The subject matter herein relates generally to a dual connector system.
Dual connector systems include first and second electrical connectors mounted to a host circuit board that are electrically connected to a dual connector module. The dual connector module includes a module circuit board having connector interfaces for interfacing with the first and second electrical connectors. Typically communication components are mounted to the module circuit board. For example, electrical and/or optical components may be mounted to the module circuit board. In various applications an on-board optics module may be mounted to the module circuit board. Heat dissipation of the communication components may be provided, such as in the form of a heat sink thermally coupled to the communication components and supported by the module circuit board.
Mating of the dual connector module to the first and second electrical connectors typically involves loading the dual connector module into a first position in a vertical direction and then sliding the dual connector module to a second position in a horizontal direction to mate with the first and second electrical connectors. However, proper mating of the module circuit board to both electrical connectors simultaneously may be difficult. Additionally, securing the dual connector module to the first and second electrical connectors may be problematic. For example, holding the rear end of the dual connector module downward on the second electrical connector to ensure adequate electrical connection between the dual connector module and the second electrical connector may be problematic. Conventional dual connector systems utilize J-shaped hooks associated with second electrical connector to hold the module circuit board downward against the contacts of the second electrical connector. Notches are formed in the module circuit board to receive the J-shaped hooks. However, such notches take away potential component area of the module circuit board and narrow the paths for routing electrical traces through the module circuit board.
A need remains for a dual connector system that secures the dual connector module with the first and second electrical connectors on the host circuit board for proper mating.
In one embodiment, a dual connector system is provided including a host circuit board having a front mounting area with a first electrical connector at the front mounting area having a housing having a card slot holding first contacts at the card slot being terminated to the host circuit board and a rear mounting area with a second electrical connector at the rear mounting area having a housing having an upper mating surface, a first side and an opposite second side and holding second contacts at the upper mating surface between the first and second sides. The housing has a hold down ledge having a hold down surface located below the upper mating surface. The dual connector system includes a dual connector module mated to the first and second electrical connectors having a module circuit board including an upper surface and a lower surface facing the host circuit board having at least one communication component on the upper surface and front contact pads proximate to the front edge for electrically connecting to the first electrical connector and rear contact pads remote from the front edge for electrically connecting to the second electrical connector. The dual connector module includes a securing anchor extending below the lower surface engaging the hold down surface and being captured below the hold down ledge to secure the dual connector module to the second electrical connector.
In another embodiment, a dual connector system is provided including a host circuit board having a front mounting area with a first electrical connector at the front mounting area having a housing having a card slot holding first contacts at the card slot being terminated to the host circuit board and a rear mounting area with a second electrical connector at the rear mounting area having a housing having an upper mating surface, a first side and an opposite second side and holding second contacts at the upper mating surface between the first and second sides. The housing has a hold down ledge having a hold down surface located below the upper mating surface. The dual connector system includes a dual connector module mated to the first and second electrical connectors having a module circuit board including an upper surface and a lower surface facing the host circuit board having at least one communication component on the upper surface and front contact pads proximate to the front edge for electrically connecting to the first electrical connector and rear contact pads remote from the front edge for electrically connecting to the second electrical connector. The dual connector module includes a securing anchor extending below the lower surface. The securing anchor has an anchor surface engaging the hold down surface and being captured below the hold down ledge to secure the dual connector module to the second electrical connector. At least one of the anchor surface and the hold down surface are angled to drive the module circuit board downward toward the upper mating surface as the securing anchor is mated with the hold down ledge.
