At least one embodiment of the present disclosure relates to a display panel and a manufacture method thereof, and a display apparatus.
The performance and service life of OLED devices are easily affected by moisture and oxygen, and it is very significant to block the contact between moisture, oxygen and the OLED devices by effective sealing technologies. At the same time, the narrow border is the development trend of OLED display screens. For example, generally, the distance between the encapsulation frame of the display region and the light-emitting region (AA region) can be reduced to meet the requirements of the narrow border.
At least one embodiment of the present disclosure provides a display panel, the display panel has a display region and a border region surrounding the display region, the border region comprises a peripheral circuit region and a peripheral region, and the peripheral circuit region is between the display region and the peripheral region; the display panel comprises: a base substrate; a barrier structure, a peripheral circuit, a encapsulation substrate, and a encapsulation sealant. At least a part of the barrier structure is in the peripheral circuit region on the base substrate, and the barrier structure comprises: an organic barrier layer, and an inorganic barrier layer. The organic barrier layer comprises an opening passing through the organic barrier layer, an extension direction of the opening is substantially same as an extension direction of an edge, close to the opening, of the display panel, in the display panel; and the inorganic barrier layer covers the organic barrier layer and fills the opening; the peripheral circuit is on the base substrate and in the peripheral circuit region; the encapsulation substrate is on a side of the barrier structure away from the base substrate; and the encapsulation sealant is filled between the base substrate and the encapsulation substrate, and covers the display region and the peripheral circuit region.
For example, the display panel provided by an embodiment of the present disclosure further comprises: a frame sealant, in the peripheral region, and connected to the base substrate and the encapsulation substrate, respectively, and the encapsulation sealant is filled in a region surrounded by the frame sealant, the base substrate, and the encapsulation substrate.
For example, in the display panel provided by an embodiment of the present disclosure, the organic barrier layer is on a side, close to the display region, of the frame sealant, and the inorganic barrier layer comprises a portion between the organic barrier layer and the frame sealant.
For example, in the display panel provided by an embodiment of the present disclosure, a gap is provided between the inorganic barrier layer and the frame sealant.
For example, in the display panel provided by an embodiment of the present disclosure, a direction from the display region to the border region is a first direction, and the peripheral circuit comprises a first signal wire and a function component; the first signal wire extends in a second direction that intersects the first direction; an orthographic projection of the first signal wire on the base substrate is within an orthographic projection of the organic barrier layer on the base substrate, and an orthographic projection of the opening on the base substrate does not overlap with the orthographic projection of the first signal wire on the base substrate.
For example, in the display panel provided by an embodiment of the present disclosure, the peripheral circuit comprises a plurality of the first signal wires, the plurality of the first signal wires are in a same layer and a gap is provided between two adjacent first signal wires of the plurality of the first signal wires, and the orthographic projection of the opening on the base substrate is in an orthographic projection of the gap between two adjacent first signal wires of the plurality of the first signal wires on the base substrate.
For example, the display panel provided by an embodiment of the present disclosure further comprises: a protection layer which covers the first signal wire and is between the first signal wire and the organic barrier layer.
For example, in the display panel provided by an embodiment of the present disclosure, the protection layer is in the border region, a gap is provided between the protection layer and the display region, and the inorganic barrier layer covers the protection layer.
For example, in the display panel provided by an embodiment of the present disclosure, a direction from the display region to the border region is a first direction, and the peripheral circuit comprises a second signal wire extending from the display region to the border region along the first direction; the second signal wire comprises a first portion and a second portion connected in series with each other, the first portion is exposed by the opening, and the second portion is not exposed by the opening; the first portion comprises at least two wires connected in parallel, and the second portion is a single wire.
For example, the display panel provided by an embodiment of the present disclosure further comprises: an encapsulation layer covering the display region and the inorganic barrier layer.
For example, in the display panel provided by an embodiment of the present disclosure, the opening comprises a first opening which is in a closed annular shape, surrounding the display region; and the first opening which is in the closed annular shape divides the organic barrier layer into an inner portion close to the display region and an outer portion away from the display region, the inner portion is in a closed annular shape and surrounds the display region, and the outer portion is in a closed annular shape and surrounds the first opening.
For example, in the display panel provided by an embodiment of the present disclosure, the organic barrier layer comprises a plurality of openings in the border region.
