The present invention relates to smoke detection, and more particularly, is related to a smoke detector chamber with dual emitters.
Different types of smokes produced from different material burning have particulate matter distributions of different sizes. Certain wavelengths of light work better for detecting certain particle size ranges, for instance, IR (infrared) light works better for larger smoke particle while blue light works better for smaller smoke particles.
Smoke detecting devices typically detect smoke particles in a chamber between a light emitting source and a light detector. Traditional smoke detecting devices incorporate an optic block assembly that emits and detects a single wavelength, for example, using an infrared (IR) light emitting diode (LED) as the emitter.
More recently, smoke detector have been developed that emit both IR and blue light to detect the presence of different sized smoke particles. The optics block of such detectors produces a smoke signal ratio of the two wavelengths, which is a function of the smoke particles dimensions (types of fire), thus permitting the user to improve the detection selectivity between small smoke particles and large smoke particles via the smoke detection algorithms. The dual color allows a reduction in the smoke detection threshold.
However, the present dual wavelength smoke detector require additional components and tighter manufacturing tolerances resulting in increased costs. Therefore, there is a need in the industry to address one or more of the abovementioned issues.
Embodiments of the present invention provide a dual-emitter optic block and chamber for a smoke detector. Briefly described, the present invention is directed to a photo-electric smoke detector assembly that includes a Y-shaped optic block with a first photo-electronic device mounted on a first end and second and third photo-electronic devices mounted on a second end, with an interaction volume at a midpoint. Two of the photo-electronic devices direct pulses of differing wavelengths toward the interaction volume, and the remaining photo-electronic device receives light from the pulses scattered off of smoke particles in the interaction volume.
Other systems, methods and features of the present invention will be or become apparent to one having ordinary skill in the art upon examining the following drawings and detailed description. It is intended that all such additional systems, methods, and features be included in this description, be within the scope of the present invention and protected by the accompanying claims.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present invention. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
FIG.7 is a schematic diagram illustrating the field of illumination, the field of view, and a cross section plane of the interaction volume of the optical block of
The following definitions are useful for interpreting terms applied to features of the embodiments disclosed herein, and are meant only to define elements within the disclosure.
As used within this disclosure, an “interaction volume” refers to a volume of space where the field of illumination of one or more smoke detector emitters intersects with the field of view of a smoke detector light sensor. The interaction volume is determined as a volume overlap of the illumination and detection optical path. The value of the interaction volume for each volume element depends on the field of illumination of the light source and field of view of the detector. High field densities are prone to mechanical tolerances such as pointing errors that lead to a significant signal loss once the foci of the field of view and the field of illumination do not coincide. A more homogeneous interaction volume shows less signal loss if the optical axes of emitter and detector are not perfectly aligned.
As used within this disclosure, a “hotspot” refers to a (typically small) volume element with high interaction volume values (therefore high density regions) due to coinciding foci of field of illumination and field of view, for example, as a result of round-shaped optical sensitive areas of the previous designs.
As used within this disclosure, a “photo-electronic device” refers to both light emitting and light detecting electronic devices, for example, LED devices and photodiodes. Detectors with more than one LED emitter may include LED emitters emitting two or more different wavelength ranges of light, for example, infrared (IR) and visible blue light.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
Embodiments of the present invention are directed to a photo-electric device having photo-electronic devices including one or two emitters and one photodetector integrated into one plastic optic block assembly, for example as a surface mountable device (SMD) to be solder reflow mounted to a printed circuit board (PCB) for smoke detection. As noted in the background section, the optic block for previous smoke detectors may include one light emitter and one optical detector where a single wavelength optical signal may not be able to differentiate between small and large smoke particles.
The embodiments include a particularly configured Y shape optic block 200 (Y-block Assembly) with two emitters 211, 212 and one photodetector 250 and a particularly shaped smoke chamber designed around the Y-block assembly, used in smoke detection. Under the first embodiment, a first end 201 of the optic block 200 houses the emitters 211 while a second end 202 opposite the first end 201 houses a photo detector 250, for example, a photodiode. The first emitter 211 and the second emitter 212 alternately generate a short duration light pulse. The optic block 200 includes a dust collector 215 configured as a slot recessed into the optic blot 200 located at a midpoint of an intersection portion of field of view of the emitters 211, 211 and the detector 250. The photodiode 250 may receive light from the light pulses scattered within the interaction volume off of smoke particles in the smoke chamber 260.
As shown by
Likewise, the optic block 200 is configured to mount the photo detector 250 so the photo detector 250 receives light along the detector axis 209 oriented at the angle α with respect to the planar mounting surface of the substrate 280.
Metal leads 216 of the photo-electronic components 211, 212, 250 may formed in J shape (so called J leads) and photo-electronic components are inserted into plastic body of the optic block 200. The optic block plastic body may include crush ribs 217 configured to hold the photo-electronic components 211, 212, 250 in the optic block 200 at certain strength for example, on the order of about 1 Kg pull force, so the photo-electronic components 211, 212, 250 stay in position during a high temperature solder reflow of optical block 200 on the PCB 280. A detector channel 225 aligned with the detector axis 209 has a flat channel floor parallel to the photo detector optical axis. The channel floors 221, 222, 225 are optically sensitive areas arranged to follow the same angle of each corresponding optical component pointing direction, for example 22.5 degrees off the PCB plane. The optical sensitive areas may be, for example, flat along the optical axis, having a polished surface to have controlled light reflection out from the emitters 211, 212 and toward the photodetector 225. The configuration of the optical sensitive areas 221, 222, 225 helps reduce the interaction volume density to avoid hotspots.
