Patent Application
20200213795
The present disclosure relates to the technical field of speakers, and in particular, to a dome material, a diaphragm and a speaker.
With advent of a mobile internet era, numerous smart mobile devices continuously emerge. Among these numerous mobile devices, mobile phones are undoubtedly the most common and portable mobile terminal devices. At present, mobile phones have extremely various functions, one of which is high-quality music displaying. Hence, a speaker box for playing sound is widely used in today's smart mobile devices.
The existing speakers usually use diaphragm to vibrate and to sound, and a high frequency cut-off frequency thereof is an important parameter for evaluating the diaphragm. In the related art, the diaphragm usually includes a diaphragm body and a dome attached to a central position of the diaphragm, and the dome usually has a sandwich structure composed an aluminum foil, polymethacrylimide foam plastic (PMI), and aluminum foil. However, the aluminum foil dome with such a sandwich structure usually has a high-frequency cut-off frequency smaller than 8.5 KHz, which can not meet the requirements on the high-pitched acoustic performance of the speaker.
Many aspects of the exemplary embodiment can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
1 intermediate layer;
2 adhesive layer;
3 film layer;
4 surface layer.
The present disclosure will be further described in detail in the following with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the present disclosure and are not intended to limit the present disclosure.
In this embodiment, the speaker includes a diaphragm, and the diaphragm is formed by cutting a dome material. As shown in
The intermediate layer 1 of the dome material is made of a foamed material. The adhesive layer 2, the film layer 3 and the surface layer 4 are stacked, from the center to the outside, on each of two sides of the intermediate layer 1. The surface layer 4 adopts a fiber prepreg, which can improve a quality of the dome material. With the diaphragm and the speaker formed by the dome material according to the present embodiment of the present disclosure, the high frequency cut-off frequency can be increased to 10 KHz, thereby meeting people's requirements on the high-pitched acoustic performance of the speaker.
In this embodiment, the foamed material is a rigid foamed material, and for example, has a density of 0.05 g/cm3, 0.10 g/cm3, 0.15 g/cm3, 0.20 g/cm3, 0.25 g/cm3, 0.30 g/cm3, 0.35 g/cm3, 0.40 g/cm3, 0.45 g/cm3, 0.50 g/cm3, etc. The intermediate layer 1 can include a material selected from the group consisting of polymethacrylimide (PMI) foamed plastic, Micro Cellular PET (MCPET), polyimide (PI), polyamideimide (PAI) and phenylene sulfide (PPS), and combinations thereof. In other embodiments, the intermediate layer can also include a material selected from the group consisting of polystyrene, rigid polyurethane, phenolic resin, amino resin, epoxy resin, rigid polyvinyl chloride, and combinations thereof.
The thickness of the adhesive layer 2 can be in a range of 5-15 μm, for example, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, etc. The thickness of the adhesive layer 2 can also be in a range of 3-5 μm, for example, 3 μm, 4 μm, 5 μm, etc. The thickness of the adhesive layer 2 can also be in a range of 15-20 μm, for example, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, etc. The adhesive layer 2 is formed by an adhesive. In this embodiment, the adhesive is selected from the group consisting of epoxy resin, phenolic resin, acrylic resin, silica gel, and combinations thereof. The adhesive is used for bonding and fixing the intermediate layer 1 with the film layer 3, and thus it can be any material capable of bonding and fixing intermediate layer 1 with the film layer 3. For example, in other embodiments, the adhesive can be, for example, selected from the group consisting of cellulose ester, vinyl polymer, polyether, polyamide, phenolic aldehyde-butyronitrile adhesive, phenolic aldehyde-neoprene adhesive, phenolic aldehyde-polyurethane adhesive, epoxy-butyronitrile adhesive, epoxy-polysulfide, and combinations thereof.
The thickness of the film layer 3 can be in a range of 5-15 μm, for example: 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, etc. The thickness of the film layer 3 can also be in a range of 2-5 μm, for example, 2 μm, 3 μm, 4 μm, 5 μm, etc. The thickness of the film layer 3 can also be in a range of 15-20 μm, for example, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, etc. In the present embodiment, the film layer 3 is made of a high modulus material, and the film layer 3 includes a material selected from the group consisting of aluminum foil, magnesium lithium alloy foil, titanium foil, polyimide (PI), liquid crystal polymer (LCP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and combinations thereof. In other embodiments, the film layer 3 can also include a material selected from the group consisting of lithium aluminum alloy foil, magnesium aluminum alloy foil, polyphenylene ether (PPE), and combinations thereof.
In the fiber prepreg of the surface layer 4, the weight percentage of the resin can be, for example, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, etc.. The surface density of the fiber prepreg can be, for example, 10 g/m2, 15 g/m2, 20 g/m2, 25 g/m2, 30 g/m2, 35 g/m2, 40 g/m2, 45 g/m2, 50 g/m2, 55 g/m2, 60 g/m2, 65 g/m2, 70 g/m2, 75 g/m2, 80 g/m2, 85 g/m2, 90 g/m2, 95 g/m2, 100 g/m2, etc.. In the present embodiment, the resin can be selected from the group consisting of epoxy resin, phenolic resin, polyamide resin, polyetheretherketone (PEEK), polyimide (PI), polyetherimide (PEI), and combinations thereof. In other embodiments, the resin can also be selected from the group consisting of polypropylene (PP), polycarbonate (PC), polyether sulfone (PES), and combinations thereof. In this embodiment, the fiber is selected from the group consisting of carbon fiber, glass fiber, aramid fiber, basalt fiber, and combinations thereof. For example, the fiber is selected from the group consisting of polyacrylonitrile-based carbon fiber, pitch-based carbon fiber, poly-p-phenylene benzobisthiazole fiber (PBO fiber), poly-p-phenylene terephthalamide, PE fiber, AR glass fiber, high-strength glass fiber, E-glass fiber, and combinations thereof.
The above described embodiments are merely intended to illustrate the present disclosure, and it should be noted that, without departing from the inventive concept of the present disclosure, the improvements made by those skilled in the related art shall fall within the protection scope of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201811637249.8 | Dec 2018 | CN | national |
