This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2007-003541, filed Jan. 11, 2007, the entire contents of which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to a driver and a driver/receiver system, and the invention is applied, for example, to a driver which adopts a variable output impedance LVDS (Low Voltage Differential Signaling) method.
2. Description of the Related Art
Conventionally, there is known a driver which adopts, for example, a variable output impedance LVDS (Low Voltage Differential Signaling) method (hereinafter referred to as “LVDS driver”) (see, for instance, Jpn. Pat. Appln. KOKAI Publications No. H9-214314 and No. 2006-60320). There is an LVDS driver which includes a switch for turning on/off the conduction path between output resistors which are connected to two output terminals.
In the structure of the conventional LVDS, however, there is a tendency that the circuit area increases, which is disadvantageous for microfabrication.
The reason for this is as follows. In a case where a MOS transistor (MOSFET), which is fabricated by an ordinary CMOS fabrication process, is used as the above-described switch, it is necessary to make an ON resistance (Rsw) of the switch (MOSFET) sufficiently lower than an output resistance (e.g. about 50Ω) of the LVDS driver. As a result, the gate width (W) of the switch (MOSFET) considerably increases, and the area of occupation of the switch (MOSFET) greatly increases. The great increase in occupation area of the switch (MOSFET) leads to an increase in area of the entirety of the driver, and this is disadvantageous in terms of manufacturing cost.
In addition, with the great increase in occupation area of the switch (MOSFET), a parasitic capacitance between the gate and drain of the switch and a parasitic capacitance between the gate and source of the switch also increase, and power supply noise may easily be mixed in.
According to an aspect of the present invention, there is provided a driver comprising: an output circuit which converts an input signal to a predetermined output waveform and outputs the predetermined waveform to first and second output terminals; a first output resistor having one end connected to the first output terminal; a second output resistor having one end connected to the second output terminal; an output resistor switch element having one end connected to the other end of the first output resistor, and having the other end connected to the other end of the second output resistor; and a 2-input-2-output amplifier which receives first and second input voltages corresponding to voltages at both ends of the output resistor switch element, and outputs voltages, which are produced by amplifying voltage differences between a reference voltage and the first and second input voltages, once again to both ends of the output resistor switch element as first and second output voltages, a high impedance state being set between both ends of the output resistor switch element when a stop signal is input to the 2-input-2-output amplifier.
According to another aspect of the present invention, there is provided a driver/receiver system comprising: a driver, the driver including: an output circuit which converts an input signal to a predetermined output waveform and outputs the predetermined waveform to first and second output terminals; a first output resistor having one end connected to the first output terminal; a second output resistor having one end connected to the second output terminal; an output resistor switch element having one end connected to the other end of the first output resistor, and having the other end connected to the other end of the second output resistor; and a 2-input-2-output amplifier which receives first and second input voltages corresponding to voltages at both ends of the output resistor switch element, and outputs voltages, which are produced by amplifying voltage differences between a reference voltage and the first and second input voltages, once again to both ends of the output resistor switch element as first and second output voltages, a high impedance state being set between both ends of the output resistor switch element when a stop signal is input to the 2-input-2-output amplifier; and a receiver which receives output signals of the driver, which are output from the first and second output terminals.
Embodiments of the present invention will now be described with the accompanying drawings. In the description below, common parts are denoted by like reference numerals throughout the drawings.
An example of the basic structure of a driver according to an embodiment of the present invention is described with reference to
To begin with, a driver/receiver system, which includes the driver according to the present embodiment, is described with reference to
As shown in
As will be described later, the LVDS driver 11 is configured to amplify an input signal SIN by a small amplitude differential signaling method (LVDS) and to output a predetermined driver output signal SOUT to the receiver 12 from output terminals 15-1 and 15-2. In this manner, by using the small amplitude differential signaling method (LVDS), the LVDS driver 11 can perform differential transmission with a small signal amplitude. Therefore, the amount of occurring noise can be reduced, and the power consumption can be decreased.
The receiver 12 is configured to receive the driver output signal SOUT that is input via the transmission lines L1 and L2.
Normally, the LVDS driver 11 includes a terminal end resistor R0 which has one end and the other end connected between differential output terminals. For example, the resistance value of the terminal end resistor R0 is about 100Ω.
The LVDS driver 11 prevents reflection of the output signal SOUT by matching the transmission line impedance of the transmission line L1, L2 and the impedance of the terminal end resistor R0 at the input section of the receiver 12.
However, in the case where the differential output terminals (e.g. output pins) 15-1 and 15-2 of the LVDS driver 11 are shared with other circuits, it is necessary to set the output resistance between the differential output terminals 15-1 and 15-2 in the open state.
For this purpose, at first, the LVDS driver 11 needs to be configured such that the ON state (conductive state) can be set between the differential output terminals 15-1 and 15-2 and the OFF state (non-conductive state) can be set between the differential output terminals 15-1 and 15-2.
