The present application claims the benefit of Chinese Patent Application No. 202210570268.3, filed on May 24, 2022, the content of which is incorporated herein by reference in its entirety.
The present disclosure relates to the field of display technologies, and, particularly, relates to a display panel, a method for manufacturing the display panel, and a display apparatus.
Compared with a liquid crystal display (LCD) panel, an organic light-emitting diode (OLED) panel has the advantages of self-luminescence, high luminous efficiency, low power consumption, fast response, wide viewing angle, high brightness, bright colors, and being light and thin, and so on, which is widely used in various electronic device.
In the related art, when an OLED display panel displays images, if only some pixel regions are to be lit, ideally, other pixel regions that should not be lit should be in a completely non-light-emitting state. However, due to the large leakage current between the lit pixel region and its adjacent pixel region, the adjacent pixel region that should not be lit will be slightly brightened under the leakage current, resulting in an undesirable light emission of the sub-pixels, thereby affecting the display effect.
A first aspect of the present disclosure provides a display panel. The display panel has pixel regions and at least one non-pixel region, and each of the at least one non-pixel region is at least located between two adjacent pixel regions of the pixel regions. The display panel includes a substrate, a light-emitting element layer located at a side of the substrate and comprising an organic common layer, and a first opening located in one of the at least one non-pixel region. The first opening includes a first sidewall and a second sidewall. The first sidewall is a side surface of a first layer, and the second sidewall is a side surface of a second layer. The first layer and the second layer are located at a side of the organic common layer facing towards the substrate, and the organic common layer forms a recessed structure at the first opening.
A second aspect of the present disclosure provides a method for manufacturing a display panel. The display panel has pixel regions and at least one non-pixel region, and each of the at least one non-pixel region is at least located between two adjacent pixel regions of the pixel regions. The display panel includes a substrate, a light-emitting element layer located at a side of the substrate and comprising an organic common layer, and a first opening located in one of the at least one non-pixel region. The first opening includes a first sidewall and a second sidewall. The first sidewall is a side surface of a first layer, and the second sidewall is a side surface of a second layer. The first layer and the second layer are located at a side of the organic common layer facing towards the substrate, and the organic common layer forms a recessed structure at the first opening. The method includes: forming the first layer and the second layer on the substrate, where the first sidewall of the first layer and the second sidewall of the second layer form the first opening located in the one of the at least one non-pixel region; and forming the light-emitting element layer at a side of the first layer and the second layer that faces away from the substrate, wherein the light-emitting element layer comprises the organic common layer.
A third aspect of the present disclosure provides a display apparatus. The display apparatus includes a display panel. The display panel has pixel regions and at least one non-pixel region, and each of the at least one non-pixel region is at least located between two adjacent pixel regions of the pixel regions. The display panel includes a substrate, a light-emitting element layer located at a side of the substrate and comprising an organic common layer, and a first opening located in one of the at least one non-pixel region. The first opening includes a first sidewall and a second sidewall. The first sidewall is a side surface of a first layer, and the second sidewall is a side surface of a second layer. The first layer and the second layer are located at a side of the organic common layer facing towards the substrate, and the organic common layer forms a recessed structure at the first opening.
In order to better illustrate technical solutions of embodiments of the present disclosure, the accompanying drawings used in embodiments are briefly described below. The drawings described below are merely a part of some embodiments of the present disclosure.
Based on these drawings, those skilled in the art can obtain other drawings.
In order to better understand the technical solutions of the present disclosure, some embodiments of the present disclosure are described in detail below Referring to the accompanying drawings.
It should be clear that the described embodiments are only some embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present disclosure.
The terms used in some embodiments of the present disclosure are only for the purpose of describing specific embodiments, and are not intended to limit the present disclosure. As used in some embodiments of the present disclosure and the appended claims, the singular forms “a/an” “the” and “said” are intended to include the plural forms as well, unless the context clearly dictates otherwise.
It should be understood that the term “and/or” used in this document is only an association relationship to describe the associated objects, indicating that there can be three relationships, for example, A and/or B, which can indicate that A alone, A and B, and B alone. The character “/” in this document generally indicates that the related objects are an “or” relationship.
Before describing the technical solutions of the present disclosure, the present disclosure first describes the reasons of undesirable light-emitting of the sub-pixels in the related art.
