Distributed thermoelectric string and insulating panel

Information

  • Patent Grant
  • 9989282
  • Patent Number
    9,989,282
  • Date Filed
    Friday, August 29, 2014
    9 years ago
  • Date Issued
    Tuesday, June 5, 2018
    6 years ago
Abstract
Inexpensive, lightweight, flexible heating and cooling panels with highly distributed thermoelectric elements are provided. A thermoelectric “string” is described that may be woven or assembled into a variety of insulating panels such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office partitions, under-desk panels, electronic enclosures, building walls, refrigerator walls, and heat conversion panels. The string contains spaced thermoelectric elements which are thermally and electrically connected to lengths of braided, meshed, stranded, foamed, or otherwise expandable and compressible conductor. The elements and a portion of compacted conductor are mounted within the insulating panel On the outsides of the panel, the conductor is expanded to provide a very large surface area of contact with air or other medium for heat absorption on the cold side and for heat dissipation on the hot side.
Description
BACKGROUND
Cooling and Heating

Thermoelectric modules typically contain densely packed elements spaced apart by 1-3 mm. Up to 256 such elements are connected in an array that is 2×2 inches (5.08×5.08 cm) in area. When these modules are deployed, large and heavy heat sinks and powerful fans are required to dissipate or absorb the heat on each side. The reasons for these dense prior art configurations are well-founded: small elements with low resistance allow larger current I to flow before the resistive heat (I2R) generated destroys the thermoelectric cooling (pI1 where p=Peltier coefficient). The use of short elements for maximum cooling capacity results in the hot and cold side circuit boards being close together. This proximity results in the high density.


To achieve a low density packing of thermoelectric elements, one could space out these elements on the boards laterally, but then the backflow of heat conducted and radiated through the air between the elements limits the overall performance. Some designs require evacuating the module interior to reduce heat backflow due to air conduction, but vacuum cavities require expensive materials and are prone to leaks. Vacuum materials (like glass and Kovar™) are also hard and easily broken when thin enough to limit their own backflow of heat. Broken glass can lead to safety issues when these modules are used in seat cushions, automobiles, and other environments.


Another problem in spreading out thermoelectric elements is that the rigid connection of elements over large distances causes them to rupture due to sheer stress upon thermal expansion of the hot side relative to the cold side. To solve this problem, other designs have been proposed that use a flexible plastic such as polyimide for the circuit boards, but these materials are too porous to maintain a vacuum.


Another disadvantage of the prior art design of thermoelectric modules is that the high density of heat moved to the hot side results in a temperature gradient through the heat sink, and this temperature delta subtracts from the overall cooling that the module can achieve. In particular, traditional thermoelectric products are not able to reach true refrigeration temperature because of this temperature gradient.


Finally, because prior art thermoelectric modules are placed in a solder reflow oven during assembly, only high-temperature materials may be used. Unfortunately, many desired uses of cooling and heating involve close or direct contact with the human body, for which soft materials, such as cushions, cloths, and flexible foam are preferred, but these materials cannot withstand the high temperatures of a solder reflow oven.


Thermoelectric devices can be as efficient, or even more efficient, than vapor compression cooling systems when the temperature delta is 10 degrees C. or less. For this reason, a strong desire exists to deploy thermoelectric technology for local heating and cooling of occupied spaces and thereby reduce the overall energy consumption needed for personal comfort. The total energy savings of the central A/C or heating system plus the local thermoelectric systems can be 30% or more for such a combination, but the unwieldy implementation of prior-art thermoelectric modules inhibits their use for this purpose.


Hence, the need exists for a variety of insulating panels to be safely and comfortably improved with thermoelectric capability, such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office/residence walls or partitions, under-desk panels, electronic enclosures, building walls, solar panels, refrigerator walls, freezer walls within refrigerators, or crisper walls within refrigerators.


BACKGROUND
Power Generation

Devices that generate electricity from renewable sources all have limitations. The ideal power generation technology supplies power 24 hours per day, is low cost, and uses only energy from renewable sources, such as wind, tidal and wave, sunlight, or geothermal pools. The two most common forms of utility-scale renewable power generation are wind turbines and photovoltaic systems.


Photovoltaic (PV) technology has the following limitations: (1) high cost, (2) generates power only when the sun is shining brightly which is less than 33% of the time, (3) introduces transients into the electrical grid when clouds suddenly block the sun, and (4) low efficiency without concentration or dangerous temperatures and light levels with concentration.


Wind turbines have the following limitations: (1) relatively high cost, (2) generates power only when the wind is blowing which is less than 33% of the time on average, (3) introduces transients into the electrical grid when the wind suddenly stops or changes direction, (4) requires very tall and visually unacceptable structures, (5) generates noise, (6) has a random peak capacity time during the day that rarely matches the peak demand time, and (7) has very low land usage at about 4 Kwatts per acre.


Both PV and wind turbines may be supplemented with large batteries to store energy for periods of time when the renewable source is not available, but such storage is very expensive at about $1000 per Kwatt hour. When combined with battery storage to achieve 100% renewable generation, the cost for a renewable PV or wind turbine plant is around $20 per watt, vs. about $10 per watt for a fossil fuel pant including 10 years of fuel costs.


Tidal and wave energy installations require high capital startup costs, and like wind turbines, suffer from variable output and may be usually unacceptable structures if erected near shorelines.


Hence, the need exists for a low-cost electrical power generation capability that can supply power 24 hours per day, 7 days per week, and 365 days per year and only tap renewable energy sources. One preferred embodiment of the invention thermoelectric string and associated panel described herein can accomplish these goals.


SUMMARY OF THE INVENTION

Broadly speaking, this invention makes possible thermoelectric capability for a variety of panel materials and enables local/personal heating and cooling that reduces overall energy consumption. In one aspect this invention provides a thermoelectric string that can be woven or inserted into a variety of such panels, including soft and low-temperature panels. In another aspect, this invention also eliminates the need for a large, bulky, heavy, and expensive heat sinks and fans to dissipate heating and cooling. In one aspect this invention combines hardware that moves electrical current with hardware that dissipates thermal energy, thereby saving cost over embodiments such as U.S. Pat. No. 3,196,524. In another aspect this invention provides a common set of hardware to provide low thermal back flow near the thermoelectric elements and simultaneously provide high thermal conduction to ambient air away from the elements. In one embodiment this invention provides a thermoelectric string that can be routed through small holes in the panel to minimize thermal leakage. In another embodiment this invention eliminates the need for vacuum enclosures such as U.S. Pat. No. 3,225,549 of highly-distributed thermoelectric elements and also eliminate the need for wicking fluids such as U.S. 2010/0107657. In a particularly preferred embodiment this invention provides cooling capability and electricity generation for pennies per watt in manufacturing cost.





BRIEF DESCRIPTION OF THE DRAWINGS

Features and advantages of the present invention will be seen from the following detailed description taken into conjunction with the accompanying drawings wherein like numerals depict like parts, and wherein:



FIG. 1 is a string showing the thermoelectric elements connected by lengths of braided wire;



FIGS. 2a and 2b illustrate a method of assembling the thermoelectric elements on strain reliefs using a standard circuit board manufacturing process;



FIGS. 3a, 3b, 3c and 3d illustrate how the braid of FIG. 1 is woven into an insulating panel;



FIGS. 4a and 4b illustrate how multiple layers of panels as described in FIGS. 3a-3d can be cascaded in order to more efficiently achieve a high temperature difference;



FIG. 5 illustrates how multiple metal materials can serve as an expandable heat sink or heat absorber;



FIG. 6 illustrates a more exhaustive list of possible expandable metals;



FIGS. 7a, 7b, 7c and 7d illustrate one way that the invention was reduced to practice and cooling performance was measured and compared to the prior art;



FIG. 8 illustrates, without limitation, many of the applications for the panel of FIGS. 3a-3d or FIGS. 4a and 4b for heating and cooling functionality, and



FIG. 9 illustrates one application for the panel of FIGS. 3a-3d or FIGS. 4a and 4b for generating electricity from a heat storage medium heated by the sun.





DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

A preferred embodiment of this invention includes a string containing alternating P-type 102 and N-Type 103 thermoelectric elements connected by lengths of braided or stranded wire 101 as shown in FIG. 1. The thermoelectric elements preferably comprise metals, although non-metallic conductors such as graphite and carbon may be used. In one embodiment, the alternating elements can be small crystals of, e.g. Bismuth Telluride (N-type) 103 and, e.g. Antimony Bismuth Telluride (P-type) 102, possibly plated with, e.g. Nickel and/or Tin on the ends to facilitate solder connections 104 or 105, or can be small thermo-tunneling vacuum tubes. Because the thermoelectric elements or tubes may be fragile, a “strain relief”, made of a stiff material 106 like FR4 combined with copper 107 and solder 104 or 105 bonds prevents a pulling force on the wire from breaking the elements or vacuum tubes. The aggregate diameter of the stranded or braided wire is designed to carry the desired electrical current with minimal resistance.



FIG. 2 shows how subassemblies of this thermoelectric string might be fabricated using standard circuit board assembly techniques and machinery. A large FR4 circuit board 202 is patterned with the copper pads 107 of the strain reliefs 106 of FIG. 1. A packed arrangement is used to assemble the pellets 102 and 103 or tubes 203 and 204 onto the board. An assembly robot can place the thermoelectric elements or tubes and place solder paste 104 at the appropriate joints. The whole assembly is run through an oven to flow the solder and then cooled to harden the solder joints. Once assembly is completed, the strain relief assemblies are cut out along the cut lines 201 to leave the thermoelectric elements mounted on the strain relief 106.


The lower portion of FIG. 2 shows how the invention can also apply to the latest advanced thermo-tunneling devices. Such devices are more efficient, but require packaging in a vacuum tube. These small vacuum tubes can substitute for the thermoelectric elements 102 and 103 of FIG. 1 and can also benefit greatly from the strain reliefs 106 of FIG. 1 and FIG. 2. Since a useful vacuum package must have a thin glass wall to minimize thermal conduction, it will also likely be very fragile.


The thermoelectric elements of FIG. 1 alternate between N-type 103 and P-type 102 in order to move heat in the same direction while the current flows back and forth along the string woven into a panel 301 as shown in FIG. 3. One purpose of compacting the wire strands in the string of FIG. 1 is to be able to route the string through small-diameter holes 302 in the panel. The hole diameter should be small to minimize thermal leakage that compromise the insulating capability of the panel material. Another purpose of compacting the wires near the elements is to minimize the area for heat to backflow from the hot side of the element to the cold side of the element. The string may be woven into the panel 301 in an alternating fashion as illustrated in FIG. 3a and FIG. 3b. Or, the N-type and P-type elements may be paired together to allow the string to be pushed though the holes 302 from one side as illustrated in FIG. 3c and FIG. 3d. The single sided approach in FIGS. 3c and 3d facilitates manufacture of the panel from one side rather than having to work with both sides as in FIGS. 3a and 3b.


Another embodiment is when the compacted portions 303 of the string within the panel holes of FIG. 3 are replaced with solid cylinders made of copper or similar metal and these cylinders are attached to the thermoelectric element on one end and the expanded wire 101 on the other end. This approach would facilitate robotic placement of the cylinders and elements in the holes in an electronic assembly operation.


Yet another embodiment is to weave or assemble the string into a mold instead of the panel of FIG. 3, then injection-mold the panel material into the mold. Upon removal of the mold, a similar configuration to FIG. 3 is obtained.


In the embodiment of FIG. 3, the thermoelectric elements or tubes are spaced apart over a larger area vs. prior art modules, but the hot and cold sides are also separated by a length much longer than the elements. Since heat backflow conduction is proportional to area/length, scaling both simultaneously maintains a similar overall heat backflow as prior art thermoelectric modules. Since many desirable insulating panels like Styrofoam™, cloth, etc. have thermal conductivities comparable to air, the conduction ability of the invention's panel is comparable to that of the air cavity in prior art modules. In addition, the presence of the opaque panel blocks heat backflow from radiation almost entirely.


Once woven or placed, the exterior metal 101 in FIG. 3 is expanded, if necessary, on the hot and cold sides of the panel in order to maximize the exposure of the metal to air, which in turn maximizes its heat sinking or absorbing capability in either a natural or forced-air convection environment.


A key element of this invention over the prior art is re-optimizing the heat sinks for natural convection vs. the forced-air convection. With the prior art forced-air convection systems, usually based on a fan, the forced air is moving in one direction only. Hence, the optimal heat sink is a metal plate for spreading the heat and linear metal “fins” for distributing the heat along the direction of the forced air. So, in prior-art forced air systems, the optimal heat sink maximizes the area touching air along the airflow, as represented by the parallel fins commonly used.


For a natural convection environment, the air flow velocity is much less than with a fan, but the air has the ability to move in all directions. Hence, the optimal heat sink for a natural convection environment is one that maximizes the area touching air in any direction.


In this preferred embodiment, re-optimizing the heat sink for natural convection brings about the following advantages: (1) better uniformity of the absorption of heat on the cold side and of the dissipation of heat on the hot side, (2) silent operation by eliminating the need for a fan, (3) much less total metal required, (4) more reliable because fans are prone to failure, (5) more efficient because the temperature change across the heat sink can be recovered to provide better additional cooling.


A typical prior-art thermoelectric module deployment has a heat sink with fins that are typically 2 mm thick. Because two surfaces of the fin are exposed to air, the total cross section perimeter of exposure is 4 mm for each thermoelectric element. In the preferred embodiment of this invention, the aggregate diameter d of the compacted wire is 1 mm. However, when the strands are spaced apart on the hot or cold side as shown in FIGS. 3a-3d, the total cross section perimeter exposed to air is now Nπ(d/N1/2) where N is the number of strands and d is the aggregate diameter. As stranded wire is easily available with 100-400 strands, then total cross section exposed to air for the invention is 31.4-62.8 mm, more than seven times the exposed cross section for prior art devices. Because of this larger cross section of exposure, the heat dissipation and absorption capacity of the invention can be, depending on geometric parameters, sufficient to eliminate the need for a fan as well as a rigid heat sink and rely instead only on natural convection. In addition, the larger amount of area touching air by the use of strands reduces the total amount of metal required for heat dissipation, facilitating lightweight, soft, and wearable panels.


Furthermore, the number of strands in FIGS. 3a-3d may be increased almost arbitrarily while the diameter of each strand is proportionately decreased. As above discussed, more strands leads to increased heat absorption and dissipation by factor N1/2 with natural convection. Thinner strands also allows for the heat sink of the invention to be soft, lightweight, and flexible in contrast to rigid, hard, and heavy heat sinks of the prior art. Wire braid of tinned copper with 72-400 strands is typically used in the electronics industry, and such braid is designed to be expandable in order to serve as shielding of cables of varying diameter. Each strand in these braids is AWG 36 or about ˜100 microns in diameter. Another type of braid, wick-braided copper, is used to remove solder and its strands are even thinner, making possible a very soft device for dissipating heat and carrying electrical current in a thermoelectric panel when the strands are spread apart. Copper mesh is also readily available with even thinner strands of 44 AWG and spread out in 140 strands per inch when fully expanded.


Without limitation, the panel 301 in FIGS. 3a-3d may be Styrofoam™ (polystyrene foam), natural cloth, synthetic cloth, natural sponge, synthetic sponge, polyurethane, fiberglass, foam glass, building insulation material, wood, paper, cotton, batting, pipe-wrapping insulation, ceiling tile material, memory foam, cushion material, or any other insulating material.