Second, the LVDS driver 11 needs to be configured to realize, with a small increase in device area, switching between the two states, i.e. the ON state and OFF state of connection between the differential output terminals 15-1 and 15-2.
Third, the LVDS driver 11 needs to be configured to reduce, regardless of fabrication processes and operational environments, a variation in output resistance value due to the switching between the two states, i.e. the ON state and OFF state of conduction between the differential output terminals 15-1 and 15-2.
Next, referring to
The LVDS output circuit 16 is configured to convert a driver input signal SIN, which is input, to a predetermined output waveform signal by the small amplitude differential signaling method (LVDS) and to output the predetermined output waveform signal.
The output resistor RP is an output resistor having one end connected to the output terminal (first output terminal) 15-1 and the other end connected to one end of a current path of the output resistor switch element SW1.
The output resistor RN is an output resistor having one end connected to the output terminal (second output terminal) 15-2 and the other end connected to the other end of the current path of the output resistor switch element SW1.
The output resistor switch element SW1 has the current path with the one end and the other end connected to the other ends of the output resistors RP and RN, respectively.
The 2-input-2-output amplifier 19 is configured to receive a first input voltage Vin1 and a second input voltage Vin2, which correspond to voltages at both ends of the output resistor switch element SW1, and to output first and second output voltages Vo1 and Vo2, which are obtained by amplifying voltage differences between the first and second input voltages Vin1 and Vin2 and a reference voltage Vcm, once again to both ends of the output resistor switch element SW1.
In addition, the 2-input-2-output amplifier 19 is configured such that if the stop signal SS is input to the 2-input-2-output amplifier 19, a high impedance state is set between both ends of the output resistor switch element SW1. The output resistor switch element SW1 is configured such that if the stop signal SS is input to the gate of the element SW1, a high impedance state is set between both ends of the output resistor switch element SW1. Thus, if the stop signal SS is input to the 2-input-2-output amplifier 19, an open state is set between the output terminals (out1, out2) of the 2-input-2-output amplifier 19.
Next, an example of the structure of the LVDS output circuit 16 relating to the present embodiment is described with reference to
An input of the current source Ic-1 is connected to a reference power supply VDD, and an output of the current source Ic-1 is connected to the sources of the PMOS transistors QP1 and QP2.
An input of the current source Ic-2 is connected to a ground power supply VSS, and an output of the current source Ic-2 is connected to the sources of the NMOS transistors QN1 and QN2.
The drain of the PMOS transistor QP1 is connected to the output terminal 15-1, and the control signal −Φ is input to the gate of the PMOS transistor QP1. The drain of the PMOS transistor QP2 is connected to the output terminal 15-2, and the control signal Φ is input to the gate of the PMOS transistor QP2.
The drain of the NMOS transistor QN1 is connected to the output terminal 15-1, and the control signal −Φ is input to the gate of the NMOS transistor QN1. The drain of the NMOS transistor QN2 is connected to the output terminal 15-2, and the control signal Φ is input to the gate of the NMOS transistor QN2.
Accordingly, as regards the MOS switches QP1, QP2, QN1 and QN2, when the control signal Φ is at the level of the reference power supply VDD, the MOS switches QP1 and QN2 are turned on and the MOS switches QN1 and QP2 are turned off. On the other hand, when the control signal φ is at the level of the ground power supply VSS, the MOS switches QP1 and QN2 are turned off and the MOS switches QP2 and QN1 are turned on.
As described above, the LVDS output circuit 16 of this embodiment is different from an LVDS differential amplifier circuit 116 according to a comparative example (to be described later) in that the LVDS output circuit 16 does not include a buffer amplifier 117 which functions as an amplifier unit.
Next, an example of the structure of the above-described switch element SW1 according to the present embodiment is described with reference to
<4-1. Example in which the Switch Element SW1 is Composed of a PMOS Transistor (Pch Switch)>
In an example shown in
<4-2. Example in which the Switch Element SW1 is Composed of an NMOS Transistor (Nch Switch)>
In an example shown in
<4-3. Example in which the Switch Element SW1 is Composed of a CMOS Switch>
In an example shown in
The source of the PMOS transistor QP4 is connected to the output terminal 15-1 via the output resistor RP, the drain of the PMOS transistor QP4 is connected to the output terminal 15-2 via the output transistor RN, and the gate of the PMOS transistor QP4 is connected to the ground power supply VSS. The source of the NMOS transistor QN4 is connected to the drain of the PMOS transistor QP4, the drain of the NMOS transistor QN4 is connected to the source of the PMOS transistor QP4, and the gate of the NMOS transistor QN4 is connected to the reference power supply VDD.
