This relates generally to electronic devices and, more particularly, to electronic devices with antennas.
Electronic devices are often provided with antennas. Challenges can arise in mounting antennas within an electronic device. For example, factors such as the relative position between an antenna and surrounding device structures and electrical components and factors such as the size and shape of antenna structures can have an impact on antenna tuning and bandwidth. If care is not taken, an antenna may become detuned or may exhibit an undesirably small efficiency bandwidth at desired operating frequencies.
It would therefore be desirable to be able to provide improved antennas for use in electronic devices.
An electronic device may be provided with antenna structures. The antenna structures may be formed using a dielectric carrier structure such as a hollow plastic speaker enclosure, thereby allowing a volume in the interior of the device that is occupied by the speaker enclosure to be used as part of an antenna. A speaker driver may be mounted in the speaker enclosure. Openings in the speaker enclosure may be used to allow sound from the speaker driver to be emitted from the speaker enclosure.
The antenna structures may have first and second loop antenna resonating elements. The loop antenna resonating elements may be formed from metal traces on the speaker enclosure and, if desired, portions of a metal housing for the electronic device.
The first loop antenna resonating element may indirectly feed the second loop antenna resonating element. The second loop antenna resonating element may be formed from a strip of metal that loops around the speaker enclosure. A gap in the metal strip may form a capacitance in the second loop antenna resonating element. An inductance may also be formed in the second loop antenna resonating element. Openings in the second loop antenna resonating element may be aligned with the speaker enclosure openings. Segments of metal between the openings in the second loop antenna resonating element may collectively form the inductance for the second loop antenna resonating element.
The electronic device housing may have openings aligned with the speaker enclosure openings and the openings in the second loop antenna resonating element.
Further features of the invention, its nature and various advantages will be more apparent from the accompanying drawings and the following detailed description of the preferred embodiments.
Electronic devices may include antennas. The antennas may be used to transmit and receive wireless signals. Illustrative electronic devices that may be provided with antennas are shown in
The illustrative configurations for device 10 that are shown in
Housing 12 of device 10, which is sometimes referred to as a case, may be formed of materials such as plastic, glass, ceramics, carbon-fiber composites and other fiber-based composites, metal (e.g., machined aluminum, stainless steel, or other metals), other materials, or a combination of these materials. Device 10 may be formed using a unibody construction in which most or all of housing 12 is formed from a single structural element (e.g., a piece of machined metal or a piece of molded plastic) or may be formed from multiple housing structures (e.g., outer housing structures that have been mounted to internal frame elements or other internal housing structures). In configurations in which housing 12 is formed from metal or other conductive materials, dielectric structures such as plastic structures may be used to form antenna windows that overlap some or all of the antenna structures in device 10. Antenna structures in device 10 may also be configured to transmit and receive radio-frequency antenna signals through display cover layers and other dielectric structures in device 10.
Display 14 may be a touch sensitive display that includes a touch sensor or may be insensitive to touch. Touch sensors for display 14 may be formed from an array of capacitive touch sensor electrodes, a resistive touch array, touch sensor structures based on acoustic touch, optical touch, or force-based touch technologies, or other suitable touch sensor components.
Displays for device 10 may, in general, include image pixels formed from light-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells, electrowetting pixels, electrophoretic pixels, liquid crystal display (LCD) components, or other suitable image pixel structures.
A display cover layer may cover the surface of display 14 or a display layer such as a color filter layer or other portion of a display may be used as the outermost (or nearly outermost) layer in display 14. A display cover layer or other outer display layer may be formed from a transparent glass sheet, a clear plastic layer, or other transparent member.
Touch sensor components such as an array of capacitive touch sensor electrodes formed from transparent materials such as indium tin oxide may be formed on the underside of a display cover layer, may be formed on a separate display layer such as a glass or polymer touch sensor substrate, or may be integrated into other display layers (e.g., substrate layers such as a thin-film transistor layer).