As shown in
When the pixel region 110 is controlled to be lit, the anode 103 and the cathode 108 in the pixel region 110 receive corresponding driving voltages, respectively. At this time, holes migrate to the light-emitting layer 106 through the hole transmission layer 105. Electrons migrate to the light-emitting layer 106 through the electron transmission layer 107. Holes and electrons meet in the light-emitting layer 106 to form excitons which excite the light-emitting molecules in the light-emitting layer 106 to emit visible light.
However, since the hole transmission layer 105 and the electron transmission layer 107 each are a whole layer, that is, the organic common layers between adjacent pixel regions 110 are also connected to each other, when only some pixel regions 110 need to be controlled to be lit, the holes injected into the hole transmission layer 105 and the electrons injected into the electron transmission layer 107 in the lit pixel regions 110 will migrate to their adjacent light-emitting layer 106 of the pixel region 110 that should not be lit, the pixel region 110 that should not be lit is then lit, resulting in the phenomenon of undesirable light-emitting of sub-pixels.
In order to improve the problem of undesirable light-emitting, as shown in
However, only increasing the impedance of the organic common layer can improve the current leakage problem to a certain extent, but the effect is not improved significantly.
In this regard, the present disclosure provides a display panel.
In some embodiments of the present disclosure, the first opening 6 is defined by the sidewalls of two different layers, i.e., the first layer 9 and the second layer 10. The first layer 9 and the second layer 10 are two layers formed by different film forming processes. For example, a first film forming process can be used to form the first layer 9 first, and then secondary second film forming process can be used to form the second layer 10. In some embodiments, the second layer 10 can be formed by the first film forming process first, and then the first layer 9 can be formed by the second film forming process.
If the first opening 6 is described in another perspective, it can be as follows: the display panel can include an auxiliary layer located at a side of the substrate 3 facing towards the organic common layer 5. The auxiliary layer includes a first layer 9 and a second layer 10. The auxiliary layer can include a first opening 6 located in the non-pixel region. A first sidewall 7 of the first opening 6 belongs to the first layer 9, and a second sidewall 8 of the first opening 6 belongs to the second layer 10.
The openings in the panel in the related art, such as a groove 109 shown in
The first opening 6 in the present disclosure is different from the above opening. The sidewalls of the first opening 6 in some embodiments of the present disclosure respectively belong to two different layers. In this case, by adjusting the inclination angle between the sidewalls of the two layers and the bottom surface, the relative positional relationship of the two layers and the etching area of the two layers, etc., the inclination degrees of the first sidewall 7 and the second sidewall 8 of the first opening 6, a distance between the first sidewall 7 and the second sidewall 8, etc. can be flexibly adjusted to realize flexible regulation of parameters such as the shape and volume of the first opening 6. For example, in some embodiments of the present disclosure, two layers can be used to form a slit-shaped first opening 6 with a small volume to form a V-shaped structure. In this way, when the organic common layer 5 forms a recessed structure at the first opening 6, there will be a stress concentration point at this part of the layer at the bottom of the first opening 6, so that a natural fracture occurs at this part of the layer under the intrinsic stress of the layer, high temperature, and external force, and a disconnection region 11 is formed to separate the organic common layer 5 located between two adjacent pixel regions 1, thereby effectively avoiding the mutual flow of holes and electrons between the adjacent pixel regions 1.
In this way, when only some pixel regions 1 need to be controlled to be lit, the lit pixel region 1 will no longer transmit holes and electrons to their adjacent pixel regions 1, thereby avoiding undesirable light-emitting in the adjacent pixel regions 1. In other words, in some embodiments of the present disclosure, based on the current process capability, the organic common layer 5 between adjacent pixel regions 1 can be separated by openings, and the flow of holes and electrons between adjacent pixel regions 1 can be effectively blocked.
In some embodiments, referring to
In some embodiments, referring to
In some embodiments, referring to
In some embodiments, the first opening 6 is at least located between two adjacent pixel regions 1. The first sidewall 7 and the second sidewall 8 are two sidewalls of the first opening 6 opposite to each other in the first direction x, and overlap at least in the first direction x. The first direction x is a direction along which the pixel regions 1 at both sides of the non-pixel region 2 where the first opening 6 is located, are arranged.
In some embodiments, referring to
The organic common layer 5 is very thin, generally at a nanometer level. In a manufacturing process of the display panel, affected by the process capability, the organic common layer 5 deposited at a sidewall of the layer will be thinned, for example, along a direction towards the bottom of the first opening 6, the thickness of the organic common layer 5 decreases. In this way, it not only makes the organic common layer 5 at the bottom of the first opening 6 easier to fracture under stress, but also makes the organic common layers 5 extending on the first sidewall 7 and the second sidewall 8 not contact with each other after the organic common layer 5 fractures, so that the organic common layer 5 is effectively disconnected.