The resistance values ron of the ON resistances, which are described in the above <4-1> to <4-3>, are expressed by:
where VTN and VTP are threshold values of the NMOS transistors QN3 and QP3, and μN and μP are the mobility of electrons and the mobility of holes, respectively. These values of the threshold voltages and mobilities are variable depending on temperatures. Cox is the unit area capacity of the oxide film, and W and L are the channel width and channel length of the transistor, respectively.
In the above equation (1), the mobility μN, μP, the unit area capacity Cox of the oxide film, and the threshold voltage VTN, VTP are inherent values of the device. The minimum value of the channel length L is restricted by the precision in microfabrication. Normally, when the MOSFET switch is designed, the minimum value of the channel length L is set at a minimum value that is set by design rules, in order to decrease the ON resistance value. Besides, the reference power supply VDD and offset voltage Vos are normally set by circuit specifications.
Accordingly, in the circuit design stage, the parameter, which has a degree of freedom in order to determine the ON resistance of the MOSFET switch, is only the channel width W. Thus, the channel width W needs to be increased in order to decrease the ON resistance.
When one of the PchFET switch QP3, NchFET switch QN3 and CMOS switch, which are shown in the above <4-1> to <4-3>, is to be chosen as the output resistor switch element SW1, it is preferable, in terms of area cost, to give consideration to the mobilities of electrons and holes and the voltage values of the reference power supply VDD and offset voltage Vos that are determined by specifications, and to choose the switch which minimizes the area even with the same resistance value.
No matter which of the structures of the above <4-1> to <4-3> is chosen, the resistance value ron of the ON resistance of the output resistor switch element SW1 has the following relationship expressed by formula (2):
As has been described above, in order to reduce the ON resistance value ron, the channel width W has to be increased.
Next, an example of the structure of the 2-input-2-output amplifier 19 according to the present embodiment is described with reference to
One end of a current path of the switch element SW2 is connected to the said other end of the output resistor RP, and the other end of the current path is connected to the first input (first input voltage Vin1) of the amplifier 19. One end of a current path of the switch element SW3 is connected to the said other end of the output resistor RN, and the other end of the current path is connected to the second input (second input voltage Vin2) of the amplifier 19.
The amplifier amp1 is configured such that the reference voltage Vcm is input to a first input terminal of the amplifier amp1 and the first input voltage Vin1 and second input voltage Vin2 of the amplifier 19 are input to a second input terminal of the amplifier amp1, and outputs corresponding to differences between the reference voltage Vcm and the first input voltage Vin1 and second input voltage Vin2 are delivered to the amplifiers amp2 and amp3. In addition, the amplifier amp1 has a gain −A1.
The output voltage of the amplifier amp2 is output to the said one end of the current path of the switch element SW1 as the first output voltage Vo1 of the amplifier 19. The output voltage of the amplifier amp3 is output to the said other end of the current path of the switch element SW1 as the second output voltage V02 of the amplifier 19. Each of the amplifiers amp2 and amp3 has a gain −A2.
The amplifiers amp2 and amp3 are configured such that a high impedance state is set between the amplifiers amp2 and amp3 if the stop signal SS is input.
Next, the output operation of the LVDS driver 11 according to this embodiment is described with reference to
As shown in
Accordingly, the LVDS driver 11 has output waveforms (Vop, Von) as shown in the lower part of
<7. Comparison with a Driver According a Comparative Example>
Next, referring to
To begin with, an output impedance Rtot, as viewed from the output terminal (Vop) 115-1, is found in order to examine a variation in output resistance due to the insertion of ON/OFF switches SW11 and SW12 between output resistors of the LVDS driver 111 of the comparative example shown in
The output resistance of the current source circuit that is composed of transistors (MOSFETs), which operate in a saturation region, is a high resistance on the order of MΩ. Thus, the output resistance of the current source circuit is sufficiently higher than the resistance values Rout and Rsw of the output resistors Rp and Rn and is ignorable. Therefore, the output impedance, as viewed from the output terminal (Vop) 115-1, can be simplified as in an equivalent circuit 200 shown in
For example,
In the meantime, as shown in
In the case of the structure of the buffer amplifier 117 shown in
If the size of the transistor Mp1 shown in
In equation (3), λp is a channel length modulation coefficient, which is an inherent value of a transistor (MOSFET) having process dependency.
Then, since the gain −A2 of the output stage is expressed by −gm·ro, the gain At of the entire buffer amplifier 117 is expressed by the following equation (4):
A
T=(−A1)×(−A2)=A1×gmro (4)
Further, if the equivalent circuit 200 of the buffer amplifier shown in
Moreover, by using the buffer amplifier in which feedback is effected, the output resistance ro of the buffer amplifier 117 is improved to the reciprocal of the loop gain (1+At). If the output resistance of the buffer amplifier 117 is Ro_buf, the output impedance Rtot is expressed by the following equation (5a):
R
tot
=R
out
+R
o
buf
+R
sw (5a)
The resistor Rp, Rn having the resistance value Rout is formed of, e.g. polycrystalline silicon, and is substantially free from process variations such as temperature dependency, power supply voltage dependency and a threshold voltage of the transistor (MOSFET), although there occurs a variation in absolute value due to process conditions.