A schematic diagram of an illustrative configuration that may be used for electronic device 10 is shown in
Control circuitry 29 may be used to run software on device 10, such as operating system software and application software. Using this software, control circuitry 29 may present audio information to the user of device 10 using speakers and other audio circuitry, may use antenna structures and radio-frequency transceiver circuitry to transmit and receive wireless signals, and may otherwise control the operation of device 10.
Input-output circuitry 30 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices. Input-output circuitry 30 may include communications circuitry 32. Communications circuitry 32 may include wired communications circuitry for supporting communications using data ports in device 10. Communications circuitry 32 may also include wireless communications circuits (e.g., circuitry for transmitting and receiving wireless radio-frequency signals using antennas).
Input-output circuitry 30 may also include input-output devices 34. A user can control the operation of device 10 by supplying commands through input-output devices 34 and may receive status information and other output from device 10 using the output resources of input-output devices 34.
Input-output devices 34 may include sensors and status indicators 36 such as an ambient light sensor, a proximity sensor, a temperature sensor, a pressure sensor, a magnetic sensor, an accelerometer, and light-emitting diodes and other components for gathering information about the environment in which device 10 is operating and providing information to a user of device 10 about the status of device 10.
Audio components 38 may include speakers and tone generators for presenting sound to a user of device 10 and microphones for gathering user audio input.
Display 14 may be used to present images for a user such as text, video, and still images. Sensors 36 may include a touch sensor array that is formed as one of the layers in display 14.
User input may be gathered using buttons and other input-output components 40 such as touch pad sensors, buttons, joysticks, click wheels, scrolling wheels, touch sensors such as sensors 36 in display 14, key pads, keyboards, vibrators, cameras, and other input-output components.
As shown in
Communications circuitry 32 may include radio-frequency transceiver circuits for handling multiple radio-frequency communications bands. For example, transceiver circuitry 100 may include circuits for handling cellular telephone communications, wireless local area network signals, and satellite navigation system signals such as signals at 1575 MHz from satellites associated with the Global Positioning System. Transceiver circuitry 100 may handle 2.4 GHz and 5 GHz bands for WiFi® (IEEE 802.11) communications and may handle the 2.4 GHz Bluetooth® communications band. Circuitry 100 may include cellular telephone transceiver circuitry for handling wireless communications in cellular telephone bands such as the bands in the range of 700 MHz to 2.7 GHz (as examples).
Communications circuitry 32 can include wireless circuitry for other short-range and long-range wireless links if desired. For example, circuitry 32 may include wireless circuitry for receiving radio and television signals, paging circuits, etc. In WiFi® and Bluetooth® links and other short-range wireless links, wireless signals are typically used to convey data over tens or hundreds of feet. In cellular telephone links and other long-range links, wireless signals are typically used to convey data over thousands of feet or miles.
Communications circuitry 32 may include antenna structures 102. Antenna structures 102 may include one or more antennas. Antenna structures 102 may include inverted-F antennas, patch antennas, loop antennas, monopoles, dipoles, single-band antennas, dual-band antennas, antennas that cover more than two bands, or other suitable antennas. Configurations in which at least one antenna in device 10 is formed using loop antenna structures are sometimes described herein as an example.
To provide antenna structures 102 with the ability to cover communications frequencies of interest, antenna structures 102 may, if desired, be provided with tunable circuitry that is controlled by control circuitry 29. For example, control circuitry 29 may supply control signals to tunable circuitry in antenna structures 102 during operation of device 10 whenever it is desired to tune antenna structures 102 to cover a desired communications band.
