Patent Application
20240153968
The present disclosure relates to the technical field of display, and more particularly to a display substrate, a method for manufacturing the same and a display device.
In a desktop display product with touch function, due to a touch-control module added onto the display module, a parasitic capacitance is generated between touch-control wirings and signal lines of the display module, which may aggravate an adverse phenomenon like stains. Therefore, an organic film layer needs to be introduced between the display module and the touch-control module, so as to reduce the parasitic capacitance between the touch-control wirings and the signal lines.
The technical problem to be solved by the present disclosure is to provide a display substrate, a method for manufacturing the same, and a display device, which can prevent abnormal display of pictures.
In order to solve the above technical problem, the embodiments of the present disclosure provide the following technical solutions.
In an aspect, a display substrate is provided, including a base substrate including a display region and a peripheral region surrounding the display region, wherein the display substrate includes:
In some embodiments, the display substrate further includes:
In some embodiments, a first orthographic projection of the first portion on the base substrate is located within the orthographic projection of the groove on the base substrate, a second orthographic projection of the second portion on the base substrate is located outside the orthographic projection of the groove on the base substrate, and a ratio of area of the first orthographic projection to the second orthographic projection ranges from 6:1 to 1:1.
In some embodiments, an extending direction of the first connection line is parallel with an extending direction of the first signal line.
In some embodiments, a distance between adjacent first connection lines is 10-15 um.
In some embodiments, the second connection line includes a hollowed-out region, and an extending direction of the hollowed-out region is parallel to an extending direction of the second connection line.
In some embodiments, the second connection line includes a third portion and a fourth portion, a third orthographic projection of the third portion on the base substrate is located within the orthographic projection of the first connection line on the base substrate, a fourth orthographic projection of the fourth portion on the base substrate is located outside the orthographic projection of the first connection line on the base substrate, and the ratio of area of the third orthographic projection to the fourth orthographic projection ranges from 1:20 to 1:25.
In some embodiments, the second connection line includes a fifth portion and a sixth portion, a fifth orthographic projection of the fifth portion on the base substrate is located within an orthographic projection of the via hole on the base substrate, a sixth orthographic projection of the sixth portion on the base substrate is located outside the orthographic projection of the via hole on the base substrate, and a ratio of area of the fifth orthographic projection to the sixth orthographic projection ranges from 1:20 to 1:25.
In some embodiments, the second connection line includes a seventh portion and an eighth portion, the seventh portion connects the first connection line to the first signal line, the eighth portion connects the first connection line to the second signal line, the seventh portion extends in a direction parallel to the first signal line, the eighth portion is L-shaped, and the eighth portion includes a first sub-portion parallel to the first signal line and a second sub-portion parallel to the second signal line.
In some embodiments, the via hole is a rectangular via hole with a side length of 6-8 um.
In some embodiments, the preset threshold is 2 um.
In some embodiments, the connection wiring is made of a transparent conductive material.
In some embodiments, the second connection line is in the same layer and made of the same material as a pixel electrode of the display substrate; and/or,
In some embodiments,
An embodiment of the present disclosure further provides a display device including the display substrate described above.
An embodiment of the present disclosure further provides a method for manufacturing a display substrate, the display substrate including a base substrate including a display region and a peripheral region surrounding the display region, the method including:
In some embodiments, the method further includes:
The embodiments of present disclosure has the following beneficial effects.
In the above-mentioned solution, the first signal line and the second signal line are connected via the first connection line, and the first connection line does not have a hollowed-out region. When the first connection line is formed, the photoresist on the conductive film layer forming the first connection line can be overexposed to form the first connection line, so as to prevent the residual conductive film layer in the groove, and further to prevent the residual conductive film layer from shorting different signal lines together, thereby preventing picture abnormality and ensuring the yield of the display product.
In order that the technical problems, technical solutions, and advantages to be solved by the embodiments of the present disclosure will become more apparent, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.
When an organic film layer is introduced between a display module and a touch control module, a clock signal line at the periphery of a gate driving circuit (GOA) area 02 may be shorted. Since the organic film layer has water absorption, in order to prevent external water vapor from invading into the interior of the display product, as shown in
The embodiments of the present disclosure provide a display substrate, a method for manufacturing the same, and a display device, which can prevent abnormal display of pictures.