On the other hand, as regards the switch elements which are transistors (MOSFET), the value of the ON resistance Rsw of the switch SW11, SW12 greatly varies due to a temperature variation, a power supply voltage variation and a threshold voltage variation, as expressed in the above equation (1).
If it is assumed that a complete differential operation is performed with the output voltages Vop and Von at the output terminals 115-1 and 115-2 of the LVDS driver 116 according to the comparative example shown in
R
tot
=R
out
+R
SW (5b)
Actually, however, the complete differential operation is not performed, for example, due to an in-phase component resulting from an error current of the current value Ic that is supplied to the output voltage Vop, Von, and skew of the switch control signal Φ, −Φ.
Thus, the buffer amplifier 117 is necessary in the LVDS output driver 111 of the current output type. In order to obtain a stabler operation point voltage, it is necessary to sufficiently lower the value of the output resistance Ro_buf of the buffer amplifier, as shown in equation (5b).
From the above equation (5a), in order to decrease the process variation of the output impedance Rtot of the LVDS output driver 116, the relationship of the following equation (6) needs to be satisfied:
R
out
>>R
o
buf
+R
SW (6)
Normally, the resistance value Rout is a small value, for example, about 50Ω. Thus, in order to meet the relationship of equation (6), if it is assumed that the ON resistance Rsw of the switch SW11, SW12 is constituted by the transistors (MOSFET), the gate width W has to be considerably increased. This leads to an increase in device area of the switch SW11, SW12. The resistance value Ro_buf increases as the frequency becomes higher, but is a small value, e.g. about several Ω, in the vicinity of DC.
As described above, in the structure in which the two output resistor ON/OFF switch elements SW11 and SW12 are provided in the LVDS output driver 111 according to the comparative example, the gate width W of the switch element SW11, SW12 needs to be considerably increased, and the circuit area increases.
Specifically, the reason for this is that in the ordinary CMOS fabrication process, in order to make the ON resistance Rsw of the switch element SW11, SW12 sufficiently lower than the resistance of the LVDS output resistor Rp, Rn (e.g. about 50Ω), the gate width W needs to be considerably increased. The increase in area of the switch element SW11, SW12, which is the transistor (MOSFET), leads to an increase in circuit area and an increase in manufacturing cost. In addition, a parasitic capacitance between the gate and drain and between the gate and source of the transistor (MOSFET) increases, and power supply noise may easily mix in.
If the added resistance value of the ON resistances Rsw and Rout is Rtot, the resistance value Rtot becomes the output resistance of the LVDS driver 111. It is thus considered that it should suffice to set the ON resistance Rout so as to obtain the output resistance Rtot=50Ω, taking the resistance value of the ON resistance Rsw into account in advance in the stage of design.
In fact, however, there is a variation of about 50% to 200% or more due to process variations of the ON resistance Rsw of the switch element SW11 and variations in operational conditions. Therefore, the ON resistance Rsw should be as small as possible, relative to the ON resistance Rout, in order to limit the variations of the output resistance value of the resistance value Rtot and differential output amplitude Vod within the ranges that are set by specifications.
As has been described above, the example of the structure of the LVDS driver 111 according to the comparative example is disadvantageous for microfabrication.
Next, detailed analysis and comparison of electrical characteristics are made between the LVDS driver 11 shown in
As shown in
On the other hand, in the LVDS driver 11 shown in
Both ends of the switch element SW1 are connected to output voltages vo1 and vo2 of the amplifiers amp2 and amp3 with the gain −A2, which receive the output of the amplifier amp1 having the gain −A1. The switches SW2 and SW3 having the same ON resistance value (Rsw2) are connected in series to both ends of the current path of the switch SW1.
The connection point of the switch elements SW2 and SW3 has an average voltage ((vo1+vo2)/2) between both ends of the current path of the switch element SW1. This average voltage is connected to the negative input terminal of the amplifier amp1. The positive input terminal of the amplifier amp1 is connected to the reference potential Vcm.
As has been described above, at first, the LVDS driver 11 of the present embodiment differs from the LVDS driver 111 of the comparative example in that the LVDS driver 11 requires only one switch element SW1 between the output resistors RP and RN whereas the LVDS driver 111 needs to have two transistor (MOSFET) switch elements between the output resistors Rp and Rn, which require a large area.
