This application claims priority to and benefits of Korean Patent Application No. 10-2022-0137499 under 35 U.S.C. § 119 filed on Oct. 24, 2022, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate to a display panel including an separator isolating electrodes of a light emitting device from each other.
Each of multimedia display devices such as televisions, mobile phones, tablets, computers, navigation devices, and game consoles has a display panel for displaying an image. The display panel may include a light emitting device and a driver for an operation of the light emitting device. Research on a connection between the light emitting device and the driver in order to improve characteristics of the display panel is being conducted.
It is to be understood that this background of the technology section is, in part, intended to provide useful background for understanding the technology. However, this background of the technology section may also include ideas, concepts, or recognitions that were not part of what was known or appreciated by those skilled in the pertinent art prior to a corresponding effective filing date of the subject matter disclosed herein.
Embodiments provide a display panel including an separator with improved isolation ability.
The technical objectives to be achieved by the disclosure are not limited to those described herein, and other technical objectives that are not mentioned herein would be clearly understood by a person skilled in the art from the description of the disclosure.
According to an embodiment, a display panel may include a first light-emitting unit and a second light-emitting unit spaced apart from each other, wherein each of the first emitting part and the second emitting part may include an separator and at least one emitting part, the separator may include a first isolation portion, the first isolation portion may include first portions spaced apart from each other, and second portions, each of the second portions is disposed between adjacent ones of the first portions, each of the second portions is bent from each of the first portions.
Each of the second portions may extend in a first direction and each of the second portions may extend in a second direction intersecting the first direction.
The first isolation portion may further include third portions, each of the third portions may be disposed between adjacent ones of the first portions, each of the third portions may be bent from each of the first portions, and each of the third portions may be spaced apart from each of the second portions.
Two first portions adjacent to each other among the first portions, a second portion disposed between the two adjacent first portions among the second portions, and a third portion disposed between the two adjacent first portions among the third portions may define a first opening.
Each of the third portions may extend in parallel to a direction in which each of the second portions extends.
The first isolation portion may include at least two first isolation portions, the separator may further include an intersection disposed between the two first isolation portions, wherein a first width in a first direction of the intersection may be greater than a width in the first direction of each of the two first isolation portions.
An edge of the emitting part and an edge of the intersection may have a same curvature in a plan view.
The separator may further include a second isolation portion extending from the intersection in a direction intersecting a direction in which the first isolation portion extends, a second width in a second direction of the intersection may be greater than a width in the second direction of the second isolation portion, and the first direction intersects the second direction.
The second isolation portion may include fourth portions spaced apart from each other, and fifth portions, each of the fifth portions may be disposed between adjacent ones of the fourth portions, and each of the fifth portions may be bent from each of the fourth portions.
The second isolation portion may further include sixth portions, each of the sixth portions may be disposed between adjacent ones of the fourth portions, each of the sixth portions may be bent from each of the fourth portions, and each of the sixth portions may be spaced apart from each of the fifth portions.
Each of the first light-emitting unit and the second light-emitting unit may include first emitting parts, second emitting parts and third emitting parts emitting light of different colors.
The display panel may further include first light emitting devices, second light emitting devices and third light emitting devices, wherein each of the first light emitting devices, the second light emitting devices and the third light emitting devices may include a first electrode, a second electrode facing the first electrode, and a light-emitting layer disposed between the first electrode and the second electrode, wherein the first light emitting devices, the second light emitting devices and the third light emitting devices may respectively correspond to the first emitting parts, the second emitting parts and the third emitting parts, and first transistor, second transistors and third transistors respectively connected to the first light emitting devices, the second light emitting devices and the third light emitting devices, wherein the separator may isolate the second electrodes of the first light emitting devices, the second light emitting devices and the third light emitting devices from each other.
The display panel may further include first connection wirings, second connection wirings and third connection wirings respectively connecting the first light emitting devices, the second light emitting devices and the third light emitting devices and the first transistor, the second transistor and the third transistor to each other, wherein each of the first connection wirings, the second connection wirings and the third connection wirings may include each of first emission connection parts, second emission connection parts and third emission connection parts connected to each corresponding one of the first light emitting devices, the second light emitting devices and the third light emitting devices, and each of first driver connection parts, second driver connection parts and third driver connection parts connected to each corresponding one of the first transistor, the second transistor and the third transistor, wherein each of the first emission connection parts, the second emission connection parts and the third emission connection parts may be connected to each of the second electrodes of the first light emitting devices, the second light emitting devices and the third light emitting devices.
The separator may include one face, another face facing one face, and a side face disposed between the one face and the another face, wherein the side face may be inclined with respect to the one face in a cross-sectional view.
The side face may include a first side face and a second side face spaced apart from the first side face in a direction perpendicular to a thickness direction, a first angle at which the first side face is inclined with respect to the one face and a second angle at which the second side face is inclined with respect to the one face may be different from each other.
The another face may include a groove, wherein the groove may be defined by a first inner side face, a second inner side face spaced apart from the first inner side face, and an inner bottom face disposed between the first inner side face and the second inner side face, wherein each of the first inner side face and the second inner side face may be inclined with respect to the inner bottom face.
According to an embodiment, a display panel may include a first light-emitting unit and a second light-emitting unit spaced apart from each other, wherein each of the first light-emitting unit and the second light-emitting unit may include an separator, at least one light emitting device, and at least one transistor, wherein the separator may include at least two first isolation portions extending in a first direction and spaced apart from each other, and an intersection disposed between the at least two first isolation portions, wherein a first width in a second direction of the intersection is greater than a width in the second direction of one of the at least one first isolation portion, wherein the second direction intersects the first direction.
Each of the first light-emitting unit and the second light-emitting unit may include a emitting part corresponding to the at least one light emitting device and emitting light, wherein an edge of the emitting part and an edge of the intersection may have a same curvature in a plan view.
The separator may further include a second isolation portion extending from the intersection in the second direction, wherein a second width in the first direction of the intersection may be greater than a width in the first direction of the second isolation portion.
The intersection may have a substantially rectangular shape in which a second opening is defined in a plan view.
The intersection may include four outer edges defining the substantially rectangular shape, and inner edges respectively spaced apart from the outer edges and defining the second opening, each of the first width and the second width may be defined as a straight line distance between two outer edges spaced apart from each other among the four outer edges.
Each of the at least two first isolation portions may include first portions spaced apart from each other, and second portions, wherein each of the second portions may be disposed between adjacent ones of the first portions, wherein each of the second portions is bent from each of the first portions.
Each of the first light-emitting unit and the second light-emitting unit may include first emitting parts, second emitting parts and third emitting parts emitting light of different colors.
The first light-emitting unit may include a first light emitting device and a first transistor electrically connected to the first light emitting device, wherein the second light-emitting unit may include a second light emitting device and a second transistor electrically connected to the second light emitting device, each of the first light emitting device and the second light emitting device may include a first electrode, a second electrode facing the first electrode, and a light-emitting layer disposed between the first electrode and the second electrode, the separator may isolate the second electrode of the first light emitting device and the second electrode of the second light emitting device from each other while the separator is disposed between the second electrode of the first light emitting device and the second electrode of the second light emitting device.
The display panel may further include a first connection wiring electrically connecting the first light emitting device to the first transistor, and a second connection wiring electrically connecting the second light emitting device to the second transistor, wherein each of the first connection wiring and the second connection wiring may include an emission connection part electrically connected to the at least one corresponding light emitting device, and a driver connection part electrically connected to the at least one corresponding transistor, wherein the emission connection part of the first connection wiring may be electrically connected to the second electrode of the first light emitting device, wherein the emission connection part of the second connection wiring may be electrically connected to the second electrode of the second light emitting device.
The above and other objects and features of the disclosure will become apparent by describing in detail embodiments thereof with reference to the accompanying drawings in which:
The disclosure may have various changes and various forms. Thus, embodiments will be illustrated in the drawings and described in detail herein. However, it should be understood that the embodiments are not intended to limit the disclosure to the disclosed forms. The disclosure includes all modifications, equivalents, and substitutes included in the spirit and scope of the disclosure.
As used herein, when a component (or a region, a layer, a portion, and the like) is referred to as being “on”, “connected to”, or “coupled to” another component, it means that the component may be directly disposed/connected/coupled on another component or a third component or other components may be disposed between the component and another component.
Like reference numerals refer to like components. In the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content.
As used herein, the singular forms, “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.
In the specification and the claims, the term “and/or” is intended to include any combination of the terms “and” and “or” for the purpose of its meaning and interpretation. For example, “A and/or B” may be understood to mean “A, B, or A and B.” The terms “and” and “or” may be used in the conjunctive or disjunctive sense and may be understood to be equivalent to “and/or.”
In the specification and the claims, the phrase “at least one of” is intended to include the meaning of “at least one selected from the group of” for the purpose of its meaning and interpretation. For example, “at least one of A and B” may be understood to mean “A, B, or A and B.”
Terms such as first, second, and the like may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the disclosure, a first component may be named as a second component, and similarly, the second component may also be named as the first component.
Terms such as “beneath”, “below”, “on”, “above” are used to describe the relationship of the components illustrated in the drawings. The above terms are relative concepts, and are described with reference to directions indicated in the drawings but are not limited thereto.