The light-emitting element layer 4 also includes a cathode 34 located at a side of the organic common layer 5 facing away from the substrate 3. In the first direction x, a maximum distance L1 between the first sidewall 7 and the second sidewall 8 satisfies L1<2×d1, where d1 is a sum of the film thicknesses of the cathode 34 and the organic common layer 5, and the first direction x is a direction along which the pixel regions 1 at both sides of the non-pixel region 2 where the first opening 6 is located are arranged.
The thicknesses of the cathode 34 and the organic common layer 5 can be understood as the thicknesses of the cathode 34 and the organic common layer 5 in the pixel region 1. If there are multiple organic common layers 5, d1 denotes a sum of a thickness of the cathode 34 and a thickness of multiple organic common layers 5.
In some embodiments of the present disclosure, by setting L1 within a range smaller than or equal to 2×d1, and on the premise that A1 and A2 are within a range from 60° to 90°, the top widths L1 and L2 of the first opening 6 will not be very large. In this case, the shape of the first opening 6 is defined as a very narrow slit that tends to a V-shaped structure, so that the organic common layer 5 at the bottom of the first opening 6 is more likely to have a stress concentration point and thus be more easily disconnected.
In some embodiments, by designing the top width L1 of the first opening to be smaller than twice the sum of the thicknesses of the cathode 34 and the organic common layer 5, the top of the first opening 6 can be prevented from being excessively wide. When one or more organic common layers 5 forms a recessed structure at the first opening 6, the first opening 6 can be substantially filled entirely with the organic common layer 5 extending on the first sidewall 7 and the second sidewall 8. When the cathode 34 is subsequently formed, the cathode 34 will not be recessed deeply at the first opening 6, so that the fluctuation of the cathode 34 at the first opening 6 can be reduced, and the continuity of the cathode 34 can be ensured to a greater extent, avoiding the disconnection of the cathode 34.
In some embodiments, referring to
With the above configuration, the first layer 9 and the second layer 10 are two layers arranged in different layers. By staggering the grooves in two layers to form the first opening 6, in addition to better forming the V-slit-shaped first opening 6 to fracture the organic common layer 5, a step surface with fluctuation is formed between a part of the first layer 9 exposed in the second groove 16 and the second layer 10 located above this part of the first layer 9. Compared with providing grooves in a single layer, the present disclosure can increase a length of the part of the organic common layer 5 extending in the non-pixel region 2 to a greater extent, so that the impedance of this part of the organic common layer 5 is increased to a greater extent, thereby suppressing the flow of holes and electrons in the pixel region 1 to the surrounding more effectively.
In an embodiment, referring to
In the panel structure, the planarization layer 19 is configured to planarize the layer, so the planarization layer 19 usually has a large thickness. By reusing the planarization layer 19 as the first layer 9, the planarization layer 19 can be used to form the first opening 6 with a large depth, the organic common layer 5 is easily fractured at the junction of the top surface of the planarization layer 19 and the first sidewall 7 in addition to the fracture at the bottom of the first opening 6. The organic common layer 5 is disconnected at multiple positions, the flow of holes and electrons between adjacent pixel regions 1 can be blocked to a greater extent. Since the organic common layer 5 is in direct contact with the pixel definition layer 17 in the non-pixel region 2, when the planarization layer 19 is reused as the first layer 9, and the pixel definition layer 17 is reused as the second layer 10, the organic common layer 5 can be directly recessed at the first opening 6 formed by the planarization layer 19 and the pixel definition layer 17, there is no other layers under the organic common layer 5, so the organic common layer 5 is more likely to have sharp corners at the bottom of the first opening 6, and the stress is more concentrated, thereby being more prone to fracture.
By reusing the planarization layer 19 as the first layer 9, and reusing the pixel definition layer 17 as the second layer 10, the first groove 15 and the second groove 16 can be respectively etched in the planarization layer 19 and the pixel definition layer 17 by only respectively changing the mask patterns corresponding to the pixel definition layer 17 and the planarization layer 19, which not only does not need to add a new process, but also lowers the process cost. In this way, it will not lead to an increase in the overall thickness of the panel, which is more conducive to achieve a thin and light display panel.
