Patent Application
20160004110
The present invention relates to a display panel and a method of producing the display panel.
A known liquid crystal panel that is a main component of a liquid crystal display device has the following configuration. The liquid crystal panel includes liquid crystals held between a pair of glass boards. A sealing member is formed around the liquid crystals to seal the liquid crystals. One of the boards is an array board including TFTs that are switching components, pixel electrodes, and traces. The other board is a CF board including color filters. An example of such a liquid crystal panel that has been known is disclosed in Patent Document 1.
The liquid crystal panel disclosed inn Patent Document 1 includes column-shaped spaces disposed in a sealant application area and a wall-shaped spacer disposed along an inner surface of the sealing member. With those, the sealing member is less likely to shrink due to atmospheric pressure after produced by a one drop filling method.
The sealing member may be formed on one of the boards using a sealant dispenser in the production of the liquid crystal panel by the one drop filling method. An amount of sealant for forming the sealing member on the board may vary according to individual specificity the sealant dispenser or temperature conditions. If an excessive amount of material is supplied, the sealing member may have a wide portion, a width of which is larger than a designed width. If the amount of sealant is smaller, the sealing member may have a narrow portion, a width of which is smaller than designed. The technology disclosed in Patent Document 1 is not able to reduce such variations in width of the sealing member.
If the sealing member includes the wide portion, the material of the sealing member may flow into a display area. As a result, display quality may decrease. In production of the boards that are prepared from a base board, if the wide portion of the sealing member has reached a cutting line between the boards, cutting for preparing the boards may become difficult. If the sealing member includes the narrow portion, the narrow portion may have a higher moisture transmission rate. Namely, moisture is more likely to enter the liquid crystals via the narrow portion. A charged voltage at the pixel electrode may drop and the display quality may decrease. If non-scanning driving (or low-frequency driving) is performed for halting scanning of the gate lines for a certain period to display a still image on the liquid crystal panel, the decrease in display quality resulting from the voltage drop of the pixel electrode due to the moisture tends to be more significant.
The present invention was made in view of the foregoing circumstances. An object of the present invention is to stabilize a sealing member forming area.
A display panel according to the present invention includes a first board, a second board, a sealing member, an inner limiting portion, and an outer limiting portion. The second board is disposed opposite the first board with internal space between the first board and the second board. The sealing member is disposed between the first board and the second board so as to surround the internal space. The sealing member seals the internal space. The inner limiting portion is included in at least one of the first board and the second board. The inner limiting portion is located closer to the internal space than the sealing member. The inner limiting portion is for limiting a sealing member forming area from an internal space side. The outer limiting portion is included in at least one of the first board and the second board. The outer limiting portion is located on an outer side farther from the internal space than the sealing member. The outer limiting portion is for limiting the sealing member forming area from the outer side.
The internal space is between the first board and the second board that are opposite to each other. The sealing member is disposed so as to surround the internal space. The internal space is sealed with the sealing member. During formation of the sealing member, an amount of material of the sealing member supplied to at least one of the first board and the second board may vary according to individual specificity of a machine that supplies the material or temperature conditions. If an amount of material of the sealing member to be supplied is set larger than a normal amount, an actual amount of supplied material of the sealing member is less likely to be short. The sealing member forming area is less likely to become smaller than designed. Therefore, moisture is less likely to enter from the outside to the internal space through the sealing member and thus display quality is less likely to decrease.
If the amount of material of the sealing member to be supplied is set larger as described above, an excessive amount of material of the sealing member may be supplied. However, the sealing member forming area is limited by the inner limiting portion located closer to the internal space and the outer limiting portion located on the outer side farther from the internal space. Therefore, the sealing member forming area is less likely to become larger than designed. Namely, the sealing member forming area is less likely to expand toward the inner space. Therefore, the display quality is less likely to decrease. The sealing member forming area is less likely to expand toward the outside. Therefore, the appearance of the display panel is less likely to degrade. Furthermore, in a production process of the display panel, cutting of a base board for preparing multiple display panels therefrom by cutting it is properly performed.
Preferable embodiments may include the following configurations.
(1) The inner limiting portion and the outer limiting portion may be arranged so as to be in contact with the sealing member. According to the configuration, the sealing member forming area is properly limited.
(2) The display panel may further include at least one of a second inner limiting portion and a second outer limiting portion. The second inner limiting portion may be included in at least one of the first board and the second board and located on the internal space side in a distance from the inner limiting portion. The second outer limiting portion may be included in at least one of the first board and the second board located on the outer side in a distance from the outer limiting portion. According to the configuration, even if the excessive amount of material of the sealing member is supplied during the formation of the sealing member, the excessive material of the sealing member is released to at least space between the inner limiting portion and the second inner limiting portion or space between the outer limiting portion and the second outer limiting portion. Specifically, if the display panel includes the second inner limiting portion, the excessive material is released to the space between the inner limiting portion and the second inner limiting portion. Furthermore, a leak of the material to the internal space is restricted by the second inner limiting portion. Therefore, the display quality is less likely to decrease. If the display panel includes the second outer limiting portion, the excessive material is released to the space between the outer limiting portion and the second outer limiting portion. Furthermore, a leak of the material to the outside farther from the internal space is restricted by the second outer limiting portion. Therefore, the appearance of the display panel is less likely to degrade. Furthermore, in the production process of the display panel, cutting of the base board for preparing multiple display panels therefrom by cutting it is properly performed.
(3) At least one of the second inner limiting portion and the second outer limiting portion may be arranged parallel to the sealing member for an entire periphery of the sealing member. According to the configuration, even if the excessive amount of material of the sealing member is supplied during the formation of the sealing member, a leak of the excessive material of the sealing member to the internal space or the outside farther from the internal space is properly restricted by at least one of the second inner limiting portion and the second outer limiting portion that are arranged parallel to the sealing member for the entire periphery of the sealing member.
(4) At least one of the second inner limiting portion and the second outer limiting portion may include sections arranged at intervals in a peripheral direction of the sealing member. According to the configuration, even if the excessive amount of material of the sealing member is supplied during the formation of the sealing member, the excessive material is smoothly released to the space between the inner limiting portion and the second inner limiting portion or the space between the outer limiting portion and the second outer limiting portion through openings of at least one of the inner limiting portion and the outer limiting portion including the sections arranged at intervals in the peripheral direction of the sealing member.
