Patent Application
20170069700
This application claims the priority to Chinese Patent Application No. 201510564816.1 filed on Sep 7, 2015, the disclosure of which is incorporated in their entirety by reference herein.
The present disclosure relates to the field of display technologies, and in particular, to a display substrate and a method for manufacturing the same, and a display device.
At present, in an Active Matrix Organic Light Emitting Diode (AMOLED) display apparatus, the structure of the array substrate thereof is as shown in
In the prior art, the planarization layer 7 usually employs an organic material, for example, an organic resin. The processing technique for an organic material is simple, and a planar surface may be provided. The inorganic insulating layer 6 usually employs a material of SiOx or SiNx, wherein SiOx or SiNx may generate a hydrogen bond by reacting with an organic material, thus the adsorptivity may be increased. However, the adsorptivity of the organic material and the transparent conducting material is poor, and it tends to cause the planarization layer 7 and the anode 9 to depart from each other.
The present disclosure provides a display substrate and a method for manufacturing the same, thereby solving the problem that the adsorptivity of the planarization layer and the transparent conducting layer on a display substrate is poor and it tends to cause the planarization layer and the transparent conducting layer to depart from each other.
The present disclosure further provides a display device, which employs the above display substrate to improve the yield and quality of the products.
In order to solve the above technical problems, one embodiment of the present disclosure provides a display substrate, which includes a planarization layer that is configured for providing a planar surface, wherein the material of the planarization layer includes organosilicon, and the organosilicon adheres the planarization layer to an organic material film and an inorganic material film.
In one example, the display substrate further includes an inorganic insulating layer and a conducting layer, the planarization layer covers the inorganic insulating layer, and the conducting layer is arranged on the planarization layer.
In one example, the material of the inorganic insulating layer includes silicon nitride or silicon oxide.
In one example, the organosilicon is manufactured by dissolving a silicone gel in an aliphatic or aromatic alkane or an aliphatic or aromatic haloalkane.
In one example, the organosilicon is manufactured by a hydrolytic polymerization reaction of tetraethyl orthosilicate and H2O.
In one example, the display substrate is an active matrix organic light-emitting diode array substrate, which includes:
One embodiment of the present disclosure further provides a method for manufacturing a display substrate, which includes a step of forming a planarization layer, wherein the planarization layer is configured for providing a planar surface, and the step of forming the planarization layer includes:
In one example, the manufacture method further includes:
During the step of forming the planarization layer, the planarization layer is formed on the inorganic insulating layer.
The manufacture method further includes:
In one example, the material of the inorganic insulating layer includes silicon nitride or silicon oxide.
In one example, the step of preparing the organosilicon which is used for forming the planarization layer includes:
In one example, the step of forming the organosilicon film via the film-forming process includes:
In one example, the step of preparing the organosilicon which is used for forming the planarization layer includes:
In one example, the step of carrying out a hydrolytic polymerization reaction of tetraethyl orthosilicate and H2O includes:
In one example, the step of forming the organosilicon film via the film-forming process includes:
One embodiment of the present disclosure further provides a display device, which includes the above display substrate.
The above technical solutions of the present disclosure have the following beneficial effects.
In the above technical solutions, the planarization layer of the display substrate is made of a material including organosilicon, and because organosilicon has the performance of both an organic material and an inorganic material, the adhesivity of the planarization layer to the organic material film and the inorganic material film can be increased, and the planarization layer may be prevented from departing from the interface with an adjacent film, thereby it may guarantee the performance of the display substrate, and the product quality may be improved.
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure or the prior art, the drawings required in the description of the embodiments or the prior art will be briefly introduced below. Apparently, the drawings in the description below only show some embodiments of the present disclosure, and other drawings may also be obtained by one of ordinary skills in the art based on these drawings without creative work.
The present disclosure provides a display substrate, which includes a planarization layer for providing a planar surface, the material of the planarization layer includes organosilicon, and because organosilicon has the performance of both an organic material and an inorganic material, the planarization layer has good adhesivity with an organic material film and an inorganic material film, and the planarization layer may be prevented from peeling off from an adjacent film, thereby the performance of the display substrate may be guaranteed, and the product quality may be improved.
