The present invention relates to a DML (Directly Modulated Laser) driver for driving a DML.
In recent years, the traffic amount of communication in the world has been increasing year by year due to the remarkable development of SNS (Social Networking Service). Hereafter, a further increase in traffic amount is expected by the development of IOT (Internet of Things) and cloud computing technology. In order to support the massive traffic amount, the increase in communication capacity inside and outside the data center has been demanded.
With an increase in capacity, the standard specification of the Ethernet (registered trademark) of the main standard element of the network has been currently completed in standardization of 10 GbE and 40 GbE, and standardization of 100 GbE aiming for a larger capacity is almost completed. For the purpose of application to 100 GbE, from the viewpoint of the reduction of the power consumption, a driver using a DML has attracted attention (see NPL 1).
Graph (a) of
Embodiments of the present invention were completed in order to solve the problem. It is an embodiment of the present invention to provide a DML driver capable of improving the band of the EO response characteristic while suppressing the group delay in the vicinity of the relaxation oscillation frequency of a LD.
A DML driver of embodiments of the present invention includes a first transistor for receiving a signal at a gate or a base thereof; a first resistance connected at one end thereof with a first power supply voltage; a first inductor connected at one end thereof with the other end of the first resistance, and connected at the other end thereof with a drain or a collector of the first transistor; a second inductor connected at one end thereof with the drain or the collector of the first transistor, and connected at the other end thereof with an input terminal of a post driver for supplying a driving current to a laser diode; a second transistor for receiving a first control voltage at a gate or a base thereof, connected at a source or an emitter thereof with the first power supply voltage, and connected at a drain or a collector thereof with a node between the first resistance and the first inductor; a third transistor for receiving a second control voltage at a gate or a base thereof, connected at a drain or a collector thereof with a source or an emitter of the first transistor, and connected at a source or an emitter thereof with a second power supply voltage; a third inductor connected at one end thereof with a drain or a collector of the third transistor, and connected at the other end thereof with the second power supply voltage; a first capacitor connected at one end thereof with a drain or a collector of the third transistor, and connected at the other end thereof with the second power supply voltage; a second capacitor connected at one end thereof with a drain or a collector of the third transistor; and a second resistance connected at one end thereof with the other end of the second capacitor, and connected at the other end thereof with the second power supply voltage.
In accordance with embodiments of the present invention, a first transistor is provided with first and second resistances, first to third inductors, and first and second capacitors. This can add an equalizer function of suppressing the group delay in the vicinity of the relaxation oscillation frequency of the laser diode, and a peaking function of performing improvement of the band to the DML driver. This enables the suppression of the group delay in the vicinity of the relaxation oscillation frequency, and further the improvement of the band of the EO response characteristic. Further, in embodiments of the present invention, the second transistor is provided in parallel with the first resistance, and the third transistor is provided in parallel with the first capacitor. As a result, the first and second control voltages can adjust the peaking amount of the EO response characteristic.
Below, embodiments of the present invention will be described by reference to the accompanying drawings.
The post driver 2 is assumed to be a driver including a transistor (not shown), and capable of driving the LD 1. In embodiments of the present invention, to the post driver 2, a driver circuit with a given configuration is applicable.
The predriver 3 has an equalizer function of suppressing the group delay in the vicinity of the relaxation oscillation frequency fr of the LD 1, and a peaking function of performing improvement of the band. Specifically, the predriver 3 includes an NMOS transistor M1n for receiving a modulation signal Vin at the gate, a load resistance R1 connected at one end thereof with a power supply voltage V1 (first power supply voltage), a peaking inductor L1 connected at one end thereof with the other end of the load resistance R1, and connected at the other end thereof with the drain of the transistor M1n, a peaking inductor L2 connected at one end thereof with the drain of the transistor M1n, and connected at the other end thereof with the input terminal of the post driver 2, a PMOS transistor M1p for receiving a control voltage Vcon_p (first control voltage) at the gate thereof, connected with the power supply voltage V1 at the source thereof, and connected with the node between the load resistance R1 and the peaking inductor L1 at the drain thereof, an NMOS transistor Mxn for receiving a control voltage Vcon_n (second control voltage) at the gate, connected with the source of the transistor M1n at the drain thereof, and connected with a grounding voltage GND (a second power supply voltage lower than the first power supply voltage) at the source, an inductor Lx for suppressing the group delay connected at one end thereof with the drain of the transistor Mxn, and connected at the other end thereof with the grounding voltage GND, a peaking capacitor Cx connected at one end thereof with the drain of the transistor Mxn, and connected at the other end thereof with the grounding voltage GND, a peaking capacitor Cy connected at one end thereof with the drain of the transistor Mxn, and a peaking resistance Rx connected at one end thereof with the other end of the peaking capacitor Cy, and connected at the other end thereof with the grounding voltage GND.