For example, in the display panel provided by an embodiment of the present disclosure, the opening further comprises a non-annular opening spaced apart from the first opening, and the non-annular opening is at least in one of the outer portion or the inner portion.
For example, in the display panel provided by an embodiment of the present disclosure, a width of the opening in a direction from the border region to the display region ranges from 1 μm to 5000 μm.
For example, the display panel provided by an embodiment of the present disclosure further comprises: a planarization layer, comprising a portion in the display region and a portion in the border region; the portion, in the border region, of the planarization layer serves as the organic barrier layer.
For example, the display panel provided by an embodiment of the present disclosure further comprises: a light-emitting device, on the portion of the planarization layer in the display region.
For example, in the display panel provided by an embodiment of the present disclosure, a direction from the display region to the border region is a first direction, and a width of the border region in the first direction is equal to or larger than 5 mm.
At least one embodiment of the present disclosure further provides a display apparatus, which comprises any display panel provided by the embodiments of the present disclosure.
At least one embodiment of the present disclosure provides a manufacture method of a display panel, the display panel has a display region and a border region surrounding the display region, the manufacture method comprises: providing a base substrate; forming a barrier structure on the base substrate, comprising: forming an organic barrier layer, in which the organic barrier layer comprises an opening passing through the organic barrier layer, and an extension direction of the opening is substantially same as an extension direction of an edge of the display panel close to the opening in the display panel; and forming an inorganic barrier layer, in which the inorganic barrier layer covers the organic barrier layer and fills the opening; and the manufacture method of the display panel further comprises: forming a peripheral circuit on the base substrate, in which the border region comprises a peripheral circuit region, and the peripheral circuit is formed in the peripheral circuit region; providing a encapsulation substrate; forming a encapsulation sealant covering the display region and the peripheral circuit region; and cell-assembling the encapsulation substrate with the base substrate to allow the encapsulation substrate to be on a side, away from the base substrate, of the barrier structure, and to allow the encapsulation sealant to be filled between the base substrate and the encapsulation substrate.
For example, the manufacture method of a display panel provided by an embodiment of the present disclosure further comprises: forming a frame sealant on the base substrate, in which the encapsulation sealant is filled in a region surrounded by the frame sealant, the base substrate, and the encapsulation substrate.
For example, in the manufacture method of a display panel provided by an embodiment of the present disclosure, the organic barrier layer is on a side, close to the display region, of the frame sealant, and the inorganic barrier layer comprises a portion between the organic barrier layer and the frame sealant.
For example, in the manufacture method of a display panel provided by an embodiment of the present disclosure, the opening comprises a first opening which is in a closed annular shape and surrounds the display region; and the first opening which is in the closed annular shape divides the organic barrier layer into an inner portion close to the display region and an outer portion away from the display region, the inner portion is in a closed annular shape and surrounds the display region, and the outer portion is in a closed annular shape and surrounds the first opening.
For example, in the manufacture method of a display panel provided by an embodiment of the present disclosure, the opening further comprises a non-annular opening spaced apart from the first opening.
For example, the manufacture method of a display panel provided by an embodiment of the present disclosure further comprises: forming a planarization layer, in which the planarization layer comprises a portion in the display region and a portion in the border region, and performing a patterning process on a material layer used to form the planarization layer, so as to use a portion, in the border region, of the planarization layer, to form the organic barrier layer.
For example, the manufacture method of a display panel provided by an embodiment of the present disclosure further comprises: forming a light-emitting device on the portion of the planarization layer in the display region.
For example, in the manufacture method of a display panel provided by an embodiment of the present disclosure, a direction from the display region to the border region is a first direction, and the forming the peripheral circuit comprises: forming a first signal wire and a function component, in which the first signal wire extends in a second direction that intersects the first direction; and an orthographic projection of the first signal wire on the base substrate is in an orthographic projection of the organic barrier layer on the base substrate, and an orthographic projection of the opening on the base substrate does not overlap with the orthographic projection of the first signal wire on the base substrate.
For example, in the manufacture method of a display panel provided by an embodiment of the present disclosure, a direction from the display region to the border region is a first direction, and the forming the peripheral circuit further comprises: forming a second signal wire extending along the first direction, in which the second signal wire comprises a first portion and a second portion connected in series with each other, the first portion is exposed by the opening, and the second portion is not exposed by the opening; and the first portion comprises at least two wires connected in parallel, and the second portion is a single wire.