In a further embodiment, a dual connector system is provided including a host circuit board having a front mounting area with a first electrical connector at the front mounting area having a housing having a card slot holding first contacts at the card slot being terminated to the host circuit board and a rear mounting area with a second electrical connector at the rear mounting area having a housing having an upper mating surface, a first side and an opposite second side and holding second contacts at the upper mating surface between the first and second sides. The housing has a hold down ledge having a hold down surface located below the upper mating surface. The dual connector system includes a dual connector module mated to the first and second electrical connectors having a module circuit board including an upper surface and a lower surface facing the host circuit board having at least one communication component on the upper surface and front contact pads proximate to the front edge for electrically connecting to the first electrical connector and rear contact pads remote from the front edge for electrically connecting to the second electrical connector. The dual connector module includes a securing anchor extending below the lower surface. The dual connector module is coupled to the host circuit board by lowering the dual connector module in a loading direction generally perpendicular to the host circuit board to a pre-staged position where the first connector interface is adjacent to the first electrical connector and the second connector interface is adjacent to the second electrical connector. The securing anchor is aligned rearward of and not engaged with the hold down ledge in the pre-staged position. The dual connector module is slid forward from the pre-staged position to a mated position in a mating direction generally parallel to the upper surface of the host circuit board to mate the first connector interface to the first electrical connector by loading the front edge of the module circuit board into the card slot of the first electrical connector to mate the first contacts to the first contact pads and to mate the second connector interface to the second electrical connector to mate the second contacts to the second contact pads. The securing anchor is slid forward with the dual connector module to the mated position such that an anchor surface of the securing anchor engages the hold down surface and such that the securing anchor is captured below the hold down ledge in the mated position to prevent lift off of the dual connector module from the second electrical connector in the mated position.
When the dual connector module 102 is mounted to the host circuit board 110, the dual connector module interfaces with both electrical connectors 112, 116. Optionally, the dual connector module 102 may be simultaneously mated with the first and second electrical connectors 112, 116 during a mating process. In an exemplary embodiment, the first electrical connector 112 is a different type of electrical connector than the second electrical connector 116. For example, the first electrical connector 112 may be a front loaded electrical connector, such as a card edge connector. The second electrical connector 116 may be a top loaded electrical connector, such as a Z-axis or mezzanine connector. The electrical connectors 112, 116 may be used for different types of signaling. For example, the first electrical connector 112 may be used for high-speed signaling while the second electrical connector 116 may be used for low speed signaling, powering, or for another type of connection.
In an exemplary embodiment, mating of the dual connector module 102 to the host circuit board 110 occurs by loading the dual connector module 102 in a loading direction 124 (for example, Z-axis or downward) to a pre-staged position and then mating the dual connector module 102 in a mating direction 126 (for example, X-axis or forward) to a mated position. The loading direction 124 may be perpendicular to the host circuit board 110, such as in a vertical direction, and the mating direction 126 may be parallel to the host circuit board 110, such as in a horizontal direction.
The dual connector module 102 includes a module circuit board 130 having an upper surface 132 and a lower surface 134. The module circuit board 130 extends between a front edge 136 (shown in phantom) and a rear edge 138. The lower surface 134 faces the host circuit board 110 and may be parallel to and spaced apart from the host circuit board 110 when mated to the electrical connectors 112, 116.
In an exemplary embodiment, the dual connector module 102 includes one or more communication components 140 on the upper surface 132 and/or the lower surface 134. The communication components 140 may be electrical components, optical components, or other types of components. In an exemplary embodiment, one or more of the communication components 140 may be on-board optical modules. The communication components 140 may include optical/digital converters for converting between optical and electrical signals. Other types of communication components 140 may be provided on the module circuit board 130, such as processors, memory modules, antennas, or other types of components.
In an exemplary embodiment, the dual connector module 102 includes a housing or shell 142 on the upper surface 132. The shell 142 encloses the communication components 140 and may enclose portions of the module circuit board 130. In an exemplary embodiment, the shell 142 extends generally around the perimeter of the module circuit board 130; however, portions of the module circuit board 130 may be exposed exterior of the shell 142. In an exemplary embodiment, the dual connector module 102 includes a heat sink 144 thermally coupled to one or more of the communication components 140. The heat sink 144 dissipates heat from the communication components 140. The heat sink 144 may be mounted to the shell 142 and/or the module circuit board 130. In an exemplary embodiment, the heat sink 144 extends substantially the entire length of the dual connector module 102. The heat sink 144 may have a plurality of fins having a large surface area for dissipating heat.
In an exemplary embodiment, the dual connector module 102 includes a latch 146 at a front end of the dual connector module 102 for latchably securing the dual connector module 102 to the first electrical connector 112. A tether 148 is coupled to the latch 146 and extends to the rear end of the dual connector module 102 for releasing the latch 146.
