The present invention relates to a drying apparatus, and more particularly to a drying apparatus capable of avoiding from forming defects on the appearance of a substrate after drying.
With the continuously development of the optical technology and semiconductor technology, the liquid crystal display (LCD) is widely applied to all areas of society, wherein, in the production process of sealing the liquid crystal between two glass substrates, at least one liquid crystal displaying unit area (which is referred to a display area, and other regions are referred to non-display areas, hereinafter) on the two glass substrates will be configured with a layer of alignment film, respectively.
In particular, forming steps of the alignment film mainly comprise: (1) a coating step, that forms a material of the alignment film, which is diluted by a solvent, on the surface of the glass substrate by printing processes; (2) a drying step, that evaporates the solvent within a temperature range from 80° C. to 120° C. and then only remains the uniform alignment film; and (3) a baking step, that cures the alignment film with a temperature above 180° C. . The traditional drying step mainly adopts a solution of polyimide (PI) to be the material of the alignment film, and to heat the glass substrate by infrared radiation for evaporating the solvent in the polyimide. The disadvantage is that during the drying process of the substrate, the surfaces may cause problems of uneven heating and an inconsistent evaporating rate of the solvent, such that uneven spots are left on the surfaces of the substrate and thereby affect the quality of the final product.
For example, the traditional drying step is used to coat the solution of polyimide on a first surface of the substrate and use a plurality of support pins to support a second surface of the substrate, so that the substrate may lie on the support pins. Because the support pins are not completely insulated, it is very easy to occur inconsistent heating between regions of the substrate that is in contacted with the support pins and regions that is not in contacted with the support pins. Thereby, after the drying step, the first surface may form uneven pin Mura phenomenon.
For reducing the spots like pin Mura on the first surface, the traditional support pins usually adopt a way of proximity effect to support the substrate, and the support pins are made of better thermal-insulation materials, wherein
Referring to
Referring to
Although the existing technology can slightly reduce defects of appearance of the substrate by alternately changing contact positions of the support pins and the substrate, it still can not completely eliminate problems of the appearance of the substrate. As a result, it is necessary to provide a processing apparatus which enable to efficiently remove the pin Mura of the substrate for the drying step of the alignment film to solve the appearance problems of products in the conventional technology.
An object of the present invention is to provide a drying apparatus, wherein the drying apparatus is provide for an alignment film to avoid the pin Mura to solve the appearance problems of products in the conventional technology.
A primary object of the present invention is to provide a drying apparatus which uses to dry a pre-formed material of alignment film on a first surface of a substrate. The drying apparatus has a heating platform, a first support net, a plurality of support pins and a first elevating mechanism. The heating platform uses to heat a second surface of the substrate. The first support net comprises a plurality of first filaments, and the first filaments commonly define a plurality of first meshes (i.e. net holes). The support pins are set/disposed in at least one portion of the first meshes. The first elevating mechanism controls the support pins to rise and lower, thereby the support pins are higher or lower than the first support net. Thus, the first elevating mechanism can determine that: the support pins support the second surface of the substrate before and after the drying step, or the first support net supports the second surface of the substrate during the drying step, so that to avoid the first surface of the substrate from remaining pin Mura after the drying step.
A secondary object of the present invention is to provide a drying apparatus, which comprises a heating platform, a first support net, a second support net, a plurality of support pins, a first elevating mechanism and a second elevating mechanism. The second support net has a plurality of second filaments, and the second filaments commonly define a plurality of second meshes. The second elevating mechanism controls the first and second support net to alternately rise and lower, thereby the first support net is higher or lower than the second support net for determining that the second surface of the substrate is supported by the first or second support net. Thus, the substrate does not contact the support pins during the drying process, so that to avoid the first surface of the substrate from remaining Mura after the drying step.
A third object of the present invention is to provide a drying apparatus, wherein the first support net and the second support net adopt the first filaments and the second filaments with very thin and better loading capacity to support the substrate, so that the substrate can be flatly and inflexibly set/disposed on the first support net or the second support net during the drying process. It is helpful to ensure the substrate will not be bent and deformed after the drying step.