In order to clearly illustrate the technical solution of the embodiments of the present disclosure, the drawings of the embodiments will be briefly described in the following. It is obvious that the described drawings in the following are only related to some embodiments of the present disclosure and thus are not limitative of the present disclosure.
In order to make objects, technical details and advantages of the embodiments of the disclosure apparent, the technical solutions of the embodiments will be described in a clearly and fully understandable way in connection with the drawings related to the embodiments of the disclosure. Apparently, the described embodiments are just a part but not all of the embodiments of the disclosure. Based on the described embodiments herein, those skilled in the art can obtain other embodiment(s), without any inventive work, which should be within the scope of the disclosure.
Unless otherwise defined, all the technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terms “first,” “second,” etc., which are used in the description and the claims of the present application for disclosure, are not intended to indicate any sequence, amount or importance, but distinguish various components. Also, the terms “comprise,” “comprising,” “include,” “including,” etc., are intended to specify that the elements or the objects stated before these terms encompass the elements or the objects and equivalents thereof listed after these terms, but do not preclude the other elements or objects. The phrases “connect”, “connected”, “coupled”, etc., are not intended to define a physical connection or mechanical connection, but may include an electrical connection, directly or indirectly. “On,” “under,” “left,” “right” and the like are only used to indicate relative position relationship, and when the position of the object which is described is changed, the relative position relationship may be changed accordingly.
At least one embodiment of the present disclosure provides a display panel, the display panel has a display region and a border region surrounding the display region, and includes a base substrate, a peripheral circuit, and a barrier structure. The peripheral circuit is in the border region on the base substrate; the barrier structure is on the base substrate, an orthographic projection of the barrier structure on the base substrate at least partially overlaps with an orthographic projection of the peripheral circuit on the base substrate; the barrier structure includes an organic barrier layer and an inorganic barrier layer, the organic barrier layer includes an opening in the border region, the organic barrier layer is disconnected at the opening, and the inorganic barrier layer covers the organic barrier layer and fills the opening.
Exemplarily,
The display panel 10 includes a base substrate 1, a peripheral circuit 2, a barrier structure 3, an encapsulation substrate 15 and an encapsulation sealant 13. The border region 102 includes a peripheral circuit region 1020, and the peripheral circuit 2 is located on the base substrate 1 and located in the peripheral circuit region 1020. The barrier structure 3 is located on the base substrate 1, and the barrier structure 3 includes an organic barrier layer 31 and an inorganic barrier layer 32. The organic barrier layer 31 includes an opening 3101 passing through the organic barrier layer 31, and an extension direction of the opening 3101 is substantially the same as an extension direction of an edge, close to the opening, of the display panel, in the display panel. The opening 3101 is an opening located in the border region 102. The organic barrier layer 31 is disconnected at the opening 3101, that is, the opening 3101 divides the organic barrier layer 31 into a plurality of portions spaced apart from each other; the inorganic barrier layer 32 covers the organic barrier layer 31 and fills the opening 3101. The inorganic barrier layer 32 and the organic barrier layer 31 can block external moisture, oxygen, etc. from entering the display region. Organic materials have a weak barrier effect on moisture and oxygen, and inorganic materials have a strong barrier effect on moisture and oxygen. Because the opening 3101 disconnects the inorganic barrier layer 32 at the border region 102, the inorganic barrier layer 32 covers the organic barrier layer 31 and fills the opening 3101, thereby forming the inorganic barrier layer and the organic barrier layer that are alternate with each other in a direction from the border region 102 to the display region 101, so as to enhance the barrier effect of the barrier structure 3 on moisture and oxygen in a direction from the border region 102 to the display region 101. The encapsulation substrate 15 is disposed on a side, away from the base substrate 1, of the barrier structure 3; the encapsulation sealant 13 is filled between the base substrate 1 and the encapsulation substrate 15, and covers the display region 101 and the peripheral circuit region 1020.