(5) The sealing member may contain at least a curing resin and spacer particles. At least one of the inner limiting portion and the outer limiting portion may include an opening that opens toward the internal space and the outer side and have an opening width larger than a diameter of the spacer particles. Because the opening width of the opening formed in at least one of the inner limiting portion and the outer limiting portion is larger than the diameter of the spacer particles, if the excessive material is supplied during the formation of the sealing member, the spacer particles in the excessive material are released to the internal space or the outside through the opening. Therefore, the spacer particles are less likely to move over the inner limiting portion or the outer limiting portion and thus a distance (or a cell gap) between the first board and the second board is less likely to become uneven.
(6) At least one of the inner limiting portion and the outer limiting portion may be included in one of the first board and the second board such that a gap is provided between the at least one of the inner limiting portion and the outer limiting portion and another one of the boards. Because at least one of the inner limiting portion and the outer limiting portion is included in one of the first board and the second board such that the gap is provided between the at least one of the inner limiting portion and the outer limiting portion and the other one of the boards, even if the excessive material is supplied during the formation of the sealing member, the excessive material of the sealing member is released to the space between the inner limiting portion and the second inner limiting portion or the space between the outer limiting portion and the second outer limiting portion.
(7) At least one of the second inner limiting portion and the second outer limiting portion may be included in at least one of the first board and the second board such that a gap is provided between the at least one of the second inner limiting portion and the second outer limiting portion and another one of the boards. If the distance between the inner limiting portion and the second inner limiting portion or the distance between the outer limiting portion and the second limiting portion is set larger, a larger amount of the excessive material of the sealing member can be released. However, an area required for the limiting portions becomes larger, that is, the frame size of the display panel becomes larger. As described above, the at least one of the second inner limiting portion and the second outer limiting portion is included in one of the first board and the second board such that the gap is provided between the at least one of the second inner limiting portion and the second outer limiting portion and the other one of the boards. Therefore, the excessive amount of material of the sealing member can be released to the space between the inner limiting portion and the second limiting portion or the space between the outer limiting portion and the second outer limiting portion at a certain upper limit even if the distance between the inner limiting portion and the second inner limiting portion or the distance between the outer limiting portion and the second outer limiting portion is not set relatively large. Only if the amount of material of the sealing member exceeds the upper limit, the excessive material is released to the internal space or the outside through the gap between at least one of the second inner limiting portion and the second outer limiting portion and the other one of the boards. Namely, the distance between the inner limiting portion and the second inner limiting portion or the distance between the outer limiting portion and the second outer limiting portion is set as small as possible. This is advantageous for reducing the frame size of the display panel.
(8) At least one of the first board and the second board may include at least a color filter, a light blocking portion, and a spacer. The color filter may include multiple color portions. The light blocking portion may be arranged between the adjacent color portions. The space may be for defining a distance between the at least one of the first board and the second board and the other one of the first board and the second board. The inner limiting portion and the outer limiting portion may be included in the one of the boards and made of same material as that of at least one of the color filter, the light blocking portion, and the spacer. The inner limiting portion and the outer limiting portion may be made of the same material as that of the color filter, the light blocking portion, and the spacer that are originally included in the one of the boards. According to the configuration, the cost required for forming the inner limiting portion and the outer limiting portion in the one of the boards can be reduced.
(9) The inner limiting portion and the outer limiting portion may be included in one of the first board and the second board. The sealing member may contain at least a curing resin and spacer particles. The other one of the first board and the second board may include a spacer holding groove for holding the spacer particles therein at a portion that is in contact with the sealing member. If the excessive amount of material is supplied during the formation of the sealing member, the spacer particles in the excessive material of the sealing member are released to the spacer holding groove formed in the portion of the other one of the first board and the second board in contact with the sealing member and in which the inner limiting portion and the outer limiting portion are formed. According to the configuration, the spacer particles are less likely to move over the inner limiting portion or the outer limiting portion. Therefore, the distance (the cell gap) between the first board and the second board is less likely to be uneven.
(10) Any one of the first board and the second board may include at least a switching component that uses an oxide semiconductor as a semiconductor film and a pixel electrode connected to the switching component. Because the oxide semiconductor is used for the semiconductor film of the switching component, in comparison to a configuration in which amorphous silicon is used for the semiconductor film, an off-leak current of the switching component is small. A high voltage retaining rate of the pixel electrode is achieved. This is advantageous for non-scanning driving (low-frequency driving) during display of a still image. If moisture enters from the outside to the internal space through the sealing member, a leak current from the pixel electrode tends to increase due to the moisture. As a result, a voltage of the pixel electrode charged through the switching component tends to drop during the non-scanning driving. With the inner limiting portion and the outer limiting portion, the sealing member forming area is less likely become smaller than designed. Therefore, the moisture is less likely to enter from the outside to the internal space via the sealing member and thus the voltage drop of the pixel electrode due to the moisture is less likely to occur. According to the configuration, the display quality is maintained at a high level.
(11) The oxide semiconductor may contain indium (In), gallium (Ga), zinc (Zn), and oxygen (O) as base components. According to the configuration, the off-leak current of the switching component can be further reduced and thus the voltage retaining rate of the pixel electrode increases. This is further advantageous for the non-scanning driving (the low-frequency driving) during the display of a still image.
(12) The display panel may further include liquid crystals in the internal space between the first board and the second board. The liquid crystals in the internal space between the first board and the second board that are opposite to each other are sealed with the sealing member that surrounds the internal space.
A method of producing a display panel according to the present invention includes a limiting portion forming process, a sealing member forming process, and a bounding process. The limiting portion forming process is for forming an inner limiting portion in any one of a first board and a second board closer to an internal space and an outer limiting portion on an outer side farther from the internal space. The sealing member forming process is for forming a sealing member between the inner limiting portion and the outer limiting portion on the one of the boards. The bonding process is for bonding another one of the first board and he second board opposite the one of the boards to the one of the boards with the internal space therebetween.
In the limiting portion forming process, the inner limiting portion and the outer limiting portion are formed in one of the first board and the second board. In the sealing member forming process, the sealing member is formed between the inner limiting portion and the outer limiting portion that are formed in the one of the boards in advance. Therefore, a sealing member forming area is formed is properly limited by the inner limiting portion and the outer limiting portion. In the bonding process, the other one of the first board and the second board is bonded to the one of the boards such that the boards are opposite to each other with the internal space therebetween. As a result, the inner space is sealed with the sealing member.