The s in Equation (1) is the Laplace operator. The part 30 of
Further, for the load impedance between V1-L1, the PMOS transistor M1p is connected in parallel with the load resistance R1. When the control voltage Vcon_p to be inputted to the gate of the PMOS transistor M1p is increased, the transistor M1p is put in an OFF state, and the load impedance becomes R1. Conversely, when the control voltage Vcon_p is decreased, the transistor M1p is put in an ON state, and the load impedance becomes the impedance value in parallel with the ON resistance of the transistor M1p and the load resistance R1, and becomes a smaller value than R1. In other words, it becomes possible to adjust the peaking amount of the EO response characteristic by the control voltage Vcon_p.
The part 31 of
The part 32 of
Further, the control voltage Vcon_n to be inputted to the gate of the NMOS transistor Mx connected in parallel with the peaking capacitor Cx can adjust the peaking amount in the high region of the EO response characteristic. For example, when the control voltage Vcon_n is decreased, the transistor Mx is put into an OFF state, resulting in a high impedance between drain-source of the transistor Mxn. Whereas, when the control voltage Vcon_n is increased, the transistor Mxn is put into an ON state, resulting in a low impedance between drain-source of the transistor Mxn.
When a high impedance is caused between drain-source of the transistor Mxn, the impedance in parallel with the transistor Mxn and the capacitor Cx is also increased. For this reason, the peaking amount in the high region by the peaking function part 32 is suppressed. Conversely, when a low impedance is caused between drain-source of the transistor Mxn, the impedance in parallel with the transistor Mxn and the capacitor Cx is also reduced, resulting in an increase in peaking amount in the high region.
The peaking function parts 30 and 32 and the group delay suppressing function part 31 can implement the equalizer function. Even when a difference is caused in frequency characteristic among individual LD 1's, the adjustment of the control voltages Vcon_n and Vcon_p can adjust the equalizer according to each individual LD 1.
The peaking function parts 30 and 32 and the group delay suppressing function part 31 can improve the band of the EO response characteristic without increasing the resonant peak of the EO response characteristic as shown in
A second Embodiment of the present invention will be described.
The predriver 3a of the present embodiment includes a resistance Radd inserted between the source of the transistor M1n and the drain of the transistor Mxn in the predriver 3 of the first embodiment. Thus, in the present embodiment, the linearization function can be added to the predriver 3a. When the post driver 2 also has the linearization function, it becomes possible to drive the LD 1 even when the signal Vin to be inputted to the predriver 3a is a signal required to have linearity such as a PAM (Pulse Amplitude Modulation) signal or a DMT (Discrete MultiTone) signal.
A third embodiment of the present invention will be described.
The predriver 3b of the present embodiment includes a resistance Radd inserted between the drain of the transistor Mxn and one end of the inductor Lx in the predriver 3 of the first embodiment. In the present embodiment, as compared with the configuration of the second embodiment, it is possible to reduce the impedance added to the source of the transistor M1n in the high region, and it is possible to increase the gain of the driver. For this reason, it becomes possible to improve the frequency band.
A fourth embodiment of the present invention will be described.
The predriver 3c of the present embodiment includes an NMOS transistor M2n, in which a direct-current bias voltage V2 is inputted to the gate, the drain is connected with the node of the inductors L1 and L2, and the source is connected with the drain of the transistor M1n, inserted in the predriver 3 of the first embodiment. The bias voltage V2 is desirably set so that the transistors M1n and M2n operate in the saturation region.
In the present embodiment, the transistors M1n and M2n are connected in a cascode type, which can suppress the mirror effect in the transistor M1n. For this reason, it is possible to further improve the frequency characteristic of the DML driver.
Incidentally, in the first to fourth embodiments, the examples were shown in which a FET was used as the transistor M1n, M2n, Mxn, or M1p. However, it is also acceptable that a NPN bipolar transistor is used as the transistor M1n, M2n, or Mxn, and a PNP bipolar transistor is used as the transistor M1p. When a bipolar transistor is used, in the description in the first to fourth embodiments, it is essential only that the gate is replaced with the base, the drain is replaced with the collector, and the source is replaced with the emitter.
Embodiments of the present invention are applicable to the technology of directly modulating the optical output of a LD.
This patent application is a national phase filing under section 371 of PCT application No. PCT/JP2020/015638, filed on Apr. 7, 2020, which is incorporated herein by reference in its entirety.
Filing Document | Filing Date | Country | Kind |
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PCT/JP2020/015638 | 4/7/2020 | WO |