The switch elements SW2 and SW3, which are included in the 2-input-2-output amplifier 19 in the present embodiment, are provided only for the purpose of generating an average voltage between both ends of the current path of the switch element SW1. Thus, the resistance value Rsw2 of the switch element SW2, SW3 can be made sufficiently higher than the resistance value Rsw1 of the switch element SW1, and the occupation area of the switches SW2 and SW3 may be small.
As shown in
The first-stage amplifier section 33 receives input voltages V+ and V−, and produces an output voltage Voa. This first-stage amplifier section 33 is the same as a first-stage amplifier section 133 shown in
The output-stage amplifier section 35 receives the output voltage Voa from the first-stage amplifier section 33, and produces two output voltages Vo1 and Vo2.
The output-stage amplifier section 35 includes transistors (MOSFETs) Mp1, Mp2, Mn1 and Mn2, and capacitors Cc.
Comparison will now be made with an output-stage amplifier section 135 of the buffer amplifier 117 according to the comparative example shown in
The gate width of each of the transistors Mp1 and Mp2 has half the value (Wp/2). In addition, the gate width of each of the transistors Mn1 and Mn2 has half the value (Wn/2). The capacitance value (phase compensation capacitance) of each of the capacitors Cc has half the value (Cc/2).
As described above, the occupation area of the entire 2-input-2-output amplifier 19 of the present embodiment can be made substantially equal to the occupation area of the operational amplifier 117 according to the comparative example. In short, the occupation area is not increased by this structure.
When the conduction path between the output resistors RP and RN shown in
Next, referring the example of the structure of the LVDS driver 11 shown in
To begin with, consider a small signal equivalent circuit for calculating an impedance as viewed from Vop, as in the case where the output resistance of the LVDS driver 111 of the comparative example is calculated. Specifically,
As shown in
The gate width of each of the transistors (MOSFETs) Mp1, Mp2, Mn1 and Mn2, which constitute the output-stage amplifier section 35 of the present embodiment, is half the gate width (Wp/2, Wn/2) of each of the transistors which constitute the output-stage amplifier section 135 of the operational amplifier 117 in
If the small signal equivalent circuit 20 shown in
As shown in
Using the small signal equivalent circuit 20′ shown in
In addition, there is a relationship expressed by the following equation (8):
If the terminal voltage V02 is deleted from equations (7) and (8), the current Iin can be calculated by the following equation (9):
Further, from the equation (9), the output resistance Rtot as viewed from the terminal Vop is expressed by the following equation (10):
The second term in the equation (10) is the same value as the output impedance of the operational amplifier 117 shown in
If it is assumed that a complete differential operation is performed with the output voltages Vop and Von, the middle point of the resistance value Rsw1 shown in
From the above equations, the output resistance Rtot of the LVDS driver 11 shown in
R
tot
=R
out
+R
o
buf
+R
SW (5a)
(the output resistance value in the comparative example)
(the output resistance value in the present embodiment)
R
tot
=R
out
+R
SW (5b)
(the output resistance value in the comparative example)
(the output resistance value in the present embodiment)
In each of the case where the complete differential operation is performed (equation (11b)) and the case where the complete differential operation is not performed (equation (11a)), the resistance value of the switch element SW1 of the LVDS driver 11 of the present embodiment can be decreased.
For example, in the case of the present embodiment, as indicated by the above equations (11a) and (11b), it is understood that the resistance value of the switch element SW1 can be reduced to ¼, compared to the comparative example. However, this is considered on the basis of the case in which the switch elements SW11 and SW12 of the driver 111 shown in
As described above, the resistance value Rsw1 of the switch element SW1, which becomes an unnecessary resistance, can be reduced. In addition, it is possible to suppress the process variation of the resistance value Rsw and the variation of Rtot due to a power supply voltage variation and an operational environment.
Furthermore, in the LVDS driver 111 according to the comparative example shown in
In the example of the structure of the LVDS driver 111 according to the comparative example, in the case where the output resistance, as viewed from the voltage Vop and voltage Von, is to be set at a high impedance, it may be considered that the two switches, namely the switches SW11 and SW12, are not necessarily needed. However, at the time of the actual operation of the LVDS driver 111 according to the comparative example, if consideration is given to the differential amplitude of the voltage Vop and voltage Von with the voltage Vos being set as the reference voltage, and to the balance in circuit configuration, it is not preferable in terms of circuit characteristics to insert the switch element only on one of the voltage Vop side and the voltage Von side. Therefore, in the example of the structure of the LVDS driver 111 according to the comparative example, the two switch elements, namely the switch SW11 and switch SW12, are necessary and indispensable.
According to the driver 11 of the present embodiment, at least the following advantageous effects (1) to (4) can be obtained.
(1) Since the occupation area of the switch element SW1 of the output section (2-input-2-output amplifier 19) can be reduced, lower cost can advantageously be achieved.
As described above, the LVDS driver 11 according to the present embodiment includes the single switch element SW1, and the conduction path between the output terminals 15-1 and 15-2 (i.e. between the voltage Vop and voltage Von) can be ON/OFF controlled by the switch SW1 alone.