The terms “overlap” or “overlapped” mean that a first object may be above or below or to a side of a second object, and vice versa. Additionally, the term “overlap” may include layer, stack, face or facing, extending over, covering, or partly covering or any other suitable term as would be appreciated and understood by those of ordinary skill in the art.
When an element is described as ‘not overlapping’ or ‘to not overlap’ another element, this may include that the elements are spaced apart from each other, offset from each other, or set aside from each other or any other suitable term as would be appreciated and understood by those of ordinary skill in the art.
The terms “face” and “facing” mean that a first element may directly or indirectly oppose a second element. In a case in which a third element intervenes between the first and second element, the first and second element may be understood as being indirectly opposed to one another, although still facing each other.
It should be understood that terms such as “comprises,” “comprising,” “includes,” and/or “including,”, “has,” “have,” and/or “having,” and variations thereof when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
“About” or “approximately” as used herein is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the stated value.
Unless otherwise defined or implied, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Hereinafter, embodiments of the disclosure will be described with reference to the drawings.
A display device DD according to an embodiment may be a semiconductor device including at least one semiconductor. The display device DD may include a display panel DP, a panel driver SDC, EDC, and DDC, a power supply PWS, and a timing controller TC. The panel driver may include the scan driver SDC, the emission driver EDC, and the data driver DDC. The display panel DP may display an image according to an electrical signal.
The display panel DP of an embodiment may be a light-emitting display panel, and is not particularly limited. For example, the display panel DP may be an organic light-emitting display panel or an inorganic light-emitting display panel. A light emitting device of the organic light-emitting display panel may include an organic light-emitting material. A light emitting device of the inorganic light-emitting display panel may include a quantum dot or a quantum rod. Further, a light emitting device of the display panel DP may include a micro LED element and/or a nano LED element. Hereinafter, an example in which the display panel DP is embodied as the light-emitting display panel is described.
The display panel DP may include scan lines GWL1 to GWLn, GCL1 to GCLn, GILL to GILn, GBL1 to GBLn, and GRL1 to GRLn, emission lines ESL1 to ESLn, and data lines DL1 to DLm. The display panel DP may include pixels connected to the scan lines GWL1 to GWLn, GCL1 to GCLn, GILL to GILn, GBL1 to GBLn, and GRL1 to GRLn, the emission lines ESL1 to ESLn, and the data lines DL1 to DLm. m and n are integers greater than 1.
For example, a pixel PXij (where each of i and j is an integer greater than 1) located at an i-th horizontal line (or an i-th pixel row) and a j-th vertical line (or a j-th pixel column) may be connected to the i-th first scan line GWLi (or a write scan line), the i-th second scan line GCLi (or a compensation scan line), the i-th third scan line GILi (or a first initialization scan line), the i-th fourth scan line GBLi (or a second initialization scan line), the i-th fifth scan line GRLi (or a reset scan line), the j-th data line DLj, and the i-th emission line ESLi.
The pixel PXij may include light emitting devices, transistors, and capacitors. The pixel PXij may receive, via the power supply PWS, a first power supply voltage VDD, a second power supply voltage VSS, a third power supply voltage VREF (or a reference voltage), a fourth power supply voltage VINT1 (or a first initialization voltage), a fifth power supply voltage VINT2 (or a second initialization voltage), and a sixth power supply voltage VCOMP (or a compensation voltage).
A voltage value of each of the first power voltage VDD and the second power voltage VSS may be set so that current flows in a light emitting device LD (
The third power voltage VREF may be a voltage for initializing a gate of a driving transistor included in the pixel PXij. The third power voltage VREF may be used to implement a predefined grayscale using a voltage difference between the third power voltage VREF and a voltage of a data signal. To this end, the third power voltage VREF may be set to a predefined voltage within a voltage range of the data signal.
The fourth power voltage VINT1 may be a voltage for initializing a capacitor included in the pixel PXij. The fourth power voltage VINT1 may be set to a voltage level lower than that of the third power voltage VREF. For example, the fourth power voltage VINT1 may be set to a voltage level lower than a difference between the third power voltage VREF and a threshold voltage of the driving transistor. However, an embodiment is not limited thereto.
The fifth power voltage VINT2 may be a voltage for initializing a cathode of the light emitting device included in the pixel PXij. The fifth power voltage VINT2 may be set to a voltage level lower than that of the first power voltage VDD or the fourth power voltage VINT1, or may be set to a voltage level similar to or equal to that of the third power voltage VREF. However, an embodiment is not limited thereto, and the fifth power voltage VINT2 may be set to a voltage level similar to or the same as that of the first power voltage VDD.
The sixth power voltage VCOMP may supply a predefined current to the driving transistor in case that compensating for the threshold voltage of the driving transistor.
In
The scan driver SDC may receive a first control signal SCS from the timing controller TC. Based on the first control signal SCS, the scan driver SDC may supply a scan signal to each of the first scan lines GWL1 to GWLn, the second scan lines GCL1 to GCLn, the third scan lines GILL to GILn, the fourth scan lines GBL1 to GBLn, and the fifth scan lines GRL1 to GRLn. The scan signal may be set to a voltage level such that each of transistors receiving the scan signal may be turned on.
For example, a scan signal supplied to a P-type transistor may be set to a logic low level, and a scan signal supplied to an N-type transistor may be set to a logic high level. Hereinafter, “a scan signal is supplied” may be understood as a scan signal at a logic level that turns on a transistor controlled by the scan signal being supplied.
In
The emission driver EDC may supply a light-emission signal to the emission lines ESL1 to ESLn based on a second control signal ECS. For example, the light-emission signal may be sequentially supplied to the emission lines ESL1 to ESLn.
Each of transistors connected to the emission lines ESL1 to ESLn may be embodied as an N-type transistor. In this regard, the light-emission signal supplied to the emission lines ESL1 to ESLn may be set to a gate-off voltage. The transistors may be turned off in case that the light-emission signal is supplied thereto. Otherwise, the transistors may be set to a turned-on state.
The second control signal ECS may include a light-emission start signal and clock signals. The emission driver EDC may be implemented as a shift register that sequentially shifts a pulse-type light-emission start signal using the clock signals to sequentially generate and output a pulse-type light-emission signal.
The data driver DDC may receive a third control signal DCS and image data RGB from the timing controller TC. The data driver DDC may convert the image data RGB in a form of a digital signal into an analog data signal (for example, a data signal). The data driver DDC may supply the data signal to the data lines DL1 to DLm in response to the third control signal DCS.
The third control signal DCS may include a data enable signal instructing output of a valid data signal, a horizontal start signal, a data clock signal, and the like within the spirit and the scope of the disclosure. For example, the data driver DDC may include a shift register which shifts the horizontal start signal in synchronization with the data clock signal to generate a sampling signal, a latch that latches the image data RGB in response to the sampling signal, a digital-to-analog converter (or a decoder) that converts the latched image data (for example, the digital data) into analog data signals, and buffers (or amplifiers) that output the data signals to the data lines DL1 to DLm.
The power supply PWS may supply the first power voltage VDD, the second power voltage VSS, and the third power voltage VREF for operation of the pixel PXij to the display panel DP. Further, the power supply PWS may supply at least one voltage among the fourth power voltage VINT1, the fifth power voltage VINT2, and the sixth power voltage VCOMP to the display panel DP.
For example, the power supply PWS may supply, to the display panel DP, each of the first power voltage VDD, the second power voltage VSS, the third power voltage VREF, the fourth power voltage VINT1, the fifth power voltage VINT2, and the sixth power voltage VCOMP via each of a first power line VDL (
The power supply PWS may be implemented as a power management integrated circuit. However, this is an example, and an embodiment is not limited thereto.
The timing controller TC may generate the first control signal SCS, the second control signal ECS, the third control signal DCS, and the fourth control signal PCS, based on input image data IRGB, a synchronization signal Sync (for example, a vertical synchronization signal, a horizontal synchronization signal, etc.), a data enable signal DE, and a clock signal, etc. The first control signal SCS may be supplied to the scan driver SDC, and the second control signal ECS may be supplied to the emission driver EDC, the third control signal DCS may be supplied to the data driver DDC, and the fourth control signal PCS may be supplied to the power supply PWS. The timing controller TC may rearrange the input image data IRGB in correspondence with an arrangement of the pixel PXij in the display panel DP to generate the image data RGB (or a frame data).
In one example, the scan driver SDC, the emission driver EDC, the data driver DDC, the power supply PWS, and/or the timing controller TC may be directly formed on the display panel DP, or may be provided in a form of a separate driver chip and connected to the display panel DP. Further, at least two of the scan driver SDC, the emission driver EDC, the data driver DDC, the power supply PWS, or the timing controller TC may be provided as one driver chip. For example, the data driver DDC and the timing controller TC may be provided as one driver chip.
The display device DD has been described above with reference to
As shown in
The pixel driver PDC may be connected to the scan lines GWLi, GCLi, GILi, GBLi, and GRLi, the data line DLj, the emission line ESLi, and the power voltage lines VDL, VSL, VIL1, VIL2, VRL, and VCL. The pixel driver PDC may include first to eighth transistors T1, T2, T3, T4, T5, T6, T7, and T8, a first capacitor C1, and a second capacitor C2. Hereinafter, a case in which each of the first to eighth transistors T1, T2, T3, T4, T5, T6, T7, and T8 is embodied as an N-type transistor is described by way of example. However, this is an example, and an embodiment is not limited thereto. Each of some or a number of the first to eighth transistors T1 to T8 may be an N-type transistor, while each of the others thereof may be a P-type transistor, or each of the first to eighth transistors T1 to T8 may be a P-type transistor. However, the disclosure is not limited to any one embodiment.
