Patent Application
20220006046
This application claims a priority to Chinese Patent Application No. 201711240035.2 filed on Nov. 30, 2017, the disclosures of which are incorporated in their entirety by reference herein.
The present disclosure relates to the field of display technology, in particular to a display panel and a method for packaging the same, and a display device comprising the display panel.
The development trends of Organic Light-Emitting Diode (OLED) display screens are narrow bezel, low power consumption, bendability, foldability and the like. The package film layer of the existing flexible OLED package structure comprises an organic film and an inorganic film laminated in sequence. In manufacturing the organic film, the organic film is formed by inkjet printing a rheological organic material, such as an acrylic material, in a filled region surrounded by a barrier and then making the rheological organic material solidify in the filled region.
In an aspect, a display panel is provided, comprising a display substrate and at least one package film layer covering the display substrate, wherein the package film layer comprises a first inorganic film, a second inorganic film, an organic film and a third inorganic film laminated on the display substrate in sequence, and wherein an adhesion between a material of the first inorganic film and a material of the organic film is less than an adhesion between a material of the second inorganic film and a material of the organic film.
Alternatively, the display panel comprises a display region and a non-display region, the non-display region comprising a first region provided with a barrier structure and a second region between the display region and the barrier structure, the first inorganic film covering the second region and the barrier structure, and the second inorganic film and the organic film cover the second region but not cover the barrier structure.
Alternatively, the third inorganic film covers the second region and the barrier structure.
Alternatively, the third inorganic film and the first inorganic film are made of a same material.
Alternatively, the at least one package film layer comprises two package film layers.
Alternatively, the two package film layers comprises a first package film layer and a second package film layer laminated in sequence, the third inorganic film of the first package film layer is reused as the first inorganic film of the second package film layer.
Alternatively, the first inorganic film is made of silicon nitride, the second inorganic film is made of silicon oxynitride, and the third inorganic film is made of silicon nitride.
Alternatively, the first inorganic film has a thickness of 500 nm to 1000 nm, the second inorganic film has a thickness of 50 nm to 100 nm, and the third inorganic film has a thickness of 500 nm to 1000 nm.
Alternatively, the barrier structure comprises at least a first barrier and a second barrier, a distance between the first barrier and the display region is less than a distance between the second barrier and the display region, and a height of the first barrier is less than a height of the second barrier.
Alternatively, the display substrate is an Organic Light-Emitting Diode (OLED) display substrate.
An embodiment of the present disclosure further provides a display device including the display panel as described above.
An embodiment of the present disclosure further provides a method for packaging a display panel, comprising forming at least one package film layer on a display substrate for covering the display substrate, wherein a step of forming the package film layer comprises:
laminating a first inorganic film, a second inorganic film, an organic film and a third inorganic film on the display substrate in sequence, wherein an adhesion between a material of the first inorganic film and a material of the organic film is less than an adhesion between a material of the second inorganic film and a material of the organic film.
Alternatively, the display panel comprises a display region and a non-display region, the non-display region comprising a first region provided with a barrier structure and a second region between the display region and the barrier structure, the method for packaging comprises:
forming the first inorganic film covering the second region and the barrier structure;
forming the second inorganic film covering the second region but not covering the barrier structure; and
covering the second inorganic film with a rheological organic material, wherein the rheological organic material is blocked on a surface of the second inorganic film by the barrier structure and leveled to form the organic film, and the organic film covers the second region but not covers the barrier structure.
In order to make the technical problems to be solved, the technical solutions, and the advantages of the embodiments of the present disclosure, the present disclosure will be described hereinafter in conjunction with the drawings and specific examples.
The development trends of OLED display screens are narrow bezel, low power consumption, bendability, foldability and the like. The packaging process of the related flexible OLED package structure mainly comprises: manufacturing a flexible substrate; manufacturing a first gate insulating layer; manufacturing a first gate metal layer pattern; manufacturing a second gate insulating layer; manufacturing a second gate metal layer pattern; manufacturing an interlayer insulating layer; manufacturing the source-drain metal layer pattern; manufacturing an overcoat; manufacturing an anode; manufacturing a pixel defining layer; manufacturing a spacer layer manufacturing a cathode; manufacturing a package film layer. The package film layer comprises an organic film and an inorganic film laminated in sequence. In manufacturing the organic film, an organic film is formed by inkjet printing a rheological organic material, such as an acrylic material, in a filled region surrounded by a barrier and making the rheological organic material in the filled region solidifying.
In order to ensure the display quality of the OLED display screen, the package film layer needs to concern both the high water-oxygen barrier capacity and the uniformity of the organic film. However, the related package film layer cannot concern both the high water-oxygen barrier capacity and the uniformity of the organic film.