Since the occupation area of the 2-input-2-output amplifier 19 can be reduced, lower cost can advantageously be achieved. For example, since the LVDS driver 111 according to the comparative example is configured to require the two switch elements SW11 and SW12, the LVDS driver 111 formally has double the occupation area for the switch.
Moreover, according to the present embodiment, the occupation area of the switch element SW1 itself can be reduced.
For example, in the case where the output resistors Rp and Rn of the LVDS driver 11 of the present embodiment are ON/OFF controlled by the switch element, consideration is given to the condition that the ratio of the ON resistance of the MOSFET switch, relative to the Rout (e.g. about 50Ω), is constant. Under this condition, the device area of the switch element SW1 (MOSFET) of the present embodiment can be reduced to ⅛, compared to the switch elements SW11 and SW12 in the comparative example.
The resistance values Rsw1 and Rsw2 of the switch elements SW2 and SW3 of the 2-input-2-output amplifier 19 may be sufficiently higher than the output resistance Rout. Therefore, these resistance values are ignorable in relation to the device area of the switch element SW1.
(2) The ON resistance of the switch element SW1 can be reduced.
In each of the case where the complete differential operation is performed (equation (11b)) and the case where the complete differential operation is not performed (equation (11a)), the ON resistance value of the switch element SW1 of the LVDS driver 11 of the present embodiment can be decreased.
For example, in the case of the present embodiment, as indicated by the above equations (11a) and (11b), the resistance value of the switch element SW1 can be reduced to ¼, compared to the comparative example.
However, this is the example in the case where the switch elements SW11 and SW12 of the driver 111 shown in
(3) Mixing of power supply noise can be prevented.
As described in the above (1), according to the structure of the present embodiment, the occupation area of the switch element SW1 can be decreased.
It is thus possible to prevent an increase in parasitic capacitance between the gate and drain and between the gate and source, which occurs due to an increase in occupation area of the switch element SW1. Therefore, mixing of power supply noise can be prevented.
(4) The manufacturing cost can advantageously be reduced.
For example, in the case where the ON resistance of the switch element, which has a sufficiently smaller resistance value relative to the normal Rout (e.g. about 50Ω), is constituted, a considerably large area is required and the manufacturing cost increases.
However, as described in the above (1) and (2), according to the structure of the present embodiment, the occupation area and the ON resistance of the switch element SW1 can be reduced. Thus, a sufficiently low ON resistance of the switch element SW1, relative to the normal Rout (e.g. about 50Ω), can be realized, and the occupation area can be reduced. Therefore, the manufacturing cost can advantageously be reduced.
Next, a driver according to a second embodiment of the present invention is described with reference to
At first, the second embodiment differs from the first embodiment in that the 2-input-2-output amplifier 19, as shown in
The average voltage generating circuit 21 is configured to receive, as first and second input voltages, the first and second input voltages (Vin1, Vin2) corresponding to voltages at both ends of the output resistor switch element SW1, and to output, as an output voltage, an average voltage (Vavg) of the first and second input voltages (Vin1, Vin2) to a negative (−) input terminal (V−) of the 2-output amplifier 22.
The 2-output amplifier 22 is configured to output once gain, voltages, which are obtained by amplifying a voltage difference between the average voltage (Vavg) that is input to the negative (−) input terminal (V−) and a reference voltage (Vcm) that is input to a positive (+) input terminal (V+), to both ends of the output resistor switch element SW1 as first and second output voltages (out1, out2). In addition, the 2-output amplifier 22 is configured such that if the stop signal SS is input to the 2-output amplifier 22, a high impedance state is set between both ends of the output resistor switch element SW1.
The output resistance Rtot, as viewed from the output terminal 15-1 side (Vop side), in the embodiment that is composed by combining the 2-output amplifier 22 and the arbitrary average voltage generating circuit 21, is expressed by the following equation (12):
As expressed in the above equation (12), like the first embodiment, the resistance value Rsw1 of the output resistor switch element can be reduced to ¼.
Examples of the structure of the average voltage generating circuit 21 are as follows.
An average voltage generating circuit 21-1 shown in
One end of the current path of the NMOS transistor QN5 is connected to the input (Vin1), the other end of the current path of the NMOS transistor QN5 is connected to the output (Vavg), and the gate of the NMOS transistor QN5 is connected to an internal power supply VDD.
One end of the current path of the NMOS transistor QN6 is connected to the input (Vin2), the other end of the current path of the NMOS transistor QN6 is connected to the output (Vavg), and the gate of the NMOS transistor QN6 is connected to an internal power supply VDD.