Organosilicon is an organosilicon compound, which refers to a compound that contains a Si—C bond and in which at least one organic group is directly connected with a silicon atom. Conventionally, a compound in which an organic group is connected with a silicon atom via oxygen, sulfur, nitrogen and the like is also regarded as an organosilicon compound. Polysiloxanes that take a silicon-oxygen bond (—Si—O—Si—) as the backbone are organosilicon compounds that are most popular, most deeply researched and most widely applied, and occupy over about 90% of the total amount used. Organosilicon materials have a unique structure:
Because organosilicon has a unique structure, it has the performances of both an inorganic material and an organic material; it has the basic properties of low surface tension, small viscosity-temperature coefficient, high compressibility and high gas permeability, etc., moreover, it has the excellent features of high-low temperature resistance, electrical insulation, oxidation-resistant stability, weathering resistance, flame resistance, hydrophobicity, corrosion resistance, nontoxicity and smellessness and physiological inertia, etc.
Moreover, organosilicon has a good film-forming feature, thus the film-forming quality of the planarization layer can be guaranteed.
Materials in the prior art that have the performances of both an organic material and an inorganic material are not limited to organosilicon, other materials that are easy for film forming and have the performances of both an organic material and an inorganic material may be readily thought of and selected by one skilled in the art based on the inventive concept of the present disclosure, for replacing organosilicon and implementing the technical solutions of the present disclosure, which also pertain to the protection scope of the present disclosure.
The specific implementation of the present disclosure will be further described in detail in conjunction with the drawings and embodiments. The embodiments below are only used for illustrating the present disclosure, rather than limiting the scope of the present disclosure.
Referring to
A planarization layer 7 is covered on the inorganic insulating layer 6 for providing a planar surface. A conducting layer 9 is arranged on the planarization layer 7. The material of the conducting layer 9 includes an inorganic material such as metal, metal alloy or metal oxide, etc.
In one embodiment, the material of the planarization layer 7 is organosilicon. Because organosilicon has the performance of both an organic material and an inorganic material, the planarization layer 7 has good adhesivity with both the inorganic insulating layer 6 and the conducting layer 9, so that the planarization layer 7 may be prevented from peeling off from the inorganic insulating layer 6 and the conducting layer 9, thereby the performance of the display substrate may be guaranteed.
When the inorganic insulating layer 6 is replaced by an organic insulating layer, the planarization layer 7 also has good adhesivity with the organic insulating layer and the conducting layer 9, so that the planarization layer 7 may be prevented from peeling off from the organic insulating layer and the conducting layer 9, thereby the performance of the display substrate may be guaranteed.
In the technical solution of the present disclosure, it is configured that the material of the planarization layer includes organosilicon which has the performance of both an organic material and an inorganic material, so that the planarization layer has good adhesivity with both the organic material film and the inorganic material film, the planarization layer may be prevented from peeling off from an adjacent film, thereby the performance of the display substrate may be guaranteed, and the product quality may be improved.
In one embodiment, the organosilicon may be manufactured by dissolving a silicone gel in an aliphatic or aromatic alkane or an aliphatic or aromatic haloalkane. Or, it may be manufactured by carrying out a hydrolytic polymerization reaction of tetraethyl orthosilicate and H2O. An exemplary manufacture process will be introduced below. It should be noted that the manufacture method of the organosilicon is not limited to the above two methods, and it will not be listed one by one here.
An active matrix light emitting diode array substrate is taken as an example, and the display substrate according to one embodiment of the present disclosure may include:
In the case of an active matrix light emitting diode array substrate, in order to simplify the manufacture process, the organic luminescent layers 11 in all the pixel regions are formed simultaneously via a one-time process, and the organic luminescent layers 11 will emit lights of the same color.
Moreover, in order to realize color display, the active matrix light emitting diode display panel is configured to further include a color filter substrate. As shown in
The active matrix light emitting diode display panel manufactured according to the technical solution of the present disclosure has the following advantages: because the planarization layer 7 has good adhesivity with both an organic material film and an inorganic material film, the planarization layer 7 will not be peeled off from the inorganic insulating layer 6, so that the inorganic insulating layer 6 can function to resist moisture, filth and other atmosphere constituents. The planarization layer 7 has good adhesivity with the conducting layer 9, thus good electrical performance and long-term stability of the conducting layer 9 can be guaranteed. At the same time, good adhesivity between layers can also alleviate the mechanical stress and tension caused by a mechanical and thermal impact and shock.
One embodiment of the present disclosure further provides a method for manufacturing a display substrate, which includes a step of forming a planarization layer, wherein the planarization layer is configured for providing a planar surface. The above step of forming the planarization layer includes:
In the above step, the organosilicon film may be cured by heating or under normal temperature.
