DOCUMENT AUTHENTICATION

Abstract

Disclosed herein is a method comprising: exposing a document to radiation; capturing a first image with a portion of the radiation that has transmitted through the document, with a first characteristic X-ray emitted from the document caused by the radiation, or with both, using a radiation detector; determining a pattern from the first image; determining authenticity of the document based on the pattern.

Description

BACKGROUND

X-ray fluorescence (XRF) is the emission of characteristic X-rays from a material that has been excited by, for example, exposure to high-energy X-rays or gamma rays. An electron on an inner orbital of an atom may be ejected, leaving a vacancy on the inner orbital, if the atom is exposed to X-rays or gamma rays with photon energy greater than the ionization potential of the electron. When an electron on an outer orbital of the atom relaxes to fill the vacancy on the inner orbital, an X-ray (fluorescent X-ray or secondary X-ray) is emitted. The emitted X-ray has a photon energy equal the energy difference between the outer orbital and inner orbital electrons.

For a given atom, the number of possible relaxations is limited. As shown in FIG. 1A, when an electron on the L orbital relaxes to fill a vacancy on the K orbital (L→K), the fluorescent X-ray is called Kα. The fluorescent X-ray from M→K relaxation is called Kβ. As shown in FIG. 1B, the fluorescent X-ray from M→L relaxation is called Lα, and so on.

Analyzing the fluorescent X-ray spectrum can identify the elements in a sample because each element has orbitals of characteristic energy. The fluorescent X-ray can be analyzed either by sorting the energies of the photons (energy-dispersive analysis) or by separating the wavelengths of the fluorescent X-ray (wavelength-dispersive analysis). The intensity of each characteristic energy peak is directly related to the amount of each element in the sample.

Proportional counters or various types of solid-state detectors (PIN diode, Si(Li), Ge(Li), Silicon Drift Detector SDD) may be used in energy dispersive analysis. These detectors are based on the same principle: an incoming photon of X-ray ionizes a large number of detector atoms with the amount of charge carriers produced being proportional to the energy of the incoming photon of X-ray. The charge carriers are collected and counted to determine the energy of the incoming photon of X-ray and the process repeats itself for the next incoming photon of X-ray. After detection of many photons of X-ray, a spectrum may be compiled by counting the number of photons of X-ray as a function of their energy.

SUMMARY

Disclosed herein is a method comprising: exposing a document to radiation; capturing a first image with a portion of the radiation that has transmitted through the document, with a first characteristic X-ray emitted from the document caused by the radiation, or with both, using a radiation detector; determining a pattern from the first image; determining authenticity of the document based on the pattern.

In an aspect, the radiation is X-ray having photon energies in a range from 6 keV to 9 keV.

In an aspect, the pattern is an intensity distribution of the radiation, an intensity distribution of the radiation, a spatial distribution of a chemical element in the document, a spatial distribution of a thickness of the document, or a combination thereof.

In an aspect, determining the authenticity of the document based on the pattern comprises comparing the pattern to a reference pattern.

In an aspect, the method further comprises capturing a second image with a second characteristic X-ray emitted from the document caused by the radiation; wherein determining the pattern is from both the first image and the second image; wherein the first characteristic X-ray and the second characteristic X-ray are different.

In an aspect, the radiation detector comprises: a radiation absorption layer comprising an electric contact; a first voltage comparator configured to compare a voltage of the electric contact to a first threshold; a second voltage comparator configured to compare the voltage to a second threshold; a counter configured to register a number of particles of radiation incident on the radiation absorption layer; a controller; wherein the controller is configured to start a time delay from a time at which the first voltage comparator determines that an absolute value of the voltage equals or exceeds an absolute value of the first threshold; wherein the controller is configured to activate the second voltage comparator during the time delay; wherein the controller is configured to cause the number to increase by one, when the second voltage comparator determines that an absolute value of the voltage equals or exceeds an absolute value of the second threshold.

In an aspect, the controller is configured to activate the second voltage comparator at a beginning or expiration of the time delay.

In an aspect, the controller is configured to connect the electric contact to an electrical ground.

In an aspect, a rate of change of the voltage is substantially zero at expiration of the time delay.

In an aspect, the radiation detector does not comprise a scintillator.

BRIEF DESCRIPTION OF FIGURES

FIG. 1A and FIG. 1B schematically show mechanisms of X-ray fluorescence (XRF).

FIG. 2 shows a flowchart for an imaging method, according to an embodiment.

FIG. 3 schematically shows a system, according to an embodiment.