In an exemplary embodiment, the dual connector module 102 includes one or more securing anchors 150 (
In an exemplary embodiment, the second electrical connector 116 includes a hold down ledge 152 having a hold down surface 154. The securing anchor 150 has an anchor surface 156 configured to engage the hold down surface 154 to secure the dual connector module 102 to the second electrical connector 116. In the illustrated embodiment, the hold down ledge 152 is provided at the rear of the second electrical connector 116. The securing anchor 150 is coupled to the hold down ledge 152 from behind the second electrical connector 116. The securing anchor 150 extends below the lower surface 134 of the module circuit board 130 to engage the second electrical connector 116. The securing anchor 150 is located between the module circuit board 130 and the host circuit board 110. The second electrical connector 116 does not include any J-hooks or other upwardly protruding towers or posts used by conventional electrical connectors for securing the module circuit board 130. As such, the module circuit board 130 does not need to include notches or other cutouts in the side edges to accommodate such J-hooks typical of conventional electrical connectors. As such, the module circuit board 130 has more surface area for mounting components and routing traces as compared to conventional module circuit boards.
As the securing anchor 150 is coupled to the hold down ledge 152 (for example, as the dual connector module 102 is slid forward toward the mated position), the hold down ledge 152 may pull downward on the securing anchor 150 to force the dual connector module 102 into electrical connection with the second electrical connector 116. The hold down ledge 152 prevents lift-off of the dual connector module 102 from the second electrical connector 116. In an exemplary embodiment, the hold down ledge 152 is located below the top or mating surface of the second electrical connector 116. For example, the hold down ledge 152 is located below the module circuit board 130.
The module circuit board 130 includes rear contact pads 164 on the lower surface 134 that define a second connector interface 166 configured for electrically connecting to the second electrical connector 116 (shown in
The securing anchors 150 are provided proximate to the rear end 138 of the module circuit board 130. Any number of securing anchors 150 may be provided, including a single securing anchor 150. In the illustrated embodiment, two securing anchors 150 are provided proximate to opposite side edges 170, 172 of the module circuit board 130; however, the securing anchors 150 may be provided at other locations in alternative embodiments. Optionally, the securing anchors 150 may be mounted to the module circuit board 130, such as to the lower surface 134; however, the securing anchors 150 may be mounted at other locations or to other structures, such as the shell 142 and/or the heat sink 144.
The securing anchor 150 may define a hook 180 configured to be received in the second electrical connector 116 under the hold down ledge 152. For example, the hook 180 may be forward facing to load into the second electrical connector 116 as the dual connector module 102 is slid forward to the mated position. The securing anchor 150 includes a base 182 extending from the module circuit board 130 and a beam 184 extending from the base 182 to a distal end 186. In the illustrated embodiment, the beam 184 extends forward from the base 182; however, the beam 184 may extend in other directions in alternative embodiments, such as inward toward a center of the dual connector module 102. The anchor surface 156 is defined at a top 188 of the beam 184. The anchor surface 156 may be a generally horizontal surface extending generally parallel to the module circuit board 130 in various embodiments; however, the anchor surface 156 may be ramped or angled in alternative embodiments. For example, in the illustrated embodiment, the anchor surface 156 includes a ramped surface 190 ramped upward between the distal end 186 and the base 182. Optionally, the ramped surface 190 may be angular. Alternatively, the ramped surface 190 may be curved. The ramped surface 190 may be positioned rearward of a flat surface (such as at the distal end 186) and/or forward of a flat surface (such as at the base 182). Having the anchor surface 156 ramped drives the securing anchor 150, and thus the dual connector module 102, downward as the securing anchor 150 is slide forward into the second electrical connector 116 to the mated position. Optionally, a bottom 192 of the beam 184 may be configured to rest on the host circuit board 110 to support the dual connector module 102 as the dual connector module 102 is slid forward to the mated position.
When assembled, the securing anchor 150 secures the dual connector module 102 to the second electrical connector 116. Optionally, the securing anchor 150 may be coupled to the second electrical connector 116 such that the securing anchor 150 induces a downward biasing force on the dual connector module 102 when the anchor surfaces 156 are driven along the hold down ledges 152 to force the rear contact pads 164 downward on corresponding contacts of the second electrical connector 116.