An embodiment of the present disclosure provides a display substrate, including a base substrate including a display region and a peripheral region surrounding the display region, wherein the display substrate includes:
In this embodiment, the first signal line and the second signal line are connected via the first connection line, and the first connection line does not have a hollowed-out region. When the first connection line is formed, the photoresist on the conductive film layer forming the first connection line can be overexposed to form the first connection line, so as to prevent residual conductive film layer in the groove, and further to prevent the residual conductive film layer from shorting different signal lines together, thereby preventing abnormal display of pictures and ensuring the yield of the display product.
The first insulating layer may be an organic film layer located between the display module and the touch control module. In order to reduce the parasitic capacitance between the touch control wiring and the signal line, the thickness of the organic film layer is relatively large, for example greater than 2.5 um, and the depth of the groove is relatively large, generally greater than 2 um. When making a first connection line, the first conductive layer is formed on the side of the first insulating layer away from the base substrate, and the photoresist pattern is formed on the first conductive layer. In order to prevent the residual first conductive layer at the bottom of the groove, the photoresist pattern for forming the first connection line on the first conductive layer is overexposed, so as to ensure that the photoresist at the bottom of the groove can be fully exposed. Then, the first conductive layer is etched to form the first connection line, so as to prevent the residual first conductive layer at the bottom of the groove.
In some embodiments, The display substrate further includes:
In this embodiment, the first signal line, the second signal line and the first connection line are located in different film layers, and the first signal line, the second signal line and the first connection line are connected via the second connection line, wherein the second insulating layer may be an inorganic insulating layer, the thickness of the second insulating layer is relatively small and less than the thickness of the first insulating layer, the depth of the via hole for connecting the first connection line and the second connection line is less than the depth of the groove, and the second conductive layer forming the second connection line may not remain in the via hole.
To prevent affecting the transmission of the display substrate, the connection wiring may be made of a transparent conductive material, such as ITO, IZO, etc. In order to prevent increasing the number of patterning processes of the display substrate, the first connection line and the second connection line may be arranged in the same layer and made of the same material as the original film layer of the display substrate. For example, the second connection line is in the same layer and made of the same material as the pixel electrode of the display substrate, and thus the second connection line and the pixel electrode of the display substrate may be formed by one patterning process; the first connection line is in the same layer and made of the same material as the common electrode of the display substrate, so that the first connection line and the common electrode of the display substrate may be formed by one patterning process.
In this embodiment, the first signal line and the second signal line may be any signal lines to be connected on the display substrate, and in some embodiments, the first signal line may be a clock signal line of a gate driving unit; the second signal line may be a signal line of a sector region.
In a particular example, in the position shown by a dotted line box in
In this embodiment, the peripheral region of the display substrate is provided with a plurality of clock signal lines 07 arranged in parallel and spaced apart from each other, the widths of adjacent clock signal lines 07 may be the same or different from each other, and the spacing between adjacent clock signal lines 07 may be the same or different.
The via holes (including the via holes 161, 162, 163 and 164) may be an elliptical via hole, a circular via hole or a rectangular via hole. When the via hole is an elliptical via hole, the cross section of the via hole in the direction parallel to the base substrate (the cross section on the XY plane) is elliptical. When the via hole is a circular via hole, the cross section of the via hole in the direction parallel to the base substrate (the cross section on the XY plane) is circular. When the via hole is a rectangular via hole, the cross section of the via hole in the direction parallel to the base substrate (the cross section on the XY plane) is rectangular. In some embodiments, the via hole may be a rectangular via hole, and the side length of the rectangle may be 6-8 um.
As shown in
In some exemplary embodiments, as shown in
A second insulating layer 13 is formed on a side of the first connection line 15 away from the base substrate, and the second insulating layer 13 may be a passivation layer, and the thickness may be less than 1 um; a second connection line 17 is formed on a side of the second insulating layer 13 away from the base substrate, and the second connection line 17 may be made by the second transparent conductive layer of the display substrate. As shown in
If the second connection line 17 is directly formed by the second transparent conductive layer to connect the clock signal line 07 and the signal line 09, in order to prevent the residual second transparent conductive layer in the groove, when the second connection line is formed, the photoresist for forming the second connection line on the second transparent conductive layer needs to be overexposed to form the second connection line. However, as shown in
In order to prevent crosstalk between adjacent first connection lines, the distance between adjacent first connection lines is 10-15 um.