FIG. 4A schematically shows a cross-sectional view of a radiation detector, according to an embodiment.

FIG. 4B schematically shows a detailed cross-sectional view of the radiation detector, according to an embodiment.

FIG. 4C schematically shows an alternative detailed cross-sectional view of the radiation detector, according to an embodiment.

FIG. 5 schematically shows that the radiation detector may have an array of pixels, according to an embodiment.

FIG. 6A and FIG. 6B each show a component diagram of an electronic system of the radiation detector in FIG. 4A, FIG. 4B and FIG. 4C, according to an embodiment.

FIG. 7 schematically shows a temporal change of the electric current flowing through an electrode (upper curve) of a diode or an electric contact of a resistor of a radiation absorption layer exposed to radiation, the electric current caused by charge carriers generated by a particle of radiation incident on the radiation absorption layer, and a corresponding temporal change of the voltage of the electrode (lower curve), according to an embodiment.

DETAILED DESCRIPTION

FIG. 2 shows a flowchart for a method, according to an embodiment. In procedure 710, a document (e.g., document 109 in FIG. 3) is exposed to radiation (e.g., radiation 101 in FIG. 3).

The document 109 may be a legal document, a banknote, a certificate, an identification paper, a document printed with special ink. The radiation may be X-ray having photon energies in a range from 6 keV to 9 keV. In procedure 720, a first image (e.g., first image 104 in FIG. 3) is captured using a radiation detector (e.g., radiation detector 100 in FIG. 3), with a portion of the radiation that has transmitted through the document, or with a first characteristic X-ray emitted from the document caused by the radiation, or with both. The radiation detector may be configured to distinguish the portion of the radiation and the first characteristic X-ray. The first characteristic X-ray may be emitted by a chemical element in the document under the excitation of the radiation. A second image (e.g., image 105 in FIG. 3) may be captured using the same radiation detector or a different radiation detector. The first image and the second image may be captured using radiation detector at different positions. The second image may be captured with a second characteristic X-ray emitted from the document caused by the radiation. The second characteristic X-ray is different from the first characteristic X-ray. For example, the first characteristic X-ray and the second characteristic X-ray are emitted by different chemical elements in the document. In procedure 730, a pattern (e.g., pattern 106 in FIG. 3) is determined from the first image (e.g., by a controller 310 in FIG. 3). The pattern may be determined from both the first image and the second image (e.g., from a superposition or combination of the first image and the second image). For example, the pattern may be an intensity distribution of the radiation, an intensity distribution of the radiation, a spatial distribution of a chemical element in the document, a spatial distribution of a thickness of the document, or a combination thereof. In procedure 740, authenticity of the document is determined based on the pattern. For example, determining the authenticity of the document based on the pattern may involve comparing the pattern with a reference pattern. The reference pattern may be determined in the same way from an authentic document as the pattern.

FIG. 3 schematically shows a system 200. The system 200 includes the radiation detector 100. The radiation detector 100 may be positioned at or moved to multiple locations relative to the document 109. The radiation detector 100 may be arranged at about the same distance or different distances from the document 109 at different times. The radiation detector 100 may have discrete portions at different locations relative to the document 109 at the same time. Other suitable arrangement of the radiation detector 100 may be possible. The position of the radiation detector 100 is not necessarily fixed. For example, the radiation detector 100 may be movable towards and away from the document 109 or may be rotatable relative to the document 109. The radiation detector 100 may be configured to capture images with X-rays with more than one wavelength. The radiation detector 100 may be configured capture images using only X-rays with wavelengths within a particular range. In an embodiment, the radiation detector 100 does not comprise a scintillator.

The system 200 may have a controller 310. The controller 310 may be used to determine the pattern 106 from the first image 104, or by superimposing or combining the first image 104 and the second image 105. The first image 104 and the second image 105 may be captured at different times, or at different positions relative to the document 109.

FIG. 4A schematically shows a cross-sectional view of the radiation detector 100, according to an embodiment. The radiation detector 100 may include a radiation absorption layer 110 and an electronics layer 120 (e.g., an ASIC) for processing or analyzing electrical signals incident radiation generates in the radiation absorption layer 110. The radiation absorption layer 110 may include a semiconductor material such as, silicon, germanium, GaAs, CdTe, CdZnTe, or a combination thereof. The semiconductor may have a high mass attenuation coefficient for the radiation of interest.

