The present application relates to a field of display technology, in particular to the manufacture of a display device, and more particularly, relates to a display panel, a source driver chip, and an electronic device.
Currently, liquid crystal displays are widely-used displays. There are a DLS architecture (left and right adjacent sub-pixels share one data line) and a Tri-gate architecture (the number of gate lines increases by 3 times to realize a reduction of the number of data lines to ⅓) for the liquid crystal displays in consideration of the cost of data driver chips.
Although the afore-mentioned architectures reduce the number of source driver chips by half or more as compared with a 1G1D architecture, the load driven by the source driver chips will be much larger than that of 1G1D. This can be compensated by an Output Data Delay Compensation (ODDC) technique to control the voltage value of all output channels in the source driver chip to be the same after charged. However, for different display areas corresponding to different levels in ODDC, the devices in the ODDC module correspondingly have different connection relations. This causes a difference between equivalent loads, resulting in a difference between the outputs of data signals. As a result, a split-screen problem is caused.
Therefore, the existing display panels utilizing the ODDC technique have the above defects, and it has an urgent need of being improved.
The objective of the present application is to provide a display panel, a source driver chip and an electronic device, for improving or solving the split-screen problem in the existing display panels utilizing the ODDC technique.
The present application provides a display panel, including:
The present application provides a display panel, a source driver chip, and an electronic device, including: a plurality of first sub-pixels; a plurality of second sub-pixels; a first source driver chip, including a first delay module, wherein the first delay module is electrically connected to the plurality of first sub-pixels and includes a first delay load; and a second source driver chip, including a second delay module, wherein the second delay module is electrically connected to the plurality of second sub-pixels and includes a second delay load, wherein the second source driver chip further includes a first compensation module electrically connected to the plurality of second sub-pixels and the second delay module, and the first compensation module is configured to compensate for a difference in equivalent resistance between the second delay load and the first delay load according to a parameter of the second delay module and a parameter of the first delay module, thereby improving uniformity of displayed images, caused by the difference in equivalent resistance between the second delay load and the first delay load.
The present application will be further illustrated below by referring to appended figures. It should be noted that the appended figures described below are only some embodiments used to illustrate the present application, and those of ordinary skill in the art can further obtain other figures according to these figures without making any inventive effort.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to appended figures of the embodiments of the present application. Obviously, the described embodiments are merely a part of embodiments of the present application and are not all of the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those of ordinary skill in the art without making any inventive effort are within the scope of the present application.
In the description of the present application, the terms “first” and “second” are used for descriptive purposes only and should not be taken to indicate or imply relative importance, or implicitly indicate the indicated number of technical features. Thus, by defining a feature with “first” or “second”, it may explicitly or implicitly include one or more features. In addition, it further needs to be explained that the appended figures provide only the structures that are closely related to the present application and omit some details that are less related to the application. The purpose of this is to simplify the appended figures and make the application clear at a glance, instead of making the appended figures exactly same as the actual device. The appended figures should not be construed as a limitation of the actual device.
The term “embodiment” or “implementation” referred to herein means that a particular feature, structure or property described in conjunction with the embodiment may be contained in at least one embodiment of the present application. The phrase appearing in various places in the specification does not necessarily refer to the same implementation, nor does it refer to an independent or alternative implementation that is mutually exclusive with other implementations. It is expressly and implicitly understood by those skilled in the art that an implementation described herein may be combined with other implementations.
Embodiments of the present application provide a display panel. The display panel may include, but is not limited to, the following embodiments and any combination of the following embodiments.
In an embodiment, as shown in
A plurality of gate lines and a plurality of data lines may be provided in the display area A. Each gate line may be electrically connected to a plurality of sub-pixels, and each data line may be electrically connected to a plurality of sub-pixels. When one of the gate lines controls a plurality of sub-pixels to be turned on, each data line can load a data voltage transmitted at the time to a turned-on sub-pixel. The plurality of gate lines operate sequentially in a similar fashion, thereby realizing that all the sub-pixels are turned on in turn. Each time a plurality of sub-pixels are turned on, the plurality of data lines are operated as above, thereby realizing light emission of the plurality of sub-pixels, and finally realizing light emission of all the sub-pixels.