In this embodiment, as shown in
In some exemplary embodiments, as shown in
In some exemplary embodiments, as shown in
An embodiment of the present disclosure further provides a display device including the display substrate described above.
The display device includes, but is not limited to: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, a power supply, etc. It will be appreciated by those skilled in the art that the configuration of the display device described above is not intended to be limiting and that the display device may include more or fewer of the components described above, or some combinations of the components, or different arrangements of the components. In embodiments of the present disclosure, the display device includes, but is not limited to, a display, a cell phone, a tablet, a television, a wearable electronic device, a navigation display device, etc.
The display device may be: any product or component with a display function, such as a television, a display, a digital photo frame, a mobile phone, a tablet computer, and among others, the display device further includes a flexible circuit board, a printed circuit board and a back panel.
An embodiment of the present disclosure further provides a method for manufacturing a display substrate, including the following steps:
In this embodiment, the first signal line and the second signal line are connected via the first connection line, and the first connection line does not have a hollowed-out region. When the first connection line is formed, the photoresist on the conductive film layer forming the first connection line can be overexposed to form the first connection line, so as to prevent the residual conductive film layer in the groove, and further to prevent the residual conductive film layer from shorting different signal lines together, thereby preventing abnormal display of pictures and ensuring the yield of the display product.
The first insulating layer may be an organic film layer located between the display module and the touch control module. In order to reduce the parasitic capacitance between the touch control wirings and the signal lines, the thickness of the organic film layer is generally relatively large, for example greater than 2.5 um, and the depth of the groove is relatively large, generally greater than 2 um. When making a first connection line, the first conductive layer is formed on the side of the first insulating layer away from the base substrate, and the photoresist pattern is formed on the first conductive layer. In order to prevent the residual first conductive layer at the bottom of the groove, the photoresist pattern for forming the first connection line on the first conductive layer is overexposed, so as to ensure that the photoresist at the bottom of the groove can be fully exposed. Then, the first conductive layer is etched to form the first connection line, so as to prevent the residual first conductive layer at the bottom of the groove.
In some embodiments, the method further includes:
In this embodiment, the first signal line, the second signal line and the first connection line are located in different film layers, and the first signal line, the second signal line and the first connection line are connected via the second connection line, wherein the second insulating layer may be an inorganic insulating layer, the thickness of the second insulating layer is relatively small and less than the thickness of the first insulating layer, the depth of the via hole for connecting the first connection line and the second connection line is less than the depth of the groove, and the second conductive layer forming the second connection line may not remain in the via hole.
To prevent affecting the transmission of the display substrate, the connection wiring may be made of a transparent conductive material, such as ITO, IZO, etc. In order to prevent increasing the number of patterning processes of the display substrate, the first connection line and the second connection line may be arranged in the same layer and made of the same material as the original film layer of the display substrate. For example, the second connection line is in the same layer and made of the same material as the pixel electrode of the display substrate, and thus the second connection line and the pixel electrode of the display substrate may be formed by one patterning process; the first connection line is in the same layer and made of the same material as the common electrode of the display substrate, so that the first connection line and the common electrode of the display substrate may be formed by one patterning process.
In this embodiment, the first signal line and the second signal line may be any signal lines to be connected on the display substrate, and in some embodiments, the first signal line may be a clock signal line of a gate driving unit; the second signal line may be a signal line of a sector region.
In a particular example, as shown in
Specifically, a first transparent conductive layer may be formed on the display substrate after Step 1 is completed, wherein the first transparent conductive layer may be made of ITO, IZO or other transparent metal oxides. Then, a layer of photoresist is coated on the first transparent conductive layer, and a mask plate is used to expose the photoresist so that the photoresist forms a photoresist unreserved region and a photoresist reserved region, wherein the photoresist reserved region corresponds to a region where the first connection line 15 is located, and the photoresist unreserved region corresponds to a region outside the above-mentioned pattern. Developing treatment is performed, and the photoresist in the photoresist unreserved region is completely removed, while the photoresist thickness in the photoresist reserved region remains unchanged. The first transparent conductive layer is etched with the photoresist as a mask to form a first connection line 15. When the photoresist is exposed, the exposure amount is increased, and the first transparent conductive layer is prevented from being remained at the bottom of the groove by overexposure.