FIG. 4A schematically shows a cross-sectional view of the radiation detector 100, according to an embodiment. The radiation detector 100 may include a radiation absorption layer 110 and an electronics layer 120 (e.g., an ASIC) for processing or analyzing electrical signals incident radiation generates in the radiation absorption layer 110. In an embodiment, the radiation detector 100 does not comprise a scintillator. The radiation absorption layer 110 may include a semiconductor material such as, silicon, germanium, GaAs, CdTe, CdZnTe, or a combination thereof. The semiconductor may have a high mass attenuation coefficient for the radiation energy of interest. The surface of the radiation absorption layer 110 distal from the electronics layer 120 is configured to receive radiation.

As shown in a detailed cross-sectional view of the radiation detector 100 in FIG. 4B, according to an embodiment, the radiation absorption layer 110 may include one or more diodes (e.g., p-i-n or p-n) formed by a first doped region 111, one or more discrete regions 114 of a second doped region 113. The second doped region 113 may be separated from the first doped region 111 by an optional the intrinsic region 112. The discrete regions 114 are separated from one another by the first doped region 111 or the intrinsic region 112. The first doped region 111 and the second doped region 113 have opposite types of doping (e.g., region 111 is p-type and region 113 is n-type, or region 111 is n-type and region 113 is p-type). In the example in FIG. 4B, each of the discrete regions 114 of the second doped region 113 forms a diode with the first doped region 111 and the optional intrinsic region 112. Namely, in the example in FIG. 4B, the radiation absorption layer 110 has a plurality of diodes having the first doped region 111 as a shared electrode. The first doped region 111 may also have discrete portions.

When a particle of radiation hits the radiation absorption layer 110 including diodes, the particle of radiation may be absorbed and generate one or more charge carriers by a number of mechanisms. A particle of radiation may generate 10 to 100000 charge carriers. The charge carriers may drift to the electrodes of one of the diodes under an electric field. The field may be an external electric field. The electric contact 119B may include discrete portions each of which is in electrical contact with the discrete regions 114. In an embodiment, the charge carriers may drift in directions such that the charge carriers generated by a single particle of radiation are not substantially shared by two different discrete regions 114 (“not substantially shared” here means less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different one of the discrete regions 114 than the rest of the charge carriers). Charge carriers generated by a particle of radiation incident around the footprint of one of these discrete regions 114 are not substantially shared with another of these discrete regions 114. A pixel 150 associated with a discrete region 114 may be an area around the discrete region 114 in which substantially all (more than 98%, more than 99.5%, more than 99.9%, or more than 99.99% of) charge carriers generated by a particle of radiation incident therein at an angle of incidence of 0° flow to the discrete region 114. Namely, less than 2%, less than 1%, less than 0.1%, or less than 0.01% of these charge carriers flow beyond the pixel.

As shown in an alternative detailed cross-sectional view of the radiation detector 100 in FIG. 4C, according to an embodiment, the radiation absorption layer 110 may include a resistor of a semiconductor material such as, silicon, germanium, GaAs, CdTe, CdZnTe, or a combination thereof, but does not include a diode. The semiconductor may have a high mass attenuation coefficient for the radiation energy of interest.

When a particle of radiation hits the radiation absorption layer 110 including a resistor but not diodes, it may be absorbed and generate one or more charge carriers by a number of mechanisms. A particle of radiation may generate 10 to 100000 charge carriers. The charge carriers may drift to the electric contacts 119A and 119B under an electric field. The field may be an external electric field. The electric contact 119B includes discrete portions. In an embodiment, the charge carriers may drift in directions such that the charge carriers generated by a single particle of radiation are not substantially shared by two different discrete portions of the electric contact 119B (“not substantially shared” here means less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different one of the discrete portions than the rest of the charge carriers). Charge carriers generated by a particle of radiation incident around the footprint of one of these discrete portions of the electric contact 119B are not substantially shared with another of these discrete portions of the electric contact 119B. A pixel 150 associated with a discrete portion of the electric contact 119B may be an area around the discrete portion in which substantially all (more than 98%, more than 99.5%, more than 99.9% or more than 99.99% of) charge carriers generated by a particle of radiation incident at an angle of incidence of 0° therein flow to the discrete portion of the electric contact 119B. Namely, less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow beyond the pixel associated with the one discrete portion of the electric contact 119B.

