
The detailed description set forth below is intended as a description of the subject technology with reference to the appended figures and embodiments. It is understood that the embodiments described herein include merely some parts of the embodiments of the present disclosure, but do not include all the embodiments. Based on the embodiments of the present disclosure, all other embodiments that those skilled in the art may derive from these embodiments are within the scope of the present disclosure.
Referring to
As shown in
A plurality of bonding pads 103 may be arranged in the bonding pad portion 13. The bonding pad 103 may include a bonding pad body 130, a plurality of first bonding pad units 110, and a plurality of second bonding pad units 120. The bonding pad body 130 may be a shape of a longitudinal rectangle having a first long side 131 and a second long side 132. The first long side 131 and the second long side 132 of the longitudinal rectangle may be substantially parallel to a vertical direction. The plurality of first bonding pad units 110 may be arranged on the first long side 131, and the plurality of second bonding pad 120 units may be arranged on the second long side 132. The plurality of first bonding pad units 110 arranged on the first long side 131 and the plurality of second bonding pad units 120 arranged on the second long side 132, may be arranged in the longitudinal direction of longitudinal rectangle, alternately, to form a boundary with a concave and convex changing. For a clear description, the bonding pad portion 13 may be arranged below the active area AA, and the first bonding pad unit 110 and the second bonding pad unit 120 may be arranged on the left and right sides of the bonding pad body 130, respectively, but it is not a limitation of the present disclosure.
In the present disclosure, by processing a bonding pad 130 to forming a boundary with a concave and convex changing, an area of an overlap where a peripheral circuit 14 is contacted the display panel 100 may be increased, and a distance between two bonding pads 103 may be ensured, an efficiency of a production yield of bonding process may be increased and a cost may be reduced.
Referring to
The bonding pad body 13 may include a plurality of the bonding pads 103. A horizontal distance between the first bonding pad unit 110 of one of the plurality of bonding pads 103 and the second bonding pad unit 120 of an bonding pad 103 adjacent to the one of the plurality of bonding pads 103, may be same, so that each horizontal distance between two adjacent bonding pads 103 may be not affected by forming the boundary with the concave and convex changing.
Referring to
S1=L*(b−a)
In the present disclosure, the area of the overlapping region that the pad of the peripheral circuit 14 contacts the bonding pad 103 may be:
S2=L*(b−a)+S{circumflex over ( )}
S{circumflex over ( )} is an area of a bonding pad unit in one side of the bonding pad body in the bonding pad 103, and the S{circumflex over ( )}>0. As a result, it may be concluded that S2>S1, i.e., the area of the overlapping region that the pad of the peripheral circuit 14 contacts the bonding pad 103 may be increased.
Furthermore, assuming that a width of the bonding pad 103 is d1; a width of the bonding pad body 130 is d13; a width of the first bonding pad unit 110 is d11; and a width of the second bonding pad unit 120 is d12. In one embodiment, a range of the width d11 of the bonding pad body 130 may be set to about 20% d1≤d11≤50% d1. Further, a range of the width d11 of the bonding pad body 130 may be set to about 30% d1≤d11≤40% D1.
As an example of an ideal state, when d11=d12=d13=0.5b, i.e., when the width d13 of the bonding pad body is one-third of the width d1 of bonding pad, and when the area of the overlapping region that the pad of the peripheral circuit 14 contacts the bonding pad 103 is only half in an actual state because of an actual bonding process, in the related art, the area of the overlapping region that the pad of the peripheral circuit 14 contacts the bonding pad 103 is:
S1=L*(b−0.5b)=0.5Lb
In the present disclosure, the area of the overlapping region that the pad of the peripheral circuit 14 contacts the bonding pad 103 may be:
S2=L*(b−0.5b)+0.5L*(b−0.5b)=0.75Lb
Therefore, in the present disclosure, the area of the overlapping region that the pad of the peripheral circuit 14 contacts the display panel 103 may be increased to about 50%, it may increase the area of the overlapping area where the display panel 100 contacts the peripheral circuit 14. Moreover, because the distance between the boundary with the concave and convex changing in two adjacent bonding pad 103 may be not changed, but the width of the bonding pad 103 may be increased, so that the production yield may be not affected because the area of the overlapping region are too small. Otherwise, when the area of the overlapping region that the pad of the peripheral circuit 14 contacts the display panel 103 is not increased, the width of the bonding pad 103 may be reduced, so that the distance between two adjacent bonding pads may be increased, and a solder pitch may be reduced to increase the resolution.