Specifically, magnetron sputtering, thermal evaporation, PECVD or other film-forming methods may be used to deposit a passivation layer with a thickness of 2000-1000 Å as the second insulating layer 13 on the display substrate after step 2 is completed. The passivation layer may be made of a material selected from oxides, nitrides or oxynitride compounds. Specifically, the material of the passivation layer may be SiNx, SiOx or Si(ON)x; and Al2O3 may also be used as the passivation layer. The passivation layer may be of single layer structure or two-layer structure composed of silicon nitride and silicon oxide. The reaction gas corresponding to the oxides of silicon may be SiH4, and N2O; the gas corresponding to nitrides or oxynitrides may be SiH4, NH3, N2 or SiH2Cl2, and NH3, N2. The pattern of the passivation layer including the via hole is formed through one patterning process, and the via hole exposes the first connection line 15.
Specifically, a second transparent conductive layer with a thickness of 300 to 1500 Å may be deposited on the display substrate through sputtering or thermal evaporation after Step 3 is completed, wherein the second transparent conductive layer may be made of ITO, IZO or other transparent metal oxides. Then, a layer of photoresist is coated on the second transparent conductive layer, and a mask plate is used to expose the photoresist so that the photoresist forms a photoresist unreserved region and a photoresist reserved region, wherein the photoresist reserved region corresponds to a region where the pattern of the second connection line 17 is located, and the photoresist unreserved region corresponds to a region outside the above-mentioned pattern. Developing treatment is performed, and the photoresist in the photoresist unreserved region is completely removed, while the photoresist thickness in the photoresist reserved region remains unchanged. The transparent conductive layer film in the area where the photoresist does not reserved is completely etched away by an etching process, and the remained photoresist is stripped to form the second connection line 17, and the second connection line 17 is connected to the first connection line 15 via the via holes 161 and 162.
In this embodiment, the first connection line 15 and the second connection line 17 constitute the connection wiring connecting the signal line 09 and the clock signal line 07. As the first connection line 15 is a complete conductive pattern, which does not include a hollowed-out region, so that when forming the first connection line, the photoresist for forming the first connection line on the first transparent conductive layer may be exposed to form the first connection line without breaking the first connection line, so as to prevent the residual first transparent conductive layer in the groove, resulting in a short circuit of the signal lines.
In this embodiment, the peripheral region of the display substrate is provided with a plurality of clock signal lines 07 arranged in parallel and spaced apart from each other, the widths of adjacent clock signal lines 07 may be the same or different from each other, and the spacing between adjacent clock signal lines 07 may be the same or different.
The via holes (including the via holes 161, 162, 163 and 164) may be an elliptical via hole, a circular via hole or a rectangular via hole. When the via hole is an elliptical via hole, the cross section of the via hole in the direction parallel to the base substrate (the cross section on the XY plane) is elliptical. When the via hole is a circular via hole, the cross section of the via hole in the direction parallel to the base substrate (the cross section on the XY plane) is circular. When the via hole is a rectangular via hole, the cross section of the via hole in the direction parallel to the base substrate (the cross section on the XY plane) is rectangular. In some embodiments, the via hole may be a rectangular via hole, and the side length of the rectangle may be 6-8 um.
It should be noted that the various embodiments described herein are described in a progressive manner with reference to the same or similar parts throughout the various embodiments, with each embodiment focusing on differences from the other embodiments. In particular, the embodiments are described more simply because they are substantially similar to the product embodiments, with reference to the partial description of the product embodiments.
Unless defined otherwise, technical or scientific terms used in this disclosure shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms “first”, “second”, and the like as use herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The terms “comprising” or “comprises”, and the like, means that the presence of an element or item preceding the word covers the presence of the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms “connecting” or “connected” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms “upper”, “lower”, “left”, “right” and the like are used only to indicate relative positional relationships that may change accordingly when the absolute position of the object being described changes.
It will be understood that when an element such as a layer, film, region or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “directly under” the other element or intervening elements may be present.
In the description of the embodiments above, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
While the present disclosure has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the disclosure. Accordingly, the protection sought herein is as set forth in the claims below.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2022/073778 | 1/25/2022 | WO |