The electronics layer 120 may include an electronic system 121 suitable for processing or interpreting signals generated by particles of radiation incident on the radiation absorption layer 110. The electronic system 121 may include an analog circuitry such as a filter network, amplifiers, integrators, and comparators, or a digital circuitry such as a microprocessor, and memory. The electronic system 121 may include components shared by the pixels or components dedicated to a single pixel. For example, the electronic system 121 may include an amplifier dedicated to each pixel and a microprocessor shared among all the pixels. The electronic system 121 may be electrically connected to the pixels by vias 131. Space among the vias may be filled with a filler material 130, which may increase the mechanical stability of the connection of the electronics layer 120 to the radiation absorption layer 110. Other bonding techniques are possible to connect the electronic system 121 to the pixels without using vias.

FIG. 5 schematically shows that the radiation detector 100 (e.g., the first radiation detector 100A, the second radiation detector 100B, and the third radiation detector 100C) may each have an array of pixels 150. The array may be a rectangular array, a honeycomb array, a hexagonal array or any other suitable array. Each pixel 150 may be configured to detect a particle of radiation incident thereon, to measure the energy of the particle of radiation, or both. For example, each pixel 150 may be configured to count numbers of particles of radiation incident thereon whose energy falls in a plurality of bins, within a period of time. All the pixels 150 may be configured to count the numbers of particles of radiation incident thereon within a plurality of bins of energy within the same period of time. Each pixel 150 may have its own analog-to-digital converter (ADC) configured to digitize an analog signal representing the energy of an incident particle of radiation into a digital signal. The ADC may have a resolution of 10 bits or higher. Each pixel 150 may be configured to measure its dark current, such as before or concurrently with each particle of radiation incident thereon. Each pixel 150 may be configured to deduct the contribution of the dark current from the energy of the particle of radiation incident thereon. The pixels 150 may be configured to operate in parallel. For example, when one pixel 150 measures an incident particle of radiation, another pixel 150 may be waiting for another particle of radiation to arrive. The pixels 150 may be but do not have to be individually addressable.

FIG. 6A and FIG. 6B each show a component diagram of the electronic system 121, according to an embodiment. The electronic system 121 may include a first voltage comparator 301, a second voltage comparator 302, a counter 320, a switch 305, an optional voltmeter 306 and a controller 310.

The first voltage comparator 301 is configured to compare the voltage of at least one of the electric contacts 119B to a first threshold. The first voltage comparator 301 may be configured to monitor the voltage directly, or calculate the voltage by integrating an electric current flowing through the electrical contact 119B over a period of time. The first voltage comparator 301 may be controllably activated or deactivated by the controller 310. The first voltage comparator 301 may be a continuous comparator. Namely, the first voltage comparator 301 may be configured to be activated continuously and monitor the voltage continuously. The first voltage comparator 301 may be a clocked comparator. The first threshold may be 5-10%, 10%-20%, 20-30%, 30-40% or 40-50% of the maximum voltage one incident particle of radiation may generate on the electric contact 119B. The maximum voltage may depend on the energy of the incident particle of radiation, the material of the radiation absorption layer 110, and other factors. For example, the first threshold may be 50 mV, 100 mV, 150 mV, or 200 mV.

The second voltage comparator 302 is configured to compare the voltage to a second threshold. The second voltage comparator 302 may be configured to monitor the voltage directly or calculate the voltage by integrating an electric current flowing through the diode or the electrical contact over a period of time. The second voltage comparator 302may be a continuous comparator. The second voltage comparator 302 may be controllably activate or deactivated by the controller 310. When the second voltage comparator 302 is deactivated, the power consumption of the second voltage comparator 302 may be less than 1%, less than 5%, less than 10% or less than 20% of the power consumption when the second voltage comparator 302 is activated. The absolute value of the second threshold is greater than the absolute value of the first threshold. As used herein, the term “absolute value” or “modulus” |x| of a real number xis the non-negative value of x without regard to its sign. Namely,

$❘x❘=\{\begin{array}{c}x,\mathrm{if}x\ge 0\\ -x,\mathrm{if}x\le 0\end{array}.$

The second threshold may be 200%-300% of the first threshold. The second threshold may be at least 50% of the maximum voltage one incident particle of radiation may generate on the electric contact 119B. For example, the second threshold may be 100 mV, 150 mV, 200 mV, 250 mV or 300 mV. The second voltage comparator 302 and the first voltage comparator 310 may be the same component. Namely, the system 121 may have one voltage comparator that can compare a voltage with two different thresholds at different times.

The first voltage comparator 301 or the second voltage comparator 302 may include one or more op-amps or any other suitable circuitry. The first voltage comparator 301 or the second voltage comparator 302 may have a high speed to allow the electronic system 121 to operate under a high flux of incident particles of radiation. However, having a high speed is often at the cost of power consumption.