The package film layer may be a laminated structure of an inorganic film/an organic film/an inorganic film. The inorganic film may be made by various common film forming methods. Alternatively, the film is formed by CVD (Chemical Vapor Deposition) process, and the inorganic film (silicon nitride layer or silicon oxynitride layer) formed by CVD process has strong water-oxygen barrier capacity, good light transmittance and good wear resistance. Among silicon nitride (for example, SiNx) and silicon oxynitride (for example, SiON), silicon nitride has a better water-oxygen barrier capacity, but has a relatively poor adhesion to the material of the organic film; while silicon oxynitride has a relatively poor water-oxygen barrier capacity, but has a better adhesion to the material of the organic film and allows the organic ink to have a better fluidity. If a silicon nitride layer/organic film/silicon nitride layer is used as the package film layer, the uniformity of the organic film will be relatively poor, because the rheological organic material has a relatively poor leveling diffusion property on the surface of silicon nitride layer. As shown in
In order to solve the above technical problems, embodiments of the present disclosure provide a display panel and a display device comprising the display panel, which are capable of concerning both the high water-oxygen barrier capacity and the uniformity of the organic film.
An embodiment of the present disclosure provides a display panel, as shown in
In the present embodiment, since the adhesion between the material of the first inorganic film and the material of the organic film is less than the adhesion between the material of the second inorganic film and the material of the organic film, when the rheological organic material is formed on the second inorganic film, the rheological organic material has a relatively good leveling diffusion property on the surface of the second inorganic film, thereby being capable of forming an organic film having relatively good uniformity. Moreover, since the adhesion between the material of the first inorganic film and the material of the organic film is relatively weak, it is ensured that the package film layer has a relatively good water-oxygen barrier capacity.
Alternatively, as shown in
In some embodiments, the constituent materials of the third inorganic film 6 and the first inorganic film 3 may be the same. That is, an adhesion between a material of the third inorganic film 6 to a material of the organic film 5 is less than an adhesion between a material of the second inorganic film 4 to a material of the organic film 5, or relatively weak.
Alternatively, as shown in
Alternatively, when the at least one package film layer comprises a first package film layer and a second package film layer laminated in sequence, the third inorganic film 6 of the first package film layer is reused as the first inorganic film 3 of the second package film layer. As shown in
Alternatively, the first inorganic film 3 has a thickness of 500 nm to 1000 nm, the second inorganic film 4 has a thickness of 50 nm to 100 nm, and the third inorganic film 6 has a thickness of 500 nm to 1000 nm.
In an alternative embodiment, the first inorganic film 3 is made of silicon nitride, the second inorganic film 4 is made of silicon oxynitride, and the third inorganic film 6 is made of silicon nitride, that is, the package film layer has a structure of a silicon nitride film/a silicon oxynitride film/an organic film 5/a silicon nitride film. The two layers of silicon nitride film are manufactured by process parameters with a high water resistance, and have a thickness of about 500 nm to 1000 nm; and the silicon oxynitride film is manufactured by process parameters with a good diffusion capacity, and has a thickness of about 50 nm to 100 nm. When the above parameters are used, the thickness of the package film layer can be relatively small, and the package film layer can have a relatively good water-oxygen barrier capacity.
In the package film layer, the adhesion between the silicon nitride film and the organic film 5 is relatively poor, and the adhesion between the silicon oxynitride film and the organic film 5 is relatively good. As shown in
Alternatively, as shown in
Alternatively, the display substrate is an OLED display substrate. The technical solution of the embodiment allows the OLED display panel to have a relatively good water-oxygen barrier capacity, and a relatively good uniformity of the organic film.
An embodiment of the present disclosure further provides a display device comprising the display panel as described above. The display device may be any product or component having a display function, such as a television, a display, a digital photo frame, a mobile phone, a tablet computer, etc. The display device further comprises a flexible circuit board, a printed circuit board, and a backplane.
The display device of the embodiment has a relatively good water-oxygen barrier capacity and a relatively good uniformity of the organic film, thereby ensuring the service life of the display device. In addition, the climbing distance of the organic film 5 is relatively short, so that the design distance between the edge of the display region and the barrier structure can be reduced, that is, the width of the second region B can be designed to be narrower, which contributes to a narrow bezel of the display device.
An embodiment of the present disclosure further provides a method for packaging a display panel, comprising forming at least one package film layer on a display substrate for covering the display substrate, wherein the step of forming the package film layer comprises:
laminating a first inorganic film 3, a second inorganic film 4, an organic film 5 and a first inorganic film 3 on the display substrate in sequence, wherein an adhesion between a material of the first inorganic film 3 to a material of the organic film 5 is less than an adhesion between a material of the second inorganic film 4 to a material of the organic film 5.