An average voltage generating circuit 21-2 shown in
One end of the current path of the PMOS transistor QP5 is connected to the input (Vin1), the other end of the current path of the PMOS transistor QP5 is connected to the output (Vavg), and the gate of the PMOS transistor QP5 is connected to a ground power supply VSS.
One end of the current path of the PMOS transistor QP6 is connected to the input (Vin2), the other end of the current path of the PMOS transistor QP6 is connected to the output (Vavg), and the gate of the PMOS transistor QP6 is connected to a ground power supply VSS.
An average voltage generating circuit 21-3 shown in
One end of the current path of the MOS transistor QN7 is connected to the input (Vin1), the other end of the current path of the MOS transistor QN7 is connected to the output (Vavg), and the gate of the PMOS transistor QN7 is connected to the internal power supply VDD. One end of the current path of the MOS transistor QP7 is connected to the input (Vin1), the other end of the current path of the MOS transistor QP7 is connected to the output (Vavg), and the gate of the MOS transistor QP7 is connected to the ground power supply VSS.
One end of the current path of the MOS transistor QN8 is connected to the input (Vin2), the other end of the current path of the MOS transistor QN8 is connected to the output (Vavg), and the gate of the MOS transistor QN8 is connected to the internal power supply VDD. One end of the current path of the MOS transistor QP8 is connected to the input (Vin2), the other end of the current path of the MOS transistor QP8 is connected to the output (Vavg), and the gate of the MOS transistor QP8 is connected to the ground power supply VSS.
This average voltage generating circuit 21-3 is composed of the MOS transistors QN7, QN8, QP7 and QP8 which are CMOS-connected between the inputs (Vin1, Vin2). Thus, even if the output voltage Vavg increases, the increase in ON resistance can advantageously be suppressed.
On the other hand, the average voltage generating circuits 21-1 and 21-2 are advantageous for microfabrication since the number of MOS transistors, which are structural components, can be reduced.
Examples of the structure of the 2-output amplifier 22 are as follows.
A 2-output amplifier 22-1 shown in
The amplifier amp5 receives an input voltage V+at an input (+) thereof and receives an input voltage V− at an input (−) thereof, and outputs an output voltage, which is produced by amplifying a voltage difference between the input voltage V+ and the input voltage V−, to the inputs of the amplifiers amp6 and amp7.
The amplifiers amp6 and amp7 amplify the input voltage from the amplifier amp5, and output the amplified voltages to the output terminals out1 and out2 as output voltages. When the stop signal SS is input to the amplifiers amp6 and amp7, the amplifiers amp6 and amp7 are set in a high impedance state. Thereby, a high impedance state is set between the output terminals out1 and out2.
A 2-output amplifier 22-2 shown in
The transconductance gm1 receives an input voltage V+at an input (+) thereof and receives an input voltage V− at an input (−) thereof, and outputs an output voltage Iout1, which is produced by amplifying a voltage difference between the input voltage V+ and the input voltage V−, to the output terminal out1.
The transconductance gm2 receives an input voltage V+at an input (+) thereof and receives an input voltage V− at an input (−) thereof, and outputs an output voltage Iout2, which is produced by amplifying a voltage difference between the input voltage V+ and the input voltage V−, to the output terminal out2.
When the stop signal SS is input to the transconductances gm1 and gm2, a high impedance state is set between the transconductances gm1 and gm2. Thereby, a high impedance state is set between the output terminals out1 and out2.
With the above-described structure, the 2-output amplifier 22-2 can output, from the output terminals out1 and out2, the current values Iout1 and Iout2 which are produced by multiplying the voltage difference between the positive input terminal (V+ side) and the negative input terminal (V− side) by the transconductance Gm. For example, in the case where the voltage V− of the negative input terminal is higher than the voltage V+ of the positive input terminal, the 2-output amplifier 22-2 operates so as to take in the current from the output terminal out2. Ideally, it is preferable that the output terminals out1 and out2 of the 2-output amplifier 22-2 have infinite impedance.
A 2-output amplifier 22-3 shown in
The amplifier amp8 receives an input voltage V+at an input (+) thereof and receives an input voltage V− at an input (−) thereof, and outputs an output voltage, which is produced by amplifying a voltage difference between the input voltage V+ and the input voltage V−, to the output terminal out1.
The amplifier amp9 receives an input voltage V+at an input (+) thereof and receives an input voltage V− at an input (−) thereof, and outputs an output voltage, which is produced by amplifying a voltage difference between the input voltage V+ and the input voltage V−, to the output terminal out2. When the control signal SS is input to the amplifiers amp8 and amp9, the amplifiers amp8 and amp9 are set in a high impedance state. Thereby, a high impedance state is set between the output terminals out1 and out2.
As has been described above, according to the driver 11 of the present embodiment, at least the same advantageous effects as the above-described (1) to (4) can be obtained. The structure of this embodiment is applicable where necessary.