Transceiver circuitry 100 may be coupled to antenna structures 102 by signal paths such as signal path 104. Signal path 104 may include one or more transmission lines. As an example, signal path 104 of
Transmission line 104 may be coupled to antenna feed structures associated with antenna structures 102. As an example, antenna structures 102 may form an antenna having an antenna feed with a positive antenna feed terminal such as terminal 110 and a ground antenna feed terminal such as ground antenna feed terminal 112. Positive transmission line conductor 106 may be coupled to positive antenna feed terminal 110 and ground transmission line conductor 108 may be coupled to ground antenna feed terminal 112. Other types of antenna feed arrangements may be used if desired. The illustrative feed configuration of
Antenna structures 102 may be formed from metal traces or other patterned conductive material supported by a dielectric carrier. With one suitable arrangement, antenna structures 102 may be based on loop antenna structures. For example, antenna structures 102 may include a strip of conductive material that is wrapped into a loop. Because the strip of conductive material has an associated width across which material is distributed, loop antenna structures such as these may sometimes be referred to as distributed loop antenna structures. A distributed loop antenna may be fed using a direct feeding arrangement in which feed terminals such as terminals 110 and 112 are coupled directly to the strip of material that forms the loop, may be fed indirectly by using near-field electromagnetic coupling to couple a loop antenna feeding element or other element to the loop that is formed from the strip of material, or may be fed using other suitable feed arrangements.
A schematic diagram of a distributed loop antenna of the type that may be used in electronic devices 10 of
As shown in
Antenna structures 102 of
In the illustrative configuration of
Loop antenna structures 102 may be formed using conductive antenna resonating element structures such as metal traces on a dielectric carrier. The dielectric carrier may be formed from glass, ceramic, plastic, or other dielectric material. As an example, the dielectric carrier may be formed from a plastic support structure. The plastic support structure may, if desired, be formed from a speaker box enclosure that serves as a resonant cavity for a speaker driver.
The conductive structures that form loop antenna structures 102 may include wires, metal foil, conductive traces on printed circuit boards, portions of conductive housing structures such as conductive housing walls and conductive internal frame structures, and other conductive structures.
As shown in
Conductive structures 116 in resonating element loop L2 of antenna structures 102 may include a strip or sheet of conductor that has a first dimension that is wrapped around longitudinal axis 120 and a second dimension (i.e., a width W) that extends along the length of longitudinal axis 120. Conductive structures 116 may wrap around axis 120. During operation, antenna currents can flow within the strip-shaped conductive material of loop L2 around axis 120. In effect, conductive material 116 will form a wide strip of conductor in the shape of a loop that is characterized by a perimeter P. The antenna currents flowing in loop L2 tend to wrap around longitudinal axis 120. When installed within device 10, longitudinal axis 120 of antenna element L2 may extend parallel to an adjacent edge of housing 12 in electronic device 10 (as an example).
It may be desirable to form distributed loop antenna structures 102 from conductive structures that exhibit a relatively small dimension P. In a loop without any break along periphery P, the antenna may resonate at signal frequencies where the signal has a wavelength approximately equal to P. In compact structures with unbroken loop shapes, the frequency of the communications band covered by antenna loop L2 may therefore tend to be high. By incorporating a gap or other capacitance-generating structure into the loop, a capacitance C can be introduced into antenna loop L2. Conductive material 116 may also be configured to form one or more inductor-like paths to introduce inductance L into antenna loop L2. Material 116 may, for example, be configured to produce segments of conductive material 116 within loop L2 that serve as inductance-producing wires. With the presence of capacitance C and inductance L within the perimeter of loop antenna element L2, the resonant frequency of antenna element L2 may be reduced to a desired frequency of operation without enlarging the value of perimeter P.
Dashed curve 122 of
During operation, both elements L1 and L2 contribute to the overall performance of antenna structures 102 represented by curve 126. At lower frequencies such as frequencies in low band LB, antenna resonating element L2 serves at the primary radiating element in structures 102 and antenna resonating element L1 serves as a secondary radiating element in structures 102. At higher frequencies such as frequencies in high band HB, antenna resonating element L1 serves as the primary radiating element in antenna structures 102 and antenna resonating element L2 serves as a secondary radiating element.