In some cases, it is desirable to have multi-stage thermoelectric cooling and heating. Higher temperature deltas are achievable. Prior art modules often are stacked with 2 to 4 stages to achieve the very low temperatures needed for sensitive imaging cameras. The same multi-staging is possible with this invention and provides similar benefits, as illustrated in FIGS. 4a and 4b. Here, two panels 301 are connected thermally in between by thermal connectors 400 that have high thermal conduction and electrical isolation. The thermal connectors may contain copper solder pads 401 and an electrically insulating layer like polyimide 402. In this configuration, the polyimide layer 402 is so thin that its thermal conduction is high. Without limitation, the electrical insulator could be FR-4, Kapton (polyimide), Teflon (polytetra-fluoroethylene), an insulated metal substrate circuit board, aluminum oxide or any other readily available material. The multi-stage configuration may be applied to the alternating weave as shown in FIG. 4a or to the single-sided weave as shown in FIG. 4b. The thermoelectric elements are shown as pellets 102 and 103 but could also be thermo-tunneling tubes 203 and 204 shown in FIGS. 2a-2b and 3a-3d.



FIG. 5 shows several different types of expandable metal conductors that may replace the braid 101 in FIGS. 1, 3a-3d and 4. Copper mesh is available in an oriented form 501 or un-oriented form 502 and either provides strands with high contact area to air. Metal tinsel 503 has a thick central wire which is convenient for moving electricity from one thermoelectric element to the other plus many branches of thin copper strands which are convenient for dissipating or absorbing heat to or from the air. Flat braid 504 is also available with or without solder joints on either end. A panel made with one or a combination of these expanded metals 505 becomes a fully functional thermoelectric panel.



FIG. 6 shows even more possibilities for expanded or expandable metals, including another type of un-oriented copper mesh 601, copper strands weaved like rope 603, coaxially grouped strands 604, copper foam 605, or loose copper strands 606. For the metal screen or mesh, the metal may be compacted by rolling tightly or folding tightly in an accordion shape near the thermoelectric elements, and loosening the roll or the folds away from the thermoelectric elements.


The thermoelectric panels described can also be deployed for generating electricity from heat. When heat is applied to one side, a Seebeck voltage is generated that can be used for electrical power. The heat source can be a selective surface receiving sunlight, a road or highway surface, geothermal heat, engine heat, smokestack heat, body heat, waste heat, and many other possibilities.


EXAMPLE 1
A Thermoelectric Cooler Using Invention


FIGS. 7a-7c illustrate a thermoelectric cooler 701 using the invention. Four thermoelectric panels 505 were built using a string as shown in FIG. 1 with braid 101 lengths 7 and 11 cm for the cold and hot sides, respectively. The panels were 1-inch (2.54 cm) thick Styrofoam™ 301 with 3 mm diameter holes and a pellet spacing of 3 cm. A total of 256 pellets were inserted into the four populated panels. The four thermoelectric panels were combined with two plain Styrofoam™ panels to construct a small cooler. The invention cooler 701 in FIG. 7a did not contain a heat sink or a fan and was powered with 20 watts of electricity.


The invention prototype of FIG. 7a was compared with a prior art commercial cooler 702 that contains a prior art thermoelectric module 704 also with 256 pellets, a prior art heat sink 706, and a prior art fan 705. This commercial cooler was powered as designed with 40 watts of electricity.



FIG. 7d shows the data taken during an experiment to compare the invention cooler with the prior art commercial cooler. The two key measures of performance for such a cooler are (1) the rate of cool-down for a room-temperature cup of water 703 and (2) the minimum temperature reached by the air inside each cooler. The graph 707 in FIG. 7d plots the temperature of on the Y-axis and the elapsed time in minutes on the X-axis.


The experiment revealed that the cooling-down rate for the cup of water, indicated by the slope of the line 709 and 711 for the invention, was comparable to the cooling-down rate of the prior art commercial cooler, indicated by the slope of 710. In addition, the minimum temperature of the air inside the box reached 5.5 degrees C. for both the invention cooler as indicated by line 713 and for the prior art cooler 712.


The data in FIG. 7d indicates that the invention performs as well as the prior art commercial cooler in cooling. However, the invention only required 20 watts of power vs. 40 watts for the prior art commercial cooler. Hence, the invention achieved the comparable performance with significantly greater efficiency. The greater efficiency is due to the following: (1) not needing the electrical power for a fan, (2) recovering much of the temperature drop across the heat sink, and (3) better distribution of the cooling over the walls of the container.


The thermoelectric panels of the invention illustrated in FIG. 3 and FIGS. 4a and 4b are generalized insulating panels with the ability to cool or heat one side relative to the other. These generalized panels may be manufactured using a similar process and with similar machines and then deployed in a plurality of applications. Without exception, some of these applications are illustrated in FIG. 8.


In order to save overall energy or achieve greater individual comfort in cooling or heating the human body, one advantageous technique is to allow for local heating or cooling relative, the environment. For example, the thermoelectric panel of the present invention may be placed around the cavity under a desk 805 as illustrated in FIG. 8 to provide local comfort for an office worker with significant energy savings. Or, the panel could be placed in an office chair 804 in the seat bottom or the seat back or both. In a vehicle, the panels may be placed in the seat bottom or seat back of a car seat 803. For sleeping, these panels may be placed in an electric blanket 813 combined with a thermostatic controller to maintain a desired under-blanket sleep temperature. The control electronics for the blanket can automatically switch the electrical current in the proper direction when cooling is needed to achieve the set temperature or when heating is needed. Without limitation, such thermostatic control can be applied to any of the applications of the invention including all of those illustrated in FIG. 8.


For individuals that must wear helmets, the body heat confined inside the helmet can be uncomfortable. Or, the helmet may not provide sufficient warmth when worn in cold environments that require head protection. The thermoelectric panel of the present invention may be molded into the proper shape to add cooling and heating capability to helmets of all types, including motorcycle or bicycle 808, military 810, or hard hats 809 for construction sites.


Similarly, the invention panel may be shaped and used to make clothing like vests 816 or, without limitation, other types of clothing such as coats, pants, pant legs, and shirts.


The thermoelectric panel of the present invention also can be used to cool food and drinks or other objects. These panels can be deployed as the wall, door, back, or top of a wine chiller 806 or a camping cooler 801 and 802. Because the panel and string can be flexible 812 in FIG. 8, it can be wrapped around shaped objects like water pitchers, beer or other mug or bottles, coffee drinks, milk or cream bottles or cartons, etc.


The thermoelectric panel of the present invention also may be deployed to heat or cool buffet trays 807 shown in FIG. 8 for self-serve restaurants, cafeterias, or catering services. The prior art uses ice to cool the trays and boiling water to heat them. The supply of ice and hot water must be maintained and the reservoir under the trays must be replenished periodically. The present invention provides benefits over the prior art by heating or cooling the trays electrically and not requiring cold and hot supplies.


The thermoelectric panel of the present invention also may be deployed in residences and buildings, A portion of a wall or window or floor 815 may be replaced by the panel of the present invention and provide heating or cooling for room. The ceiling tiles 815 in buildings also may be replaced by the panels of the present invention to provide heating and cooling for the space underneath the ceiling. The panel of the present invention also may be employed in combination with central compressor-based air conditioning systems to eliminate the need for forced air that can carry germs and smells from one room to another. In this case, the panels of the present invention would be mounted along plenums with the hot side facing into the plenum. The cool air from the compressor-based HVAC system would carry the heat away from the hot side while the cold side of the panel removes heat from the room. In this case, the room is cooled without forced air.