Further, as shown in
It should be noted that since the delay module itself also has a corresponding delay load, in compensating for the difference in total charging amount caused by the impedance difference, due to a difference in equivalent resistance between two delay loads corresponding to two delay modules with different delay intervals, it will cause a difference in attenuation of data voltages loaded by two sub-pixels electrically connected to different source driver chips, resulting in ununiformed presentation of displayed images. Specifically, for ease of description, it is illustrated only by using a plurality of sub-pixels arranged in an array along a row direction and a column direction, and a plurality of source driver chips electrically connected to a plurality of sub-pixel groups arranged in a horizontal direction, respectively, that is, it can be considered that a plurality of first sub-pixels 101 and a plurality of second sub-pixels 102 are located in two areas arranged in the display area A along the horizontal direction, respectively. With reference to above description, it can be known that because of the difference in equivalent resistance between the second delay load 02 and the first delay load 01, this cause different attenuation of data voltages loaded to the plurality of first sub-pixels 101 and the plurality of second sub-pixels 102.
Specifically, the first delay module 301 has a first delay interval, the second delay module 302 has a second delay interval, and the first compensation module 40 is configured to compensate for the difference in equivalent resistance between the second delay load 02 and the first delay load 01 according to a difference between the second delay interval and the first delay interval; and/or the first delay module 301 has a first delay level, the second delay module 302 has a second delay level, and the first compensation module 40 is configured to compensate for the difference in equivalent resistance between the second delay load 02 and the first delay load 01 according to a difference between the second delay level and the first delay level. In this embodiment, the former is taken as an example for illustration.
It can be understood that the second source driver chip 202 in this embodiment further includes the first compensation module 40 electrically connected to the plurality of second sub-pixels 102 and the second delay module 302, and the first compensation module 40 is configured to compensate for the difference in equivalent resistance between the second delay load 02 and the first delay load 01 according to a difference between the second delay interval and the first delay interval. While the first delay module 301 and the second delay module 302 compensate for the difference in total charging amount caused by the impedance difference, the first compensation module 40 can also be set to compensate for the difference in equivalent resistance between the second delay load 02 and the first delay load 01, caused by this mechanism, to improve ununiformed presentation of displayed images, caused by the difference in equivalent resistance between the second delay load 02 and the first delay load 01.
In this embodiment, the way how the first compensation module 40 and the second delay module 302 are electrically connected to the plurality of second sub-pixels 102, and the structure of the first compensation module 40, are not limited as long as the first compensation module 40 in the second source driver chip 202 can be used to compensate for the difference in equivalent resistance between the second delay load 02 and the first delay load 01 according to a difference between the second delay interval and the first delay interval. For example, the first compensation module 40 may be directed to, but is not limited to, at least one of voltage source compensation, current source compensation, or load compensation.
In an embodiment, as shown in
Specifically, as shown in
Further, withe reference to
It should be noted that in this application the second delay module 302 and the first compensation module 40 in the second source driver chip 202 can process at least one of the gamma signals or the image signals and can also process the signals generated from the gamma signals and the image signals as long as the first compensation module 40 corresponds to a second delay module 302 to realize corresponding compensation. According to processing requirements, the second delay module 302 and the first compensation module 40 may be arranged in a path of an appropriate signal flow. In
Specifically, it is assumed that in theory two gamma signals generated by two gamma generating modules 701 with different impedances are the same. However, as shown in
Correspondingly, as shown in
In an embodiment, as shown in
It can be understood that this embodiment further illustrates that based on the first delay load 01 in the first source driver chip 201, the first compensation module 40 and the second compensation module 50 are set to have two compensation values, respectively, which are used to compensate the second delay load 02 and the third delay load 03, respectively. As a result, it can be considered that the greater the difference from the first delay interval, that is, the greater the difference from the first delay load, the greater the absolute value of the compensation value required to be set.