The counter 320 is configured to register at least a number of particles of radiation incident on the pixel 150 encompassing the electric contact 119B. The counter 320 may be a software component (e.g., a number stored in a computer memory) or a hardware component (e.g., a 4017 IC and a 7490 IC).

The controller 310 may be a hardware component such as a microcontroller and a microprocessor. The controller 310 is configured to start a time delay from a time at which the first voltage comparator 301 determines that the absolute value of the voltage equals or exceeds the absolute value of the first threshold (e.g., the absolute value of the voltage increases from below the absolute value of the first threshold to a value equal to or above the absolute value of the first threshold). The absolute value is used here because the voltage may be negative or positive, depending on whether the voltage of the cathode or the anode of the diode or which electrical contact is used. The controller 310 may be configured to keep deactivated the second voltage comparator 302, the counter 320 and any other circuits the operation of the first voltage comparator 301 does not require, before the time at which the first voltage comparator 301 determines that the absolute value of the voltage equals or exceeds the absolute value of the first threshold. The time delay may expire before or after the voltage becomes stable, i.e., the rate of change of the voltage is substantially zero. The phase “the rate of change of the voltage is substantially zero” means that temporal change of the voltage is less than 0.1%/ns. The phase “the rate of change of the voltage is substantially non-zero” means that temporal change of the voltage is at least 0.1%/ns.

The controller 310 may be configured to activate the second voltage comparator during (including the beginning and the expiration) the time delay. In an embodiment, the controller 310 is configured to activate the second voltage comparator at the beginning of the time delay. The term “activate” means causing the component to enter an operational state (e.g., by sending a signal such as a voltage pulse or a logic level, by providing power, etc.). The term “deactivate” means causing the component to enter a non-operational state (e.g., by sending a signal such as a voltage pulse or a logic level, by cut off power, etc.). The operational state may have higher power consumption (e.g., 10 times higher, 100 times higher, 1000 times higher) than the non-operational state. The controller 310 itself may be deactivated until the output of the first voltage comparator 301 activates the controller 310 when the absolute value of the voltage equals or exceeds the absolute value of the first threshold.

The controller 310 may be configured to cause at least one of the number registered by the counter 320 to increase by one, if, during the time delay, the second voltage comparator 302 determines that the absolute value of the voltage equals or exceeds the absolute value of the second threshold.

The controller 310 may be configured to cause the optional voltmeter 306 to measure the voltage upon expiration of the time delay. The controller 310 may be configured to connect the electric contact 119B to an electrical ground, so as to reset the voltage and discharge any charge carriers accumulated on the electric contact 119B. In an embodiment, the electric contact 119B is connected to an electrical ground after the expiration of the time delay. In an embodiment, the electric contact 119B is connected to an electrical ground for a finite reset time period. The controller 310 may connect the electric contact 119B to the electrical ground by controlling the switch 305. The switch may be a transistor such as a field-effect transistor (FET).

In an embodiment, the system 121 has no analog filter network (e.g., a RC network). In an embodiment, the system 121 has no analog circuitry.

The voltmeter 306 may feed the voltage it measures to the controller 310 as an analog or digital signal.

The electronic system 121 may include an integrator 309 electrically connected to the electric contact 119B, wherein the integrator is configured to collect charge carriers from the electric contact 119B. The integrator 309 can include a capacitor in the feedback path of an amplifier. The amplifier configured as such is called a capacitive transimpedance amplifier (CTIA). CTIA has high dynamic range by keeping the amplifier from saturating and improves the signal-to-noise ratio by limiting the bandwidth in the signal path. Charge carriers from the electric contact 119B accumulate on the capacitor over a period of time (“integration period”). After the integration period has expired, the capacitor voltage is sampled and then reset by a reset switch. The integrator 309 can include a capacitor directly connected to the electric contact 119B.