In another aspect, the invention, provides renewable electrical power from the sun's radiation in well-suited climates. A second purpose is to continue providing energy when the sun is not shining and all night long. A third purpose is to improve the land utilization as measured in Kwatts/acre to many times higher than a wind turbine farm. A fourth purpose is to provide peak power capacity at a time of day that better matches the typical peak demand time for electricity. A fifth purpose of this invention is to use inert and non-toxic materials to store the energy of the sun in the form of heat. A sixth purpose is to provide these capabilities at a cost per watt that is a fraction of the cost (including fuel costs) of a traditional power plant and an even smaller fraction of the cost per watt of a PV or wind turbine plant (including battery storage costs). As discussed below, the invention demonstrates better performance over prior art implementations that do not have energy storage such as U.S. Pat. No. 3,088,989, by additionally distributing the thermoelectric elements to match the heat distribution from un-concentrated sunlight and remove the need for metal heat spreaders.


An embodiment of the invention is illustrated in FIG. 9. An insulating material 903 that is largely transparent to the sun's radiation surrounds heat storage medium 905. The insulating material 903 also prevents the heat from escaping when the sun 907 is not shining. The insulating material may be, without limitation, bubble wrap, glass or Plexiglas sealing in air or air pockets, or any of the materials used for solar covers for swimming pools. A selective surface layer or coating 904 of the heat storage medium is designed to absorb radiation from the sun and prevent radiative re-emission of absorbed heat. This selective surface layer or coating 904 may be constructed, without limitation, from, e.g. an oxide of copper, aluminum, or iron, from carbon, steel or a combination or alloy of these, black paint, or similar materials used in solar ovens, solar camping showers, or solar rooftop water heaters. The heat storage medium 905 contains a large volume of a material with a high heat capacity. This material could be water, which has a volumetric heat capacity of 4.2 joules/cm3/° C. or could be scrap iron which has a heat capacity slightly less than water. The selective surface 904 and the heat storage medium 905 are in good thermal contact. This contact possibly employs a thermal interface material 906 there between that has high thermal conductivity, the ability to mate the surfaces, and the ability to spread the heat. The heat storage medium 905 is thermally connected to the hot side of a distributed thermoelectric panel 902, again possibly employing a thermal interface material 906. The distributed thermoelectric panel 902 is an insulating panel with thermoelectric elements inside, as described in FIGS. 2a-2b and FIGS. 3a-3d. The cold side of the thermoelectric panel 902 is thermally connected to ground 901 or floating on a body of water such as an ocean, lake, or pool.


Without limitation, the power generator illustrated in FIG. 9 could generate power only when the sun 907 is shining, eliminating the need for storage medium 905. In this case the selective surface 904 would be adjacent to the thermoelectric panel 902, possibly with a thermal interface material 906 there between.


Again without limitation, the power generator of FIG. 9 could employ a heat source other than sunlight. The water in the storage medium 905 could flow from an active geothermal source, or be heated waste water from a power plant or factory. If the thermoelectric panel 902 were built in the flexible configuration described earlier, then it could be wrapped around pipes carrying hot water or hot gases and generate electricity as illustrated in FIG. 8, item 814.


EXAMPLE 2
Solar Power Storage and Electricity Generation

An example power generator in accordance with FIG. 9 will now be described that is competitive with other power generators such as wind turbines and photovoltaic panels. The heat storage medium 905 is 2 m×2 m×0.3 m and is assumed to reach a peak of 100° C. This temperature does not exceed the boiling point of water, and is a temperature easily reached by insulated solar ovens used to cook food. The cold side 901 temperature is assumed to be room temperature or 20° C. The delta temperature ΔT across the thermoelectric panel 902 is then 80° C. and the average temperature is 60° C. The heat storage medium at a temperature elevated by 80° C. relative to ambient stores 4.0 E+8 joules or 112 Kwatt-hours if the heat capacity of water at 4.2 joules/cm3° C. is assumed.


The insulating material 903 dimensions are 2 m×2 m×0.05 m, and so the thermal loss through the thickness of the insulator at the ΔT of 80° C. is 147 watts if a typical thermal conductivity of air-pocket insulators of 0.023 watts/m° C. is assumed.


Thermoelectric elements are readily available with an electrical resistance r of 0.005 ohm, thermal conductance K of 0.009 watts/° C., and Seebeck coefficient S of 300 μV/° C. These values indicate a thermoelectric performance ZT=S2T/rK at the average temperature of 60° C. (333K) of 0.60, which is well within the performance claimed by most manufacturers.


The distributed thermoelectric panel 902 is 2 m×2 m×0.05 m, and it contains 1333 thermoelectric elements. The elements are spaced apart by 5.5 cm in each lateral direction. The total thermal loss through the elements is 960 watts (1333ΔTK). The total voltage V generated by the elements connected in series is 1333SΔT or 32 volts. The total resistance of the elements, all connected in series, is R 32 1333r=6.7 ohm. Assuming a matched load of 6.7 ohm, then the current flow I is V/2R or 2.4 amps. Hence, a total of 38.4 watts (0.5VI) of power is available to the load by this example embodiment.


The sun's 907 radiation is known to be about 1000 watts/m2, which indicates that 4000 watts reaches the selective surface 904. After subtracting the loss through the thermoelectric elements and through the insulating material, 2893 watts (4000-960-147) is absorbed as heat in the heat storage medium 905. Because 4000 watts are entering the medium for 8 hours of the day and 1145.4 watts (960+147+38.4) are leaving the medium for 24 hours of the day, more energy (net 4.52 Kwatt hours per day) is entering per day than is leaving, allowing for this embodiment to reach and maintain a maximum temperature. The heat builds up in the heat storage medium until it reaches its heat capacity of 112 Kwatt hours. The time required to reach the maximum temperature is about 25 days (112 Kwatt hours/4.52 Kwatt hours per day).


While this embodiment is less than 1% efficient on an instantaneous basis (38.4 watts generates/4000 watts available from the sun), which is a conservative expectation for a thermoelectric generator at these temperatures, making use of the heat storage allows the thermoelectric device to be about 3% efficient on a daily average basis.


A feature and advantage of this embodiment is that it reaches its maximum temperature in the mid-afternoon hours as heat builds up in the heat storage medium 905. Hence, the time of maximum power output of this embodiment better matches the time of peak demand for electricity. Photovoltaic panels have their maximum output at noon, which is two hours earlier than the peak demand. The daily maximum output of wind turbines is unpredictable.


With this embodiment, 38.4 watts of electrical power generated in a 2 m×2 m area corresponds to 38 Kwatts per acre, which compares very favorably to wind turbines which average about 4 Kwatts per acre.


Another feature and advantage of the present invention is that the storage medium, water, of this embodiment, is essentially free as the water does not even need to be fresh water. Storing energy as heat is much less costly than storing energy as electricity, and it may be stored without the toxic chemicals found in batteries.


Various changes may be made in the above, without degrading from the spirit and scope of the present invention.

