This invention relates to transformers and more particularly to transformers having a dry-type construction with solid insulation.
A transformer with a dry-type construction includes at least one coil mounted to a core so as to form a core/coil assembly. The core is ferromagnetic and is often comprised of a stack of metal plates or laminations composed of grain-oriented silicon steel. The core/coil assembly is encapsulated in a solid insulating material to insulate and seal the core/coil assembly from the outside environment.
The solid insulating material that is used to encapsulate the core/coil assembly of a dry-type transformer is typically a thermoset polymer, which is a polymer material that cures, through the addition of energy, to a stronger form. The energy may be in the form of heat (generally above 200 degrees Celsius), through a chemical reaction, or irradiation. A thermoset resin is usually liquid or malleable prior to curing, which permits the resin to be molded. When a thermoset resin cures, molecules in the resin cross-link, which causes the resin to harden. After curing, a thermoset resin cannot be remelted or remolded, without destroying its original characteristics. Thermoset resins include epoxies, melamines, phenolics and ureas.
When a thermoset resin cures, the resin typically shrinks. Because the resin surrounds the core/coil assembly, the shrinking thermoset resin exerts high mechanical stresses and strains on the core of the transformer. These stresses and strains distort the oriented grains of the core and increase resistance to the magnetic flux flow in the laminations. This distortion and increased resistance results in higher core loss which causes the sensitivity of the transformer to decrease and diminishes the accuracy of the transformer. In addition, when the thermoset resin shrinks around edges and protrusions, cracks may form in the thermoset resin. The cracks may grow over time and compromise the insulating properties of the thermoset resin. As a result, partial discharges may occur. A partial discharge is an electrical spark that bridges the thermoset resin between portions of the core/coil assembly. A partial discharge doesn't necessarily occur at the core/coil assembly, it can occur anywhere the electric field strength exceeds the breakdown strength of the thermoset resin. Partial discharges contribute to the deterioration of the thermoset resin, which shortens the useful life of the transformer.
One approach for protecting the core of a transformer and preventing partial discharges has been disclosed in U.S. patent application Ser. No. 11/518,682, filed on Sep. 11, 2006, entitled “DRY-TYPE TRANSFORMER WITH SHIELDED CORE/COIL ASSEMBLY AND METHOD OF MANUFACTURING THE SAME”, which is assigned to the assignee of the present invention, ABB Technology AG, and which is incorporated herein by reference. In the '682 patent application, a core and coil assembly of a transformer are disposed inside a protective polymer case having an exterior surface that is at least partially covered with a conductive coating. The present invention is directed toward such a protective polymer case having an improved construction.
In accordance with the present invention, a transformer is provided that includes a shield case formed from a polymeric resin composition comprising conductive particles. At least a portion of a core comprised of ferromagnetic material is disposed inside the shield case. A primary coil and a secondary coil are disposed proximate to the core. An encasement encapsulates the shield case. The encasement comprises a dielectric resin.
Also provided in accordance with the present invention is a method of producing a transformer. In accordance with the method, a shield case is provided. The shield case is formed from a polymeric resin composition containing conductive particles. A coil and a core comprised of ferromagnetic material are also provided. The coil is disposed around the core and at least a portion of the core is placed inside at least a portion of the shield case. The shield case is encapsulated in a dielectric resin.
The features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings where:
It should be noted that in the detailed description that follows, identical components have the same reference numerals, regardless of whether they are shown in different embodiments of the present invention. It should also be noted that in order to clearly and concisely disclose the present invention, the drawings may not necessarily be to scale and certain features of the invention may be shown in somewhat schematic form.