To achieve the above object, the present invention provides a drying apparatus, which uses to dry a pre-formed material of alignment film on a first surface of a substrate, wherein the drying apparatus comprises: a heating platform, which uses to heat a second surface of the substrate; a first support net, which comprises a plurality of first filaments, and wherein the first filaments are parallelly arranged to each other to commonly define a plurality of first meshes; a second support net, which comprises a plurality of second filaments, wherein the second filaments are parallelly arranged to each other to commonly define a plurality of second meshes, and the second filaments and the first filaments are parallel to each other; a plurality of support pins, which are located/set in at least one portion of the first meshes and the second meshes; a first elevating mechanism, which controls the support pins to rise and lower, thereby the support pins are higher or lower than the first and second support net for determining that the second surface of the substrate is supported by the support pins, the first support net or the second support net; and a second elevating mechanism, which controls the first and second support net to alternately rise and lower in accordance with a precedent period and a following period; wherein while the support pins are lower than the first and second support net, the second elevating mechanism drives the first support net to be higher or lower than the second support net for determining that the second surface of the substrate is supported by the first or second support net.
To achieve the above object, the present invention provides another drying apparatus, which uses to dry a pre-formed material of alignment film on a first surface of a substrate, wherein the drying apparatus comprises: a heating platform, which uses to heat a second surface of the substrate; a first support net, which comprises a plurality of first filaments, and wherein the first filaments commonly define a plurality of first meshes; a plurality of support pins, which are located/set in at least one portion of the first meshes; and a first elevating mechanism, which controls the support pins to rise and lower, so that the support pins are higher or lower than the first support net for determining that the second surface of the substrate is supported by the support pins or the first support net.
To achieve the above object, the present invention also provides a drying apparatus, which uses to dry a pre-formed material of alignment film on a first surface of a substrate, wherein the drying apparatus comprises: a heating platform, which uses to heat a second surface of the substrate; a first support net, which comprises a plurality of first filaments, and wherein the first filaments commonly define a plurality of first meshes; a second support net, which comprises a plurality of second filaments, wherein the second filaments commonly define a plurality of second meshes; a plurality of support pins, which are set in at least one portion of the first meshes and the second meshes; and a second elevating mechanism, which controls the first and second support net to alternately rise and lower, thereby the first support net is higher or lower than the second support net for determining that support the second surface of the substrate is supported by the first or second support net.
In one embodiment of the present invention, the first filaments are carbon fiber filaments.
In one embodiment of the present invention, the first filaments are vertically (longitudinally) and horizontally (transversely) arranged to form the first meshes.
In one embodiment of the present invention, the first support net comprises 95 to 2937 of the first filaments, and a space between axes of each two parallel and adjacent vertical (or horizontal) first filaments is from 3.8 to 48 millimeter (mm).
In one embodiment of the present invention, the first filaments are parallel to each other to form the first meshes, and the second filaments are parallel to each other to form the second meshes, wherein the first filaments are risen and lowered in the second meshes and the second filaments are risen and lowered in the first meshes.
In one embodiment of the present invention, the first filaments and the second filaments are carbon fiber filaments.
In one embodiment of the present invention, a cross-sectional diameter of the first and second filaments is from 0.8 to 3 millimeter.
In one embodiment of the present invention, the first and second support net totally comprise 95 to 2937 of the first and second filaments, and a space between axes of each two the parallel and adjacent first and second filaments is from 3.8 to 48 millimeter.
In one embodiment of the present invention, the second elevating mechanism controls the first and second support net to alternately rising and lowering in accordance with a precedent period and a following period, and the precedent period is smaller than the following period.
In one embodiment of the present invention, a cross-sectional diameter of the support pins is 2 millimeter.
Comparing to the existing technology, the drying apparatus in the present invention can avoid the support pins from being in contact with the substrate, so that to ensure that the surface of the substrate will not remain pin Mura after the drying step. It also can help the material of alignment film to be more uniform and can avoid the substrate from be deformed, and thus a yield of the product thereof can be enhanced.
The foregoing objects, features and advantages adopted by the present invention can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings. Furthermore, the directional terms described in the present invention, such as upper, lower, front, rear, left, right, inner, outer, side and etc., are only directions referring to the accompanying drawings, so that the used directional terms are used to describe and understand the present invention, but the present invention is not limited thereto.
The present invention is to provide a drying apparatus which is mainly applied to the field of substrate processes, and more particularly to the field of processes for semiconductor or optoelectronic products. It is mainly used to reduce chance of contact between a plurality of support pins and the substrate during a process of a solvent evaporation and drying process after the substrate was coated a layer of alignment film, so as to prevent surfaces of the substrate from forming pin Mura.
Referring to
Referring to
As shown in
Simultaneously referring to
Please refer to
Besides,
In
As shown in
The present invention has been described with a preferred embodiment thereof and it is understood that many changes and modifications to the described embodiment can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Number | Date | Country | Kind |
---|---|---|---|
201120347765.4 | Sep 2011 | CN | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/CN11/80564 | 10/9/2011 | WO | 00 | 12/19/2011 |