In some embodiments, referring to
Since the planarization layer 19 has a relatively large thickness, when the planarization layer 19 is reused as the second layer 10, the extension length of the second sidewall 8 is relatively large, except that the organic common layer 5 is fractured at the bottom of the first opening 6, the organic common layer 5 is also easy to fracture at the junction between the top surface of the planarization layer 19 and the second sidewall 8, thereby blocking the flow of holes and electrons between adjacent pixel regions 1 to a greater extent.
By reusing the first insulation layer 20 as the first layer 9, and reusing the planarization layer 19 as the second layer 10, the first groove 15 and the second groove 16 can be respectively etched on the first insulation layer 20 and the planarization layer 19 by only change the mask patterns corresponding to the first insulation layer 20 and the planarization layer 19, respectively, which not only does not need to add a new process, but also lowers the process cost. In this way, it will not lead to an increase in the overall thickness of the panel, which is more conducive to achieve a thin and light display panel.
In some embodiments, referring to
In some embodiments, referring to
In some embodiments, referring to
The first layer 9 and the second layer 10 are located between the pixel definition layer 17 and the organic common layer 5, and are arranged in a same layer. Although the first layer 9 and the second layer 10 are arranged in the same layer, the first layer 9 and the second layer 10 are formed through two patterning processes, respectively.
With this configuration, the first layer 9 and the second layer 10 are located on an upper side of the pixel definition layer 17 and are arranged in a same layer. In this case, the shape of the first opening 6 can be flexibly regulated directly by adjusting the thickness of the first layer 9 and the second layer 10, and adjusting a distance between the first layer 9 and the second layer 10, thereby achieving a simpler design of the first opening 6.
When the second layer 10 is located at a side of the first layer 9 facing away from the substrate 3, the layer height at the second sidewall 8 is larger, and the organic common layer 5 is easily fractured at the top edge of the second sidewall 8 in addition to be fractured at the bottom of the first opening 6, therefore the reliability of disconnection of the organic common layer 5 at the second sidewall 8 is higher. The extension length of the second sidewall 8 is large, and the impedance of the organic common layer 5 extending on the second sidewall 8 is also large. Therefore, the holes and electrons of the pixel region 1 at a side of the second sidewall 8 are less likely to flow to the second sidewall 8, that is, the effect of suppressing the current leakage is good at a side of the second sidewall 8.
Since the blue pixel region 29 has a higher light-on voltage than the red pixel region 27 and the green pixel region 28, when the blue pixel region 29 is lit, the undesirable light-emitting of the red pixel region 27 and the green pixel region 28 more likely occurs due to current leakage. In some embodiments of the present disclosure, by arranging the blue pixel region 29 at a side of the second sidewall 8 with a better suppressing effect on current leakage, so that the undesirable light-emitting of the red pixel region 27 and the green pixel region 28 can be better blocked when the blue pixel region 29 is lit.
The pixel region 1 includes a red pixel region 27 for emitting red light, a green pixel region 28 for emitting green light, and a blue pixel region 29 for emitting blue light. The blue pixel region 29 is located a side of the sidewall 8 of the first opening 6.
Since the layer height of the second sidewall 8 is higher, on the one hand, the organic common layer 5 is easily fractured at the intersection of the second sidewall 8 and the top surface of the second layer 10 in addition to be fractured at the bottom of the first opening 6. On the other hand, the impedance of the organic common layer 5 extending on the second sidewall 8 is also higher, so the suppressing effect on the current leakage at a side of the second sidewall 8 is better. By arranging the blue pixel region 29 at a side of the second sidewall 8 with a better suppressing effect on current leakage, the undesirable light-emitting of the red pixel region 27 and the green pixel region 28 can be better blocked when the blue pixel region 29 is lit.
In some embodiments of the present disclosure, the pixel region 1 can adopt the arrangement manners shown in
Since the volume of the first opening 6 formed in some embodiments of the present disclosure is relatively small, as the layer number of the organic common layer 5 deposited in the first opening 6 increases, the first opening 6 is easier to be filled. In an embodiment, referring to
The step structure 38 can be formed by the first layer 9, the second layer 10, or another layer that is located at a side of the organic common layer 5 facing towards the substrate 3. Taking the first layer 9 as the planarization layer 19 and the second layer 10 as the pixel definition layer 17 as an example, the step structure 38 can be formed by the pixel definition layer 17.
The step structure 38 can be a protrusion. In some embodiments, the display panel can also include a spacer located in the non-pixel region 2. In the manufacturing process of the display panel, the spacer is configured to support a mask plate for forming the light-emitting layer. When the step structure is a protrusion, the step structure can be reused as the spacer, so that there is no need to add an additional process for forming the step structure.