Referring now to
The core 12 has a torroidal shape with a central opening and is composed of a ferromagnetic material, such as iron or steel. The core 12 may be comprised of a strip of steel (such as grain-oriented silicon steel), which is wound on a mandrel into a coil. The low voltage winding 16 comprises a length of wire, such as copper wire, wrapped around the core 12 to form a plurality of turns that are disposed around the circumference of the core 12. End portions of the low voltage winding 16 are secured to transformer leads 30 (or form the transformer leads 30), which are connected to a terminal board mounted to the exterior of the outer encasement 24. The combination of the core 12 and the low voltage winding 16 is hereinafter referred to as the core/coil assembly 18. The high voltage winding 14 comprises an open loop of a metallic conductor, which may be comprised of copper. The high voltage winding 14 extends through the shield case 22 and the core/coil assembly 18, as will be described more fully below. A pair of rectangular connectors 32 is secured to the ends of the high voltage winding 14, respectively.
Referring now to
The body 34 includes a cylindrical side wall 40 joined to an annular end wall 42 having an enlarged central opening. Openings are formed in the side wall 40 through which the terminal leads 30 extend. A free end of the side wall 40 has an outwardly-facing notch 44 (shown in
The cover 38 is annular in shape and includes a disc-shaped wall 56 with an opening 58 in the center thereof. An inner flange 60 is disposed around the opening 58 and extends away from the wall 56. An outer flange 62 (shown best in
The body 34 and the cover 38 are each comprised of a thermoset resin composition and are each formed in a RIM process. The thermoset resin composition comprises a thermoset resin and an amount of conductive particles that is sufficient to render at least the outside surfaces of the body 34 and the cover 38 sufficiently conductive to convey a charge to ground so as to prevent a partial discharge. The thermoset resin may also include various additives to modify the properties of the cured thermoset resin composition. The thermoset resin may be a polynorbornene resin, a polyurethane resin, a polyurea resin, or a polyurethane/polyester resin. Generally, in a RIM process, two reactant compositions are combined in a mixhead, and this mixture is then injected into a mold in which polymerization occurs. For example, if the thermoset resin is a polyurethane resin, a polyisocyanate (e.g., a diisocyanate) will be supplied in one reactant composition and a polyolefin will be supplied in the other reactant composition.
The use of a polynorbornene resin to form the body 34 and the cover 38 is particularly suitable. A polynorbornene resin is formed from one or more norbornene monomers in a ring-opening metathesis polymerization (ROMP) reaction. A norbonene monomer is a bridged cyclic hydrocarbon. Examples of norbornene monomers include 2-norbornene, 5-methyl-2-norbornene, 5-ethyl-2-norbornene, 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-ethylidene-2-norbornene, 5-phenylnorbornene, dicyclopentadiene, dihydrodicyclopentadiene, tetracyclododecene, methyl tetracyclododecene, ethyl tetracyclododecene, dimethyl tetracyclododecene, ethylidene tetracyclododecene, phenyl tetracyclododecene, tricyclopentadiene, tetracyclopentadiene and the like. Different combinations of the foregoing monomers may be used.
Dicyclopentadiene (DCPD) and, more specifically, endo-DCPD (3a,4,7,7a-tetrahydro-4,7-methano-1H-indene) is especially suitable for use in forming the body 34 and the cover 38. Commercially available endo-DCPD is initially purified by low vacuum distillation to remove trace impurities. The purified endo-DCPD is then polymerized to form poly-DCPD in a RIM process, using a two-part metathesis catalyst system. The two-part metathesis catalyst system includes a catalyst and a co-catalyst, or activator.