In the sealing member forming process, the amount of material of the sealing member supplied to the one of the boards may vary according to individual specificity of a machine that supplies the material or temperature conditions. If the amount of material of the sealing member to be supplied is set larger than a normal amount, the actual amount of supplied material of the sealing member is less likely to be short. Namely, the sealing member forming area is less likely to become smaller than designed. Therefore, the moisture is less likely to enter from the outside to the internal space and thus the display quality is less likely to decrease.
If the amount of material of the sealing member to be supplied is set as described above, the excessive amount of material of the sealing member may be supplied. In this case, the sealing member forming area is limited by the inner limiting portion located closer to the internal space and the outer limiting portion located on the outer side farther from the internal space. Therefore, the sealing member forming area is less likely to expand toward the internal space and thus the display quality is less likely to decrease. The sealing member forming area is less likely to expand toward the outside farther from the internal space. Therefore, the appearance of the display panel is less likely to degrade. Furthermore, in the production process of the display panel, cutting of the base board for preparing multiple display panels therefrom is properly performed.
Preferable embodiments of the method of producing the display panel may include the following.
(1) The sealing portion forming process may include supplying a material of the sealing member to the one of the boards at an amount such that a sealing member forming area is larger than a distance between the inner limiting portion and the outer limiting portion. In the sealing member forming process, because the material of the sealing member to the one of the boards at the amount such that the sealing member forming area is larger than a distance between the inner limiting portion and the outer limiting portion, even if the actual supplied amount is smaller than the set amount due to the individual specificity of the machine that supplies the material or the temperature conditions, the material of the sealing member is further less likely to be short. Because the sealing member forming area is less likely to become smaller than designed, the moisture is less likely to enter from the outside to the internal space through the sealing member and thus the display quality is less likely to decrease.
According to the present invention, the sealing member forming area is stabilized.
A first embodiment of the present invention will be described with reference to
As illustrated in
The backlight unit 14 will be briefly described. As illustrated in
Next, the liquid crystal panel 11 will be described. As illustrated in
Next, the components connected to the liquid crystal panel 11 will be described. As illustrated in
The flexible printed circuit board (an FPC board) 13 includes a base member made of synthetic resin having insulating property and flexibility (e.g., polyimide resin) as illustrated in
As illustrated in
The liquid crystal panel 11 will be described in more detail. As illustrated in
The liquid crystal panel 11 according to this embodiment operates in a fringe field switching (FFS) mode that is a mode improved from an in-plane switching (IPS) mode. As illustrated in
The films formed in layers on the inner surface of the array board 11b (on the liquid crystal layer 11c side, a surface opposite the CF board 11a) by a known photolithography method will be described. As illustrated in
The first metal film 34 is a multilayer film of titanium (Ti) and copper (Cu). The gate insulator 35 is formed at least above the first metal film 34 and is made of, for example, silicon oxide (SiO2). The semiconductor film 36 is a thin film of an In—Ga—Zn—O (oxide) semiconductor (an indium gallium zinc oxide) containing indium (In), gallium (Ga), and zinc (Zn) as main components. The oxide semiconductor film, that is, the oxide semiconductor film 36 is amorphous or crystalline. The protection film 37 is made of silicon oxide (SiO2). The second metal film 38 is a multilayer film that includes titanium (Ti) and copper (Cu). The first interlayer insulator 39 is made of silicon oxide (SiO2). The organic insulator 40 is made of acrylic resin (e.g., polymethyl methacrylate (PMMA)), which is an organic material, and functions as a planarization film. The first transparent electrode film 23 and the second transparent electrode film 24 are made of a transparent electrode material such as indium tin oxide (ITO) or zinc oxide (ZnO). The second interlayer insulator 41 is made of silicon nitride (SiNx). The first transparent electrode film 23 and the second transparent electrode film 24 among these films are formed only in the display area AA of the array board 11b, and are not formed in the non-display area NAA. The insulators made of the insulating materials, such as the gate insulator 35, the protection film 37, the first interlayer insulator 39, the organic insulator 40, and the second interlayer insulator 41, are formed in solid patterns disposed in a substantially whole area of the surface of the array board 11b (although holes are formed in some areas). The first metal film 34, the oxide semiconductor film 36, and the second metal film 38 are formed in predetermined patterns in the display area AA and the non-display area NAA of the array board 11b.
Next, configurations of components in the display area AA of the array board 11b will be described in sequence. As illustrated in
As illustrated in
As illustrated in
Each pixel electrode 18 is formed from the second transparent electrode film 24 as illustrated in
The common electrode 22 is formed from the first transparent electrode film 23. The common electrode 22 is a solid trace formed in the substantially entire display area AA of the array board 11b. The common electrode 22 is sandwiched between the organic insulator 40 and the second interlayer insulator 41. A common potential (a reference potential) is applied to the common electrode 22 through a common line, which is not illustrated. By controlling the potential to be applied to the pixel electrode 18 by the TFT 17 as described above, a predetermined potential difference is generated between the electrodes 18 and 22. When the potential difference is generated between the electrodes 18 and 22, a fringe field (an oblique field) including a component in a direction normal to a plate surface of the array board 11b is applied to the liquid crystal layer 11c in addition to a component in a direction along the plate surface of the array board 11b because of the slit 18a of the pixel electrode 18. Therefore, not only alignment of the liquid crystal molecules in the slit 18a in the liquid crystal layer 11c but also alignment of the liquid crystal molecules on the pixel electrode 18 is properly switchable. With this configuration, the aperture ratio of the liquid crystal panel 11 increases and a sufficient amount of transmitted light is obtained. Furthermore, high view-angle performance is achieved. The common electrode 22 is provided with an opening 22a in a portion overlapping with a portion of the TFT 17 in a plan view (specifically, in the range of an approximately rectangular shape surrounded by a two-dot chain line in
Next, configurations of components in the display area AA of the CF board 11a will be described in detail. As illustrated in
Driving of the liquid crystal panel 11 will be described. In driving of the liquid crystal panel 11, operations of the TFTs 17 are controlled by a control circuit board 12 that supplies signals to the liquid crystal panel via the driver 21 to control operations of the TFTs 17. The control circuit board 12 supplies scanning signals to the gate lines 19 and data signals to the source lines 20 via the driver 21 for scanning the TFTs 17 included in the pixels, which are disposed along the row direction, along the column direction in sequence. According to the configuration, the pixel electrodes 18 in the pixels are charged in sequence along the column direction. The driving may include a scanning period (a refreshing period, a refreshing frame) and a non-scanning period (a non-refreshing period, a non-refreshing frame). In the scanning period, all gate lines 19 are scanned for refreshing the screen. In the non-scanning period, none of the gate lines 19 are scanned for halting the refreshing of the screen. According to the driving, operations of the control circuit board 12 and the driver 21 are halted and thus the power consumption of the liquid crystal display device 10 is reduced. This type of driving is referred to as “a non-scanning driving (a low frequency driving, an intermittent driving).” In this embodiment, specifically, as illustrated in
In the liquid crystal panel 11, as illustrated in
As illustrated in
As illustrated in
As illustrated in
This embodiment has the configuration described above. Next, a method of producing the liquid crystal panel 11 will be described. The liquid crystal panel 11 according to this embodiment is produced through a CF board preparing process, an array board preparing process, a sealing member forming process, a one drop filling process (a liquid crystal arrangement process), a bonding process, and a cutting process. The CF board preparing process is for preparing the CF base board including multiple CF boards 11a. The array board preparing process is for preparing the array base board including multiple array boards 11b. The sealing member forming process is for forming the sealing member 11j on each CF board 11a of the CF base board. The one drop filling process is for dropping (or arranging) the liquid crystal material for the liquid crystal layer 11c on each CF board 11a of the CF base board. The bonding process is for bonding the CF base board and the array base board together for preparing a panel base board 11M. The cutting process is for cutting the panel base board 11M into multiple liquid crystal panels 11.