It should be noted that as mentioned above the gamma signals may include positive gamma signals and negative gamma signals. Based on a same absolute value of the difference yielded between a reference voltage and the positive gamma signal and between the reference voltage and the negative gamma signal, if the voltage values corresponding to the positive gamma signal and the negative gamma signal are all greater than or less than 0, a same compensation module can be adopted to compensate for the positive gamma signal and the negative gamma signal; and if the voltage values corresponding to the positive gamma signal and the negative gamma signal are greater than 0 and less than 0 respectively, “inverters” can be connected before an input end and after an output end of the compensation module used for processing the positive gamma signal as a new compensation module, to realize the compensation for the negative gamma signal. Based on different absolute values of the difference between the reference voltage and the positive gamma signal and between the reference voltage and the negative gamma signal, it is necessary to set two compensation modules with different compensation values for performing corresponding amplitude compensation on the positive gamma signal and the negative gamma signal, respectively.
For example, as shown in
It can be understood that with reference to
In an embodiment, as shown in
Specifically, based on the above description, the delay module itself also has a corresponding delay load, and here, it can be considered that the smaller the delay interval, the smaller the equivalent resistance of the delay load formed by corresponding circuit connection. In this embodiment, based on a fact that the equivalent resistance of the second delay load 02 is less than the equivalent resistance of the first delay load 01, the first compensation module 40 is set to include the first compensation load 401, that is, for the second source driver chip 202, the first compensation load 401 is superimposed on the second delay load 02 with smaller equivalent resistance, and this can reduce the difference from the first delay load 01, thereby improving uniformity of displayed images, caused by a large difference between the equivalent resistance values of the second delay load 02 and the first delay load 01.
In an embodiment, as shown in
In an embodiment, with reference to
The load resistance R has an impedance value, and the load capacitor C has a capacitive reactance value. The afore-mentioned “equivalent resistance” related thereto may represent a total effect of all the impedance values, the capacitive reactance values in the compensation module 40 or the sub-compensation module 402. Specifically, based on a fact that the signals flow from the second delay module 302 to the digital-to-analog converting module 703 herein, the load resistance R is connected in series with the second delay module 302 in this embodiment, and this leads to an attenuation of the signals. Similarly, it can be understood that the load capacitor C that acts on the signals flowing from the second delay module 302 to the digital-to-analog converting module 703 also leads to an attenuation of the signals, and if the signals appear to be like DC signals, the capacitive reactance formed by the load capacitor C will be huge.
It can be understood that the sub-selection module 4021 included in each sub-compensation module 402 provided in this embodiment can control the sub-compensation load to be electrically connected to or electrically disconnected from the plurality of second sub-pixels 102. With reference to
In an embodiment, with reference to
It can be considered that the first switch Q1 and the second switch Q2 are configured to control the on-off of branches where the load capacitor C and the load resistor R are located, respectively, and the third switch Q3 is used to control the second delay module 302 and the digital-to-analog converting module 703 to be electrically connected to each other without connecting to any sub-compensation load 4025. Specifically, based on the structures shown in
if the first delay interval and the second delay interval are 8UI and 2UI respectively, it can be considered that the first delay load 01 corresponding to the first delay interval 8UI does not have to be compensated, and only the second delay load 02 corresponding to the second delay interval 2UI is to be compensated, for example, three sub-control modules 4024 may be used to control corresponding sub-compensation loads 4025 to be electrically connected to the plurality of second sub-pixels 102, that is, the first switch Q1 and the second switch Q2 that correspond to each of the three sub-control modules 4024 are turned on, and a corresponding third switch Q3 is turned off;
if the first delay interval and the second delay interval are 6UI and 2UI respectively, it can be considered that the first delay load 01 corresponding to the first delay interval 6UI does not have to be compensated, and only the second delay load 02 corresponding to the second delay interval 2UI is to be compensated, for example, two sub-control modules 4024 may be used to control corresponding sub-compensation loads 4025 to be electrically connected to the plurality of second sub-pixels 102, that is, the first switch Q1 and the second switch Q2 that correspond to each of the two sub-control modules 4024 are turned on, and a corresponding third switch Q3 is turned off;
if the first delay interval and the second delay interval are 4UI and 2UI respectively, it can be considered that the first delay load 01 corresponding to the first delay interval 4UI does not have to be compensated, and only the second delay load 02 corresponding to the second delay interval 2UI is to be compensated, for example, one sub-control modules 4024 may be used to control corresponding sub-compensation loads 4025 to be electrically connected to the plurality of second sub-pixels 102, that is, the first switch Q1 and the second switch Q2 that correspond to the one sub-control modules 4024 are turned on, and a corresponding third switch Q3 is turned off.