A gate of the first transistor T1 may be connected to a first node N1. A first electrode of the first transistor T1 may be connected to a second node N2 and a second electrode thereof may be connected to a third node N3. The first transistor T1 may be a driving transistor. The first transistor T1 may control a driving current ILD flowing from the first power line VDL to the second power line VSL via the light emitting device LD in response to a voltage of the first node N1. In this regard, the first power voltage VDD may be set to a voltage level having a higher potential than that of the second power voltage VSS.
The second transistor T2 may include a gate connected to the write scan line GWLi, a first electrode connected to the data line DLj, and a second electrode connected to the first node N1. The second transistor T2 may supply a data signal DATA to the first node N1 in response to a write scan signal GW transmitted via the write scan line GWLi. In case that the write scan signal GW is supplied to the write scan line GWLi, the second transistor T2 is turned on to electrically connect the data line DLj and the first node N1 to each other.
The third transistor T3 may be connected to and disposed between the first node N1 and the reference voltage line VRL. A first electrode of the third transistor T3 may receive the reference voltage VREF via the reference voltage line VRL, and a second electrode of the third transistor T3 may be connected to the first node N1. In an embodiment, a gate of the third transistor T3 may receive a reset scan signal GR via the i-th fifth scan line GRLi. In case that the reset scan signal GR is supplied to the reset scan line GRLi, the third transistor T3 may be turned on to provide the reference voltage VREF to the first node N1.
The fourth transistor T4 may be connected to and disposed between the third node N3 and the first initialization voltage line VIII. A first electrode of the fourth transistor T4 may be connected to the third node N3, and a second electrode of the fourth transistor T4 may be connected to the first initialization voltage line VIL1 providing the first initialization voltage VINT1. The fourth transistor T4 may be referred to as a first initialization transistor. A gate of the fourth transistor T4 may receive a first initialization scan signal GI via the i-th third scan line GILi (hereinafter, a third scan line). In case that the first initialization scan signal GI is supplied to the first initialization scan line GILi, the fourth transistor T4 is turned on to supply the first initialization voltage VINT1 to the third node N3.
The fifth transistor T5 may be connected to and disposed between the compensation voltage line VCL and the second node N2. A first electrode of the fifth transistor T5 may receive the compensation voltage VCOMP via the compensation voltage line VCL, and a second electrode of the fifth transistor T5 may be connected to the second node N2 and thus may be electrically connected to the first electrode of the first transistor T1. A gate of the fifth transistor T5 may receive a compensation scan signal GC via the i-th second scan line GCLi (hereinafter, a second scan line). In case that the compensation scan signal GC is supplied to the compensation scan line GCLi, the fifth transistor T5 is turned on to provide the compensation voltage VCOMP to the second node N2, such that during a compensation period, a threshold voltage of the first transistor T1 may be compensated for.
The sixth transistor T6 may be connected to and disposed between the first transistor T1 and the light emitting device LD. By way of example, a gate of the sixth transistor T6 may receive a light-emission signal EM via the i-th emission line ESLi (hereinafter, a light-emission line). A first electrode of the sixth transistor T6 may be connected to a cathode of the light emitting device LD via a fourth node N4, and a second electrode of the sixth transistor T6 may be connected to the first electrode of the first transistor T1 via the second node N2. The sixth transistor T6 may be referred to as a first light-emission control transistor. In case that the light-emission signal EM is supplied to the emission line ESLi, the sixth transistor T6 is turned on to electrically connect the light emitting device LD and the first transistor T1 to each other.
The seventh transistor T7 may be connected to and disposed between the second power line VSL and the third node N3. A first electrode of the seventh transistor T7 may be connected to the second electrode of the first transistor T1 via the third node N3, and a second electrode of the seventh transistor T7 may receive the second power voltage VSS via the second power line VSL. A gate of the seventh transistor T7 may be electrically connected to the emission line ESLi. The seventh transistor T7 may be referred to as a second light-emission control transistor. In case that the light-emission signal EM is supplied to the emission line ESLi, the seventh transistor T7 is turned on to electrically connect the second electrode of the first transistor T1 and the second power line VSL to each other.
In
The eighth transistor T8 may be connected to and disposed between the second initialization voltage line VIL2 and the fourth node N4. For example, the eighth transistor T8 may include a gate connected to the i-th fourth scan line GBLi (hereinafter, a fourth scan line), a first electrode connected to the second initialization voltage line VIL2, and a second electrode connected to the fourth node N4. The eighth transistor T8 may be referred to as a second initialization transistor. The eighth transistor T8 responds to a second initialization scan signal GB transmitted via the second initialization scan line GBLi to supply the second initialization voltage VINT2 to a cathode of the light emitting device LD and a corresponding fourth node N4. The cathode of the light emitting device LD may be initialized by the second initialization voltage VINT2.
In one example, some or a number of the second to eighth transistors T2, T3, T4, T5, T6, T7, and T8 may be simultaneously turned on based on the same scan signal. For example, the eighth transistor T8 and the fifth transistor T5 may be simultaneously turned on based on the same scan signal. For example, the eighth transistor T8 and the fifth transistor T5 may operate based on the same compensation scan signal GC. Because the eighth transistor T8 and the fifth transistor T5 are turned on/off based on the same compensation scan signal GC, the eighth transistor T8 and the fifth transistor T5 may be turned on/off at the same time. The compensation scan line GCLi and the second initialization scan line GBLi may be substantially provided as a single scan line. Accordingly, the initialization of the cathode of the light emitting device LD and the compensation for the threshold voltage of the first transistor T1 may be performed at the same time. However, this is an example, and the disclosure is not limited to any one embodiment.
Further, the initialization of the cathode of the light emitting device LD and the compensation for the threshold voltage of the first transistor T1 may be performed via application of the same power voltage. For example, the compensation voltage line VCL and the second initialization voltage line VIL2 may be substantially provided as a single power voltage line. The initialization operation of the cathode and the compensation operation for the threshold voltage of the driving transistor may be performed based on a single power voltage. Thus, a driver design may be simplified. However, this is an example, and the disclosure is not limited to any one embodiment.
The first capacitor C1 may be disposed between the first node N1 and the third node N3. The first capacitor C1 may store therein a difference between voltage levels of the first node N1 and the third node N3. The first capacitor C1 may be referred to as a storage capacitor.
The second capacitor C2 may be disposed between the third node N3 and the second power line VSL. For example, one electrode of the second capacitor C2 may be connected to the second power line VSL supplied with the second power voltage VSS, and the other electrode of the second capacitor C2 may be connected to the third node N3. The second capacitor C2 may store therein electric charges corresponding to a difference between voltage levels of the second power voltage VSS and the second node N2. The second capacitor C2 may be referred to as a hold capacitor. The second capacitor C2 may have a higher storage capacity than that of the first capacitor C1. Accordingly, the second capacitor C2 may minimize change in a voltage of the third node N3 in response to change in a voltage of the first node N1.
The light emitting device LD may be connected to the pixel driver PDC via the fourth node N4. The light emitting device LD may include an anode connected to the first power line VDL and the cathode opposite to the anode. The light emitting device LD may be connected to the pixel driver PDC via the cathode. For example, in the pixel PXij, a connection node where the light emitting device LD and the pixel driver PDC are connected to each other may be the fourth node N4, and the fourth node N4 may correspond to a connection node between the first electrode of the sixth transistor T6 and the cathode of the light emitting device LD.
Accordingly, a potential of the fourth node N4 may substantially correspond to a potential of the cathode of the light emitting device LD. By way of example, the anode of the light emitting device LD may be connected to the first power line VDL such that the first power voltage VDD as a constant voltage is applied thereto. The cathode thereof may be connected to the first transistor T1 via the sixth transistor T6. For example, in case that each of the first to eighth transistors T1 to T8 is an N-type transistor, an electric potential of the third node N3 corresponding to a source of the first transistor T1 as the driving transistor may not be directly affected by the characteristics of the light emitting device LD. Therefore, even in case that the light emitting device LD is deteriorated, an effect on a gate-source voltage of each of the transistors constituting the pixel driver PDC, for example, the driving transistor may be reduced. For example, an amount of change in the driving current due to deterioration of the light emitting device LD may be reduced, such that an afterimage defect of the display panel due to increase in a use time may be reduced, and a lifespan of the display panel may be improved.
By way of example, as shown in
Each of the first and second transistors T1 and T2 as shown in
The first transistor T1 may include a gate connected to the first node N1, a first electrode connected to the second node N2, and a second electrode connected to the third node N3. The second node N2 may be a node connected to the first power line VDL, and the third node N3 may be a node connected to the second power line VSL. The first transistor T1 may be connected to the light emitting device LD via the second node N2 and connected to the second power line VSL via the third node N3. The first transistor T1 may be a driving transistor.