In addition, an orthographic projection of the barrier structure 3 on the base substrate 1 at least partially overlaps with an orthographic projection of the peripheral circuit region 1020 on the base substrate 1, for example, as illustrated in
It should be noted that the organic barrier layer 31 is not an frame sealant (dam sealant) for sealing. For example, the display panel further includes a frame sealant 11 which is located in the peripheral region and surrounds the barrier structure 3, and the opening 3101 of the organic barrier layer 31 is located between the frame sealant 11 and the display region 101 to better block moisture and oxygen that are not absorbed by the frame sealant 11. The frame sealant 11 is connected with the base substrate 1 and the encapsulation substrate 15, respectively, and the encapsulation sealant 13 is filled in a region surrounded by the frame sealant 11, the base substrate 1, and the encapsulation substrate 15. For example, the frame sealant 11 is a dam sealant in a “□” shape surrounding the barrier structure 3.
For example, the organic barrier layer 31 is located on a side, close to the display region 101, of the frame sealant 11, and the inorganic barrier layer 32 includes a portion 321 between the organic barrier layer 31 and the frame sealant 11 to achieve a better barrier effect on moisture and oxygen in a direction from the border region 102 to the display region 101.
For example, a gap 14 is provided between the inorganic barrier layer 32 and the frame sealant 11 to increase the transmission path of moisture and oxygen from the frame sealant 11 to the display region 101, and the gap 14 has a buffering effect, so as to achieve a better barrier effect on moisture and oxygen in a direction from the border region 102 to the display region 101.
Other structures and technical effects of the display panel illustrated in
For example, in the embodiment illustrated in
For example, as illustrated in
For example, a width l of the first opening 3101 in a direction from the border region to the display region ranges from 1 μm to 5000 μm. Those skilled in the art can design according to the actually required width of the border region of the display panel.
For example, in the embodiment illustrated in
For example, the material of the planarization layer 5 is a resin material, a photoresist material, etc. The thickness of the planarization layer 5 in the direction perpendicular to the base substrate 1 ranges from 0.2 μm to 3 μm. Of course, the material and thickness of the planarization layer 5 are only illustrative. The embodiments of the present disclosure are not limited in this aspect, and the material and thickness may be selected according to requirements.
Of course, the encapsulation layer 4 is not limited to the case that the encapsulation layer 4 includes only one inorganic barrier layer 32, for example, the encapsulation layer 4 includes other organic encapsulation layer(s) and other inorganic encapsulation layer(s) stacked with the inorganic barrier layer 32 in the direction perpendicular to the base substrate 1. Those skilled in the art can design according to conventional techniques.
Other features of the embodiment illustrated in
As illustrated in
For example, as illustrated in
For example, the display panel 10 further includes a protection layer 8, the protection layer 8 covers the first signal wire 21 and is located between the first signal wire 21 and the organic barrier layer 31 to further protect the first signal wire 21, and meanwhile, the protection layer 8 plays a role of preventing the moisture and oxygen from entering the display region. For example, the material of the protection layer 8 is an organic material such as resin, etc.
For example, the protection layer 8 is located in the border region 102, and a gap is provided between the protection layer 8 and the display region 101, and the inorganic barrier layer 32 covers the protection layer 8. The protection layer 8 may be provided separately, or may be provided in the same layer and made of the same material as an insulation layer in the display region 101 (for example, an interlayer insulation layer in the pixel circuit of the display region, etc.), that is, the insulation layer in the display region 101 is used to form the protection layer 8, so as to simplify the manufacture process and manufacture difficulty of the display panel 10.
For example, as illustrated in
In other embodiments, the second signal wire 22 may further include a portion located in the display region 101, the portion is formed integrally with the gate wire in the display region 101, and the gate wire belongs to a part of the second signal wire 22. For another example, the second signal wire 22 is electrically connected to the gate wire in the display region 101.
Referring to
For example, in the embodiment illustrated in
The first signal wire 21 may be a signal wire having any function. For example, the peripheral circuit 2 is a gate driving circuit (GOA driving circuit), and for example, the first signal wire 21 is a clock signal wire in the GOA driving circuit.
Exemplarily,
Except for the shift register unit of the first stage, the input terminal INT of each of the shift register units of the remaining stages is connected to the output terminal OUT of the shift register units of the respective previous stage; and except for the shift register unit of the last stage, the reset terminal RST of the shift register unit of each of the remaining stages is connected to the output terminals OUT of the shift register units of the respective next stages.