In the CF board preparing process, the components are formed in layers on the glass substrate GS of the CF board 11a in sequence by a known photolithography. A large so-called mother glass from which multiple CF boards 11a are prepared is used. The mother glass is divided into sections that correspond to the CF boards 11a and components of each CF board 11a are formed in layers in each section. As a result, the CF base board is prepared. In the array board preparing process, the components are formed on the glass substrate GS of the array board 11b in sequence by a known photolithography. A large so-called mother glass from which multiple array boards 11b are prepared is used. The mother glass is divided into sections that correspond to the array boards 11b and components of each array board 11b are formed in layers in each section. As a result, the array base board is prepared.
The CF board preparing process will be described in detail. The CF board preparing process includes at least a light blocking layer forming step (a light blocking portion forming step), a color filter forming step, an OC layer forming step (a planarization film forming step), a spacer and limiting portion forming step (a limiting portion forming step), and an alignment film forming step. The light blocking layer forming step is for forming the light blocking layer 11i on the mother glass (or the glass substrate GS). The color filter forming step is for forming the color portions of the color filters 11h in sequence on the mother glass on which the light blocking layer 11i is formed. The OC layer forming step is for forming the OC layer 11k layered on the light blocking layer 11i and the color filters 11h. The spacer and limiting portion forming step is for forming the spacers 111 and the limiting portions 42 to 45 layered on the OC layer 11k. The alignment film forming step is for forming the alignment film 11d layered on the OC layer 11k, the spacers 111, and the limiting portions 42 to 45. In the spacer and limiting portion forming step, as illustrated in
On the CF base board (or the CF boards 11a) prepared through the CF board preparing process described above, the sealing member 11j is formed through the sealing member forming process. In the sealing member forming process, using a nozzle of the sealant dispenser, which is not illustrated, the material of the sealing member 11j is applied in the sealing forming space SS that is provided in advance between the first inner limiting portion 42 and the first outer limiting portion 43. During the application of the material, either one of or both of the CF base board and the nozzle of the sealant dispenser are moved. As a result, the sealing member 11j having a frame-like shape in a plan view is formed for the entire periphery of the sealing forming space SS. The amount of the material of the sealing member 11j to be supplied from the sealant dispenser to the CF base board is set larger than the normal amount. For example, if a set area in which the sealing member 11j will be formed, that is, the width of the sealing forming space SS between the first inner limiting portion 42 and the first outer limiting portion 43 is 1 mm, the amount of the material of the sealing member 11j to be supplied by the sealant dispenser is set such that the forming area of the sealing member 11j has a width of 1.1 mm. Namely, the amount of the material of the sealing member 11j supplied by the sealant dispenser is set such that the forming area of the sealing member 11j with the supplied material has a width larger than the distance between the first inner limiting portion 42 and the first outer limiting portion 43. Even if the actual supplied amount of the material of the sealing member 11j is lower than an assumed lower limit due to the individual specificity of the sealant dispenser or the temperature conditions, the amount of the material sufficient for forming the sealing member 11j having a target forming area is supplied. Therefore, the sealing member 11j is less likely to have the narrow portion. In
The one drop filling process is performed after the sealing forming process. In the one drop filling process, as illustrated in
If the excessive amount of the material of the sealing member 11j is supplied, the ultraviolet curing resin UR in the material is released to the inner escapes space IES or the outer escapes space OES via the first gaps C1 as illustrated in
As illustrated in
As described above, the liquid crystal panel (a display panel) 11 of this embodiment includes the first board (the CF board 11a or the array board 11b), the second board (the array board 11b or the CF board 11a), the sealing member 11j, the first inner limiting portion 42, and the first outer limiting portion 43. The second board is disposed opposite the first board such that the internal space IS is provided between the first board and the second board. The sealing member 11j is disposed between the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) so as to surround the internal space IS and seal the internal space IS. The first inner limiting portion (an inner limiting portion) 42 is included in at least one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a). The first inner limiting portion 42 is located closer to the internal space IS than the sealing member 11j to limit the forming area of the sealing member 11j from the internal space IS side. The first outer limiting portion 43 is located on the outer side farther from the internal space IS than the sealing member 11j to limit the forming area of the sealing member 11j from the outer side.
The internal space IS is provided between the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) that are opposite to each other. The sealing member 11j is disposed so as to surround the internal space IS and the internal space IS is sealed with the sealing member 11j. The amount of the material supplied to at least one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) during the formation of the sealing member 11j varies according to the individual specificity of the machine that supplies the material or the temperature conditions. Therefore, the amount of the material of the sealing member 11j to be supplied may be set larger than the normal amount so that the material of the sealing member 11j actually supplied is less likely to be short. Because the forming area of the sealing member 11j is less likely to be smaller than designed, the moisture is less likely to enter from the outside to the internal space IS. Therefore, the display quality is less likely to decrease.