The second transistor T2 may include a gate for receiving the write scan signal GW via the write scan line GWLi, a first electrode connected to the data line DLj, and a second electrode connected to the first node N1. The second transistor T2 may supply the data signal DATA to the first node N1 in response to the write scan signal GW transmitted via the write scan line GWLi.
The capacitor C1 may include an electrode connected to the first node N1 and an electrode connected to the third node N3. The capacitor C1 may store therein the data signal DATA transmitted to the first node N1.
The light emitting device LD may include an anode, a cathode, and a intermediate layer disposed between the anode and the cathode. By way of example, the anode of the light emitting device LD may be connected to the first power line VDL, and the cathode may be connected to the pixel driver PDC-1 via the second node N2. In an embodiment, the cathode of the light emitting device LD may be connected to the first transistor T1. The light emitting device LD may emit light in response to an amount of current flowing through the first transistor T1 of the pixel driver PDC-1.
In case that each of the first and second transistors T1 and T2 is an N-type transistor, the second node N2 at which the cathode of the light emitting device LD and the pixel driver PDC-1 are connected to each other may correspond to a drain of the first transistor T1. For example, a change in the gate-source voltage of the first transistor T1 caused by the light emitting device LD may be suppressed. Accordingly, an amount of change in the driving current due to deterioration of the light emitting device LD may be reduced, such that an afterimage defect of the display panel due to increase in a use time may be reduced and thus the lifespan thereof may be improved.
In one example (
A thickness direction of the display device DD may be a direction parallel to the third direction axis DR3 which is the normal direction to the plane defined by the first direction axis DR1 and the second direction axis DR2. As used herein, a front face (or a top face) and a rear face (or a bottom face) of each of members constituting the display device DD may be defined in the third direction axis DR3. As used herein, “a plan view” means a view toward the plane defined by the first direction axis DR1 and the second direction axis, and “a cross-sectional view” means a view of a cross-section perpendicular to the plane and parallel to the third direction axis DR3.
The emitting parts EP may be respective areas of the pixels PXij (
The peripheral area NDA may be adjacent to the display area DA. In
In an embodiment, the scan driver SDC and the data driver DDC may be mounted in the display panel DP. In an embodiment, the scan driver SDC may be disposed in the display area DA, and the data driver DDC may be disposed in the peripheral area NDA. The scan driver SDC may overlap at least some or a number of the emitting parts EP disposed in the display area DA in a plan view. As the scan driver SDC is disposed in the display area DA, an area size of the peripheral area NDA of the display panel DP of an embodiment may be reduced compared to that in other display panels in which the scan driver is disposed in the peripheral area. Thus, a display device with a thin bezel may be readily implemented. As used herein, one component overlapping another component is not limited to a configuration that one component and another component have the same area and the same shape in a plan view, and may include a configuration that one component and another component have different areas and different shapes in a plan view.
Unlike what is shown in
In one example, unlike what is shown in
The data driver DDC may be provided in a form of a separate driver chip independent of the display panel DP and may be connected to the display panel DP. However, this is an example, and the data driver DDC and the scan driver SDC may be formed in the same process to constitute the display panel DP. The disclosure is not limited to any one embodiment.
As shown in
The first scan driver SDC1 may be connected to some or a number of scan lines GL1 to GLn and the second scan driver SDC2 may be connected to the others of scan lines GL1 to GLn. For example, the first scan driver SDC1 may be connected to odd scan lines among the scan lines GL1 to GLn, and the second scan driver SDC2 may be connected to even scan lines among the scan lines GL1 to GLn.
The pads PD may be divided into two groups disposed in the peripheral area NDA and spaced apart from each other while the display area DA is interposed therebetween. For example, some or a number of the pads PD may be disposed in an upper area, for example, in an area adjacent to the first scan line GL1 among the scan lines GL1 to GLn, and the others of the pads PD may be disposed in a lower area, for example, an area adjacent to the last scan line GLn among the scan lines GL1 to GLn. In an embodiment, the pads PD connected to odd data lines among the pads PD may be disposed in the upper area, and the pads PD connected to even data lines among the pads PD may be disposed in the lower area.
Although not shown, the display panel DP may include upper data drivers respectively connected to the pads PD disposed in the upper area and/or lower data drivers respectively connected to the pads PD disposed in the lower area. However, this is an example, and the display panel DP may include one upper data driver connected to the pads PD disposed in the upper are and/or one lower data driver connected to the pads PD disposed in the lower area. For example, the pads PD may be disposed in one area and may be connected to a single data driver. The disclosure is not limited to any one embodiment.
Further, as described above in
Referring to
As described above, each of the emitting parts EP may correspond to the light-emitting opening OP-PDL (
The emitting parts EP may include a first emitting part EP1, a second emitting part EP2, and a third emitting part EP3. The first emitting part EP1, the second emitting part EP2, and the third emitting part EP3 may display light of different colors. For example, the first emitting part EP1 may emit red light, the second emitting part EP2 may emit green light, and the third emitting part EP3 may emit blue light. However, the disclosure is not limited thereto. At least two of the emitting parts EP may emit light of the same color. For example, all of the first to third emitting parts EP1, EP2, and EP3 may emit blue light or may emit white light.
In one example, the third emitting part EP3 emitting light emitted from a third light emitting device LD3 among the emitting parts EP may include two sub-emitting parts EP31 and EP32 spaced apart from each other in the second direction DR2. However, this is shown by way of example, and the third emitting part EP3 may be provided as one pattern having an integral structure as in each of the first and second emitting parts EP1 and EP2. At least one of the first and second emitting parts EP1 and EP2 may include sub-emitting parts. The disclosure is not limited to any one embodiment.
The emitting parts of the first row Rk may constitute the first row first column light emitting units UT11 and the first row second column light emitting units UT12 which are repeatedly arranged or disposed. The emitting parts of the second row Rk+1 may constitute the second row first column light emitting units UT21 and the second row second column light emitting units UT22 which are repeatedly arranged or disposed. In this regard, the emitting parts constituting the first row first column light emitting unit UT11 and the emitting parts constituting the second row first column light emitting unit UT21 may be arranged or disposed in a symmetric manner with each other in an axis parallel to the first direction DR1. The emitting parts constituting the first row second column light emitting unit UT12 and the emitting parts constituting the second row second column light emitting unit UT22 may be arranged or disposed in a symmetric manner with each other in an axis parallel to the first direction DR1. Further, connection parts of connection wirings CN-a connected to the first row first column light emitting unit UT11 and connection parts of connection wirings CN-c connected to the second row first column light emitting unit UT21 may be arranged or disposed in a symmetric manner with each other in an axis parallel to the first direction DR1. Further, connection parts of connection wirings CN-b connected to the first row second column light emitting unit UT12 and connection parts of connection wirings CN-d connected to the second row second column light emitting unit UT22 may be arranged or disposed in a symmetric manner with each other in an axis parallel to the first direction DR1.
For example, each of the light emitting units UT11, UT12, UT21, and UT22 may include three emitting parts EP1, EP2, and EP3. Each of the light emitting units UT11, UT12, UT21, and UT22 may include three second electrodes, three pixel drivers, and three connection wirings. However, this is shown by way of example, and the number and arrangement of the emitting parts in each of the light emitting units UT11, UT12, UT21, and UT22 may be designed in various ways. The disclosure is not limited to any one embodiment.
Hereinafter, the first row first column light emitting unit UT11 will be described in detail with reference to
Further, as shown in
The first to third pixel drivers PDC1, PDC2, and PDC3 may be sequentially arranged or disposed along the first direction DR1. In one example, positions of the first to third pixel drivers PDC1, PDC2, and PDC3 may be independently designed regardless of positions and/or area shapes of the first to third emitting parts EP1, EP2, and EP3.
For example, each of the first to third pixel drivers PDC1, PDC2, and PDC3 may be disposed in a different location from each of areas defined by the separators SPR, for example, from each of positions where the first to third cathodes EL2_1, EL2_2, and EL2_3 are positioned. Each of the first to third pixel drivers PDC1, PDC2, and PDC3 may be designed to have an area shape different from that of each of the first to third cathodes EL2_1, EL2_2, and EL2_3. By way of example, each of the first to third pixel drivers PDC1, PDC2, and PDC3 may be positioned so as to overlap each of the areas in which the first to third emitting parts EP1, EP2, and EP3 are positioned. Each of the first to third pixel drivers PDC1, PDC2, and PDC3 may be designed to have an area shape similar to a shape of each of areas defined by the separator SPR, for example, an area shape of each of the first to third cathodes EL2_1, EL2_2, and EL2_3.
In an embodiment, each of the first to third pixel drivers PDC1, PDC2, and PDC3 is shown as having a rectangular shape, and each of the first to third emitting parts EP1, EP2, and EP3 is shown as having a smaller area than an area of the rectangular shape and a different shape from the rectangular shape. Further, each of the first to third cathodes EL2_1, EL2_2, and EL2_3 is illustrated as being positioned as to overlap each of the first to third emitting parts EP1, EP2, and EP3, and is shown as having an irregular shape.