The catalyst may be an organoammonium molybdate, such as tetrakis(trididodecylammonium)octa-molybdate, a tungsten-containing catalyst, such as a tungsten halide (e.g. WCl6) or a tungsten oxyhalide (e.g. WOCl4), or a ruthenium-containing catalyst. Examples of ruthenium-containing catalysts are disclosed in U.S. Pat. Nos. 6,486,270 and 6,204,347, both of which are hereby incorporated by reference. The '270 patent discloses ruthenium alkylidene catalysts that are particularly suitable for use in a RIM process. These ruthenium alkylidene catalysts have the general formula AxLyXZRu═CHR′, where x=0, 1 or 2, y=0, 1 or 2, and z=1 or 2, and where R′ is hydrogen or a substituted or unsubstituted alkyl or aryl, L is any neutral electron donor (such as a phosphine), X is any anionic ligand, and A is a ligand having a covalent structure connecting a neutral electron donor and an anionic ligand. The '347 patent discloses ruthenium catalysts having the formula: RuX2(L1)m(L2)n(L3)o(L4)p, or the formula: ARuX2(L1)r(L2)s, wherein L1, L2, L3 and L4 are each independently of the other C. —C1-C18 alkylcyanide, C6≧C24-aralkylcyanide, tertiary amine, tertiary phosphine which does not contain any secondary alkyl or cycloalkyl radicals bound to the phosphorus atom, or phosphite, X is halogen, A is arene, m, n, o and p are integers from 0 to 4, where 2≦m+n+o+p≦4, r and s are integers from 0 to 2 and where 1≦r+s≦2.
If an organoammonium molybdate catalyst or a tungsten-containing catalyst is used, the activator may be an alkyl aluminum halide, an alkoxy alkyl aluminum halide, an aryloxy alkyl aluminum halide or an organic tin compound, such as tetrabutyl tin (SnBu4). If a ruthenium alkylidene catalyst of the '270 patent is utilized, the activator is an acid (organic or inorganic), such as hydrochloric acid (HCl), hydrobromic acid (HBr), sulfuric acid (H2SO4), or nitric acid (HNO3). If a ruthenium catalyst of the '347 patent is utilized, the activator is a tertiary phosphine containing at least one secondary alkyl radical or cycloalkyl radical bound to the phosphorus atom. Examples of such a tertiary phosphine include triisopropylphoshine and tricyclohexylphosphine.
The additives that may be included in the thermoset resin composition include solvents, blowing agents, encapsulated blowing agents, pigments, antioxidants, light stabilizers, flame retardants, plasticizers, foaming agents, fillers, reinforcing agents, macro-molecular modifiers, and polymeric modifiers. Suitable fillers include glass, wollastonite, mica, talc, and calcium carbonate. The additives must be ones that are substantially unreactive with the individual reactant compositions.
The conductive particles in the thermoset resin composition that are used to impart conductivity to the body 34 and the cover 38 may comprise electrically conductive carbon black, carbon nanofibers, graphite, metal particles, or a combination of the foregoing. Metal particles may include, but are not limited to, nickel particles, silver flakes, or particles of tungsten, molybdenum, gold platinum, iron, aluminum, copper, tantalum, zinc, cobalt, chromium, lead, titanium, tin alloys, and mixtures of the foregoing. The conductive particles typically have an average size of less than 30 micrometers, more typically less than 10 micrometers and still more typically less than 5 micrometers. The conductive particles comprise from about 1 weight percent to about 40 weight percent of the total thermoset resin composition, more particularly from about 1 weight percent to about 20 weight percent of the total thermoset resin composition.
Referring now to
The first tank 102 contains the first reactant composition, while the second tank 104 comprises the second reactant composition. In the embodiment where the thermoset resin is poly-DCPD, the first reactant composition comprises DCPD monomer, conductive particles and the catalyst, and the second reactant composition comprises DCPD monomer, conductive particles and the co-catalyst. Any additives that are to be included may be divided into about equal parts between the first and second reactant compositions. The amount of the DCPD monomer and the conductive particles in the first and second reactant compositions may be about the same. The first and second reactant compositions are heated and stirred in the first and second tanks 102, 104, respectively. The RIM process begins with the valves to the mixing head 106 opening and the first and second reactant compositions being fed to the mixing head 106 through the first and second supply lines 110, 116, respectively. The first and second metering pistons 122, 126 supply the first and second reactant compositions to the mixing head 106 in metered amounts. The first and second reactant compositions enter a mix chamber in the mixing head 106 and are intensively mixed together by high velocity impingement. The resulting mixture is then injected into the mold 108, where the mixture polymerizes into poly-DCPD and thereby forms the body 34. The mold 108 may be heated to a temperature of from about 50° C. to about 100° C. and the pressure in the mold 108 may be in a range from about 1 to about 10 bars, more particularly from about 1 to about 3 bars. The cover 38 is formed in substantially the same manner, except the mold for the cover 38 is used instead of the mold 108 and the amount of the first and second reactant compositions is different.