A dielectric carrier for antenna structures 102 may be formed from plastic. As an example, a hollow plastic structure may be used to serve as a carrier for antenna structures 102. If desired, a hollow plastic antenna carrier structure may be used to form a speaker enclosure (sometimes referred to as a speaker box). A speaker driver may be mounted within the speaker box to produce sound.
Speaker driver 128 may have electrical terminals such as terminals 134 and 136. Wires such as wires 138 and 140 may be coupled to terminals 134 and 136. For example, wire 138 may be used to couple one of the outputs of audio amplifier 142 to terminal 134 and wire 140 may be used to couple another of the outputs of audio amplifier 142 to terminal 136. During operation, audio amplifier 142 may receive audio signals via input 144 (e.g., from control circuitry 29) and may drive corresponding analog audio signals onto lines 138 and 140. Speaker driver 128 may respond by creating sound that exits driver 128 through port 132.
It may be desirable to insulate conductive portions of speaker driver 128 to help ensure that antenna currents do not flow through speaker driver 128. If speaker driver 128 is not insulated, there is a potential for speaker driver 128 to couple to antenna structures 102, which could adversely affect antenna performance.
As shown in the cross-sectional side view of
If desired, antenna resonating element loop traces 114 may be mounted in a ground cavity (i.e., loop L1 may be mounted in a cavity-backed antenna environment). For example, metal traces may be formed on the sidewalls of carrier 150 to the front, rear, side, and beneath traces 114 (see, e.g., cavity sidewalls 115 of
A gap may be formed between opposing edges 160 and 162 of traces 116 on the upper surface of enclosure 150. The layout of this gap may be configured to produce a desired value for capacitance C (
Traces 116 may form a strip of material of width W that wraps around axis 120 on the surface of enclosure 150. Inductance L may be produced by forming openings 168 in a portion of traces 116 such as portion 116E. Openings 168 may have the shapes of slots or other openings that run parallel to each other, giving rise to narrow metal line segments such as segments 172 through which antenna currents 166 pass. Segments 172 may be relatively long and thin and may therefore serve as inductive elements. Segments 172 may collectively produce inductance L in loop L2.
Enclosure 150 may contain speaker driver 128. To ensure that sound can escape from enclosure 150 when playing audio with speaker driver 128, enclosure 150 may be provided with openings such as speaker enclosure openings 170. Openings 170 may be formed in the shape of circular holes, oval holes, rectangular slots, or openings of other shapes. Enclosure 150 may have walls with a thickness of 0.2 to 2 mm (as an example). Rectangular slot openings 170 may have lengths of 3-4 mm or 1-8 mm and widths of 0.2 to 1 mm (as examples). Segments 172 may have lengths of 3-4 mm or 1-8 mm and widths of 0.2 to 1 mm (as examples). As shown in
In inactive display border region IA, the inner surface of display cover layer 174 may be coated with a layer of black ink or other opaque masking layer 178 to hide internal device structures from view by a user. Antenna structures 102 may be mounted within housing 12 under opaque masking layer 178. During operation, antenna signals may be transmitted and received through portion 182 of display cover layer 174 and, if desired, through dielectric portions of housing 12.
Housing 12 in the configuration of
If desired, housing speaker openings 180 may have other shapes. As shown in
Conductive structures such as conductive structures 186 may be used to electrically couple traces 116 to metal housing 12. When traces 116 are shorted to housing 12 in this way, a portion of the loop antenna currents in loop L2 may pass through housing 12 in parallel with underlying antenna traces 116 or, if desired, some of traces 116 may be omitted so that all of the loop antenna currents in a portion of loop L2 pass through housing 12 in parallel with enclosure 150. Structures 186 may be formed from metal tape, metal paint, conductive adhesive, solder, welds, fasteners such as screws, or other conductive structures.
The foregoing is merely illustrative of the principles of this invention and various modifications can be made by those skilled in the art without departing from the scope and spirit of the invention.
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