Accordingly, as shown in
The connection wiring CN-a may include connection wirings which may be spaced apart from each other. Each of the connection wirings CN-a may connect each of the first to third pixel drivers PDC1, PDC2, and PDC3 to each of the first to third light emitting devices LD1, LD2, and LD3 (
The connection wirings CN-a may include emission connection parts CE1, CE2, and CE3 and driver connection parts CD1, CD2, and CD3. Each of the emission connection parts CE1, CE2, and CE3 may be provided at one end of each of the connection wirings CN-a while each of the driver connection parts CD1, CD2, and CD3 may be provided at the other end of each of the connection wirings CN-a.
Each of the driver connection parts CD1, CD2, and CD3 may refer to a portion of each of the connection wirings CN-a connected to each of the pixel drivers PDC1, PDC2, and PDC3. In an embodiment, each of the driver connection parts CD1, CD2, and CD3 may be connected to a drain of the sixth transistor T6 as shown in
The light emitting unit UT11 may include the first to third connection wirings CN1, CN2, and CN3. The first connection wiring CN1 may connect the first light emitting device LD1 constituting the first emitting part EP1 to the first pixel driver PDC1. The second connection wiring CN2 may connect the second light emitting device LD2 constituting the second emitting part EP2 to the second pixel driver PDC2. The third connection wiring CN3 may connect the third light emitting device LD3 constituting the third emitting part EP3 to the third pixel driver PDC3.
By way of example, the first to third connection wirings CN1, CN2, and CN3 may connect the first to third cathodes EL2_1, EL2_2, and EL2_3 to the first to third pixel drivers PDC1, PDC2, and PDC3, respectively. The first connection wiring CN1 may include the first driver connection part CD1 connected to the first pixel driver PDC1 and the first emission connection part CE1 connected to the first cathode EL2_1. The second connection wiring CN2 may include the second driver connection part CD2 connected to the second pixel driver PDC2 and the second emission connection part CE2 connected to the second cathode EL2_2. The third connection wiring CN3 may include the third driver connection part CD3 connected to the third pixel driver PDC3 and the third emission connection part CE3 connected to the third cathode EL2_3.
The first to third driver connection parts CD1, CD2, and CD3 may be aligned along the first direction DR1. As described above, the positions of the first to third driver connection parts CD1, CD2, and CD3 may respectively correspond to positions of connection transistors constituting the first to third pixel drivers PDC1, PDC2, and PDC3, respectively. The connection transistor may be a transistor including a connection node at which a pixel driver and a light emitting device in one pixel are connected to each other as one electrode. For example, a position of the connection transistor may correspond to a position of the sixth transistor T6 in
In an embodiment, the first to third emission connection parts CE1, CE2, and CE3 may be respectively disposed at non-overlapping positions with the emitting parts EP1, EP2, and EP3 in a plan view. Each of the first to third emission connection parts CE1, CE2, and CE3 may refer to a portion of each of the connection wirings CN-a connected to each of the first to third light emitting devices LD1, LD2, and LD3 (
For example, the first cathode EL2_1 may include a protrusion protruding from the first emitting part EP1 at a position that does not overlap the first emitting part EP1 such that the first emission connection part CE1 is disposed in the protrusion. The first pixel driver PDC1, for example, the first driver connection part CD1 at which the first connection wiring CN1 is connected to the transistor TR (
The third pixel driver PDC3, for example, the third driver connection part CD3 contacting the connection transistor TR may be defined at a position that does not overlap the third emission connection part CE3 in a plan view, and may be disposed at an overlapping position with the third emitting part EP3. According to an embodiment, the third cathode EL2_3 and the third pixel driver PDC3 may be connected to each other via the third connection wiring CN3. Thus, in a design of the third pixel driver PDC3, limitation in terms of a location or a shape of the third emitting part EP3 may be reduced, so that a degree of freedom of design may be improved.
The above description about the first row first column light emitting unit UT11 may be equally applied to the first row second column light emitting unit UT12. For example, the above description about each of the first to third pixel drivers PDC1, PDC2, and PDC3, the first to third cathodes EL2_1, EL2_2, and EL2_3, and the first to third connection wirings CN1, CN2 and CN3 of the first row first column light emitting unit UT11 may be equally applied to each of the first to third pixel drivers PDC1b, PDC2b, and PDC3b, the first to third cathodes EL2_1b, EL2_2b, EL2_3b, and the first to third connection wiring CN1b, CN2b, and CN3b of the first row second column light emitting unit UT12. The above description about the emission connection parts CE1, CE2, and CE3 and the driver connection parts CD1, CD2, and CD3 included in the first to third connection wirings CN1, CN2 and CN3 of the first row first column light emitting unit UT11 may be equally applied to emission connection parts CE1b, CE2b, and CE3b and the driver connection parts CD1b, CD2b, and CD3b included in the first to third connection wirings CN1b, CN2b and CN3b of the first row second column light emitting unit UT12.
Referring to
Accordingly, the shapes and arrangement of the connection wirings CN-c) connected to the second row first column light emitting unit UT21 may be the same as the shapes and arrangement of the connection wirings CN-b connected to the first row second column light emitting unit UT12. Similarly, the shapes and arrangement of the connection wirings CN-d connected to the second row second column light emitting unit UT22 may be the same as the shapes and arrangement of the connection wirings CN-a connected to the first row first column light emitting unit UT11. In
Referring to
The first electrode EL1 may be an anode. As described above, the first power voltage VDD may be applied to the anode EL1 and a common voltage may be provided to all of the emitting parts EP. The anode EL1 may be connected to the first power line VDL (
In one example, openings OP-EL1 may be defined in the anode ELL The openings OP-EL1 may extend through the anode ELL The openings OP-EL1 may non-overlap the emitting parts EP. In general, the openings OP-EL1 may be defined so as to overlap the separator SPR. The openings OP-EL1 may facilitate discharge of gas generated from an organic layer disposed below the anode EL1, for example, from a sixth insulating layer 60 (
According to an embodiment, the connection wiring may be disposed between the light emitting device and the pixel driver. Thus, even in case that only a cathode shape is changed without changing an arrangement or shapes of the emitting parts, the light emitting device may be readily connected to the pixel driver. Accordingly, a design freedom in terms of an arrangement of the pixel drivers may be improved, and an area of the emitting part or a resolution of the display panel may be readily increased.
Referring to
The base layer BS may be a member providing a base face on which the pixel driver PDC is disposed. The base layer BS may be a rigid substrate or a flexible substrate capable of being bent, folded, or rolled. The base layer BS may be a glass substrate, a metal substrate, or a polymer substrate. However, an embodiment is not limited thereto, and the base layer BS may be an inorganic layer, an organic layer, or a composite material layer.
The base layer BS may have a multi-layer structure. The base layer BS may include a first polymer resin layer, a silicon oxide (SiOx) layer disposed on the first polymer resin layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second polymer resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer may be referred to as a base barrier layer.
Each of the first and second polymer resin layers may include a polyimide-based resin. Further, each of the first and second polymer resin layers may include at least one of acrylate-based resin, methacrylate-based resin, polyisoprene-based resin, vinyl-based resin, epoxy-based resin. urethane-based resin, cellulose-based resin, siloxane-based resin, polyamide-based resin, or perylene-based resin. As used herein, “˜based” resin means a resin including a functional group of “˜”.
Each of the insulating layers or the conductive layers and the semiconductor layers disposed on the base layer BS may be formed using a scheme such as coating or deposition. Thereafter, the organic layer, the inorganic layer, the semiconductor layer, and the conductive layer may be selectively patterned using photolithography processes to form a hole in the insulating layer or to form the semiconductor pattern, the conductive pattern, and a signal line.
The driving device layer DDL may include the first to fifth insulating layers 10, 20, 30, 40, and 50 sequentially stacked each other on the base layer BS and the pixel driver PDC.
In one example, the first insulating layer 10 may cover a bottom conductive layer BCL. For example, the display panel DP may further include the bottom conductive layer BCL disposed to overlap the connection transistor TR. The bottom conductive layer BCL may prevent an electric potential due to a polarization phenomenon of the base layer BS from affecting the connection transistor TR. Further, the bottom conductive layer BCL may prevent light incident from a position below the bottom conductive layer BCL from being incident to the connection transistor TR. At least one of an inorganic barrier layer and a buffer layer may be further disposed between the bottom conductive layer BCL and the base layer BS.
The bottom conductive layer BCL may include a reflective metal. For example, the bottom conductive layer BCL may include titanium (Ti), molybdenum (Mo), an alloy containing molybdenum, aluminum (Al), an alloy containing aluminum, aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), or copper (Cu).
The bottom conductive layer BCL may be connected to a wiring via a contact electrode (not shown), and may receive a constant voltage or a pulse signal therefrom. In an embodiment, the bottom conductive layer BCL may be provided in an isolated form from other electrodes or the wiring. However, this is an example, and the bottom conductive layer BCL may be provided in various forms. The disclosure is not limited to any one embodiment.
The connection transistor TR may be disposed on the first insulating layer 10. The connection transistor TR may include a semiconductor pattern SP and a gate electrode GE. The semiconductor pattern SP may be disposed on the first insulating layer 10. The semiconductor pattern SP may include an oxide semiconductor. For example, an oxide semiconductor may include a transparent conductive oxide (TCO) such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO) or indium oxide (In2O3). However, the disclosure is not limited thereto, and the semiconductor pattern may include amorphous silicon, low-temperature polycrystalline silicon, or polycrystalline silicon.