As illustrated in
For example, as illustrated in
It should be noted that OUT_m (m is an integer larger than 0) illustrated in
For example, the input terminal INT of the shift register unit of the first stage is configured to receive a trigger signal STV, and the reset terminal RST of the shift register unit of the final stage is configured to receive the reset signal. For simplicity, the trigger signal STV and the reset signal are not illustrated in
For example, the gate driving circuit 2 further includes a first voltage wire, a second voltage wire, a third voltage wire, and a fourth voltage wire (not illustrated in the figure). For example, the first voltage wire is connected to a first voltage terminal VDD and is configured to provide a first voltage; the second voltage wire is connected to a second voltage terminal VSS and is configured to provide a second voltage; the third voltage wire is connected to a third voltage terminal VGH1 and is configured to provide a third voltage; and the fourth voltage wire is connected to a fourth voltage terminal VGH2 and is configured to provide a fourth voltage.
For example, the first signal wire is the above first voltage wire or second voltage wire.
For example, as illustrated in
For example, the pixel circuit of each pixel unit of the display region includes a display signal wire (a data wire) configured to provide a signal for controlling display gray scale for the light-emitting device, and the peripheral circuit may further include a portion of the display signal wire extending to the peripheral circuit region, and the first signal wire may also be the portion of the signal wire extending to the peripheral circuit region.
For example, the second signal wire 22 is a scanning signal wire for providing scanning signals to the pixel units arranged in an array in the display region 101, the second signal wire 22 is connected to the gate wire in the display region 101, and is integrate with the gate wire. The second signal wire 22 has a bent portion in the border region, and the bent portion is connected to another part 12 of the gate driving circuit, for example, the another part 12 is a scan signal integrated chip. For example, as illustrated in
For example, the first signal wire 21 and the second signal wire 22 are metal wires.
For example, in the embodiment illustrated in
For example, in another embodiment of the present disclosure, the width d of the border region 102 in the first direction is larger than or equal to 5 mm. By increasing the width of the border region 102, the transmission path of moisture and oxygen to the display region 101 is increased, thereby achieving a better barrier effect on moisture and oxygen in the direction from the border region 102 to the display region 101. The width of the border region 102 in the first direction may be determined according to requirements, which is not limited in the embodiments of the present disclosure.
For example, in the embodiments of the present disclosure, the material of the organic barrier layer 31 is an organic material such as resin, and the material of the organic barrier layer 31 includes an oxygen-absorbing material or a water-absorbing material. For example, the material of the inorganic barrier layer 32 includes at least one selected from a group consisting of silicon oxide, silicon nitride, or silicon oxynitride. The material of the organic barrier layer 31 and the material of the inorganic barrier layer 32 are not limited to the types listed above, and the materials are not limited in the embodiments of the present disclosure.
Other features of the embodiment illustrated in
As illustrated in
At least one embodiment of the present disclosure further provides a display apparatus, the display apparatus includes any display panel provided by the embodiments of the present disclosure.
Exemplarily,
At least one embodiment of the present disclosure provides a manufacture method of a display panel, the display panel has a display region and a border region surrounding the display region, the manufacture method includes: providing a base substrate; forming a barrier structure on the base substrate, including: forming an organic barrier layer, in which the organic barrier layer comprises an opening passing through the organic barrier layer, and an extension direction of the opening is substantially same as an extension direction of an edge, close to the opening, of the display panel, in the display panel; and forming an inorganic barrier layer, in which the inorganic barrier layer covers the organic barrier layer and fills the opening; and the manufacture method of the display panel further includes: forming a peripheral circuit on the base substrate, in which the border region includes a peripheral circuit region, and the peripheral circuit is formed in the peripheral circuit region; providing an encapsulation substrate; forming an encapsulation sealant covering the display region and the peripheral circuit region; and cell-assembling the encapsulation substrate with the base substrate, so as to allow the encapsulation substrate to be on a side, away from the base substrate, of the barrier structure, and to allow the encapsulation sealant to be filled between the base substrate and the encapsulation substrate.
Inorganic barrier layer and organic barrier layer that are alternate can be formed in a direction from the border region to the display region by the manufacture method, so as to increase the barrier structure's ability of blocking moisture and oxygen in the direction from the border region to the display region.