Claims
  • 1. A thermoelectric panel, compromising: an insulating substrate comprising a plurality of holes; anda plurality of discrete semiconductor thermoelectric elements comprising p-type and n-type semiconductor elements,wherein the p-type and n-type semiconductor thermoelectric elements are directed in and out of the plurality of holes in the insulating substrate,wherein the p-type and n-type semiconductor thermoelectric elements are arranged in the plurality of holes in the insulating substrate, andwherein the p-type and n-type semiconductor thermoelectric elements are thermally and electrically connected to each other by wire conductors that emanate from the plurality of holes and which are compacted in cross section in the plurality of holes in the insulating substrate near where the wire conductors connect to the p-type and n-type semiconductor thermoelectric elements, and wherein a subset of the wire conductors are external to a top side of the insulating substrate and another subset of the wire conductors are external to a bottom side of the insulating substrate.
  • 2. The panel of claim 1, wherein the wire conductors comprise metal strands, braid, mesh, screen, tinsel, or foam.
  • 3. The panel of claim 2, wherein the wire conductors external to the top side or the bottom side of the insulating panel are exposed and have a cross section perimeter that is Nπ(d/N1/2), where N is a number of metal strands in the wire conductor and d is an aggregate diameter of the metal strands.
  • 4. The panel of claim 2, wherein the wire conductors comprise strands which are loose, roped, or grouped axially.
  • 5. The panel of claim 4, wherein the wire conductors comprise strands which are compacted adjacent to the plurality of discrete semiconductor thermoelectric elements and expanded away from the plurality of discrete semiconductor thermoelectric elements.
  • 6. The panel of claim 2, wherein the wire conductors comprise braids which are in a round, oval, or a flat tubular shape.
  • 7. The panel of claim 6, wherein the braids comprising the flat tubular shape have a small diameter adjacent to the plurality of discrete semiconductor thermoelectric elements and a large diameter away from the plurality of discrete semiconductor thermoelectric elements.
  • 8. The panel of claim 2, wherein the wire conductors comprise a mesh or screen which is in a tight accordion shape adjacent to the plurality of discrete semiconductor thermoelectric elements and in a loose accordion shape away from the plurality of discrete semiconductor thermoelectric elements.
  • 9. The panel of claim 2, wherein the wire conductors comprise mesh or screen which is in a tight cylinder adjacent to the plurality of discrete semiconductor thermoelectric elements and a loose cylinder away from the plurality of discrete semiconductor thermoelectric elements.
  • 10. The panel of claim 1, wherein a first portion of the wire conductors is located within a hole of the plurality of holes and a second portion of the wire conductors is located outside of the hole of the plurality of holes, and wherein the second portion of the wire conductors is expanded.
  • 11. The panel of claim 1, wherein a hole of the plurality of holes comprises one of the p-type and one of the n-type semiconductor thermoelectric elements, and wherein the wire conductor is expanded in a loop on the top side or the bottom side of the insulating substrate.
  • 12. The panel of claim 1, wherein the insulating substrate comprises a material selected from the group consisting of polystyrene foam, natural cloth, synthetic cloth, natural sponge, synthetic sponge, polyurethane, fiberglass, foam glass, building insulation material, wood, paper, cotton, batting, pipe-wrapping insulation, ceiling title material, memory foam, and a cushion material.
  • 13. A thermoelectric device compromising the thermoelectric panel of claim 1, wherein the thermoelectric panel is incorporated into a seat cushion, seat back, blanket or blanket section, pillow, under-desk panel, ceiling tile, building or residence wall or floor or window, refrigerator or wine chiller wall or door, beverage or pitcher insulator, electronic enclosure wall, piece of wearable clothing or uniform, a helmet or a hat or a hardhat lining, or a pipe containing fluid.
  • 14. A thermoelectric device comprising the thermoelectric panel of claim 10, wherein the thermoelectric panel is configure to generate electricity when heat is applied to one side.
  • 15. The thermoelectric device of claim 14, wherein the heat is selected from the group consisting of sunlight, geothermal heat, waste heat, body heat, animal heat, exhaust heat, engine heat, turbine heat, and pipe heat.
  • 16. A thermoelectric device comprising a plurality of thermoelectric panels of claim 1 stacked together, wherein the plurality of thermoelectric panels are in thermal communication.
  • 17. The thermoelectric device of claim 16, wherein the plurality of thermoelectric panels comprises a whole number of thermoelectric panels equal to 2, 3, or 4.
  • 18. The thermoelectric device of claim 16, wherein one or more of the plurality of thermoelectric panels are disposed on one or more boards to form a thermoelectric panel assembly and wherein the one or more boards are electrically isolated from each other and thermally conductive.
  • 19. The thermoelectric device of claim 18, wherein the one or more boards are circuit boards.
  • 20. The thermoelectric device of claim 18, wherein the one or more boards are electrically isolated by an electrical isolation material selected from the group consisting of FR4 and a polyimide.
  • 21. The thermoelectric device of claim 18, wherein the one or more boards are electrically isolated by an electrical isolation material comprising a metal substrate with thin isolation layers.
  • 22. The thermoelectric device of claim 21, wherein the thin isolation layers have a thickness of 10 to 40 micrometers and comprise a polyimide or an oxide of a metal substrate.
  • 23. The thermoelectric device of claim 18, wherein the one or more boards comprise metallic pads and wherein wire conductors adjacent to an external surface of the plurality of thermoelectric panels are soldered to the metallic pads.
  • 24. The panel of claim 1, further including strain relief for mounting the semiconductor thermoelectric elements.
  • 25. The panel of claim 24, wherein the strain relief comprises circuit board substrate material.
  • 26. The panel of claim 25, wherein the circuit board substrate material is selected from the group consisting of a polyimide, polyester, nylon, FR-4 and fiberglass.
  • 27. The panel of claim 24, wherein the strain relief comprises one or more metallic pads, and wherein the metallic pads of the strain relief are soldered to and connect the wire conductors and the semiconductor thermoelectric elements.
CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 13/101,015, filed May 4, 2011, which claims priority from U.S. Provisional Application Ser. No. 61/403,217, filed Sep. 13, 2010; U.S. Provisional Application Ser. No. 61/417,380, filed Nov. 26, 2010, U.S. Provisional Application Ser. No. 61/433,489, filed Jan. 17, 2011, and from U.S. Provisional Application Ser. No. 61/470,039 filed Mar. 31, 2011, the contents of which are incorporated herein by reference.

