1. Field of the Invention
The present invention relates to acoustic transducer technology, and more particularly to a dual-diaphragm acoustic transducer for converting sound waves to electrical signals.
2. Description of the Related Art
With the rapid development of the 4C electronics (computer, communication, consumer electronics and car industries), mobile communication products such as smart phone, Bluetooth headset and microphone have become one of the mainstreams. Due to the demand for higher tone quality of mobile communication products is increasing, an acoustic transducer for use in the aforesaid mobile communication products must have good sensitivity.
A relevant prior art acoustic transducer, for example, U.S. Pat. No. 8,104,354 discloses a capacitance sensor that comprises a substrate, a sensing device, a movable frame, a first electrode and a second electrode respectively mounted at the substrate corresponding to the sensing device and the movable frame, and some spring members connecting the movable frame and the sensing device. When a sound wave pressure acts on the sensing device, the sensing device will move vertically relative to the first electrode (see FIG. 8B of the prior art), causing a change of the capacitance value therebetween and a relative change of the voltage that is induced across the capacitance. However, this design adopts one single sensing device (one single diaphragm), and this single sensing device may be unable to sense a very small volume of sound, lowering the sensitivity. Increasing the sensitivity must increase the sensing area of the sensing device. However, increasing the sensing area will affect the arrangement of the configuration of the whole structure.
The present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide a dual-diaphragm acoustic transducer, which enhances the sound pressure sensing range and improves the sensitivity without increasing the sensing area.
To achieve this and other objects of the present invention, a dual-diaphragm acoustic transducer of the present invention comprises a substrate, a sound wave sensing unit, and a support unit. The substrate comprises a first side, a second side opposite to the first side, and an opening cut through the first side and the second side. The sound wave sensing unit is mounted at the first side of the substrate to face toward the opening, comprising an inner diaphragm and an outer diaphragm. The outer diaphragm surrounds the inner diaphragm. The support unit comprises at least two elastic supporting members connected between the inner diaphragm and outer diaphragm of the sound wave sensing unit.
Preferably, the support unit further comprises a supporting base affixed to the substrate. The supporting base is provided for the connection of the outer diaphragm directly or by means of at least two symmetrical elastic supporting members, thereby rendering a support effect.
Preferably, the first side of the substrate provides a back plate that is covered over the sound wave sensing unit. The back plate carries an electrode unit that faces toward the sound wave sensing unit. The electrode unit comprises an inner electrode and an outer electrode. The inner electrode and the outer electrode are respectively arranged corresponding to the inner diaphragm and the outer diaphragm so that a respective capacitance is created between the inner electrode/outer electrode and the inner diaphragm/outer diaphragm. When the voltage induced across each capacitance changes subject to vibration of the inner or outer diaphragm, the current induced across each capacitance will change relatively to output an electrical signal.
Thus, subject to the arrangement of the inner and outer diaphragms and the connection of the multiple elastic supporting members, the dual-diaphragm acoustic transducer enables the inner diaphragm to have a relatively larger amount of vertical displacement than the outer diaphragm when the inner and outer diaphragms are simultaneously forced by a sound wave pressure, thereby enhancing the sensitivity when the sensing area remains unchanged.
Other advantages and features of the present invention will be fully understood by reference to the following specification in conjunction with the accompanying drawings, in which like reference signs denote like components of structure.
Referring to
Referring also to
As shown in
As shown in
In addition to the aforesaid structure, the dual-diaphragm acoustic transducer 10 further comprises a back plate 50 and an electrode unit 60. As shown in
Referring to
When the incident sound wave disappears, the inner diaphragm 32 and the outer diaphragm 34 will be returned and kept apart from the inner electrode 62 and the outer electrode 64 by the elastic potential energy of the first elastic supporting members 42 and the second elastic supporting members 43, preventing the problem of adhesions between the inner/outer diaphragm 32/34 and the inner/outer electrode 62/64.
In conclusion, subject to the arrangement of the inner and outer diaphragms 32&34 and the connection of the multiple elastic supporting members 42&43, the dual-diaphragm acoustic transducer 10 enables the inner diaphragm 32 to have a relatively larger amount of vertical displacement than the outer diaphragm 34 when the inner and outer diaphragms 32&34 are simultaneously forced by a sound wave pressure, thereby enhancing the sensitivity. Thus, the inner diaphragm 32 can be used to respond to high sensitivity sound waves, and the outer diaphragm 34 can be used to respond to high-pressure sound waves. Using the inner and outer diaphragms to respond to a relatively smaller sound wave pressure and a relatively larger sound wave pressure respectively can enhance the sound wave pressure sensing range. Further, by means of combining different acoustic signals sensed by the inner and outer diaphragms can further improve the signal-to-noise ratio. Therefore, no matter the size of the sound, the dual-diaphragm acoustic transducer 10 of the present invention can offer optimized sensing results.
Finally, it is to be noted that the structure of the present invention can be variously embodied. For example, in a second embodiment of the present invention, as shown in
Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.