FIG.7 illustrates the field of illumination, the field of view, and a cross section plane of the interaction volume of the optical block 200.
As shown in
An angle θ between the infrared LED angle and the blue LED angle is equal to β+δ in a plane parallel to a mounting plane of the optical block 200. The angular configuration as well as the shape and surface texture finish of optically sensitive areas 221, 222, 225 are configured to have a desirable interaction volume of the emitter and detector field of view, providing a good signal level for the emitted/scattered light in the presence of smoke, while still keep the low cost of plastic Y-block manufacturing and friendly components insertion process. For example, the flat surfaces of the optically sensitive areas 221, 222, 225 (“light tunnels”) result in a more homogeneous interaction volume that reduces “hot spot” features. The surface texture finish of the light tunnels 221, 222, 225 may be reflective (“glossy”) to ensure light at the interaction volume shows specular reflection and not surface scattering that would lead to reduction of the interaction volume. Compared with previous optic blocks, the Y-block assembly has a larger and more homogeneous interaction volume, which reduces the impact of geometrical variances on the smoke signal sensitivity. For example, the configuration of the Y-block assembly may mitigate pointing error of the emitter or of the sensor due to mechanical or placement (led-die, photo diode-chip) tolerances. The geometrical variances also include the variance of optical axis of emitters and detector due to the dimensional difference of plastic optic blocks, and relative positioning difference of emitters and detector mounted in optic blocks.
The optic block 200 is mounted on a substrate (PCB) 280, for example in either a surface mount or thru-hole configuration. An electromagnetic interference (EMI) shield 320 may be configured to fit over the photodiode end 202 of the optic block 200. A smoke chamber assembly 400 includes a roof 310, a base 330 and a surrounding metal mesh 340. The metal mesh 340 is integrated with the smoke chamber, to screen insects and large dust particles from entering the smoke chamber and triggering the smoke detector.
In order to still have a detectable background signal to assess the health status of the photo-electric device, additional concentric circular structures 410 surrounding the central cone structure 420 on the interior of the chamber cap roof and protruding into the chamber introduce light pathways towards the photodiode with low energy per pathway contribution due to steep reflection angles (for example, angles 45° or greater) and multiple reflection introducing light traps.
Meanwhile the level of background signal may be controlled by varying specific parameters of the light reflecting feature 410 to allow the end customers to have specific background levels for their device health assessment. Such parameters may include, for example, angle of circular features, height of circular features, and surface roughness of circular features. The combination of the angle change and distance change causes light reflection and scattering to have different background signal levels.
The configuration of the cone 420 and the circular structures 410 significantly reduce the transferred power compared to previous cap interior linear groove structures according to optical simulations and smoke tunnel tests.
The labyrinth 440 is formed from a plurality of interleaved baffles integrated into the smoke cap 400 for smooth air and smoke flow while blocking direct ambient light from entering the chamber 260. The smoke cap may be configured with legs 450 that easily snap into receiving apertures in the PCB 280.
Under the first and second embodiments, the optic block assembly 200 is surface mountable to be solder reflowed on the PCB 280. Likewise, the EMI shield 320 for the photodiode 250 may be surface mounted together with the optic block assembly 200 on the same PCB 280. The EMI shield 320 and optic block assembly may be configured as solder reflow-able surface mount devices (SMD). In alternative embodiments, other PCB mounting techniques may be used, for example, through-hole mounting.
Under the embodiments described herein, the material for the optic block may include, but is not limited to glass reinforced polyethylene terephthalate for injection molding, and the material for the chamber (cap and base) may include antistatic ABS for injection molding.
In alternative embodiments, the smoke detector optic block may be substantially similar to the first embodiment but instead having a single emitter opposite a single photo detector, where the emitter and detector have flat optical channels and the chamber roof includes the central protruding cone structure and the concentric circular structures surrounding the central cone structure. Other variations are also possible.
A photodiode, an IR LED, and a Blue LED, are provided, each with tested bin numbers, as shown by block 610. The photodiode and LEDs are installed into receiving mounts of a plastic optic block, as shown by block 620. The leads of the photodiode and LEDS are trimmed to form J leads for mounting the optic block to a printed circuit board, as shown by block 630. The optic block is mounted to the PCB, as shown by block 640. A smoke detector housing is snapped over the optic block into receptacles on the PCB, as shown by block 650.
Advantages of the above described embodiments over previous smoke detectors include:
The SMD optic block allows a lower cost for manufacturing. In comparison, for a two part smoke chamber, the manufacturing tolerances will lead to an expensive smoke chamber base allowing SMD mounting or a through hole assembly of the LEDs and photodiode. The use of the optic block allows SMD assembly techniques while maintaining low cost.
The large interaction volume also allows cost reduction while maintaining good detection threshold by reducing the need for tight pointing accuracy of the LEDs and photodiode, since tight pointing error is achieved by tight mechanical tolerance on LEDs and photodiode which raise the cost of these components.
The smoke chamber design allows lower detection threshold by reducing the clean air signal due to the labyrinth, the cone, and the round features on the smoke chamber cap. The smoke chamber design widens the light interaction volume allowing wider tolerance for component placement and selection, ultimately reducing the cost of the sensor.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.