The present invention relates to a distributed feedback (DFB) semiconductor laser.
Distributed feedback semiconductor lasers are currently typically used as sources of light for high performance, high speed and long distance transmission of signals on single mode optical fibers in optical communication networks.
DFB lasers comprise various semiconductor layers forming an optical waveguide including an active layer/active layers and they also comprise a grating. The design of the grating is critical to obtain good performance. An important parameter of such lasers is the product κL, where κ is the strength of the Crating and L is the length of the waveguide. A high value of this product will reduce the threshold current and improve the speed of the laser. If integrated arrays of DFB lasers are manufactured, there should be a high yield in the manufacture of the optical array chips. This can be obtained by applying antireflection (AR) coatings on the two facets at the opposite ends of the waveguide of the laser. However, when the optical power emitted by the laser is increased, problems with mode hopping in the laser can occur. This is particularly a problem for lasers having high values of the product κL and/or having both end facets AR coated. The main reason thereof resides in the uneven power distribution inside the laser. There is a small scale varying power distribution caused by the standing wave pattern of light inside the laser. There is also a larger scale variation of power over the length of the waveguide including that the power typically decreases considerably when approaching the opposite end of the waveguide, as taken from a starting point at the center of the laser waveguide. Both the non-uniform small scale power distribution and the large scale power distribution increase the gain for unwanted optical modes of the light generated in the laser.
The uneven large scale power distribution can in more detail be described in the following way. The lower optical power at the opposite ends of the laser waveguide or laser cavity results in a lower rate of stimulated recombination and, owing to electrical resistance in contact layers and to effects associated with carrier transport, in a higher carrier density and hence in a higher gain as compared to the central region of the waveguide. The higher gain at the end regions in turn results in a higher gain also for unwanted optical modes. Another adverse effect comprises that a variation of gain results in a variation of the refractive index and thereby results in a variation of the Bragg-wavelength along the laser waveguide. This in turn reduces the suppression of the unwanted optical modes and increases the linewidth of the laser. A method of reducing these problems involves the use of a “complex coupled” grating designed to give a periodic variation of the gain or loss along the laser waveguide. However, it is difficult to fabricate such complex coupled gratings. They also typically increase both the threshold current and the losses inside the DFB laser.
In U.S. Pat. No. 5,321,716 for Kinoshita et al., assigned to KK Toshiba, a distributed feedback semiconductor laser having a controlled phase shift is disclosed. A doped semiconductor, ohmic contact layer has an electrical resistance which in a central phase shift region can be higher or lower than in the end regions.
It is an object of the invention to provide a DFB having a substantially uniform large scale distribution of gain and power along its waveguide.
Generally thus, in order to avoid the non-uniform large scale distribution of gain and power along the waveguide of a DFB semiconductor laser or other similar device, a varied resistance is used in the laser, the resistance varying in the longitudinal direction of the laser waveguide or cavity. In particular, the resistance is varied in such a way the electrical resistance is higher at the opposite ends of the laser waveguide. The electrical resistance is selected to make the electrical power or gain inside the optical waveguide uniform in the longitudinal direction thereof.
The varying resistance is obtained by a contact layer for conducting electrical current to or from the device. The contact layer can be patterned or given a selected shape as seen from above. The contact layer extends over all of the optical waveguide up to the two opposite ends thereof and can have a substantially uniform thickness. The configuration or pattern in the plane of the electrically conducting layer is selected to give an electric resistance, between a middle connection region of the layer and areas at the optical waveguide, which is higher for those areas located close to the opposite ends than for those areas located at the central region. The configuration or pattern of the contact layer can be substantially triangular or have the shape of a trapezium and can comprise two opposite sides extending from the opposite ends of the waveguide, the opposite sides being concave and/or forming acute angles to the longitudinal direction.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the methods, processes, instrumentalities and combinations particularly pointed out in the appended claims.
While the novel features of the invention are set forth with particularly in the appended claims, a complete understanding of the invention, both as to organization and content, and of the above and other features thereof may be gained from and the invention will be better appreciated from a consideration of the following detailed description of non-limiting embodiments presented hereinbelow with reference to the accompanying drawings, in which:
In the schematic picture in
In another embodiment illustrated by the view from above in
The power distribution inside the laser 1, located beneath the contact layer 11, can be calculated using known methods. The optimal geometry of the contact layer 11 can then be determined from the calculated power distribution, the gain characteristics of the laser and the resistivity of the material of the contact layer. Thus the following steps can be performed:
Lasers having contact layers with a varying width can be produced by only slightly changed standard processes used for fabricating DFB semiconductor lasers, the processes being modified to include a suitable choice of pad metallization and masks having the proper pad geometry.
The modified electrical connection of a contact layer or using a contact layer having a varying, adapted thickness can also be used to compensate for saturation effects in other semiconductor devices having a non-uniform power developed along its length, such as semiconductor modulators. This type of modulators are typically used as modulators integrated with DFB lasers.
While specific embodiments of the invention have been illustrated and described herein, it is realized that numerous additional advantages, modifications and changes will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details, representative devices and illustrated examples shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. It is therefore to be understood that the appended claims are intended to cover all such modifications and changes as fall within a true spirit and scope of the invention.
Number | Date | Country | Kind |
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0004613 | Dec 2000 | SE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/SE01/02767 | 12/13/2001 | WO | 00 | 7/17/2003 |
Publishing Document | Publishing Date | Country | Kind |
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WO02/49173 | 6/20/2002 | WO | A |
Number | Name | Date | Kind |
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4751719 | Mito et al. | Jun 1988 | A |
4932034 | Usami et al. | Jun 1990 | A |
5321716 | Kinoshita et al. | Jun 1994 | A |
5347526 | Suzuki et al. | Sep 1994 | A |
5358898 | Ogita et al. | Oct 1994 | A |
6567446 | Huang et al. | May 2003 | B1 |
Number | Date | Country |
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0332453 | Sep 1989 | EP |
Number | Date | Country | |
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20040076207 A1 | Apr 2004 | US |