When the amount of the material of the sealing member 11j to be supplied is set larger as described above, the excessive amount of the material of the sealing member 11j may be supplied. However, the forming area of the sealing member 11j is limited by the first inner limiting portion 42 located closer to the internal space IS and the first outer limiting portion 43 located on the outer side farther from the internal space IS. Therefore, the forming area of the sealing member 11j is less likely to become larger than designed. Because the forming area of the sealing member 11j is less likely to expand toward the internal space IS, the display quality is less likely to decrease and the forming area of the sealing member 11j is less likely to expand toward the outside farther from the internal space IS. Therefore, the appearance of the liquid crystal panel 11 is less likely to degrade. Furthermore, in the production process of the liquid crystal panel 11, the cutting of the base board is properly performed for preparing multiple liquid crystal panels 11 from the base board.
The first inner limiting portion 42 and the first outer limiting portion 43 are in contact with the sealing member 11j. According to the configuration, the forming area of the sealing member 11j is further properly limited.
The second inner limiting portion (a second inner limitation portion) 44 is included in at least one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a). The second inner limiting portion 44 is located closer to the internal space IS than the first inner limiting portion 42 with the gap therebetween. The second outer limiting portion (the second outer limiting portion) 45 is included in at least one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a). The second outer limiting portion 45 is located on the outer side farther from the internal space IS than the first outer limiting portion 43 with the gap therebetween. Even if the excessive amount of the material is supplied during the formation of the sealing member 11j, the excessive material of the sealing member 11j is released to at least one of the space between the first inner limiting portion 42 and the second inner limiting portion 44 and the space between the first outer limiting portion 43 and the second outer limiting portion 45. If the second inner limiting portion 44 is included, the excessive material of the sealing member 11j is released to the space between the first inner limiting portion 42 and the second inner limiting portion 44. Furthermore, with the second inner limiting portion 44, the material is less likely to leak to the internal space IS and thus a decrease in display quality is further properly restricted. If the second outer limiting portion 45 is included, the excessive material of the sealing member 11j is released to the space between the first outer limiting portion 43 and the second outer limiting portion 45. Furthermore, with the second outer limiting portion 45, the material is less likely to leak to the outside farther from the internal space IS and thus a decrease in display quality is further properly restricted. Still furthermore, the cutting for preparing the liquid crystal panels 11 from the baser board is more properly performed in the production process of the liquid crystal panel 11.
At least one of the second inner limiting portion 44 and the second outer limiting portion 45 is along the sealing member 11j for the entire periphery of the sealing member 11j. Even if the excessive amount of the material is supplied during the formation of the sealing member 11j, at least one of the second inner limiting portion 44 and the second outer limiting portion 45 along the sealing member 11j for the entire periphery more properly restricts the leak of the excessive material of the sealing member 11j to the internal space IS or the outer side away from the internal space IS.
At least one of the first inner limiting portion 42 and the first inner limiting portion 43 is included in the CF board 11a that is one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) such that the first gap (a gap) C1 is provided between at least one of the first inner limiting portion 42 and the first inner limiting portion 43 and the array board 11b that is the other board. Even if the excessive amount of the material is supplied during the formation of the sealing member 11j, the excessive material of the sealing member 11j is released to the space between the first inner limiting portion 42 and the second inner limiting portion 44 or the space between the first outer limiting portion 43 and the second outer limiting portion 45 via the first gap C1. This is because the at least one of the first inner limiting portion 42 and the first outer limiting portion 43 is included in one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) such that the first gaps C1 is provided between at least one of the first inner limiting portion 42 and the first outer limiting portion 43 and the array board 11b that is the other board.
At least one of the second inner limiting portion 44 and the second outer limiting portion 45 is included in the CF board 11a that is one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) such that the second gap (a gap) C2 is provided between at least one of the second inner limiting portion 44 and the second outer limiting portion 45 and the array board 11b that is the other board. The larger the distance between the first inner limiting portion 42 and the second inner limiting portion 44 or the distance between the first outer limiting portion 43 and the second outer limiting portion 45, the larger the amount of the excessive material of the sealing member 11j to be released. However, the space in which the limiting portions are formed becomes larger and the frame of the liquid crystal panel 11 becomes wider. As described above, at least one of the second inner limiting portion 44 and the second outer limiting portion 45 is included in the CF board 11a that is one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) such that the second gap C2 is provided between at least one of the second inner limiting portion 44 and the second outer limiting portion 45 and the array board 11b that is the other board. Therefore, even if the distance between the first inner limiting portion 42 and the second inner limiting portion 44 or the distance between the first outer limiting portion 43 and the second outer limiting portion 45 is not large, the excessive material of the sealing member 11j is released to the space between the first inner limiting portion 42 and the second inner limiting portion 44 or the space between the first outer limiting portion 43 and the second outer limiting portion 45 up to the upper limit. If the amount of the supplied material of the sealing member 11j exceeds the upper limit, the excessive material is released to the internal space IS or the outer side via the second gap C1 between at least one of the second inner limiting portion 44 and the second outer limiting portion 45 and the array board 11b that is the other board. The distance between the first inner limiting portion 42 and the second inner limiting portion 44 or the distance between the first outer limiting portion 43 and the second outer limiting portion 45 can be defined as small as possible. This is advantageous for reducing the frame size of the liquid crystal panel 11.
The CF board 11a that is one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) includes at least the color filters including the color portions, the light blocking portions, and the spacers. Each light blocking portion is arranged between the adjacent color portions. The spacers define the distance to the array board 11b that is the other one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b and the CF board 11a). The first inner limiting portion 42 and the first outer limiting portion 43 are included in the CF board 11a that is one of the boards. The first inner limiting portion 42 and the first outer limiting portion 43 are made of the same material as that of at least one of the color filters, the light blocking portions, and the spacers. The first inner limiting portion 42 and the first outer limiting portion 43 are made of the same material as that of at least one of the color filters, the light blocking portions, and the spacers that are originally included in the CF board 11a that is one of the boards. Therefore, the cost for forming the first inner limiting portion 42 and the first outer limiting portion 43 in the CF board 11a that is one of the boards can be reduced.