US Referenced Citations (185)
Number Name Date Kind
2376902 Clark May 1945 A
RE22763 Clark Jun 1946 E
2606996 Westerberg et al. Aug 1952 A
2796532 Teague et al. Jun 1957 A
2858350 Fritts Oct 1958 A
3083381 Bailey Apr 1963 A
3129345 Hatsopoulos et al. Apr 1964 A
3136577 Richard Jun 1964 A
3173032 Maynard Mar 1965 A
3196524 Jamison Jul 1965 A
3217189 Bloss Nov 1965 A
3225549 Elfving Dec 1965 A
3406753 Habdas Oct 1968 A
3549201 Wolf Dec 1970 A
3627988 Romaniec Dec 1971 A
3754703 Saponara Aug 1973 A
4343993 Binnig et al. Aug 1982 A
4423308 Callaway et al. Dec 1983 A
4523594 Kuznetz Jun 1985 A
4625394 Kemnitz et al. Dec 1986 A
4820903 Ishida Apr 1989 A
4825488 Bedford May 1989 A
4825868 Susa et al. May 1989 A
4930317 Klein Jun 1990 A
4937435 Gross et al. Jun 1990 A
4969684 Zarotti Nov 1990 A
5028835 Fitzpatrick Jul 1991 A
5138851 Mardikian Aug 1992 A
5541464 Johnson et al. Jul 1996 A
5594534 Genovese Jan 1997 A
5653741 Grant Aug 1997 A
5712448 Vandersande et al. Jan 1998 A
5837002 Augustine et al. Nov 1998 A
5851338 Pushaw Dec 1998 A
5892656 Bass Apr 1999 A
5917229 Nathan et al. Jun 1999 A
6064137 Cox May 2000 A
6129990 Frater Oct 2000 A
6220659 McDonald Apr 2001 B1
6223539 Bell May 2001 B1
6230501 Bailey, Sr. et al. May 2001 B1
6323413 Roth et al. Nov 2001 B1
6323777 Durston et al. Nov 2001 B1
6328594 Mullen, Jr. Dec 2001 B1
6385976 Yamamura May 2002 B1
6410971 Otey Jun 2002 B1
6494048 Ghoshal et al. Dec 2002 B1
6501055 Rock et al. Dec 2002 B2
6523354 Tolbert Feb 2003 B1
6582456 Hand et al. Jun 2003 B1
6639242 Chen et al. Oct 2003 B1
6651760 Cox et al. Nov 2003 B2
6653607 Ellis et al. Nov 2003 B2
6720704 Tavkhelidze et al. Apr 2004 B1
6774003 Tavkhelidze et al. Aug 2004 B2
6823678 Li Nov 2004 B1
6863981 McBain Mar 2005 B2
6876123 Martinovsky et al. Apr 2005 B2
6884732 Najafi et al. Apr 2005 B2
6946596 Kucherov et al. Sep 2005 B2
7005381 Cox Feb 2006 B1
7117687 Naaman Oct 2006 B2
7140102 Taliashvili et al. Nov 2006 B2
7152412 Harvie Dec 2006 B2
7253549 Tavkhelidze et al. Aug 2007 B2
7273490 Lachenbruch et al. Sep 2007 B2
7305839 Weaver, Jr. Dec 2007 B2
7456543 Makansi Nov 2008 B2
7708338 Wolas May 2010 B2
7996936 Marquette et al. Aug 2011 B2
8018117 Makansi Sep 2011 B2
8066324 Nathan et al. Nov 2011 B2
8102096 Makansi Jan 2012 B2
8101847 Okamura Feb 2012 B2
8327477 Lachenbruch et al. Dec 2012 B2
8495974 Agosta Jul 2013 B2
8969703 Makansi et al. Mar 2015 B2
9066601 Aminy et al. Jun 2015 B1
9272647 Gawade et al. Mar 2016 B2
9408475 Mikkelsen et al. Aug 2016 B2
20010011601 Renaud Aug 2001 A1
20010046749 Tavkhelidze et al. Nov 2001 A1
20020046762 Rossi Apr 2002 A1
20020058975 Bieberich May 2002 A1
20020170172 Tavkhelidze et al. Nov 2002 A1
20030042819 Martinovsky et al. Mar 2003 A1
20030084935 Bell May 2003 A1
20030131419 Vansteenburg Jul 2003 A1
20030141455 Lambert Jul 2003 A1
20030154725 McGrew Aug 2003 A1
20030184188 Kucherov et al. Oct 2003 A1
20030230913 Buss et al. Dec 2003 A1
20040009729 Hill et al. Jan 2004 A1
20040050415 Kucherov et al. Mar 2004 A1
20040100131 Howick et al. May 2004 A1
20040141455 Tsukuda et al. Jul 2004 A1
20040160092 Laib Aug 2004 A1
20040195934 Tanielian Oct 2004 A1
20050050415 Anand et al. Mar 2005 A1
20050066505 Iqbal et al. Mar 2005 A1
20050077618 McCutcheon et al. Apr 2005 A1
20050140189 Bajic et al. Jun 2005 A1
20050184565 Weiss et al. Aug 2005 A1
20050184603 Martsinovsky Aug 2005 A1
20050189871 Tavkhelidze et al. Sep 2005 A1
20050253425 Asada et al. Nov 2005 A1
20060000226 Weaver, Jr. Jan 2006 A1
20060027552 Krobok et al. Feb 2006 A1
20060038290 Tavkhelidze et al. Feb 2006 A1
20060068176 Zafiroglu et al. Mar 2006 A1
20060110657 Stanton et al. May 2006 A1
20060138896 Makansi Jun 2006 A1
20060162761 Tanielian Jul 2006 A1
20060180829 Martsinovsky Aug 2006 A1
20060191886 Pak Aug 2006 A1
20060192196 Tavkhelidze et al. Aug 2006 A1
20060207643 Weaver, Jr. Sep 2006 A1
20070001507 Brennan et al. Jan 2007 A1
20070023077 Tanielian Feb 2007 A1
20070033782 Taliashvili et al. Feb 2007 A1
20070056623 Tavkhelidze et al. Mar 2007 A1
20070069357 Weaver et al. Mar 2007 A1
20070084220 Asada et al. Apr 2007 A1
20070112390 Lau et al. May 2007 A1
20070137687 Tanielian Jun 2007 A1
20070181913 Li Aug 2007 A1
20070272673 Keane Nov 2007 A1
20070277313 Terech et al. Dec 2007 A1
20070289620 Stark Dec 2007 A1
20070295973 Jinbo et al. Dec 2007 A1
20080015665 Lachenbruch Jan 2008 A1
20080017237 Bray et al. Jan 2008 A1
20080029146 Plissonier et al. Feb 2008 A1
20080042163 Weaver, Jr. Feb 2008 A1
20080054490 McLellan et al. Mar 2008 A1
20080155981 Tanielian Jul 2008 A1
20080173022 Petrovski Jul 2008 A1
20080237827 Autry Oct 2008 A1
20090025774 Plissonnier Jan 2009 A1
20090038317 Otey Feb 2009 A1
20090078690 Lee et al. Mar 2009 A1
20090121524 Abe et al. May 2009 A1
20090199571 Creech et al. Aug 2009 A1
20090200983 Dyer et al. Aug 2009 A1
20090205695 Makansi Aug 2009 A1
20090229648 Makansi Sep 2009 A1
20090257774 Rummler et al. Oct 2009 A1
20090283124 Seo Nov 2009 A1
20090322221 Makansi Dec 2009 A1
20100031448 Hijlkema Feb 2010 A1
20100101620 Tanaka Apr 2010 A1
20100107657 Vistakula May 2010 A1
20100269517 Ikeda et al. Oct 2010 A1
20100270996 Ramadas et al. Oct 2010 A1
20100281884 Rawski et al. Nov 2010 A1
20100288370 Volden et al. Nov 2010 A1
20100327636 Stoll et al. Dec 2010 A1
20110016886 Ghoshal et al. Jan 2011 A1
20110109128 Axakov et al. May 2011 A1
20110139203 Yap Jun 2011 A1
20110226299 Makansi Sep 2011 A1
20110240751 Rauh et al. Oct 2011 A1
20120019074 Frolov et al. Jan 2012 A1
20120032478 Friderich et al. Feb 2012 A1
20120060882 Makansi Mar 2012 A1
20120060885 Makansi et al. Mar 2012 A1
20120110734 An May 2012 A1
20120113594 Goettert et al. May 2012 A1
20120131748 Brykalski et al. May 2012 A1
20120146455 Makansi Jun 2012 A1
20120148328 Jollet Jun 2012 A1
20120198616 Makansi et al. Aug 2012 A1
20130008181 Makansi et al. Jan 2013 A1
20130014796 Tajima Jan 2013 A1
20130097777 Marquette et al. Apr 2013 A1
20130106147 Lazanja et al. May 2013 A1
20130180563 Makansi Jul 2013 A1
20140041396 Makansi et al. Feb 2014 A1
20140082846 Blazar Mar 2014 A1
20140208521 Farnham Jul 2014 A1
20140331688 Kossakovski et al. Nov 2014 A1
20150121901 Makansi et al. May 2015 A1
20150266405 Fitzpatrick et al. Sep 2015 A1
20160133817 Makansi et al. May 2016 A1
20170273830 Hitschmann Sep 2017 A1
Foreign Referenced Citations (39)
Number Date Country
201636597 Nov 2010 CN
103098249 May 2013 CN