It should be noted that considering that there may still have a source driver chip whose delay interval is greater than the first delay interval, the compensation module can also be arranged in the first source driver chip 201 to perform corresponding compensation. In afore-described three cases, all the sub-control modules 4024 in the first source driver chip 201 may control all the sub-compensation loads 4025 to be electrically disconnected from the plurality of second sub-pixels 102, that is, the first switch Q1 and the second switch Q2 that correspond to each sub-control module 4024 are turned off, and a corresponding third switch Q3 is turned on.
The present application further provides a source driver chip. The source driver chip may include, but is not limited to, the following embodiments and any combination of the following embodiments.
In an embodiment, the source driver chip includes a delay module, having a delay parameter, for electrically connecting to a plurality of sub-pixels of a display panel, and including a delay load; a compensation module, electrically connected to the plurality of sub-pixels and the delay module, wherein the compensation module is configured to compensate for the delay load according to the delay parameter. The structures and functions of the “source driver chip”, “delay module”, and “compensation module” mentioned in this embodiment may be referred to the afore-mentioned “second source driver chip”, “second delay module”, and “second compensation module” respectively, but it should be noted that the related description of the “second source driver chip” in above context does not form a limitation to the source driver chip in this embodiment. The source driver chip may be independent from other structures such as the display panel.
The delay parameter may be a delay interval or a delay level. The “delay interval” here may represent a time interval of the delay module with respect to a standard time period. The “standard time period” may represent, for example, the “first delay interval” mentioned above, or it may be preset. Similarly, the “delay level” here may represent a level difference of the delay module with respect to a standard level. The “standard level” may represent, for example, the “first delay level” mentioned above, or it may be preset.
In an embodiment, the compensation module includes a compensation load, including at least one of a load resistor connected in series with the delay module or a load capacitor connected between the delay module and ground; and a selection module, connected to the compensation load, for controlling the compensation load to be electrically connected to or electrically disconnected from the plurality of sub-pixels. Specifically, reference may be made to the descriptions related to
The present application further provides an electronic device, including the display panel as described above, or the source driver chip as described above.
The present application provides a display panel, a source driver chip, and an electronic device, including: a plurality of first sub-pixels; a plurality of second sub-pixels; a first source driver chip, including a first delay module, wherein the first delay module is electrically connected to the plurality of first sub-pixels and includes a first delay load; and a second source driver chip, including a second delay module, wherein the second delay module is electrically connected to the plurality of second sub-pixels and includes a second delay load, wherein the second source driver chip further includes a first compensation module electrically connected to the plurality of second sub-pixels and the second delay module, and the first compensation module is configured to compensate for a difference in equivalent resistance between the second delay load and the first delay load according to a parameter of the second delay module and a parameter of the first delay module, thereby improving uniformity of displayed images, caused by the difference in equivalent resistance between the second delay load and the first delay load.
Hereinbefore, the display panel, the source driver chip, and the electronic device provided in the embodiments of the present application are introduced in detail, the principles and implementations of the embodiments are set forth herein with reference to specific examples, descriptions of the above embodiments are merely served to assist in understanding the technical solutions and essential ideas of the present application. Those having ordinary skill in the art should understand that they still can modify technical solutions recited in the aforesaid embodiments or equivalently replace partial technical features therein; these modifications or substitutions do not make essence of corresponding technical solutions depart from the spirit and scope of technical solutions of embodiments of the present application.
Number | Date | Country | Kind |
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202310332339.0 | Mar 2023 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2023/100306 | 6/14/2023 | WO |