One of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) includes at least the TFTs (switching components) 17 and the pixel electrodes 18. The oxide semiconductors are used for the semiconductor films 36 of the TFTs 17. The pixel electrodes 18 are connected to the TFTs 17. Because the oxide semiconductors are used for the semiconductor films 36 of the TFTs 17, in comparison to a configuration in which the amorphous silicon is used for the semiconductor films 36, the off-leak currents of the TFTs 17 are small. This is advantageous for non-scanning driving (low frequency driving) during the still image display. If the moisture enters from the outside to the internal space IS through the sealing member 11j, the leak currents from the pixel electrodes 18 tend to increase due to the moisture. As a result, the voltage of each pixel electrode 18 charged through the corresponding TFT 17 tends to drop during the non-scanning driving. As described earlier, with the first inner limiting portion 42 and the first outer limiting portion 43, the forming area of the sealing member 11j is less likely to become smaller than designed. Therefore, the moisture is less likely to enter from the outside to the internal space IS through the sealing member 11j and thus the voltage drop of the pixel electrode 18 due to the moisture is less likely to occur. As a result, the display quality is maintained at a high level.
The oxide semiconductor of the semiconductor film 36 contains mainly indium (In), gallium (Ga), zinc (Zn), and oxygen (O). According to the configuration, the off-leak current from the TFT 17 is smaller. The high voltage retaining rate of the pixel electrode 18 is achieved. This is further advantageous for the non-scanning driving (low frequency driving) during the still image display.
The liquid crystal layer (liquid crystals) 11c is in the internal space IS between the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a). The liquid crystal layer 11c in the internal space IS between the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) opposite to each other is sealed with the sealing member 11j that surrounds the internal space IS.
The method of producing the liquid crystal panel 11 includes the limiting portion forming process, the sealing member forming process, and the bonding process. The limiting portion forming process is for forming the first inner limiting portion 42 at the position closer to the internal space IS on the CF board 11a and the first outer limiting portion 43 farther from the internal space IS on the CF board 11a that is one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a). The sealing member forming process is for forming the sealing member 11j between the first inner limiting portion 42 and the first outer limiting portion 43 on the CF board 11a that is one of the boards. The bonding process is for placing the array board 11b that is the other one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) opposite the CF board 11a that is one of the boards such that the internal space IS is therebetween and bonding the array board 11b to the CF board 11a.
In the limiting portion forming process, the first inner limiting portion 42 and the first outer limiting portion 43 are formed on the CF board 11a that is one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a). In the sealing member forming process, the sealing member 11j is formed in the space between the first inner limiting portion 42 and the first outer limiting portion 43 that is formed in advance on the CF board 11a that is one of the boards. Therefore, the forming area of the sealing member 11j is properly limited by the first inner limiting portion 42 and the first outer limiting portion 43. In the bonding process, the array board 11b that is the other one of the first board (the CF board 11a or the array board 11b) and the second board (the array board 11b or the CF board 11a) is bonded to the CF board 11a that is one of the boards such that the internal space IS is therebetween. As a result, the internal space IS is sealed with the sealing member 11j.
In the sealing member forming process, the amount of the material of the sealing member 11j supplied to the CF board 11a that is one of the boards may vary according to the individual specificity of the machine that supplies the material or the temperature conditions. If the amount of the material of the sealing member 11j to be supplied is set larger than the normal amount, the material of the sealing member 11j which is actually supplied is less likely to be short. Therefore, the forming area of the sealing member 11j is less likely to have a portion narrower than designed. The moisture is less likely to enter from the outside to the internal space IS through the sealing member 11j. Therefore, the display quality is less likely to decrease.
If the amount of the material of the sealing member 11j to be supplied is defined as described above, an excessive amount of the material of the sealing member 11j may be supplied. However, the forming area of the sealing member 11j is limited by the first inner limiting portion 42 located closer to the internal space IS and the first outer limiting portion 43 located on the outer side farther from the internal space IS. Therefore, the forming area of the sealing member 11j is less likely to become larger than designed. Namely, the forming area of the sealing member 11j is less likely to expand toward the internal space IS. The display quality is less likely to decrease and the forming area of the sealing member 11j is less likely to expand toward the outside farther from the internal space IS. The appearance of the liquid crystal panel 11 is less likely to degrade. Furthermore, in the process for producing the liquid crystal panel 11, the cutting of the base board for preparing the liquid crystal panels 11 from the base board is properly performed.
In the sealing member forming process, the amount of the material of the sealing member 11j to be supplied to the CF board 11a that is one of the boards is set such that the area in which the sealing member 11j if formed is larger than the distance between the first inner limiting portion 42 and the first outer limiting portion 43. In the sealing member forming process, the material of the sealing member 11j is supplied to the CF board 11a that is one of the boards with the amount to form the sealing member 11j such that the area thereof is larger than the distance between the first inner limiting portion 42 and the first outer limiting portion 43. Even if the amount actually supplied is smaller than the set amount due to the individual specificity of the machine that supplies the material or the temperature conditions, the material of the sealing member 11j will not be short. The forming area of the sealing member 11j is less likely to become smaller than designed. Therefore, the moisture is less likely to enter from the outside to the internal space IS through the sealing member 11j and thus the display quality is less likely to decrease.
A second embodiment according to the present invention will be described with reference to
As illustrated in
As described above, in this embodiment, at least one of the first inner limiting portions 142 and the first outer limiting portions 143 are arranged at intervals along the peripheral direction of the sealing member 111j. Even if the excessive amount of the material is supplied during the formation of the sealing member 111j, the excessive material is smoothly released to the space between the first inner limiting portion 142 and the second inner limiting portion 144 or the space between the first outer limiting portion 143 and the second outer limiting portion 145 through the openings of at least one of the first inner limiting portions 142 and the first outer limiting portions 144 that are arranged at intervals along the peripheral direction of the sealing member 111j.
The sealing member 111j includes at least the ultraviolet curing resin (a hardening resin) and the spacer particles. At least one of the first inner limiting portions 142 and the first outer limiting portions 143 include the openings IO or OO that open toward the internal space IS and the outside and have the opening widths IOW or OOW are larger than the diameter of the spacer particles. Even if the excessive amount of the material is supplied during the formation of the sealing member 111j, the spacer particle in the excessive material is released to the internal space IS or the outside through the openings IO or OO because the opening width IOW or OOW of the openings IO or OO formed in at least one of the first inner limiting portions 142 and the first outer limiting portions 143 is larger than the diameter of the spacer particles. According to the configuration, the spacer particles are less likely to move over the first inner limiting portions 142 or the first outer limiting portions 143. Therefore, a distance (or a cell gap) between the first board and the second board is less likely to become uneven.