FIG. 7 schematically shows a temporal change of the electric current flowing through the electric contact 119B (upper curve) caused by charge carriers generated by a particle of radiation incident on the pixel 150 encompassing the electric contact 119B, and a corresponding temporal change of the voltage of the electric contact 119B (lower curve). The voltage may be an integral of the electric current with respect to time. At time to, the particle of radiation hits pixel 150, charge carriers start being generated in the pixel 150, electric current starts to flow through the electric contact 119B, and the absolute value of the voltage of the electric contact 119B starts to increase. At time t₁, the first voltage comparator 301 determines that the absolute value of the voltage equals or exceeds the absolute value of the first threshold V1, and the controller 310 starts the time delay TD1 and the controller 310 may deactivate the first voltage comparator 301 at the beginning of TD1. If the controller 310 is deactivated before t₁, the controller 310 is activated at t₁. During TD1, the controller 310 activates the second voltage comparator 302. The term “during” a time delay as used here means the beginning and the expiration (i.e., the end) and any time in between. For example, the controller 310 may activate the second voltage comparator 302 at the expiration of TD1. If during TD1, the second voltage comparator 302 determines that the absolute value of the voltage equals or exceeds the absolute value of the second threshold V2 at time t₂, the controller 310 waits for stabilization of the voltage to stabilize. The voltage stabilizes at time t_e, when all charge carriers generated by the particle of radiation drift out of the radiation absorption layer 110. At time t_s, the time delay TD1 expires. At or after time t_e, the controller 310 causes the voltmeter 306 to digitize the voltage and determines which bin the energy of the particle of radiation falls in. The controller 310 then causes the number registered by the counter 320 corresponding to the bin to increase by one. In the example of FIG. 7, time t_s is after time t_e; namely TD1 expires after all charge carriers generated by the particle of radiation drift out of the radiation absorption layer 110. If time t_e cannot be easily measured, TD1 can be empirically chosen to allow sufficient time to collect essentially all charge carriers generated by a particle of radiation but not too long to risk have another incident particle of radiation. Namely, TD1 can be empirically chosen so that time t_s is empirically after time t_e. Time t_s is not necessarily after time t_e because the controller 310 may disregard TD1 once V2 is reached and wait for time t_e. The rate of change of the difference between the voltage and the contribution to the voltage by the dark current is thus substantially zero at t_e. The controller 310 may be configured to deactivate the second voltage comparator 302 at expiration of TD1 or at t₂, or any time in between.

The voltage at time t_e is proportional to the amount of charge carriers generated by the particle of radiation, which relates to the energy of the particle of radiation. The controller 310 may be configured to determine the energy of the particle of radiation, using the voltmeter 306.

After TD1 expires or digitization by the voltmeter 306, whichever later, the controller 310 connects the electric contact 119B to an electric ground for a reset period RST to allow charge carriers accumulated on the electric contact 119B to flow to the ground and reset the voltage. After RST, the electronic system 121 is ready to detect another incident particle of radiation. If the first voltage comparator 301 has been deactivated, the controller 310 can activate it at any time before RST expires. If the controller 310 has been deactivated, it may be activated before RST expires.

While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.

Claims

1. A method comprising: exposing a document to radiation;capturing a first image with a portion of the radiation that has transmitted through the document, with a first characteristic X-ray emitted from the document caused by the radiation, or with both, using a radiation detector;determining a pattern from the first image;determining authenticity of the document based on the pattern.

2. The method of claim 1, wherein the radiation is X-ray having photon energies in a range from 6 keV to 9 keV.

3. The method of claim 1, wherein the pattern is an intensity distribution of the radiation, an intensity distribution of the radiation, a spatial distribution of a chemical element in the document, a spatial distribution of a thickness of the document, or a combination thereof.

4. The method of claim 1, wherein determining the authenticity of the document based on the pattern comprises comparing the pattern to a reference pattern.

5. The method of claim 1, further comprising capturing a second image with a second characteristic X-ray emitted from the document caused by the radiation; wherein determining the pattern is from both the first image and the second image;wherein the first characteristic X-ray and the second characteristic X-ray are different.

6. The method of claim 1, wherein the radiation detector comprises: a radiation absorption layer comprising an electric contact;a first voltage comparator configured to compare a voltage of the electric contact to a first threshold;a second voltage comparator configured to compare the voltage to a second threshold;a counter configured to register a number of particles of radiation incident on the radiation absorption layer;a controller;wherein the controller is configured to start a time delay from a time at which the first voltage comparator determines that an absolute value of the voltage equals or exceeds an absolute value of the first threshold;wherein the controller is configured to activate the second voltage comparator during the time delay;wherein the controller is configured to cause the number to increase by one, when the second voltage comparator determines that an absolute value of the voltage equals or exceeds an absolute value of the second threshold.

7. The method of claim 6, wherein the controller is configured to activate the second voltage comparator at a beginning or expiration of the time delay.

8. The method of claim 6, wherein the controller is configured to connect the electric contact to an electrical ground.

9. The method of claim 6, wherein a rate of change of the voltage is substantially zero at expiration of the time delay.

10. The method of claim 6, wherein the radiation detector does not comprise a scintillator.