The disclosure relates to a distance sensing apparatus.
With the development of optoelectronic technology, various photoelectric sensors have been developed, including LiDAR sensors, time-of-flight ranging sensors, or image sensors. Referring to
The width and position of the opening H1 may affect the sensing accuracy, so the opening H1 is required to be aligned with the sensing element 111. In addition, a blocking wall 103 is required to be configured in the encapsulation structure 104 to prevent a beam 1021 (an internal beam) emitted by the light source 102 from being transmitted to the sensing element 111 in the encapsulation structure 104, resulting in interference and degradation of product performance.
The disclosure provides a distance sensing apparatus, which prevents sensing accuracy from being affected by an opening of an encapsulation structure in a sensing region without configuring a blocking wall in the encapsulation structure.
According to an embodiment of the disclosure, a distance sensing apparatus including a substrate, a light source, a sensing device, and an encapsulation structure is provided. The sensing device includes a sensing element and a light-shielding structure. The light source is disposed in a light source region on the substrate and configured to emit a beam and irradiate an object to be sensed. The sensing device is disposed in a sensing region on the substrate. The light-shielding structure is disposed on the sensing element. The light source and the sensing device are disposed in the encapsulation structure. The encapsulation structure has a first opening corresponding to the sensing region. The light-shielding structure is disposed between the sensing element and the first opening, and the sensing element receives a beam to be sensed reflected from the object to be sensed through the first opening and at least one light-transmitting hole of the light-shielding structure. The light source region is connected to the sensing region in the encapsulation structure.
According to an embodiment of the disclosure, a distance sensing apparatus including a substrate, a light source, a sensing device, and an encapsulation structure is provided. The sensing device includes a sensing element and a microlens layer. The light source is disposed in a light source region on the substrate and configured to emit a beam and irradiate an object to be sensed. The sensing device is disposed in a sensing region on the substrate. The sensing element includes at least one sensing pixel. The microlens layer includes at least one microlens. The at least one microlens is disposed on the sensing element, and a vertical projection of a geometric center of the at least one microlens on the substrate is overlapped with a vertical projection of a geometrical center of the at least one sensing pixel on the substrate. A beam to be sensed reflected from the object to be sensed penetrates the at least one microlens and then is incident to the at least one sensing pixel. The light source and the sensing device are disposed in the encapsulation structure. The encapsulation structure has a first opening corresponding to the sensing region, the first opening is disposed corresponding to the at least one microlens, and a width of the first opening is greater than a field of view of the at least one microlens. The light source region is connected to the sensing region in the encapsulation structure.
In summary, the distance sensing apparatus provided by the embodiments of the disclosure includes a light-shielding structure or a microlens. The light-shielding structure or the microlens is used to limit the incident angle of a beam to be sensed which is transmitted to a sensing element to prevent the beam emitted by the light source from being transmitted inside the encapsulation structure and affecting the sensing accuracy. With the distance sensing apparatus provided by the embodiments of the disclosure, the sensing accuracy is prevented from being affected by the opening of the encapsulation structure in the sensing region without configuring a blocking wall in the encapsulation structure.
In order to make the features and advantages of the disclosure comprehensible, embodiments accompanied with drawings are described in detail below.
Referring to
The light-shielding structure 112 is disposed on the sensing element 111. The sensing element 111 has multiple sensing pixels 111S disposed in an array on a plane formed by a second direction D2 and a third direction D3, and the light-shielding structure 112 has the sensing pixels 111S corresponding to multiple light-transmitting holes 112H.
The encapsulation structure 104 has the opening H1 corresponding to the sensing region 100D. The sensing element 111 corresponds to the opening H1. The light-shielding structure 112 is disposed between the sensing element 111 and the opening H1, and the sensing element 111 receives a beam 102B to be sensed reflected from the object to be sensed and passing through the opening H1 and the light-transmitting hole 112H of the light-shielding structure 112.
Compared with the comparative example shown in
In addition, also referring to
In an embodiment of the disclosure, referring to
Referring to
To fully illustrate the various embodiments of the disclosure, other embodiments are provided below for explanation. It should be noted here that the following embodiments adopt the reference numbers and partial contents of the foregoing embodiments, wherein the same reference numbers are used to indicate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the same content will not be iterated in the following embodiments.
Next, referring to
Referring to
What differs a sensing region 400D shown in
Note that the opening H1 is disposed corresponding to the microlens 401P, and the width of the opening H1 is larger than the field of view that the microlens 401P can receive. In such a case, even if the beam 1021 emitted by the light source 102 is reflected on the light shielding plate 104T and transmitted to the sensing region 400D, the beam 1021 may not be incident to the sensing pixel 111S, and thereby the sensing result is prevented from being interfered by the beam 1021.
In the embodiment, the distance sensing apparatus may further include at least one light-obstruction layer 402 disposed between the sensing element 111 and the microlens layer 401L, the light-obstruction layer 402 has at least one light-transmitting hole 402H, and the light-transmitting hole 402H of the light-obstruction layer 402 corresponds to the microlens 401P. In one embodiment, the vertical projection of the geometric center of the microlens 401P on the substrate 101 is overlapped with the vertical projection of the geometric center of the sensing pixel 111S and the vertical projection of the geometric center of the light-transmitting hole 402H.
In summary, the distance sensing apparatus provided by the embodiments of the disclosure includes a light-shielding structure or a microlens. The light-shielding structure or the microlens is used to limit the incident angle of a beam to be sensed which is transmitted to a sensing element, and the width of an opening of an encapsulation structure in the sensing region is further determined according to the size of the light-shielding structure or the optical characteristics of the microlens to prevent the beam emitted by the light source from being transmitted inside the encapsulation structure and affecting the sensing accuracy. With the distance sensing apparatus provided by the embodiments of the disclosure, the sensing accuracy is prevented from being affected by the opening of the encapsulation structure in the sensing region without configuring a blocking wall in the encapsulation structure.
Number | Date | Country | Kind |
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111108354 | Mar 2022 | TW | national |
This application claims the priority benefit of U.S. provisional application Ser. No. 63/176,896, filed on Apr. 20, 2021, and Taiwan application serial no. 111108354, filed on Mar. 8, 2022. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
Number | Date | Country | |
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63176896 | Apr 2021 | US |