A third embodiment according to the present invention will be described with reference to
As illustrated in
As described above, the first inner limiting portions 242 and the first outer limiting portion 243 according to this embodiment are included in the CF board 211a that is one of the first board (the CF board 211a or the array board 211b) and the second board (the array board 211b or the CF board 211a). The sealing member 211j includes at least the ultraviolet curing resin UR and the spacer particles SP. The array board 211b that is the other one of the first board (the CF board 211a or the array board 211b) and the second board (the array board 211b or the CF board 211a) includes the spacer holding grooves 46 at the portions that are in contact with the sealing member 211j for holding the spacer particles SP. If the excessive amount of the material is supplied during the formation of the sealing member 211j, the spacer particles SP in the excessive material of the sealing member 211j are released to the spacer holding grooves 46. The spacer holding grooves 46 are formed in the portions of the array board 211b which are in contact with the sealing member 211j. The array board 211b is the board other than the CF board 211a that is one of the first board (the CF board 211a or the array board 211b) and the second board (the array board 211b or the CF board 211a) and includes the first inner limiting portions 242 and the first outer limiting portions 243. According to the configuration, the spacer particles SP are less likely to move over the first inner limiting portions 242 or the first outer limiting portions 243. Therefore, a distance (or a cell gap) between the first board (the CF board 211a or the array board 211b) and the second board (the array board 211b or the CF board 211a) is less likely to become uneven.
A fourth embodiment according to the present invention will be described with reference to
As illustrated in
A fifth embodiment according to the present invention will be described with reference to
As illustrated in
A sixth embodiment according to the present invention will be described with reference to
As illustrated in
A seventh embodiment according to the present invention will be described with reference to
As illustrated in
An eighth embodiment according to the present invention will be described with reference to
As illustrated in
A ninth embodiment according to the present invention will be described with reference to
As illustrated in
A tenth embodiment according to the present invention will be described with reference to
As illustrated in
An eleventh embodiment according to the present invention will be described with reference to
As illustrated in
A twelfth embodiment according to the present invention will be described with reference to
As illustrated in
A thirteenth embodiment according to the present invention will be described with reference to
As illustrated in
A fourteenth embodiment according to the present invention will be described with reference to
As illustrated in
A fifteenth embodiment according to the present invention will be described with reference to
As illustrated in
A sixteenth embodiment of the present invention will be described with reference to
As illustrated in
The present invention is not limited to the above embodiments described with reference to the drawings. The following embodiments may be included in the technical scope of the present invention.
(1) A modification of the first embodiment may include a first inner limiting portion 42-1, a first outer limiting portion 42-2, and a second outer limiting portion 45-1 but not include the second inner limiting portion as illustrated in
(2) A modification of the first embodiment may include a first inner limiting portion 42-2, a first outer limiting portion 43-2, and a second inner limiting portion 44-2 but not include the second outer limiting portion as illustrated in
(3) A modification of the first embodiment may include a first inner limiting portion 42-3 and a first outer limiting portion 43-3 but not include the second inner limiting portion and the second outer limiting portion as illustrated in
(4) A modification of the second embodiment may include a first inner limiting portion 42-4 and a first outer limiting portion 43-4 having a height such that they are in contact with an array board 11b-4 as illustrated in
(5) A modification of the second embodiment may include a first inner limiting portion 42-5 that only has a height such that it is in contact with an array board 11b-5 as illustrated in
(6) A modification of the second embodiment may include a first outer limiting portion 43-6 that only has a height such that it is in contact with an array board 11b-6 as illustrated in
(7) A modification of the second embodiment may include limiting portions 42-7 to 45-7 that are all in contact with an array board 11b-7 as illustrated in
(8) The above configurations (1) to (3) may be applied to the second and the third embodiments.
(9) The above configurations (4) to (7) may be applied to the first and the third embodiments.
(10) In each of the above embodiments, the second inner limiting portion is on inner than the first inner limiting portion and the second outer limiting portion is on outer than the first outer limiting portion. A third inner limiting portion may be formed at a position further inner than the second inner limiting portion and a distance from the second inner limiting portion. A third outer limiting portion may be formed at a position further outer than the second outer limiting portion and a distance from the second outer limiting portion. Another limiting portion may be added at a position inner than the third inner limiting portion or another limiting portion may be added at a position outer than the third outer limiting portion.
(11) In each of the above embodiments, all the limiting portions (the first inner limiting portion, the first outer limiting portion, the second inner limiting portion, and the second outer limiting portion) are included in the CF board. At least one of the first inner limiting portion, the first outer limiting portion, the second inner limiting portion, and the second outer limiting portion may be included in the array board. If the first inner limiting portion and the first outer limiting portion are included in the array board, it is preferable to apply the material of the sealing member to the array board in the sealing member forming process. All the limiting portions may be included in the array board. In this case, it is preferable to apply the material of the sealing member to the array board.
(12) Other than the above (11), at least one of the first inner limiting portion, the first outer limiting portion, the second inner limiting portion, and the second outer limiting portion may be included in each of the array board and the CF board.
(13) The sealing member forming area (the width, the sealing width), the widths of the first inner limiting portion, the first outer limiting portion, the second inner limiting portion, and the second outer limiting portion, the distance between the first inner limiting portion and the second inner limiting portion, the distance between the first outer limiting portion and the second outer limiting portion, the cell gap size, and the diameter of the spacer particle may be altered from those of the above embodiments as appropriate.
(14) The lengths or intervals (or the opening widths of the openings) of the first inner limiting sections and the first outer limiting sections may be altered from those of the second embodiment as appropriate.
(15) The width and the depth of the spacer holding groove may be altered from those of the third embodiment.
(16) In each of the above embodiments, the material of the sealing member contains the ultraviolet curing resin. However, other type of curing resin may be used. For example, a light curing resin that is hardened with visible light or a thermosetting resin that is hardened with heat may be used. In any cases, it is preferable to contain spacer particles.
(17) In each of the above embodiments, the material of the sealing member includes the spacer particles. However, a material only containing a curing resin, that is, without the spacer particles may be used.
(18) The fourth to the seventh embodiments may be applied to the second and the third embodiments.
(19) The second and the eighth to the fifteenth embodiment may be applied to the third embodiment.
(20) The sixteenth embodiment may be applied to the second embodiment.
(21) In each of the above embodiments, the spacers disposed in the display area are the photo spacers. The spacers may include spherical spacers dispersed within the display area.
