BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a block diagram of a driver circuit for power semiconductor device according to a first embodiment;
FIG. 2 is a diagram for explaining relations between the junction temperature and the mounting area under different cases of the dependence upon the temperature;
FIG. 3 is a circuit diagram of the driver circuit for power semiconductor device according to the first embodiment;
FIG. 4 is a diagram for explaining a gate voltage waveform in the driver circuit for power semiconductor device according to the first embodiment;
FIG. 5 is a block diagram of a driver circuit for power semiconductor device according to a second embodiment;
FIG. 6 is a block diagram of a driver circuit for power semiconductor device according to a third embodiment;
FIG. 7 is a circuit diagram of the driver circuit for power semiconductor device according to the third embodiment;
FIG. 8 is a block diagram of a driver circuit for power semiconductor device according to a fourth embodiment;
FIG. 9 is a diagram for explaining current-voltage characteristics of a diode for detecting the temperature;
FIG. 10 is a block diagram of a driver circuit for power semiconductor device according to a fifth embodiment;
FIG. 11 is a diagram for explaining a section of a SiC junction-type FET 32 according to the fifth embodiment;
FIG. 12 is a block diagram of a driver circuit for power semiconductor device according to a sixth embodiment; and
FIG. 13 is a diagram for explaining operation waveforms in a driver circuit for power semiconductor device according to the sixth embodiment.