In some embodiments, the step structure 38 can also be a groove. Referring again to
With such configuration, the organic common layer 5 is recessed at the third groove 39. While the extension length of the organic common layer 5 is increased by using the third groove 39, the depth of the third groove 39 is small, and the recessed organic common layer 5 can basically fill the third groove 39, so that the subsequent cathode 34 will not be greatly recessed at the third groove 39, thereby better ensuring the continuity of the cathode 34.
Different from the first opening 6, the third groove 39 is a groove formed by etching a single layer, and the sidewalls of the third groove 39 are all formed by a same layer. Therefore, the third groove 39 has a different shape from the first opening 6. The third groove 39 can be an inverted trapezoidal groove with a larger volume, and an angle between the sidewall and the bottom surface of the layer for forming the third groove 39 can range from 60° to 70°.
Referring again to
Based on the same or related concepts, the present disclosure also provides, in another aspect, a method for manufacturing a display panel mentioned above.
Referring to
At step S1, a first layer 9 and a second layer 10 are formed on a substrate 3, where the first sidewall 7 of the first layer 9 and the second sidewall 8 of the second layer 10 are formed in the first opening 6 of the non-pixel region 2.
At step S2, a light-emitting element layer 4 is formed at a side of the first layer 9 and the second layer 10 facing away from the substrate 3. The light-emitting element layer 4 includes an organic common layer 5 forming a recessed structure at the first opening 6.
Different from the openings in the panel in the related art, the sidewalls of the first opening 6 in some embodiments of the present disclosure respectively belong to two different layers. The inclination degree of the first sidewall 7 and the second sidewall 8 of the first opening 6, and the distance between the first sidewall 7 and the second sidewall 8 can be flexibly adjusted by adjusting the inclination angle between the sidewall and the bottom surface of two layers, relative positional relationship of the two layers, and the etching area of the two layers, etc., so as to realize the flexible regulation of the parameters such as the shape and volume of the first opening 6. For example, in some embodiments of the present disclosure, two layers can be used to form the first opening 6 with a small volume and a V-shaped slit-like structure. In this way, when the organic common layer 5 is recessed at the first opening 6, there will be a stress concentration point in this part of the layer at the bottom of the first opening 6, so that a natural fracture of this part of the layer occurs under the intrinsic stress, high temperature, and external force of the layer. In some embodiments, a disconnection region 11 is formed to separate the organic common layer 5 between two adjacent pixel regions 1, thereby effectively avoiding the mutual flow of holes and electrons in the adjacent pixel regions 1. In this way, when only some pixel regions 1 are controlled to light up, the lit pixel regions 1 will no longer transmit holes and electrons to their adjacent pixel regions 1, thereby avoiding the occurrence of undesirable light-emitting in these adjacent pixel regions 1.
In some embodiments, the light-emitting element layer 4 includes a cathode 34 located at a side of the organic common layer 5 facing away from the substrate 3. Since the first layer 9 and the second layer 10 can be used in the present disclosure to form a first opening 6 with a smaller volume, therefore, as multiple organic common layers 5 are recessed at the first opening 6, the first opening 6 can be filled to a greater extent. When the cathode 34 is subsequently formed, the cathode 34 can be continuous at the first opening 6 to avoid the disconnection of the cathode 34, improving the reliability of the cathode 34.
At step S11, a first layer 9 including a first groove 15 is formed on the substrate 3.
At step S12, a second layer 10 is formed at a side of the first layer 9 facing away from the second layer 10. The second layer 10 includes a second groove 16. In the direction perpendicular to the plane of the substrate 3, the second grooves 16 partially overlaps with the first groove 15, and a part of the second layer 10 is recessed at the first groove 15. The sidewall of the second layer 10 recessed at the first groove 15 is the second sidewall 8, and the sidewall of the first layer 9 opposite to the second sidewall 8 is the first sidewall 7.
In the above arrangement, the first layer 9 and the second layer 10 are two layers respectively arranged in different layers. By staggering the grooves in two films to form the first opening 6, in addition to using the first opening 6 to fracture the organic common layer 5, a step surface with fluctuation is formed between the portion of the first layer 9 exposed in the second groove 16 and the second layer 10 located above it. Compared with providing grooves in a single layer, the present disclosure can increase the length of the part of the organic common layer 5 extending in the non-pixel region 2 to a greater extent, so that the impedance of this part of the organic common layer 5 is increased to a greater extent, thereby suppressing the flow of holes and electrons in the pixel region 1 to the surrounding more effectively.