Further, the display panel 100 may include a flexible circuit board. The flexible circuit board may be bonded with the bonding pad portion 13, and the flexible circuit board may be electrically connected to the bonding pad 103. The display panel 100 may further include an integrated chip, and the integrated chip may be integrated on the flexible circuit board. The flexible circuit board and the bonding pad may be directly connected via an anisotropic conductive film. The anisotropic conductive adhesive film may be made a conductive path by connecting electrodes between the flexible circuit board and the bonding pad 103 using conductive particles. The anisotropic conductive film may have characteristics that it may be continuously processed and has extremely low material loss, and may be a product commonly used in display panels. The flexible circuit board may be a product form of the peripheral circuit, but it is not limited here.
Referring to
As show in
Referring to
As shown in
In general, the tilt bonding pad 404 may be arranged on both sides of the bonding pad 403, and the tilt direction thereof is not limited. When the tilt bonding pad 404 has a certain tilt angle with respect to the bonding pad 403, the line connecting to each center point of the first bonding pad unit 410 of the tilt bonding pad 404, the line connecting to each center point of the second bonding pad unit 420 of the tilt bonding pad 404, and the centerline of the bonding pad body 430, may be substantially parallel. According to an actual situation, the first bond pad unit 410 and the second bond pad unit 420 of the tilt bond pad 404 may be tilted at the same time, or may not be tilted at the same time, but may not be sometimes tilted without being tilted.
In general, a display area AA process of the display panel 100 may include: forming an array on a flexible substrate, first. The flexible substrate may be one of polyimide (PI), polyetherimide (PEI), polyphenylene sulfide (PPS), and polyarylate (PAR), or a combination of the above. The flexible substrate may be transparent or non-transparent.
The array may adopt amorphous silicon (a-Si), low temperature polysilicon (LTPS), oxide semiconductor, and so on, to form an active layer. The array may include a buffer, an active layer, a gate insulating layer, a gate layer, an interlayer insulating layer, a source and a drain layer, a flat layer, an anode layer, a pixel definition layer, a support layer, and the like. A preparation method and a process of each layer, may refer to a preparation method and a process for preparing a display panel in the related art, it is not limited here.
In the preparation process of each layer of the display panel 100, a metal layer deposited in the bonding pad portion may be required to be formed simultaneously with the source and the drain layers of the display area AA. The above-mentioned boundary with the concave and convex changing may be formed on the bonding pad portion by exposure, development, etching, and other processes. Using a mask having different image for the exposure, the boundary with the concave and convex changing may be obtained. The shape of the boundary with the concave and convex changing may include, but be not limited to, a square wave shape, a sawtooth wave shape, a triangle wave shape, and a sine wave shape.
Referring to
As shown in
The display device 10 provided by the present disclosure may be any product or component having a display function such as a mobile phone, a tablet computer, a television, a display, a notebook, a digital photo frame, a navigator, and the like.
By processing a bonding pad to forming a boundary with a concave and convex changing, an area of an overlap where an peripheral circuit is contacted the display panel may be increased, and a distance between two bonding pads may be ensured, an efficiency of a production yield of bonding process may be increased and a cost may be reduced.
It is understood that the descriptions above are only embodiments of the present disclosure. It is not intended to limit the scope of the present disclosure. Any equivalent transformation in structure and/or in scheme referring to the instruction and the accompanying drawings of the present disclosure, and direct or indirect application in other related technical field, are included within the scope of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201810374841.7 | Apr 2018 | CN | national |
The present application is a continuation-application of International (PCT) Patent Application No. PCT/CN2018/087851, filed on May 22, 2018, which claims foreign priority of Chinese Patent Application No. 201810374841.7, filed on Apr. 19, 2018 in the State Intellectual Property Office of China, the entire contents of which are hereby incorporated by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2018/087851 | May 2018 | US |
| Child | 16114172 | US |