When formed in the above-described manner, the conductive particles are substantially evenly distributed throughout the body 34 and the cover 38 so as to provide the body 34 and the cover 38 with sufficient bulk conductivity to convey a charge to ground so as to prevent a partial discharge. In another embodiment of the present invention, a second RIM process may be used to concentrate the conductive particles in the surface regions of the body 34 and the cover 38 so as to provide the body 34 and the cover 38 with only surface conductivity that is sufficient to convey a charge to ground so as to prevent a partial discharge. The ground connectors 54 are electrically connected to the body 34 so as to permit electric current to flow from the body 34 (mass and/or surface) to the ground connectors 54. Since the cover 38 is in intimate contact with the body 34 and is also conductive, the cover 38 is also electrically connected to the ground connectors 54.
With reference now to
In a first time period of the second RIM process, the third and fourth reactant compositions alone, or in combination with a lesser or equal amount of the first and second reactant compositions, are injected into the mold 108. In a subsequent second time period, only the first and second reactant compositions are injected into the mold 108. In this manner, the conductive particles are concentrated in the surface region of the formed body 34 (or cover 38).
After the body 34 and the cover 38 are molded as described above, the core/coil assembly 18 is disposed in the groove 48 of the body 34 so that the core/coil assembly 18 abuts the end wall 42 and the mount 46 extends through the central opening of the core/coil assembly 18. While the core/coil assembly 18 is so positioned, the cover 38 is placed over the body 34 such that the mount 46 is disposed inside the cover 38, against the inner flange 60, and the free end 62a of the outer flange 62 is snapped into the outer notch 44 of the side wall 40 of the body 34. In this manner, the cover 38 is secured to the body 34 in a snap-fit manner so as to enclose the core/coil assembly 18 in the shield case 22 and thereby seal the core/coil assembly 18 from the resin 26 when the shield case 22 with the core/coil assembly 18 is cast into the resin 26 to form the outer encasement 24, as will be described below.
The resin 26 may be butyl rubber or an epoxy cast resin. In one embodiment of the present invention, the resin 26 is a cycloaliphatic epoxy resin, more particularly a hydrophobic cycloaliphatic epoxy resin. In this embodiment, the outer casement 24 is formed from the resin 26 in an automatic pressure gelation (APG) process. In accordance with APG process, the resin 26 (in liquid form) is degassed and preheated to about 40° C. to about 60° C., while under vacuum. The shield case 22 with the core/coil assembly 18 disposed therein is placed in a cavity of a mold heated to a curing temperature of the resin 26. The transformer leads 30, the connectors 32 and the ground connectors 54 extend out of the cavity so as to protrude from the encasement 24 after the casting process. The degassed and preheated resin 26 is then introduced under slight pressure into the cavity containing the shield case 22. Inside the cavity, the resin 26 quickly starts to gel. The resin 26 in the cavity, however, remains in contact with pressurized resin 26 being introduced from outside the cavity. In this manner, the shrinkage of the gelled resin 26 in the cavity is compensated for by subsequent further addition of degassed and preheated resin 26 entering the cavity under pressure. As the resin 26 gels and fully cures, the resin 26 shrinks and applies forces against the shield case 22. The shield case 22 protects the core/coil assembly 18 from these forces, thereby preventing the oriented grains of the core 12 from becoming distorted.
It should be appreciated that in lieu of being formed pursuant to an APG process, the encasement 24 may be formed using a compression molding process or a vacuum casting process.