Step S12 can include forming a pixel definition layer 17 at a side of the planarization layer 19 facing away from the substrate 3, forming a second groove 16 and a second opening 18 on the pixel definition layer 17, and reusing the pixel definition layer 17 as the second layer 10. The second opening 18 is configured to define the pixel region 1.
In the panel structure, the planarization layer 19 is configured to realize the planarization of the layer, so it usually has a larger thickness. By reusing the planarization layer 19 as the first layer 9, the planarization layer 19 can be used to form the first opening 6 with a larger depth, the organic common layer 5 is easily fractured at the junction of the top surface of the planarization layer 19 and the first sidewall 7 in addition to the fracture at the bottom of the first opening 6. Therefore, the flow of holes and electrons between adjacent pixel regions 1 can be blocked to a greater extent. Since the organic common layer 5 is in direct contact with the pixel definition layer 17 in the non-pixel region 2, when the planarization layer 19 is reused as the first layer 9, and the pixel definition layer 17 is reused as the second layer 10, the organic common layer 5 can be directly recessed at the first opening 6 formed by the planarization layer 19 and the pixel definition layer 17, there is no other layers under the organic common layer 5, so the organic common layer 5 is more likely to have sharp corners at the bottom of the first opening 6, and the stress is more concentrated, thereby being more prone to fracture.
By reusing the planarization layer 19 as the first layer 9, and reusing the pixel definition layer 17 as the second layer 10, the first groove 15 and the second groove 16 can be respectively etched in the planarization layer 19 and the pixel definition layer 17 by only respectively changing the mask patterns corresponding to the pixel definition layer 17 and the planarization layer 19, which not only does not need to add a new process flow, but also lowers the process cost. In this way, it will not lead to an increase in the overall thickness of the panel, which is more conducive to achieve a thin and light display panel.
Step S12 can include forming a planarization layer 19 at a side of the first insulation layer 20 facing away from the substrate 3, forming a second groove 16 on the planarization layer 19, and reusing the planarization layer 19 as a second layer 10.
Since the thickness of the planarization layer 19 is relatively large, when the planarization layer 19 is reused as the second layer 10, the extension length of the second sidewall 8 is relatively large, the organic common layer 5 is easily fractured at the junction of the top surface of the planarization layer 19 and the first sidewall 7 in addition to the fracture at the bottom of the first opening 6, thereby blocking the flow of holes and electrons between adjacent pixel regions 1 to a greater extent.
By reusing the first insulation layer 20 as the first layer 9, and reusing the planarization layer 19 as the second layer 10, the first groove 15 and the second groove 16 can be respectively etched on the first insulation layer 20 and the planarization layer 19 by only change the mask patterns corresponding to the first insulation layer 20 and the planarization layer 19, respectively, which not only does not need to add a new process flow, but also lowers the process cost. In this way, it will not lead to an increase in the overall thickness of the panel, which is more conducive to realizing a thin-light design of the display panel.
At step S13, a pixel definition layer 17 is formed at a side of the planarization layer 19 facing away from the substrate 3. A second opening 18 and a third opening 26 are formed on the pixel defining layer 17. The second opening 18 is configured to define a pixel region 1. The third opening 26 at least exposes the first opening 6 in a direction perpendicular to the plane of the substrate 3.
In this case, the pixel definition layer 17 is not be recessed at the first opening 6 formed by the planarization layer 19 and the first insulation layer 20. During forming the organic common layer 5, the pixel definition layer 17 can be prevented from filling the first opening 6, so that the organic common layer 5 is more likely to be fracture at the bottom of the first opening 6. The overall groove depth formed by the above three layers is larger, so the extension length of the organic common layer 5 between the non-pixel regions 2 is larger and the impedance is higher.
Based on the same or related concepts, the present disclosure also provides, in another aspect, a display apparatus.
The above are merely some embodiments of the present disclosure, which, as mentioned above, are not configured to limit the present disclosure. Whatever within the principles of the present disclosure, including any modification, equivalent substitution, improvement, etc., shall fall into the protection scope of the present disclosure.
Finally, it should be noted that the technical solutions of the present disclosure are illustrated by the above embodiments, but not intended to limit thereto. Although the present disclosure has been described in detail in the foregoing embodiments, those skilled in the art can understand that the present disclosure is not limited to the specific embodiments described herein, and can make various obvious modifications, readjustments, and substitutions without departing from the scope of the present disclosure.
Number | Date | Country | Kind |
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202210570268.3 | May 2022 | CN | national |