With additional reference to
The housing 300 includes locating surfaces 308 at the mating end 304 for locating the module circuit board 130 relative to the card slot 306 during mating. For example, the locating surfaces 308 may be upward facing surfaces configured to support the front edge 136 of the module circuit board 130 in the pre-staged position. The module circuit board 130 may slide along the locating surfaces 308 during mating as the front edge 136 of the module circuit board 130 is loaded into the card slot 306. The locating surfaces 308 may support the module circuit board 130 in the mated position to prevent damage to the first contacts 302 from the weight of the dual connector module 102.
With reference to
The housing 350 includes locating surfaces 358 at the mating end 354 for locating the module circuit board 130 during mating. For example, the locating surfaces 358 may be shoulders, flanges, tabs, and the like configured to locate the module circuit board 130 by restricting side-to-side movement of the module circuit board 130. The locating surfaces 358 may define a pocket that receives the module circuit board 130.
The housing 350 includes pockets 360 at a rear 361 of the housing 350. The pockets 360 receive the securing anchors 150. The pockets 360 are defined in part by the hold down ledges 152, which, in the illustrated embodiment, are at the tops of the pockets 360. The pockets 360 are located proximate to opposite sides 362, 364 of the housing 350 in complementary locations for receiving the securing anchors 150. Optionally, the pockets 360 may be open at a bottom 366 such that the host circuit board 110 is exposed at the bottom 366. In an exemplary embodiment, the pockets 360 have chamfered lead-in surfaces 368 to guide the securing anchors 150 into the pockets 360. For example, the lead-in surfaces 368 guide the securing anchors 150 to the hold down surfaces 154 at the tops of the pockets 360. In the illustrated embodiment, the housing 350 has discrete pockets 360 at the opposite sides 362, 364 that are separated by material of the housing 350. In alternative embodiments, the housing 350 may include a single pocket defined by a common hold down ledge 152 that receives multiple securing anchors 150.
The hold down surfaces 154 are generally downward facing to capture the securing anchors 150 under the hold down ledges 152. The hold down surfaces 154 may be generally horizontal surfaces extending generally parallel to the upper mounting surface 356 in various embodiments; however, the hold down surfaces 154 may be ramped or angled in alternative embodiments, such as to drive the securing anchor 150, and thus the dual connector module 102, downward as the securing anchor 150 is slide forward into the pocket 360 to the mated position. As such, the dual connector module 102 is forced downward into the upper mating surface 356 and the second contacts 352.
In an exemplary embodiment, mating of the dual connector module 102 to the host circuit board 110 occurs by loading the dual connector module 102 in the loading direction 124 (shown in
During mating, the first connector interface 162 is generally aligned above the first electrical connector 112 and the second connector interface 166 is generally aligned above the second electrical connector 116 and the module circuit board 130 is lowered into position on the first and second electrical connectors 112, 116 to the pre-staged position. The front edge 136 of the module circuit board 130 rests on, and is supported by, the first electrical connector 112 in the pre-staged position (
In the pre-staged position, the securing anchors 150 are located rearward of the second electrical connector 116 and aligned with the pockets 360. As the dual connector module 102 is lowered into the pre-staged position, the securing anchors 150 clear the second electrical connector 116 and are configured to be received in the pockets 360. For example, the securing anchors 150 are vertically aligned with the pockets 360 and horizontally aligned with the pockets 360 (for example, side-to-side).
To complete mating, the dual connector module 102 is moved from the pre-staged position (
In an exemplary embodiment, mating of the dual connector module 102 to the host circuit board 110 occurs by loading the dual connector module 102 in the loading direction 124 to the pre-staged position (
During mating, the first connector interface 162 is generally aligned above the first electrical connector 112 and the second connector interface 166 is generally aligned above the second electrical connector 116 (
As the dual connector module 102 is moved from the pre-staged position (
A rail 372 is located rearward of the window 370. The hold down ledge 152 is defined along the rail 372, such as along a bottom surface of the rail 372. In the illustrated embodiment, the hold down ledge 152 extends the width of the housing 350 between the sides 362, 364, rather than having separate pockets, such as the pockets 360 of the embodiment shown in
It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. § 112(f), unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
Number | Name | Date | Kind |
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4678252 | Moore | Jul 1987 | A |
7470136 | Yahiro | Dec 2008 | B2 |
8787711 | Zbinden et al. | Jul 2014 | B2 |