4010909 Oct 1991 DE
1612492 Jan 2006 EP
2065465 Jul 1981 GB
S34595 Feb 1959 JP
S6147907 Mar 1986 JP
S62159610 Jul 1987 JP
S63257513 Oct 1988 JP
H02116613 Sep 1990 JP
H03247315 Nov 1991 JP
H09197806 Jul 1997 JP
2002084005 Mar 2002 JP
2002519100 Jul 2002 JP
2003042590 Feb 2003 JP
2003209297 Jul 2003 JP
2003526484 Sep 2003 JP
2006081575 Mar 2006 JP
2007175476 Jul 2007 JP
2008538850 Nov 2008 JP
2009074746 Apr 2009 JP
2009183354 Aug 2009 JP
2010240258 Oct 2010 JP
2011014281 Jan 2011 JP
2011204824 Oct 2011 JP
2011211896 Oct 2011 JP
2013198730 Oct 2013 JP
2015168357 Sep 2015 JP
WO-9811397 Mar 1998 WO
WO 9913562 Mar 1999 WO
WO 2007078048 Jul 2007 WO
WO 2008027928 Mar 2008 WO
WO 2009102706 Aug 2009 WO
WO 2010078521 Jul 2010 WO
WO-2010108254 Sep 2010 WO
WO 2010150162 Dec 2010 WO
WO-2012037031 Mar 2012 WO
WO-2014052145 Apr 2014 WO
WO-2015066518 May 2015 WO
Non-Patent Literature Citations (112)
Entry
The Thermoelectric Properties and Crystallography of Bi—Sb—Te—Se Thin Films Grown by Ion Beam Sputtering, By H. Noro, K. Sato, and H. Kagechika, Journal of Applied Physics, 73 (3) Feb. 1, 1993.
Efficient Switched Thermoelectric Refrigerators for Cold Storage Applications, by Ghoshal and Guha, Journal of Electronic Materials, vol. 38, No. 7, 2009.
Vacuum Thermionic Refrigeration with a Semiconductor Heterojunction Structure, by Y. Hishinuma, T.H. Geballe, B.Y. Moyzhes, Applied Physics Letters, vol. 81, No. 22, Nov. 25, 2002.
Measurements of Cooling by Room Temperature Thermionic Emission Across a Nanometer Gap, by Y. Hishinuma, T.H. Geballe, B.Y. Moyzhes, and T.W. Kenny, Journal of Applied Physics, vol. 94, No. 7, Oct. 1, 2003.
Thermionic Refrigeration, By G.D. Mahan, Journal of Applied Physics, vol. 76, No. 7, Oct. 1, 1994.
Multilayer Thermionic Refrigerator, by G.D. Mahan, J.A. Sofao and M. Bartkoiwak, Journal of Applied Physics, vol. 83, No. 9, May 1, 1998.
Analysis of Nanonmeter Vacuum Gap Formation in Thermo-tunneling Devices, by E T Enikov and T Makansi, Nanotechnology Journal, 2008.
Refrigeration by Combined Tunneling and Thermionic Emission in a Vacuum: Use of Nanometer Scale Design, by Y. Hishinuma, T.H. Geballe, B.Y. Moyzhes, Applied Physics Letters, vol. 78, No. 17, Apr. 23, 2001.
Design and Characterization of Thin Film Microcoolers, Chris LaBounty, Ali Shakouri, John E. Bowers, Journal of Applied Physics, vol. 89, No. 7, Apr. 1, 2001.
Possible Cooling by Resonant Fowler-Nordheim Emission, A.N. Korotkov and K.K. Likharev, Applied Physics Letters, vol. 75, No. 16, Aug. 23, 1999.
Quantum, Cyclic, and Particle-Exchange Heat Engines, Humphrey et al., Physica E29, 390-398, 2005.
Micron-gap ThermoPhotoVoltaics (MTPV), by R. DiMatteo, P. Greiff, D. Seltzer, D. Meulenberg, E. Brown, E. Carlen, K. Kaiser, S. Finberg, H. Nguyen, J. Azarkevich, P. Baldasaro, J. Beausang, L. Danielson, M. Dashiell, D. DePoy, E. Ehsani, W. Topper, K. Rahner, R. Siergie, Thermophotovoltaic Generation of Electricity Sixth Conference, American Institute of Physics, 2004.
Thermal and electrical properties of Czochralski grown GeSi single crystals, by I. Yonenaga et al. Journal of Physics and Chemistry of Solids 2001.
Thermotunneling Based on Cooling Systems for High Efficiency Buildings, by Marco Aimi, Mehmet Arik, James Bray, Thomas Gorczyca, Darryl Michael, and Stan Weaver General Electric Global Research Center, DOE Report Identifier DE-FC26-04NT42324, 2007.
Selective Epitaxial Growth of SiGe on a SOI Substrate by Using Ultra-High Vacuum Chemical Vapor Deposition, by H. Choi, J. Bae, D. Soh, and S. Hong, Journal of the Korean Physical Society, vol. 48, No. 4, Apr. 2006, pp. 648-652.
Strain relaxation of SiGe Islands on Compliant Oxide, by H. Yin et al., Journal of Applied Physics, vol. 91, No. 12, Jun. 15, 2002.
Complex Thermoelectric Materials, By G. J. Snyder and E. S. Tober, Nature Materials, vol. 7 Feb. 2008.
Substrate-Mediated Photo Induced Chemical Reactions on Ultrathin Metal Films, V.P. Zhdanov, B. Kasemo, Department of Applied. Physics, Apr. 19, 1999, Surface Science 432 (1999) L599-L603.
Bismuth Telluride (Bi2Te3)Nanowires: Synthesis by Cyclic Electrodeposition/Stripping, Thinning by Electrooxidation, and Electrical Power Generation, E. J. Menke et al, Langmuir 2006, 22, 10564-10574, Jun. 30, 2006.
Electronic Properties of Bismuth Nanowires, By Stephen B. Cronin et al., Dept of Physics, Electrical Engineering and Computer Science, Chemistry and Francis Bitter Magnet Laboratory, Massachusetts Institute of Technology, Cambridge, MA 02139.
Electroplating of Conformal Electrodes for Vacuum Nanogap Tunnel Junction, By Jangidze et al., Tbilisi State University, Chavchavadze Ave. 13, 0179, Georgia, Nov. 2008, pp. 1-11.
European Supplementary Search Report, dated Oct. 22, 2010, Appln No. 07781.451.1.7-2208/2057659, PCT/US2007077042 (8 pgs).
International Preliminary Report on Patentability, PCT/US07/07042, dated Mar. 12, 2009 (4 pgs).
International Search Report and Written Opinion issued in PCT/US07/77042, dated Sep. 5, 2008. (3 pgs).
International Search Report and Written Opinion, PCT/US07/60871, dated Jan. 22, 2007 (7 pgs).
International Search Report and Written Opinion, PCT/US09/69959, dated Mar. 15, 2010 (9 pgs).
Official Action dated Apr. 7, 2011 issued in related U.S. Appl. No. 12/302,782 (16 pgs).
European Communication, dated May 27, 2011, Appln. No. 07 756 398.9-2208 (3 pgs).
European Communication, dated Jun. 1, 2011, Appln. No. 07 814 511.7-2208 (3 pgs).
International Search Report issued for PCT/US2010/045443, dated Oct. 1, 2012 (9 pgs).
McCarthy et al, “Enhancing Thermoelectric Energy Recovery via Modulation of Source Temperature for Cyclical Heat Loadings” Journal of Heat Transfer, Jun. 2007, vol. 129, pp. 749-755 (7 pgs).
Australian Examination Report No. 1 issued in related application No. 2011302303, dated Aug. 19, 2013 (4 pgs).
Office Action issued in related U.S. Appl. No. 13/394,288 dated Nov. 14, 2013 (26 pgs).
International Search Report and Written Opinion issued in related application No. PCT/US2013/050378, dated Dec. 30, 2013 (8 pgs).
International Preliminary Report on Patentability issued in related application No. PCT/US2012/045443, dated Jan. 16, 2014 (6 pgs).
Mexican Office Action issued in related application No. MX/a/2013/009378, dated Mar. 27, 2014 (2 pgs).
PCT International Search Report and the Written Opinion, dated Dec. 23, 2011 (11 pgs).
