The disclosure relates to a dry electrode and the manufacturing method thereof, and more particularly to a porous electrode having an uneven surface and the manufacturing method thereof.
The US Patent Appl. Pub. No. 2008/0009763 provides a fixable microprobe array which is able to be inserted into the skin and has a conductive layer thereon for sensing a signal.
The TW Patent Appl. Pub. No. 200701947 provides a cloth for detecting the electric signal on the human skin, wherein the cloth is made of metal fibers or conductively polymeric fibers.
The US Patent Appl. Pub. No. 2004/0073104 provides an electrode being applied to measure the physiological signal. By setting a wet foam rubber between the electrode and the skin, the electric conductivity of the electrode is increased and the interferences of the measured signal are decreased.
Keeping the drawbacks of the prior arts in mind, and employing researches full-heartily and persistently, the applicant finally conceived a dry electrode having a relatively lower resistance and the manufacturing method thereof.
The disclosure provides a dry electrode. The dry electrode comprises a first surface having an uneven structure contacting a target surface and collecting an electric signal from the target surface; a conductive layer embedded thereinto; and a second surface being opposite to the first surface; wherein the dry electrode is made of a porous material.
The disclosure provides a method for manufacturing an electrode. The method comprises the steps of providing a conductive material; impressing and polymerizing the conductive material; forming an uneven surface on the conductive material; etching the conductive material; and forming an electroplate on the conductive material to form the electrode.
In order to further illustrate the techniques, methods and efficiencies used to procure the aims of this disclosure, please see the following detailed description. It is believable that the features and characteristics of this disclosure can be understood by the descriptions. It is to be noted that the following descriptions of preferred embodiments of this disclosure are presented herein for the purposes of illustration and description only; it is not intended to be exhaustive or to be limited to the precise form disclosed.
Please refer to
The uneven structure of first surface 14 is used to increase the contact area between the target surface and the main layer 11. Main layer 11 is made of a soft, porous or vesicant conductive material, and those flexible conductive materials, e.g. the flexible conductive plastic, would further increase the effective area to lower an impedance between main layer 11 and the target surface. In addition, the porous conductive material would increase the ventilation of dry electrode 10 and adjust the moisture between main layer 11 and the target surface.
Specifically, the raw material of main layer 11 can be a conductive polymeric material such as a compositive conductive material, a structural conductive material and flexible porous conductive plastic. The compositive conductive material can be selected from one of a carbon black, a metal power, a metal piece, a metal fiber, a carbon fiber and a combination thereof, and the structural conductive material can be selected form one of a polyacetylene, a polypyrrole, a polyphenylene sulfide, a poly(phthalocyanine) compound, a polyaniline, a polythiophene and a combination thereof.
Either the material and the form of conductive layer 15 is unlimited. For example, conductive layer 15 can be a metal network for matching the flexibility of main layer 1.
The respective materials of first surface 14 and second surface 17 of main layer 11 of the present embodiment are identical, and conductive layer 15 is embedded into main layer 11. However, the respective materials of first surface 14 and second surface 17 can be different from each other by requirements, where the material of first surface 14 is preferably a flexible one.
As shown in
Please refer to
Through the porosity of main layer 11, the uneven structure of first surface 14 would absorb the moisture of the target surface to make main layer 11 to be under a moist surrounding in microcosmic view, by which the resistance between first surface 14 and the target surface is lowered. Moreover, first surface 14 can be electroplated thereon an electroplate, e.g. an electroplating layer, for further lowering the resistance. For example, first surface 14 can be electroplated with a sliver/silver chloride electroplating layer. By coordinating with the moist surrounding, main layer 11 having the sliver/silver chloride-electroplated first surface 14 would have a high electric conductivity and a very low impedance and can be seen as a sliver/silver chloride electrode although main layer 11 is essentially a dry electrode.
The material of electroplating layer can be, for example, a silver, a chlorine silver, a gold, a titanium, a platinum, a stainless steel, an alumni oxide, a carbon, a carbon fiber, a carbon nanotube, a graphite, a diamond, a material being able to lower the impedance or a combination thereof.
Please refer to
Please refer to
On the contrary, as shown in
Please refer to
The Step 32 in the
The etching process performed in Step 34 is a reactive ion etching (RIE) process or can be any appropriate one. The material of the electroplate formed in Step 34 is also selected form the candidates of electroplating layer of first surface 14.
An additional step, embedding a conductive layer into the flexible conductive material, can be added into those steps shown in
The dry electrode formed by processed shown in
While the disclosure has been described in terms of what are presently considered to be the most practical and preferred embodiments, it is to be understood that the disclosure need not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims, which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures. Therefore, the above description and illustration should not be taken as limiting the scope of the disclosure which is defined by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 98101850 A | Jan 2009 | TW | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 3989036 | Sasamori | Nov 1976 | A |
| 4887614 | Shirakami et al. | Dec 1989 | A |
| 4967038 | Gevins et al. | Oct 1990 | A |
| 5511548 | Riazzi et al. | Apr 1996 | A |
| 5678545 | Stratbucker | Oct 1997 | A |
| 5746207 | McLaughlin et al. | May 1998 | A |
| 6510333 | Licata et al. | Jan 2003 | B1 |
| 6622035 | Merilainen et al. | Sep 2003 | B1 |
| 6835184 | Sage et al. | Dec 2004 | B1 |
| 7146221 | Krulevitch et al. | Dec 2006 | B2 |
| 7286864 | Schmidt et al. | Oct 2007 | B1 |
| 20020187556 | Shartle et al. | Dec 2002 | A1 |
| 20030208248 | Carter et al. | Nov 2003 | A1 |
| 20040073104 | Brun del Re et al. | Apr 2004 | A1 |
| 20060173523 | Rainey et al. | Aug 2006 | A1 |
| 20070015984 | Yeo et al. | Jan 2007 | A1 |
| 20080009763 | Chiou et al. | Jan 2008 | A1 |
| 20090137892 | Leftly et al. | May 2009 | A1 |
| Number | Date | Country |
|---|---|---|
| M292362 | Jun 2006 | TW |
| 200701947 | Jan 2007 | TW |
| Number | Date | Country | |
|---|---|---|---|
| 20100185077 A1 | Jul 2010 | US |