Next, a driver according to a third embodiment of the present embodiment is described with reference to
As shown in
The 2-input-2-output amplifier 19 according to the third embodiment includes amplifiers amp10 and amp11 each having a gain A1.
Positive input terminals (+) of the amplifiers amp10 and amp11 are connected to the reference voltage Vcm. The amplifier amp10 receives an input voltage Vin1 at a negative input terminal (−) thereof, and outputs an output voltage Vo1, which is produced by amplifying a difference voltage between the input voltage Vin1 and the reference voltage Vcm, to the output terminal out1 as an output voltage Vo1.
The amplifier amp11 receives an input voltage Vin2 at a negative input terminal (−) thereof, and outputs an output voltage Vo2, which is produced by amplifying a difference voltage between the input voltage Vin2 and the reference voltage Vcm, to the output terminal out2 as an output voltage Vo2.
In the driver 11 of the present embodiment, the occupation area does not increase, compared to the driver 111 of the comparative example. For example, consideration is now given to the case where the amplifier amp10, amp11 is composed of MOSFETs each having a gate width (W) which is scaled to about ½ of the gate width (W) of each of the MOSFETs that constitute the operational amplifier 117 according to the comparative example. Even in this case, the occupation area of the 2-input-2-output amplifier 19 of this embodiment is equal to the occupation area of the buffer amplifier 117 of the comparative example. Thus, even if the driver 11 of this embodiment is applied, the occupation area does not increase.
Nevertheless, the output resistance of each one of the amplifiers amp10 and amp11 is doubled (2Ro_buf), compared to the resistance value Ro_buf of the buffer amplifier 117 of the comparative example.
However, the output resistance Rtot, as viewed from the output terminal 15-1 side (voltage Vop side), is expressed by the following equation (13):
As expressed in the above equation (13), since the output resistance Rtot is at least Rtot<Rout+Ro_buf+Rsw1/2, the output resistance Rtot can be made less than the output resistance of the driver circuit 111 of the comparative example.
In addition, the output resistance is also Rtot<Rout+Ro_buf. Thus, in the case where the resistance value Ro_buf is sufficiently lower than the ON resistance Rsw1, the output resistance Rtot can advantageously be determined substantially by Ro_buf alone, even if the resistance value of the ON resistance Rsw1, which increases in terms of area, is increased.
According to the driver 11 of the present embodiment, at least the same advantageous effects as the above (1) to (4) can be obtained.
Furthermore, in the structure of this embodiment, the output resistance is also Rtot<Rout+Ro_buf. Thus, in the case where the resistance value Ro_buf is sufficiently lower than the ON resistance Rsw1, the output resistance Rtot can advantageously be determined substantially by Ro_buf alone, even if the resistance value of the ON resistance Rsw1, which increases in terms of area, is increased.
Next, in order to compare the above-described embodiments, the driver according to the comparative example will be described with reference to
With the structure of the LVDS driver according to the comparative example, the circuit area increases and this structure is disadvantageous for microfabrication.
The reason for this is as follows. In a case where a MOS transistor (MOSFET), which is fabricated by an ordinary CMOS fabrication process, is used as the above-described switch element SW11, SW12, it is necessary to make the ON resistance (Rsw) of the switch element SW11, SW12 (MOSFET) sufficiently lower than the output resistance (e.g. about 50Ω) of the LVDS driver. As a result, the gate width (W) of the switch element SW11, SW12 (MOSFET) considerably increases, and the area of occupation of the switch element SW11, SW12 greatly increases. The great increase in occupation area of the switch element SW11, SW12 leads to an increase in area of the entirety of the driver 111, and this is disadvantageous in terms of manufacturing cost.
In addition, with the great increase in occupation area of the switch element SW11, SW12, a parasitic capacitance between the gate and drain of the switch and a parasitic capacitance between the gate and source of the switch also increase, and power supply noise may easily be mixed in.
If the added resistance value of the ON resistances Rsw and Rout is Rtot, the resistance value Rtot becomes the output resistance of the LVDS driver 111 according to the comparative example. It is thus considered that it should suffice to set the ON resistance Rout so as to obtain the output resistance Rtot=50Ω, taking the resistance value of the ON resistance Rsw into account in advance in the stage of design.
However, there is a variation of about 50% to 200% or more due to process variations of the ON resistance Rsw of the switch element SW11, SW12 and variations in operational conditions. Therefore, the ON resistance Rsw should be as small as possible, relative to the ON resistance Rout, in order to limit the variations of the output resistance value of the resistance Rtot and the differential output amplitude Vod within the ranges that are set by specifications.
Taking the above into account, with the structure of the LVDS driver 111 having the ON/OFF switch elements SW11 and SW11 according to the comparative example, the occupation area increases and this structure is disadvantageous for microfabrication.
Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.
Number | Date | Country | Kind |
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2007-003541 | Jan 2007 | JP | national |