(22) The production method using the mother glasses from which nine CF boards and nine array boards are prepared is described. The number of boards prepared from a single mother glass may be altered as appropriate. A production method not using a mother glass may be used.
(23) A row control circuit for supplying output signals from the driver to the gate lines or a column control circuit for supplying output signals from the driver to the source lines may be disposed in the non-display area of the array board. The row control circuit and the column control circuit may be monolithically fabricated on the array board as the semiconductor oxide as a base. The semiconductor oxide is a material for the semiconductor film of the TFT. The row control circuit and the column control circuit include control circuit for controlling supply of the output signals to the TFTs, respectively. The row control circuit and the column control circuit are formed by patterning simultaneously on the array board by a known photolithography during the patterning of the TFTs in the production process of the array board. Specifically, the column control circuit may include a switching circuit (an RGB switching circuit) for distributing image signals in the output signals from the driver to the source lines. The row control circuit may further include an accessary circuit such as a level shifter circuit and an ESD protection circuit. The column control circuit may include a scanning circuit for supplying scanning signals in the output signals from the driver at predetermined timing for scanning the gate lines in sequence. The column control circuit may further include an accessary circuit such as a level shifter circuit and an ESD protection circuit.
(24) In the above embodiments, the oxide semiconductor film is the oxide thin film containing indium (In), gallium (Ga), and zinc (Zn). However, another kind of oxide semiconductor material may be used. Specifically, an oxide containing indium (In), silicon (Si), and zinc (Zn), an oxide containing indium (In), aluminum (Al), and zinc (Zn), an oxide containing tin (Sn), silicon (Si), and zinc (Zn), an oxide containing tin (Sn), aluminum (Al), and zinc (Zn), an oxide containing tin (Sn), gallium (Ga), and zinc (Zn), an oxide containing gallium (Ga), silicon (Si), and zinc (Zn), an oxide containing gallium (Ga), aluminum (Al), and zinc (Zn), an oxide containing indium (In), copper (Cu), and zinc (Zn), an oxide containing tin (Sn), copper (Cu), and zinc (Zn) may be used.
(25) The first metal film and the second metal film are formed from a multilayer film of titanium (Ti) and copper (Cu) in the above embodiments. However, titanium may be replaced by molybdenum (Mo), molybdenum nitride (MoN), titanium nitride (TiN), tungsten (W), niobium (Nb), molybdenum-titanium alloy (MoTi), or molybdenum-tungsten alloy (MoW). Alternatively, a single-layer metal film of titanium, copper, or aluminum may be used.
(26) In each of the above embodiments, the liquid crystal panel includes the FFS mode as an operation mode. However, a liquid crystal panel including the IPS (In-Plane Switching) mode or the VA (Vertical Alignment) mode as an operation mode may be included in the scope of the present invention. If the liquid crystal panel includes the VA mode as an operation mode, a common electrode may be included in the CF board rather than the array board and may not include the OC layer.
(27) In each of the above embodiments, polyimide is used for the material of the alignment film. However, other type of liquid crystal alignment material may be used for the material of the alignment film.
(28) In each of the above embodiments, the photo alignment material is used for the material of the alignment film and the photo alignment film for performing alignment with application of ultraviolet rays is formed. An alignment film for performing alignment with rubbing may be included in the scope of the present invention.
(29) In each of the above embodiments, the display area on the liquid crystal panel is in the middle of the short dimension and off to one end of the long dimension. However, a liquid crystal panel including a display area in the middle of the long dimension and off to one end of the short dimension may be included in the scope of the present invention. Furthermore, a liquid crystal panel including a display area off to one end of the long dimension and to one end of the short dimension may be included in the scope of the present invention. Furthermore, a liquid crystal panel including a display area in the middle of the long dimension and in the middle of the short dimension may be included in the scope of the present invention.
(30) The driver is mounted directly on the array board by the COG method in the above embodiments. However, the driver mounted on the flexible printed circuit board connected to the array board through ACF may be included in the scope of the present invention.
(31) Each of the embodiments includes the liquid crystal panel having a vertically-long rectangular shape. However, a liquid crystal panel having a horizontally-long rectangular shape or a square shape may be included in the scope of the present invention.
(32) A configuration including the liquid crystal panel in each of the above embodiments and a functional panel such as a touch panel or a parallax barrier panel (switch liquid crystal panel) attached to the liquid crystal panel may be included in the scope of the present invention. Furthermore, a configuration including a touch panel pattern directly formed on a liquid crystal panel may be included in the scope of the present invention.
(33) The backlight device in the liquid crystal display device is the edge-light type in the above embodiments. However, a liquid crystal display device including a direct backlight device may be included in the scope of the present invention.
(34) Each of the above embodiments includes the transmissive type liquid crystal display device including the backlight device as an external light source. However, a reflective liquid crystal display device configured to display images using external light may be included in the scope of the present invention. Such a display device does not require a backlight device.
(35) Each of the above embodiments includes the TFTs as switching components of the liquid crystal display device. However, switching components other than the TFTs (such as thin film diodes (TFDs)) may be included in the scope of the present invention. Furthermore, a liquid crystal display device configured to display black and white images other than o the liquid crystal display device configured to display color images.
(36) Each of the above embodiments includes the liquid crystal panel including the liquid crystals held between the boards. However, a display panel including functional organic molecules other than the liquid crystals other than the liquid crystals held between the boards may be included in the scope of the present invention.
(37) In each of the above embodiments, the liquid crystal panel is used for the display panel. A PDP (plasma display panel) or an organic EL panel may be included in the scope of the present invention. In the DPD or the organic EL panel, if the sealing member forming area is not stable, the moisture is more likely to enter from the outside to the internal space through the wide portion of the sealing member. Therefore, similarly to the above embodiments, problems including a decrease in display quality may occur. Such problems can be solved by the technology of the present invention.
(38) The above embodiments include the liquid crystal panels that are classified as small sized or small to middle sized panels. Such liquid crystal panels are used in electronic devices including PDAs, mobile phones, laptop computers, digital photo frames, portable video games, and electronic ink papers. However, liquid crystal panels that are classified as middle sized or large sized (or supersized) panels having screen sizes from 20 inches to 90 inches are also included in the scope of the present invention. Such display panels may be used in electronic devices including television devices, electronic signboards (digital signage), and electronic blackboard.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013-060721 | Mar 2013 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2014/053974 | 2/20/2014 | WO | 00 |