The semiconductor pattern SP may include a source area SR, a drain area DR, and a channel area CR (or a channel) distinguished from each other based on a conductivity level. The channel area CR may be a portion overlapping the gate electrode GE in a plan view. The source area SR and the drain area DR may be spaced apart while the channel area CR is interposed therebetween. In case that the semiconductor pattern SP is made of an oxide semiconductor, each of the source area SR and the drain area DR may be a reduced area. Accordingly, each of the source area SR and the drain area DR has a relatively high content of a reduced metal compared to that in the channel area CR. By way of example, in case that the semiconductor pattern SP is made of polycrystalline silicon, each of the source area SR and the drain area DR may be an area doped with impurities at a high concentration.
Each of the source area SR and the drain area DR may have relatively higher conductivity than that of the channel area CR. The source area SR may correspond to the source electrode of the connection transistor TR and the drain area DR may correspond to the drain electrode of the connection transistor TR. As shown in
The second insulating layer 20 may commonly overlap the pixels PX11 to PXnm and may cover the semiconductor pattern SP. The second insulating layer 20 may be an inorganic layer and/or an organic layer, and may have a single-layer or multi-layer structure. The second insulating layer 20 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, or hafnium oxide. For example, the second insulating layer 20 may be a single layer made of silicon oxide. The gate electrode GE may be disposed on the second insulating layer 20. The gate electrode GE may correspond to a gate of the connection transistor TR. Further, the gate electrode GE may be connected to the first node (N1 in
The gate electrode GE may be disposed on top of the semiconductor pattern SP. However, this is shown by way of example, and the gate electrode GE may be disposed below the semiconductor pattern SP. The disclosure is not limited to any one embodiment.
The gate electrode GE may include titanium (Ti), silver (Ag), molybdenum (Mo), aluminum (Al), aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), or alloys thereof, etc. However, this is an example, and an embodiment is not limited thereto.
The third insulating layer 30 may be disposed on the gate electrode GE. The third insulating layer 30 may be an inorganic layer and/or an organic layer, and may have a single-layer or multi-layer structure. The third insulating layer 30 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, or hafnium oxide.
A first capacitor electrode CPE1 and a second capacitor electrode CPE2 among conductive patterns W1, W2, CPE1, CPE2, and CPE3 may constitute the first capacitor C1. The first capacitor electrode CPE1 and the second capacitor electrode CPE2 may be spaced apart from each other while the first insulating layer 10 and the second insulating layer 20 are interposed therebetween.
The first capacitor electrode CPE1 and the bottom conductive layer BCL may have an integral structure with each other. Further, the second capacitor electrode CPE2 and the gate electrode GE may have an integral structure with each other.
The third capacitor electrode CPE3 may be disposed on the third insulating layer 30. The third capacitor electrode CPE3 may be spaced apart from the second capacitor electrode CPE2 while the third insulating layer 30 is therebetween, and may overlap the second capacitor electrode CPE2 in a plan view. The third capacitor electrode CPE3 and the second capacitor electrode CPE2 may constitute the second capacitor C2.
The fourth insulating layer 40 may be disposed on the third insulating layer 30 and/or the third capacitor electrode CPE3. The fourth insulating layer 40 may be an inorganic layer and/or an organic layer, and may have a single-layer or multi-layer structure. The fourth insulating layer 40 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, or hafnium oxide.
The source electrode pattern W1 and the drain electrode pattern W2 may be disposed on the fourth insulating layer 40. The source electrode pattern W1 may be connected to the bottom conductive layer BCL via a through-hole (not shown). Further, the source electrode pattern W1 may be connected to the source area SR of the connection transistor TR via a first through-hole CNT1. The drain electrode pattern W2 may be connected to the drain area DR of the connection transistor TR via a second through-hole CNT2.
The fifth insulating layer 50 may be disposed on the source electrode pattern W1 and the drain electrode pattern W2. The connection wiring CN may be disposed on the fifth insulating layer 50 and the sixth insulating layer 60. The connection wiring CN may electrically connect the pixel driver PDC and the light emitting device LD to each other. For example, the connection wiring CN may electrically connect the connection transistor TR and the light emitting device LD to each other. The connection wiring CN may be a connection node connecting the pixel driver PDC and the light emitting device LD to each other. For example, the connection wiring CN may correspond to the fourth node N4 as shown in
The sixth insulating layer 60 may be disposed on the connection wiring CN. The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 so as to cover the connection wiring CN. In one example, the sixth insulating layer 60 may be omitted or include layers. The disclosure is not limited to any one embodiment.
Each of the fifth insulating layer 50 and the sixth insulating layer 60 may be an organic layer. For example, each of the fifth insulating layer 50 and the sixth insulating layer 60 may include a general-purpose polymer such as BCB (Benzocyclobutene), polyimide, HMDSO (Hexamethyldisiloxane), Polymethylmethacrylate (PMMA), or polystyrene (PS), a polymer derivative having a phenolic group, an acrylate-based polymer, an imide-based polymer, an arylether-bsaed polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, or blends thereof.
An opening exposing at least a portion of the connection wiring CN may be defined in the sixth insulating layer 60. The connection wiring CN may be electrically connected to the light emitting device LD via a portion thereof exposed through the opening defined in the sixth insulating layer 60. For example, the connection wiring CN may electrically connect the connection transistor TR and the light emitting device LD to each other. The light emitting device layer LDL may be disposed on the sixth insulating layer 60. The light emitting device layer LDL may include a pixel defining film PDL, the light emitting device LD, and the separator SPR.
The pixel defining film PDL may be an organic layer. For example, the pixel defining film PDL may include a general-purpose polymer such as BCB (Benzocyclobutene), polyimide, HMDSO (Hexamethyldisiloxane), Polymethylmethacrylate (PMMA), or polystyrene (PS), a polymer derivative having a phenolic group, an acrylate-based polymer, an imide-based polymer, an arylether-bsaed polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, or blends thereof.
The pixel defining film PDL may have a property of absorbing light. For example, the pixel defining film PDL may have a black color. The pixel defining film PDL may include a black coloring agent. The black coloring agent may include black dyes and black pigments. The black coloring agent may include carbon black, a metal such as chromium, or an oxide thereof. The pixel defining film PDL may act as a light blocking pattern having light blocking properties.
The light-emitting opening OP-PDL exposing at least a portion of the first electrode EL1 to be described below may be defined in the pixel defining film PDL. Light-emitting openings OP-PDL may be disposed in a corresponding manner to the light emitting devices LD, respectively. All components of the light emitting device LD may be disposed in the light-emitting opening OP-PDL so as to overlap each other. The light-emitting opening OP-PDL may be an area in which light emitted from the light emitting device LD is substantially emitted. Accordingly, a shape of the above-described emitting part EP (
The first electrode EL1 may be a transmissive, transflective, or reflective electrode. In an embodiment, the first electrode EL1 may include a reflective layer made of silver, magnesium, aluminum, platinum, palladium, gold, nickel, neodymium, iridium, chromium, or a compound thereof, and a transmissive or transflective electrode layer formed on the reflective layer. The transmissive or transflective electrode layer may include at least one selected from a group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO) or indium oxide (In2O3), and aluminum doped zinc oxide (AZO). For example, the first electrode EL1 may include a stacked structure of ITO/Ag/ITO.
In an embodiment, the first electrode EL1 may be an anode of the light emitting device LD. For example, the first electrode EL1 may be connected to the first power line VDL (
In the schematic cross-sectional view of
The intermediate layer IML may be disposed between the first electrode EL1 and the second electrode EL2. The intermediate layer IML may include a emitting layer EML and a function layer FNL. However, this is an example, and the light emitting device LD may include the intermediate layer IML of each of various structures. The disclosure is not limited to any one embodiment. For example, the function layer FNL may be embodied as layers or as two or more layers spaced apart from each other while the emitting layer EML is interposed therebetween. By way of example, unlike what is shown, the function layer FNL may be omitted.
The function layer FNL may control transfer of electric charges between the first electrode EL1 and the second electrode EL2. The function layer FNL may include a hole injection/transport material and/or an electron injection/transport material. The function layer FNL may include at least one of an electron blocking layer, a hole transporting layer, a hole injection layer, a hole blocking layer, an electron transporting layer, an electron injection layer, and an electric charge generating layer.
The function layer FNL may be disposed between the first electrode EL1 and the emitting layer EML, or may be disposed between the emitting layer EML and the second electrode EL2. By way of example, the function layer FNL may be disposed between the first electrode EL1 and the emitting layer EML and between the second electrode EL2 and the emitting layer EML. In
The emitting layer EML may be disposed on the first electrode ELL The emitting layer EML may be embedded in the function layer FNL. However, an embodiment is not limited thereto, and the function layer FNL may include a layer disposed between the emitting layer EML and the first electrode EL1, and/or a layer disposed between the emitting layer EML and the second electrode EL2, wherein each of the layers may be embodied as a stack of layers. The disclosure is not limited to any one embodiment. Further, in
The emitting layers EML respectively included in the emitting parts EP adjacent to each other may include light-emitting materials emitting light beams of different colors. The emitting layer EML may provide one of blue, red, and green light. However, the disclosure is not limited thereto, and the emitting layers EML respectively disposed in all of the emitting parts EP may include a light-emitting material emitting light of the same color. The emitting layers EML may provide blue light or white light. The emitting layer EML may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED.