Lauterbach, “Smart Clothes Self-Powered by Body Heat”, Avantex Symposium, 2002.
PCT Interntaional Search Report and the Written Opinion issued for PCT/Us2012/071838, dated Mar. 8, 2013 (10 pgs).
Mexican Office Action issued in corresponding Mexican Patent Application No. MX/a/2013/002569, dated Jun. 13, 2013 (3 pgs).
Official Action issued in U.S. Appl. No. 12/276,254, dated Jun 29, 2011 (23 pgs).
Skin Cooling Surfaces: Estimating the Importance of Limiting Skin Temperature, By Charles Lachenbruch, Ostomy Wound Management, Feb. 2005 (8 pgs).
Official Action issued if related U.S. Appl. No. 13/101,015 dated Mar. 21, 2014 (24 pgs).
Official Action issued if related U.S. Appl. No. 13/101,015 dated Nov. 4, 2013 (50 pgs).
Official Action issued if related U.S. Appl. No. 13/394,288 dated Aug. 18, 2014 (8 pgs).
Official Action issued if related U.S. Appl. No. 13/394,288 dated Jun. 12, 2014 (18 pgs).
Official Action issued if related U.S. Appl. No. 13/394,288 dated Mar. 18, 2014 (12 pgs).
Extended European Search Report issued in related application No. 11825739.3, dated Nov. 18, 2014 (11 pgs).
Office Action issued in related U.S. Appl. No. 13/394,288, dated Oct. 16, 2014 (7 pgs).
Philippines Office Action issued in related application No. 1/2013/500025, dated Nov. 6, 2014 (2 pgs).
European Office Action issued in related application No. 13828204.1, dated Apr. 1, 2015 (3 pgs).
European Search Report issued in related application No. 12807127.1, dated Apr. 2, 2015 (10 pgs).
International Preliminary Report on Patentability, PCT/US13/050378, dated Feb. 19, 2015 (7 pgs).
International Search Report and Written Opinion, PCT/US14/63511, dated Feb. 11, 2015 (9 pgs).
Office Action issued in related U.S. Appl. No. 13/394,288, dated Mar. 23, 2015 (20 pgs).
Office Action issued in related U.S. Appl. No. 13/541,530, dated Feb. 17, 2015 (31 pgs).
Office Action issued in related U.S. Appl. No. 13/728,794, dated Mar. 24, 2015 (62 pgs).
Philippines Examination Report issued in related application No. 1/2013/500025, dated Apr. 8, 2015 (2 pgs).
Chinese Office Action (with translation) issued in application No. 201180043196.7 dated Apr. 3, 2015 (34 pgs).
Co-pending U.S. Appl. No. 14/934,757, filed Nov. 6, 2015.
European Search Report and Written Opinion dated Oct. 12, 2010 for EP Application No. 07556398.9.
International Preliminary Report on Patentability dated Jul. 14, 2011 for PCT Application No. US2009/069959.
International Search Report and Written Opinion dated Apr. 15, 2009 for PCT Application No. US2007/060871.
International Search Report and Written Opinion dated Apr. 17, 2009 for PCT Application No. US2009/033660.
Notice of allowance dated Jun. 29, 2011 for U.S. Appl. No. 12/302,782.
Notice of allowance dated Sep. 7, 2012 for U.S. Appl. No. 12/367,965.
Notice of allowance dated Sep. 15, 2008 for U.S. Appl. No. 11/344,622.
Notice of allowance dated Nov. 21, 2011 for U.S. Appl. No. 12/376,254.
Office action dated Mar. 15, 2012 for U.S. Appl. No. 12/367,965.
Office action dated May 21, 2012 for U.S. Appl. No. 13/330,345.
Office action dated Nov. 13, 2015 for U.S. Appl. No. 13/394,288.
International search report and written opinion dated Jan. 21, 2016 for PCT/US2015/059598.
International search report and written opinion dated Jan. 29, 2014 for PCT/US2013/060549.
International search report and written opinion dated Apr. 22, 2016 for PCT/US2016/017603.
Office Action dated Feb. 1, 2016 for U.S. Appl. No. 13/541,530.
Office action dated Mar. 21, 2016 for U.S. Appl. No. 14/430,596.
European search report and opinion dated May 19, 2016 for Application No. 13828204.1.
International search report and written opinion dated Jun. 17, 2016 for PCT/US2016/019743.
Office action dated Jun. 3, 2016 for U.S. Appl. No. 13/940,093.
Office Action dated Jun. 29, 2016 for U.S. Appl. No. 13/394,288.
Office action dated Aug. 10, 2016 for U.S. Appl. No. 14/430,596.
Co-pending U.S. Appl. No. 15/426,733, filed Feb. 7, 2017.
Co-pending U.S. Appl. No. 15/468,407, filed Mar. 24, 2017.
Notice of Allowance dated Nov. 9, 2016 for U.S. Appl. No. 13/541,530.
Notice of Allowance dated Dec. 28, 2016 for U.S. Appl. No. 13/940,093.
Office Action dated Oct. 14, 2016 for U.S. Appl. No. 14/530,360.
Office Action dated Oct. 21, 2016 for U.S. Appl. No. 13/400,093.
U.S. Appl. No. 13/101,015, filed May 4, 2011.
U.S. Appl. No. 13/394,288, filed Mar. 5, 2012.
U.S. Appl. No. 13/541,530, filed Jul. 3, 2012.
U.S. Appl. No. 13/728,794, filed Dec. 27, 2012.
U.S. Appl. No. 13/940,093, filed Jul. 11, 2013.
U.S. Appl. No. 14/530,360, filed Oct. 31, 2014.
U.S. Appl. No. 13/101,015, filed May 4, 2011, Makansi et al.
U.S. Appl. No. 13/394,288, filed Mar. 5, 2012, Makansi et al.
U.S. Appl. No. 13/541,530, filed Jul. 3, 2012, Makansi et al.
U.S. Appl. No. 13/728,794, filed Dec. 27, 2012, Makansi.
U.S. Appl. No. 13/940,093, filed Jul. 11, 2013, Makansi et al.
U.S. Appl. No. 14/530,360, filed Oct. 31, 2014, Makansi et al.
International Preliminary Report on Patentability issued in related application No. PCT/US2012/071838, dated Jul. 17, 2014 (7 pgs).
Notice of Allowance issued in related U.S. Appl. No. 13/101,015, dated Jul. 24, 2014 (23 pgs).
Co-pending U.S. Appl. No. 15/662,534, filed Jul. 28, 2017.
Extended European Search Report and Search Opinion dated Jun. 30, 2017 for European Patent Application No. EP14859204.1.
International Search Report and Written Opinion dated Jul. 24, 2017 for International PCT Patent Application No. PCT/US2017/032959.
Office Action dated May 17, 2017 for U.S. Appl. No. 14/530,360.
Chinese Office Action (with translation) issued in application No. 201280033604.5, dated Jun. 16, 2015 (25 pgs).
Indonesian Office Action (no translation) issued in application No. W00201301075, dated Jun. 30, 2015 (2 pgs).
Office Action issued in U.S. Appl. No. 13/541,530, dated Jul. 30, 2015 (26 pgs).
Office Action issued in U.S. Appl. No. 13/940,093, dated Jul. 31, 2015 (56 pgs).
Office Action dated Dec. 15, 2017 for U.S. Appl. No. 14/530,360.
Evidentiary Reference “3MESH specification sheet”.
Office action dated Apr. 9, 2018 for U.S. Appl. No. 14/934,757.
Related Publications (1)
Number Date Country
20150219368 A1 Aug 2015 US
Provisional Applications (4)
Number Date Country
61403217 Sep 2010 US
61417380 Nov 2010 US
61433489 Jan 2011 US
61470039 Mar 2011 US
Continuations (1)
Number Date Country
Parent 13101015 May 2011 US
Child 14473882 US