When the display substrate includes a semiconductor element, the manufacture method further includes:
In the step of forming the planarization layer, the planarization layer is formed on the inorganic insulating layer.
The above manufacture method further includes:
The adjacent films of the planarization layer formed by the above steps include an inorganic insulating layer and a conducting layer, and because the material of the planarization layer, i.e., organosilicon, has the performance of both an organic material and an inorganic material, the planarization layer has good adhesivity with both the inorganic insulating layer and the conducting layer, so that the planarization layer may be prevented from peeling off from the inorganic insulating layer and the conducting layer, thereby the performance of the display substrate may be guaranteed, and the product quality may be improved.
Similarly, when the inorganic insulating layer is replaced by an organic insulating layer, it can also prevent the planarization layer from peeling off from the organic insulating layer and the conducting layer.
The preparation process of the organosilicon is very important. If good film-forming performance of the organosilicon can be guaranteed, the film-forming quality of the planarization layer will be guaranteed.
In one exemplary implementation mode, the organosilicon which is used for forming the planarization layer is manufactured by dissolving a silicone gel in an aliphatic or aromatic alkane or an aliphatic or aromatic haloalkane. Then, the step of preparing the organosilicon includes:
For example, an organosilicon film may be formed via a blade-coating film-forming process.
An exemplary process of the above blade-coating film-forming process may be as follows: the shape of the display substrate is configured as a rectangle, the film-forming equipment has a long strip-shaped nozzle, the nozzle is placed above the long side of the display substrate and is configured to be parallel to the long side of the rectangle, then the nozzle is driven to scan along the broad side of the rectangle at a uniform speed so as to spray the organosilicon on the whole display substrate, thereby an organosilicon film is formed.
In another exemplary implementation mode, the organosilicon which is used for forming the planarization layer is manufactured by carrying out a hydrolytic polymerization reaction of tetraethyl orthosilicate and H2O. Then, the step of preparing the organosilicon includes:
For example, an organosilicon film with a certain thickness may be formed via a whirl-coating film-forming process, and then the organosilicon film is subjected to heat treatment. The above step is repeated until a required thickness of the organosilicon film is obtained.
In the above hydrolytic polymerization reaction, the reaction equation of tetraethyl orthosilicate and H2O is:
nSi(OR)4+(2n−1.5)H2O=(RO)3—Si—O(—Si—O)n−2—Si—OH+(4n−3)HOR
For example, the step of carrying out the hydrolytic polymerization reaction of tetraethyl orthosilicate and H2O includes:
In one embodiment, during the hydrolytic polymerization reaction of tetraethyl orthosilicate and H2O, H2O and tetraethyl orthosilicate are of equal amount of substance. The volume of the aqueous solution of polyvinyl alcohol is 10-15 ml, and the mass percentage of polyvinyl alcohol is about 5%.
In a practical preparation process, the above secondary hydrolytic polymerization reaction is generally performed for 60 min, and then the reaction solution is filtered by slow-speed filter paper, thus an organosilicon polymer solution may be obtained.
After the organosilicon polymer solution is prepared, for example, a film-forming process is carried out of the organosilicon polymer solution via a whirl coater at a speed of 1800-2200 r/min for 20 s-40 s in a super clean room, then a heat treatment is carried out at 340-360° C. for 30-35 min and the heating rate is kept at 2-5° C./min. The above operation is repeated until the organosilicon film reaches the required thickness. Finally, the organosilicon film is subjected to heat treatment at a certain temperature for 30-35 min.
One embodiment of the present disclosure further provides a display device, which includes the display substrate according to the embodiments of the present disclosure. The planarization layer of the above display substrate can have good adhesivity with adjacent organic material film and inorganic material film, and it will not peel off, so that the performance of the display substrate may be guaranteed, and the quality of the display apparatus may be improved.
The display device may include liquid crystal display device, organic light-emitting diode display device, touch display device or other display devices. For example, the display device may include any product or component that has a display function, for example, display panel, electronic paper, OLED panel, mobile phone, tablet computer, TV set, display, notebook computer, digital photo frame and navigator, etc.
The above description only shows some preferred embodiments of the present disclosure. It should be noted that, various improvements and substitutions may also be made by one of ordinary skills in the art without departing from the technical principles of the present disclosure, and all these improvements and substitutions should be regarded as falling into the protection scope of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201510564816.1 | Sep 2015 | CN | national |