The second electrode EL2 may be disposed on the intermediate layer IML. As described above, the second electrode EL2 may be connected to the pixel driver PDC via the node (N4 in
An encapsulation layer ECL may be disposed on the light emitting device layer LDL. The encapsulation layer ECL may cover the light emitting device LD and may cover the separator SPR. The encapsulation layer ECL may include a first inorganic layer IL1, an organic layer OL, and a second inorganic layer IL2 sequentially stacked each other. However, the disclosure is not limited thereto, and the encapsulation layer ECL may further include inorganic layers and organic layers. Further, the encapsulation layer ECL may be a glass substrate.
The first and second inorganic layers IL1 and IL2 may protect the light emitting device layer LDL from moisture and oxygen outside the display panel DP. The organic layer OL may protect the light emitting device layer LDL from foreign materials such as particles remaining in a process of forming the first inorganic layer ILL Each of the first and second inorganic layers IL1 and IL2 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer OL may include an acrylate-based organic layer. However, a type of a material is not limited thereto.
The sensing layer ISL may sense an external input. The sensing layer ISL may be formed on the light emitting device layer LDL using a consecutive process. In this regard, the sensing layer ISL may be directly disposed on the encapsulation layer ECL and may contact the encapsulation layer ECL. As used herein, one element being ‘directly disposed’ on another element may mean that no third element is disposed between one element and another element, but one element and another element contact each other. However, this is an example, and the sensing layer ISL may be formed separately, and may be combined with the light emitting device layer LDL via an adhesive member. The disclosure is not limited to any one embodiment.
The sensing layer ISL may include conductive layers MTL1 and MTL2 and sensing insulating layers 71, 72, and 73. The sensing layer ISL may include the first to third sensing insulating layers 71, 72, and 73. However, this is shown by way of example, and the number of the sensing insulating layers 71, 72, and 73 constituting the sensing layer ISL is not limited to any one embodiment.
Each of the first to third sensing insulating layers 71, 72, and 73 may have a single-layer structure or a multi-layer structure in which layers may be stacked each other along the third direction DR3. Each of the first to third sensing insulating layers 71, 72, and 73 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, or hafnium oxide. Each of the first to third sensing insulating layers 71, 72, and 73 may include an organic film. The organic film may include at least one of acrylate-based resin, methacrylate-based resin, polyisoprene, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin.
The first sensing conductive layer MTL1 may be disposed between the first sensing insulating layer 71 and the second sensing insulating layer 72, and the second sensing conductive layer MTL2 may be disposed between the second sensing insulating layer 72 and the third sensing insulating layer 73. A portion of the second sensing conductive layer MTL2 may be connected to the first sensing conductive layer MTL1 via a contact hole CNT formed in the second sensing insulating layer 72. Each of the first and second sensing conductive layers MTL1 and MTL2 may have a single-layer structure or a multi-layer structure in which layers may be stacked each other along the third direction DR3.
The sensing conductive layer having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide, indium zinc oxide, zinc oxide, or indium zinc tin oxide. By way of example, the transparent conductive layer may include a conductive polymer such as PEDOT, a metal nanowire, graphene, and the like within the spirit and the scope of the disclosure.
The sensing conductive layer having a multi-layer structure may include metal layers. The metal layers may include, for example, a titanium layer/an aluminum layer/a titanium layer. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.
The first sensing conductive layer MTL1 and the second sensing conductive layer MTL2 may constitute a sensor that detects an external input in the sensing layer ISL. The sensor may operate in a capacitance-based manner or may operate either a mutual-cap scheme or a self-cap scheme. However, this is an example, and the sensor may operate in a resistive film-based scheme, an ultrasonic wave-based scheme, or an infrared-ray based scheme in addition to the capacitance-based scheme. The disclosure is not limited to any one embodiment.
Each of the first sensing conductive layer MTL1 and the second sensing conductive layer MTL2 may include a transparent conductive oxide or may have a metal mesh shape made of an opaque conductive material. Each of the first sensing conductive layer MTL1 and the second sensing conductive layer MTL2 may be made of each of various materials and may have each of various shapes as long as visibility of the image displayed based on the light generated from the display panel DP is not deteriorated. The disclosure is not limited to any one embodiment. The connection wiring CN according to an embodiment may include the driver connection part CD and the emission connection part CE. The connection wiring CN will be described with referring to
The driver connection part CD may be a portion of the connection wiring CN connected to the pixel driver PDC, and may be a portion thereof substantially connected to the connection transistor TR. In an embodiment, the driver connection part CD may extend through the fifth insulating layer 50 and be electrically connected to the drain area DR of the semiconductor pattern SP via the drain electrode pattern W2.
The emission connection part CE may be a portion of the connection wiring CN connected to the light emitting device LD. The emission connection part CE may be defined in an area not covered with the sixth insulating layer 60 and may be a portion directly connected to the second electrode EL2. In this regard, the tip part TP may be defined in the emission connection part CE.
Referring to
The second layer L2 may include a material different from that of the first layer L1. The second layer L2 may include a material different from that of the third layer L3. The second layer L2 may have a relatively larger thickness compared to that of the first layer L1. Further, the second layer L2 may have a relatively larger thickness compared to that of the third layer L3. The second layer L2 may include a highly conductive material. For example, the second layer L2 may include aluminum (Al). The first layer L1 may include a material having a lower etch rate than that of the second layer L2. For example, the first layer L1 and the second layer L2 may be respectively composed of materials having high etch selectivity relative to each other. In an embodiment, the first layer L1 may include titanium (Ti), and the second layer L2 may include aluminum (Al). A side face L1_W of the first layer L1 may be defined outwardly of a side face L2_W of the second layer L2. For example, the emission connection part CE of the connection wiring CN may have a shape in which the side face L1_W of the first layer L1 is positioned outwardly beyond the side face L2_W of the second layer L2. For example, the emission connection part CE of the connection wiring CN may have a shape in which the side face L2_W of the second layer L2 is positioned inwardly of the side face L1_W of the first layer L1.
The third layer L3 may include a material having a lower etching rate than that of the second layer L2. The third layer L3 may include a material having a lower etch selectivity with respect to that of the second layer L2. For example, the third layer L3 may include titanium (Ti). For example, the third layer L3 and the second layer L2 may be respectively composed of materials having a high etch selectivity relative to each other. In an embodiment, the third layer L3 may include titanium (Ti), and the second layer L2 may include aluminum (Al). A side face L3_W of the third layer L3 may be defined outwardly of the side face L2_W of the second layer L2. For example, the emission connection part CE of the connection wiring CN may have a shape in which the side face L3_W of the third layer L3 is positioned outwardly beyond the side face L2_W of the second layer L2. For example, the emission connection part CE of the connection wiring CN may have an undercut shape or an overhang structure. A portion of the third layer L3 positioned outwardly beyond the side face L2_W of the second layer L2 may constitute the tip part TP of the emission connection part CE.
The sixth insulating layer 60 and the pixel defining film PDL may not cover at least a portion of the tip part TP and at least a portion of the side face L2_W of the second layer L2. By way of example, a first auxiliary opening OP1 exposing one side or a side of the connection wiring CN may be defined in the sixth insulating layer 60, and a second auxiliary opening OP2 overlapping the first auxiliary opening OP1 may be defined in the pixel defining film PDL. An area size of the second auxiliary opening OP2 may be at least the same as that of the first auxiliary opening OP1 or may be larger than that of the first auxiliary opening OP1. However, an embodiment is not limited thereto. As long as at least a portion of the tip part TP and at least a portion of the side face L2_W of the second layer L2 are exposed, the area size of the second auxiliary opening OP2 may be smaller than or equal to that of the first auxiliary opening OP1.
The intermediate layer IML may be disposed on the pixel defining film PDL. The intermediate layer IML may also be disposed on a partial area of the sixth insulating layer 60 exposed through the second auxiliary opening OP2 of the pixel defining film PDL. Further, the intermediate layer IML may also be disposed on a partial area of the connection wiring CN exposed through the first auxiliary opening OP1 of the sixth insulating layer 60. As shown in
The second electrode EL2 may be disposed on the intermediate layer IML. The second electrode EL2 may also be disposed on a partial area of the sixth insulating layer 60 exposed through the second auxiliary opening OP2 of the pixel defining film PDL. The second electrode EL2 may also be disposed on a top face of the sixth insulating layer 60 and a partial area of the connection wiring CN exposed through the first auxiliary opening OP1. As shown in
In one example, one end EN1 of the second electrode EL2 may be disposed along a side face of the second layer L2 so as to contact the side face L2_W of the second layer L2. By way of example, due to a difference between deposition angles of the second electrode EL2 and the intermediate layer IML, the tip part TP of the second electrode EL2 may contact the side face L2_W of the second layer L2 not covered with the intermediate layer IML. For example, the second electrode EL2 may be connected to the connection wiring CN without a separate patterning process on the intermediate layer IML, and thus the light emitting device LD may be electrically connected to the pixel driver PDC via the connection wiring CN.
Further, in an embodiment, it is illustrated that the other end IN2 of the intermediate layer IML and the other end EN2 of the second electrode EL2 cover the side face L3_W of the third layer L3. This is shown by way of example, and at least a portion of the side face L3_W of the third layer L3 may not be covered with the other end IN2 of the intermediate layer IML and/or the other end EN2 of the second electrode EL2.