After the resin 26 cures, the solid encasement 24 with the shield case 22 molded therein is removed from the mold cavity. The solid encasement 24 includes a top portion 24a with a plurality of annular fins or skirts 70 formed therein and a bottom portion 24b with a flat end wall. The connectors 32 for the high voltage winding 14 protrude upwardly from the top portion 24a, while the transformer leads 30 protrude laterally from the bottom portion 24b. A housing (not shown) containing a terminal board is secured to the bottom portion 24a of the encasement 24. The transformer leads 30 are disposed in the housing and are connected to the terminal board. The ground connectors 54 extend through the end wall of the bottom portion 24a such that end surfaces of the ground connectors 54 are substantially flush with the end wall. A base plate 72 composed of a conductive metal, such as aluminum, is secured to the end wall of the bottom portion 24a by screws or other fastening means. Openings in the base plate 72 are aligned with the bores in the ground connectors 54. Screws composed of a conductive metal are inserted through the openings in the base plate 72 and are threadably received in the bores in the ground connectors 54. Heads of the screws abut an exterior surface of the base plate 72. Thus, the screws form electrical connections between the base plate 72 and the ground connectors 54. When the transformer 10 is installed for use, the base plate 72 is electrically connected to an earth ground. Since the base plate 72 is electrically connected to the ground connectors 54, which are electrically connected to the shield case 22, the shield case 22 becomes grounded as well. In this manner, the shield case 22 forms a Faraday shield around the core/coil assembly 18. This Faraday shield will help reduce, if not eliminate, partial discharges that can damage the encasement 24.
In the embodiment of the invention described above, the shield case 22 encloses both the core 12 and the low voltage winding 16, i.e., the core/coil assembly 18. In other embodiments of the present invention, a shield case may enclose only a core or only a portion of core. In addition, shield cases of different configurations may be provided for different types of transformers. An example of another embodiment of the invention is shown in
Referring now to
The inner wall 160 of the major body 154 has an outwardly-positioned flange 172, while the outer wall 162 of the major body 154 has an inwardly-positioned flange 176. The cover 158 has an inner flange 180 and an outer flange 182. Opposing ends of the inner wall 160 each have an inwardly-positioned flange 174, while opposing ends of the outer wall 162 each have an outwardly-positioned flange 178. The cover 158 is configured such that when the cover 158 is disposed over and placed into engagement with the major body 154, the inner and outer flanges 180, 182 of the cover 158 frictionally engage the flanges 172, 176 of the major body 154, respectively, with the flange 172 being disposed outward from the inner flange 180 and the flange 176 being disposed inward from the outer flange 182.
The minor body 156 has opposing ends, each of which has an inwardly-positioned peripheral flange 186. When the minor body 156 is disposed between and placed into engagement with the ends of the major body 154 and the cover 158, the flanges 174, 178, 180, 182 of the major body 154 and the cover 158 and the flanges 186 of the minor body 156 frictionally engage each other and overlap, with the flanges 174, 178, 180, 182 of the major body 154 and the cover 158 being disposed outward from the flanges 186 of the minor body 156.
The components of the shield case 150 (i.e., the major body 154, the minor body 156 and the cover 158) are each comprised of a conductive thermoset resin composition and are each formed in a RIM process. The thermoset resin composition used to form the shield case 150 may have the same composition as the thermoset resin composition used to form the components of the shield case 22 (i.e., the body 34 and the cover 38). In addition, the components of the shield case 150 may be formed using the RIM process of the RIM system 100, or the second RIM process of the second RIM system 136, which were described above. With the shield case 150 being comprised of a conductive polymer as described above, the shield case 150 has sufficient bulk conductivity and/or surface conductivity to convey a charge to ground so as to prevent a partial discharge.
