Claims
- 1. A dough comprising:
(a) from about 55% to about 98%, by weight, of a dehydrated potato product having less than 40% broken cells, a free amylose level of less than 16% or a mixture thereof; (b) from about 1% to about 15%, by weight, of a strengthening agent having a free amylose level of at least 5% and a water absorption index of from about 0 to about 3; and (c) from about 1% to about 10%, by weight, of a water absorption agent having a water absorption index of greater than about 8.5; and (d) a solvent.
- 2. A dough comprising from about 55% to about 98%, by weight, of a dehydrated potato product having less than 40% broken cells, a free amylose level of less than 16% or a mixture thereof; said dough having a sheet tensile strength of from about 80 gf to about 1000 gf; a modulus of elasticity of from about 24 KPa to about 130 KPa; and a viscous modulus of from about 5 KPa to about 40 KPa.
- 3. The dough of claim 2 having a glass transition temperature (Tg) of from about −7° C. to about 10° C.
- 4. A dough comprising:
(a) from about 55% to about 98.9%, by weight, of a dehydrated potato product having greater than 60% broken cells; (b) from about 0.1% to about 10%, by weight, of an anti-stiffening agent having a peak viscosity of from about 40 cp to about 600 cp, and a final viscosity of from about 20 cp to about 400 cp; and (c) a solvent.
- 5. The dough of claim 4 comprising from about 1% to about 20%, by weight, of a water absorption agent having a water adsorption index of greater than about 5.
- 6. A dough comprising from about 55% to about 98.9%, by weight, of a dehydrated potato product having greater than 60% broken cells; said dough having a modulus of elasticity of from about 20 KPa to about 90 KPa, and a viscous modulus of from about 10 KPa to about 25 KPa.
- 7. The dough of claim 6 having a glass transition temperature (Tg) of from about −10° C. to about 10° C.
- 8. The dough of claim 6 having a sheet tensile strength of from about 60 gf to about 600 gf.
- 9. The dough of claim 8 having a glass transition temperature (Tg) of from about −10° C. to about 10° C.
- 10. A dough comprising:
(a) from about 55% to about 98%, by weight, of a dehydrated potato product having less than 40% broken cells and a free amylose level of more than 27%; (b) from about 1% to about 15%, by weight, of a water absorption agent having a water absorption index greater than about 8.5; and (c) a solvent.
- 11. The dough of claim 10 comprising from about 1% to about 15%, by weight, of a wetting agent having a peak viscosity of from about 300 cp to about 2000 cp, and a final viscosity of from about 190 cp to about 1900 cp.
- 12. A dough comprising from about 55% to about 98%, by weight, of a dehydrated potato product having less than 40% broken cells and a free amylose level of more than 27%; said dough having a modulus of elasticity of from about 35 KPa to about 110 KPa and a viscous modulus of from about 5 KPa to about 25 KPa.
- 13. The dough of claim 12 having a sheet tensile strength of from about 100 gf to about 600 gf.
- 14. The dough of claim 13 having a glass transition temperature (Tg) of from about −1° C. to about 8° C.
- 15. A fabricated chip made with the dough of claim 2, wherein said fabricated chip has a Tg1 greater than about 40° C. and a Tg2 of greater than about 70° C.
- 16. A fabricated chip made with the dough of claim 6, wherein said fabricated chip has a Tg1 greater than about 40° C. and a Tg2 greater than about 70° C.
- 17. A fabricated chip made with the dough of claim 12, wherein said fabricated chip has a Tg1 greater than about 40° C. and a Tg2 greater than about 70° C.
- 18. The fabricated chip of claim 15, wherein said fabricated chip has a density of from about 0.55 g/ml to about 1.1 g/ml.
- 19. The fabricated chip of claim 16, wherein said fabricated chip has a density of from about 0.55 g/ml to about 1.1 g/ml.
- 20. The fabricated chip of claim 17, wherein said fabricated chip has a density of from about 0.55 g/ml to about 1.1 g/ml.
- 21. A fabricated chip having a Tg1 greater than about 40° C., a Tg2 of greater than about 70° C., and a density of from about 0.55 g/ml to about 1.1 g/ml.
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of priority to U.S. Provisional Application Serial No. 60/338,047, filed Nov. 8, 2001, which is herein incorporated by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60338047 |
Nov 2001 |
US |