In the present embodiment, since the adhesion between the material of the first inorganic film and the material of the organic film is less than the adhesion between the material of the second inorganic film and the material of the organic film, when the rheological organic material is formed on the second inorganic film, it is capable of forming an organic film having relatively good uniformity. This is because the rheological diffusion property of the rheological organic material on the surface of the second inorganic film is relatively good. Moreover, since the adhesion between the material of the first inorganic film and the material of the organic film is relatively weak, it is ensured that the package film layer has a relatively good water-oxygen barrier capacity.
Alternatively, the display panel comprises a display region and a non-display region, as shown in
forming a first inorganic film 3 covering the second region B and the barrier structure;
forming a second inorganic film 4 covering the second region B but not covering the barrier structure; and
covering the second inorganic film 4 with a rheological organic material, wherein the rheological organic material is blocked on a surface of the second inorganic film 4 by the barrier structure and leveled to form the organic film 5, and the organic film 5 only covers the second region B but not covers the barrier structure.
Alternatively, the rheological organic material may be printed on the second inorganic film 4.
When the rheological organic material is leveled on the surface of the second inorganic film 4 and diffuses to the barrier structure, since the adhesion between the material of the first inorganic film 3 covering the barrier structure and the material of the organic film 5 is relatively weak, it is possible to prevent the rheological organic material from diffusing to the barrier structure, thereby confining the organic film 5 to the range defined by the barrier structure. This contribute to solidifying the rheological organic material, before passing over the barrier structure, to form the organic film 5, which contributes to realizing a narrow bezel of the display device.
When the display substrate of the embodiment is an OLED display substrate, the method for packaging the display panel of the embodiment specifically comprises the following steps:
1. After the OLED display substrate is manufactured, a silicon nitride film covering a display region of an OLED display substrate, a second region B and a barrier structure and having a thickness of about 500 nm to 1000 nm is manufactured by CVD process, wherein the edge of the silicon nitride film is located outside of the barrier 7 proximate to the edge of the substrate;
2. A silicon oxynitride film having a thickness of about 50 nm to 100 nm is manufactured by CVD process, wherein the silicon oxynitride film covers a display region of the OLED display substrate and the second region B but not cover the barrier structure, and the edge of the silicon oxynitride film is in closely contact with the inside of the barrier 7 proximate to the display region;
3. An organic film 5 is manufactured by an ink-jet printing (UP) process, wherein the organic film 5 covers the display region of the OLED display substrate and the second region B but not cover the barrier structure, and the edge of the organic film 5 is in closely contact with the inside of the barrier 7 proximate to the display region; and
4. A silicon nitride film covering a display region of an OLED display substrate, a second region B and a barrier structure and having a thickness of about 500 nm to 1000 nm is manufactured by CVD process, wherein the edge of the silicon nitride film is located outside of the barrier 7 proximate to the edge of the substrate.
The package structure can be manufactured through the above steps 1 to 4. In the embodiment, each of the package film layers comprises a silicon nitride film, a silicon oxynitride film, an organic film, and a silicon nitride film laminated in sequence. Since the adhesion between the silicon nitride film and the organic film is relatively weak and the adhesion between the silicon oxynitride film and the organic film is relatively good, when the rheological organic material is printed on the silicon oxynitride film, the rheological organic material has a relatively good leveling diffusion property on the surface of the silicon oxynitride film, thereby forming an organic film with a relatively good uniformity. Since the adhesion between the silicon nitride film and the organic film is relatively weak and the silicon nitride film has a relatively good water-oxygen barrier capacity, the package film layer can ensure a relatively good water-oxygen barrier capacity.
Unless otherwise defined, technical terms or scientific terms used herein have the normal meaning commonly understood by one skilled in the art in the field of the present disclosure. The words “first”, “second”, and the like used in the present disclosure does not denote any order, quantity, or importance, but rather merely serves to distinguish different components. The “including”, “comprising”, and the like used in the present disclosure means that the element or item appeared in front of the word encompasses the element or item and their equivalents listed after the word, and does exclude other elements or items. The word “connected” or “connecting” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “On”, “under”, “left”, “right” and the like are only used to represent relative positional relationships, and when the absolute position of the described object is changed, the relative positional relationship may also be changed, accordingly.
It will be understood that when an element, such as a layer, film, region, or substrate, is referred to as being “on” or “under” another element, the element may be directly “on” or “under” another element, or there may be an intermediate element.
The above descriptions are alternative embodiments of the present disclosure. It should be noted that one skilled in the art would make some improvements and substitutions without departing from the principles of the present disclosure. These improvements and modifications should also be regarded as the protection scope of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201711240035.2 | Nov 2017 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2018/104121 | 9/5/2018 | WO | 00 |