For example, in one embodiment, the manufacture method of the display panel 10 illustrated in
For example, as illustrated in
For example, the manufacture method of the display panel 10 illustrated in
For example, the manufacture method of the display panel further includes forming a light-emitting device 6 on the portion of the planarization layer 5 in the display region 101. For example, the light-emitting device 6 is an electroluminescent device, such as an OLED light-emitting device, a micro LED light-emitting device, etc. The light-emitting device 6 includes an anode, a light-emitting layer and a cathode in a direction perpendicular to the base substrate 1. For example, the display panel 10 further includes a pixel driving circuit 9 located in the display region 101 for controlling the light-emitting state of the pixel unit, which can be designed by those skilled in the art according to conventional techniques.
The manufacture method of the display panel further includes providing a encapsulation substrate 15; forming an encapsulation sealant 13 covering the display region 101 and the peripheral circuit region 102; and cell-assembling the encapsulation substrate 15 with the base substrate 1, so that the encapsulation substrate 15 is on a side, away from the base substrate 1, of the barrier structure 31, and the encapsulation sealant 13 is filled between the base substrate 1 and the encapsulation substrate 15. The frame sealant 11 is connected with the base substrate 1 and the encapsulation substrate 15, respectively, and the encapsulation sealant 13 is filled in a region surrounded by the frame sealant 11, the base substrate 1 and the encapsulation substrate 15.
As illustrated in
For example, as illustrated in
For example, as illustrated in
For example, the protection layer 8 is located in the border region 102, a gap is formed between the protection layer 8 and the display region 101, and the inorganic barrier layer 32 covers the protection layer 8. The protection layer 8 may be provided separately, or may be provided in the same layer and made of the same material as an insulation layer in the display region 101 (for example, an interlayer insulation layer in the pixel circuit of the display region, etc.), that is, the insulation layer in the display region 101 is used to form the protection layer 8, so as to simplify the manufacture process and manufacture difficulty of the display panel 10.
For example, as illustrated in
For example, the manufacture method of the display panel 10 illustrated in
As illustrated in
For example, the above structures of the display panel may be formed by a lithography process and a semiconductor process. For example, the light-emitting layer of light-emitting device can be formed by methods such as ink-jet printing (IJP), evaporation, or the like; the cathode of light-emitting device is formed by methods such as thermal evaporation, sputtering, or the like; the inorganic barrier layer and the inorganic encapsulation layer are formed by methods such as chemical vapor deposition (CVD). Those skilled in the art may select the methods according to conventional techniques.
For example, the manufacture method of the display panel further includes a package process. For example, a thin film package as illustrated in
Structures and technical effects not mentioned in the embodiments of the manufacture method of the display panel are the same as those in the embodiments of the display panel, please refer to the previous descriptions.
What have been described above are only specific implementations of the present disclosure, the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure should be based on the protection scope of the claims.
This patent application is a continuation of U.S. Ser. No. 16/977,285 filed on Sep. 1, 2020 which is a national stage application of international application PCT/CN2019/112245 filed on Oct. 21, 2019, the entire contents of all these applications are hereby incorporated by reference herein in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
20040232459 | Takayama et al. | Nov 2004 | A1 |
20150115230 | Yoon et al. | Apr 2015 | A1 |
20170110477 | Han et al. | Apr 2017 | A1 |
20180342564 | Hanari et al. | Nov 2018 | A1 |
20190058021 | Kim | Feb 2019 | A1 |
20190165312 | Bae | May 2019 | A1 |
20200295310 | Moon | Sep 2020 | A1 |
20200303485 | Jin | Sep 2020 | A1 |
20210104592 | Kim | Apr 2021 | A1 |
20210210719 | Sun et al. | Jul 2021 | A1 |
Number | Date | Country |
---|---|---|
106784368 | May 2017 | CN |
108279521 | Jul 2018 | CN |
109001949 | Dec 2018 | CN |
109461832 | Mar 2019 | CN |
109671870 | Apr 2019 | CN |
109920935 | Jun 2019 | CN |
20170090382 | Aug 2017 | KR |
20190055574 | May 2019 | KR |
20190079998 | Jul 2019 | KR |
2018205673 | Nov 2018 | WO |
Entry |
---|
Extended European Search Report form European Patent Application No. 19945467.9 dated May 10, 2022. |
2 Chinese International Search Report from International Application No. PCT/CN2019/112245 dated Jul. 28, 2020. |
Extended European Search Report form European Patent Application No. 23152180.8 dated Apr. 11, 2023. |
Number | Date | Country | |
---|---|---|---|
20230157056 A1 | May 2023 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 16977285 | US | |
Child | 18098210 | US |