Referring back to
In an embodiment, the separator SPR may include an insulating material, for example, an organic insulating material. The separator SPR may include an inorganic insulating material, or may be composed of a stack of multiple layers respectively made of an organic insulating material and an inorganic insulating material. Depending on an embodiment, the separator SPR may include a conductive material. For example, as long as the second electrode EL2 of one of adjacent pixels is electrically isolated from the second electrode EL2 of the other of the adjacent pixels via the separator SPR, a material thereof is not particularly limited.
A dummy layer UP may be disposed on the separator SPR. The dummy layer UP may include a first dummy layer UP1 disposed on the separator SPR and a second dummy layer UP2 disposed on the first dummy layer UP1. The first dummy layer UP1 and the intermediate layer IML may be formed in the same process and may include a same material or a similar material. The second dummy layer UP2 and the second electrode EL2 may be formed in the same process and may include a same material or a similar material. For example, the first dummy layer UP1 and the second dummy layer UP2 may be formed in a manufacturing step of the intermediate layer IML and the second electrode EL2. Unlike what is shown, the dummy layer UP may be omitted.
Further, in case that the intermediate layer IML and the second electrode EL2 are formed, a portion extending from the first dummy layer UP1 and a portion extending from the second dummy layer UP2 may be formed on a side face R_SF (
According to an embodiment, even in case that a separate patterning process is not performed on the second electrode EL2 or the intermediate layer IML, the second electrode EL2 or the intermediate layer IML may be prevented from being formed on the side face R_SF of the separator SPR or may be formed to be very thin, such that the second electrodes EL2 or the intermediate layers IML of adjacent pixels may be isolated from each other. Referring to
Referring to
The ZZ′-1 area of
The second side face R_S2a may be more greatly inclined with respect to one face R_DF than the first side face R_S1 may be. For example, the separator SPR-a may be formed by performing patterning using a mask. The mask may include a mask having a slit or a halftone mask. After the mask has been provided, the separator SPR-a may be formed in an exposure process. In case that the mask including a slit or the halftone mask is provided, the separator SPR-a may be formed without change in a light amount in the exposure process. Accordingly, the first angle θ1 of the first side face R_S1 and the second angle θ2a of the second side face R_S2a may be different from each other. The separator SPR-a in which the first angle 01 of the first side face R_S1 and the second angle θ2a of the second side face R_S2a are different from each other may have improved isolation ability of the second electrode EL2 and/or the intermediate layer IML.
The separator SPR-b as shown in
Referring to
Referring to
The first isolation portion SP1-a as shown in
Referring to
A first opening S_OH may be defined in the first isolation portion SP1-a. In the first isolation portion SP1-a, two first portions XT1 adjacent to each other, one second portion XT2 disposed between the two adjacent first portions XT1, and one third portion XT3 disposed between the two adjacent first portions XT1 may define the first opening S_OH. The first portion XT1 and the second and third portions XT2 and XT3 respectively extending in directions intersecting each other may constitute a quadrangular shape. Accordingly, the first opening S_OH may be defined as a square shape in the plan view.
Referring to
At least one of the first isolation portion SP1 or the second isolation portion SP2 may include portions. The intersection NP may be disposed between two isolation portions (two first isolation portions or two second isolation portions) extending in one direction or in a direction, while the other isolation portion (a second or first isolation portion) extending in the other direction intersecting the one direction or in a direction may extend from the intersection NP. For example, in the separator SPR, at least two first isolation portions SP1 may be provided, and the intersection NP may be disposed between the two first isolation portions SP1. The two first isolation portions SP1 may be spaced apart from each other in the first direction DR1. The second isolation portion SP2 may extend from the intersection NP in the second direction DR2. By way of example, in the separator SPR, at least two second isolation portions SP2 may be provided, and the intersection NP may be disposed between the two second isolation portions SP2. The two second isolation portions SP2 may be spaced apart from each other in the second direction DR2. A width in the second direction DR2 of the intersection NP may be greater than that of the first isolation portion SP1. A width in the first direction DR1 of the intersection NP may be larger than that of the second isolation portion SP2.
Referring to
Each of the fourth portions XT4 may extend in the first direction DR1, and each of the fifth portions XT5 may extend in the second direction DR2 intersecting the first direction DR1. For example, in the second isolation portion SP2, two fourth portions XT4 and one fifth portion XT5 may constitute a U shape (or an inverted U). In the second isolation portion SP2, the fourth portion XT4 and the fifth portion XT5 may respectively extend in directions that intersect each other. Thus, the second isolation portion SP2 may include a bent portion BEA-b composed of a portion of the fourth portion XT4 and a portion of the fifth portion XT5. As the second isolation portion SP2 may include the bent portion BEA-b, each of the first and second angles θ1 and θ2 of the separator SPR including the second isolation portion SP2 may increase. As each of the first and second angles θ1 and θ2 increases, the isolation ability of the separator SPR may be improved.
The second isolation portion SP2-a as shown in
Referring to
A second opening S2_OH may be defined in the second isolation portion SP2-a. In the second isolation portion SP2-a, two fourth portions XT4 adjacent to each other, one fifth portion XT5 disposed between the two adjacent fourth portions XT4, and one sixth portion XT6 disposed between the two adjacent fourth portions XT4 may define the second opening S2_OH. The fourth portion XT4 and the fifth and sixth portions XT5 and XT6 respectively extending in directions intersecting each other may constitute a quadrangular shape. Accordingly, in a plan view, the second opening S2_OH may be defined as a square shape.
The edge EP_EG of the second emitting part EP2 may correspond to an edge of the pixel defining film PDL in which the light-emitting opening OP-PDL (
In
The intersection NP including the edge NP_EG having a curvature may have a larger width than that of each of the first and second isolation portions SP1 and SP2. A first width WN1 in the second direction DR2 of the intersection NP may be greater than a width WS1 in the second direction DR2 of the first isolation portion SP1. A second width WN2 in the first direction DR1 of the intersection NP may be greater than a width WS2 in the first direction DR1 of the second isolation portion SP2. Each of the width WS1 of the first isolation portion SP1 and the width WS2 of the second isolation portion SP2 may be uniform. A contact area of the intersection NP having a larger width than that of each of the first and second isolation portions SP1 and SP2 may be increased, such that loss thereof may be prevented. Accordingly, the isolation ability of the separator SPR including the intersection NP may be improved.
The intersection NP may have a non-uniform width. The intersection NP may have a width that decreases as the intersection NP extends toward the first isolation portion SP1. The intersection NP may have a width that decreases as the intersection NP extends toward the second isolation portion SP2. Further, a maximum width in the first direction DR1 of the intersection NP may be greater than a maximum width in the second direction DR2 of the intersection NP. However, an embodiment is not limited thereto, and the maximum width in the first direction DR1 of the intersection NP may be smaller than the maximum width in the second direction DR2 of the intersection NP.
Referring back to
Referring to
Referring to
A quadrangular third opening N_OH may be defined in the intersection NPa. The intersection NPa may include four inner edges NI_G defining the third opening N_OH. Two inner edges NI_G among the four inner edges NI_G may extend in a parallel manner to the second direction DR2, and the remaining two inner edges NI_G thereof may extend in a parallel manner to the first direction DR1.
An inner edge NI_G further away from the outer edge NO_G among the two inner edges NI_G extending in the second direction DR2 may be in a line with to an edge of the second isolation portion SP2. An inner edge NI_G further away from the outer edge NO_G among the two inner edges NI_G extending in the first direction DR1 may be in a line to an edge of the first isolation portion SP1. However, an embodiment is not limited thereto, and the inner edge NI_G may be not in a line with the edge of each of the first and second isolation portions SP1 and SP2.
Third openings N_OH may be defined in the intersection NPa.
The display panel of an embodiment may include a first light emitting unit and a second light emitting unit spaced apart from each other. Each of the first light emitting unit and the second light emitting unit may include an separator and at least one emitting part. The separator may include a first isolation portion, and the first isolation portion may include first portions spaced apart from each other and second portions, wherein each of the second portions may be disposed between adjacent ones of the first portions. Each of the second portions may be bent from each of the first portions. Further, the separator may include an intersection disposed between at least two first isolation portions. In one direction or in a direction, the intersection may have a larger width than that of the first isolation portion. Accordingly, the display panel including the separator may have improved isolation ability of the cathodes of the first and second light emitting units from each other.
A display panel of an embodiment may have a bent portion or an separator having an increased contact area and thus may have improved isolation ability of electrodes from each other.
The above description is an example of technical features of the disclosure, and those skilled in the art to which the disclosure pertains will be able to make various modifications and variations. Thus, the embodiments of the disclosure described above may be implemented separately or in combination with each other.
The embodiments disclosed in the disclosure are intended not to limit the technical spirit of the disclosure but to describe the technical spirit of the disclosure, and the scope of the technical spirit of the disclosure is not limited by these embodiments. The protection scope of the disclosure should be interpreted by the following claims, and it should be interpreted that all technical spirits within the equivalent scope are included in the scope of the disclosure.
Number | Date | Country | Kind |
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10-2022-0137499 | Oct 2022 | KR | national |