Referring now to
Referring now to
The shield case 210 comprises a rectangular major body 212, a conduit-shaped minor body 214 and a rectangular cover 216. The major body 212 includes a pair of opposing inner side walls 222, each having a flanged opening 224. The cover 216 has a pair of opposing inner flanges or skirts 226 that correspond to the inner side walls 222 of the major body 212. Each of the skirts 226 has a flanged opening 228. The major body 212 defines a rectangular groove (not shown), which is adapted to receive portions of first and second cores 218, 220 of the transformer 208. The minor body 214 has an enclosed periphery and a rectangular cross section. The cover 216 and the major body 212 are constructed such that the cover 216 may be disposed over and releasably engaged with the major body 212 so as to cover the groove. When the cover 216 is engaged with the major body 212, the flanged openings 224 of the major body 212 cooperate with the flanged openings 228 of the cover 216 to form flanged composite openings. The minor body 214 extends between the side walls 222 and the side skirts 226 and has opposing flanged ends that engage the flanged composite openings of the combined major body 212/cover 216.
The components of the shield case 210 (i.e., the major body 212, the minor body 214 and the cover 216) are each comprised of a conductive thermoset resin composition and are each formed in a RIM process. The thermoset resin composition used to form the shield case 210 may have the same composition as the thermoset resin composition used to form the components of the shield case 22 (i.e., the body 34 and the cover 38). In addition, the components of the shield case 210 may be formed using the RIM process of the RIM system 100, or the second RIM process of the second RIM system 136, which were described above. With the shield case 210 being comprised of a conductive polymer as described above, the shield case 210 has sufficient bulk conductivity and/or surface conductivity to convey a charge to ground so as to prevent a partial discharge.
Referring now to
It is to be understood that the description of the foregoing exemplary embodiment(s) is (are) intended to be only illustrative, rather than exhaustive, of the present invention. Those of ordinary skill will be able to make certain additions, deletions, and/or modifications to the embodiment(s) of the disclosed subject matter without departing from the spirit of the invention or its scope, as defined by the appended claims.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US2008/010908 | 9/19/2008 | WO | 00 | 3/16/2010 |
Publishing Document | Publishing Date | Country | Kind |
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WO2009/042076 | 4/2/2009 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
2297605 | Camilli | Sep 1942 | A |
2960756 | Treanor | Nov 1960 | A |
3517361 | Reifel et al. | Jun 1970 | A |
3996543 | Conner et al. | Dec 1976 | A |
4199743 | Martincic | Apr 1980 | A |
4400340 | Klosiewicz | Aug 1983 | A |
4459576 | Fox et al. | Jul 1984 | A |
4504813 | Strang | Mar 1985 | A |
5008065 | Okumura et al. | Apr 1991 | A |
5083360 | Valencic et al. | Jan 1992 | A |
5464585 | Fitzgibbon | Nov 1995 | A |
5480940 | Khasat et al. | Jan 1996 | A |
5860550 | Miller et al. | Jan 1999 | A |
6031442 | Nakazawa | Feb 2000 | A |
6204347 | Hafner et al. | Mar 2001 | B1 |
6310533 | Coulombier | Oct 2001 | B2 |
6331586 | Thielen et al. | Dec 2001 | B1 |
6486279 | Lynn et al. | Nov 2002 | B2 |
6689835 | Amarasekera et al. | Feb 2004 | B2 |
6753749 | Chin | Jun 2004 | B1 |
7230808 | Kirby et al. | Jun 2007 | B2 |
20050270134 | Skinner et al. | Dec 2005 | A1 |
20060069199 | Charati et al. | Mar 2006 | A1 |
20060125593 | Piaskowski | Jun 2006 | A1 |
20070231587 | Naito et al. | Oct 2007 | A1 |
20070241852 | Goudreau | Oct 2007 | A1 |
20070265379 | Chen et al. | Nov 2007 | A1 |
20080061915 | Godbey | Mar 2008 | A1 |
20080096022 | Naito et al. | Apr 2008 | A1 |
Number | Date | Country |
---|---|---|
1 783 155 | Sep 2007 | EP |
1156369 | Jun 1969 | GB |
WO 2007051342 | May 2007 | WO |
2009042076 | Feb 2009 | WO |
Number | Date | Country | |
---|---|---|---|
20100201472 A1 | Aug 2010 | US |
Number | Date | Country | |
---|---|---|---|
60974117 | Sep 2007 | US |