The following disclosure generally relates to electrical circuits and signal processing.
Conventional solid-state integrated circuits make use of reference voltage and reference current generation circuits for various purposes, for example, to provide dc biasing. Integrated circuits associated with applications having low tolerances to variations of a reference voltage or a reference current typically include accurate off-chip passive components for reference generation.
One type of reference voltage generation circuit is a bandgap circuit. A bandgap circuit typically generates a constant bandgap voltage (VBG) that is insensitive to conditions of an integrated circuit such as temperature, chip supply voltage, and fabrication process variations. Another type of reference voltage generation circuit is a proportional-to-absolute-temperature reference (PTAT) circuit. In contrast to a bandgap circuit, a PTAT circuit generates a PTAT voltage (VPTAT) that has a linear dependence on temperature (i.e., VPTAT=kT, where T represents absolute temperature (in Kelvin) and k represents a temperature insensitive constant). Since a transconductance (gm) of transistors (e.g., bipolar junction transistors) typically changes linearly with respect to temperature, some integrated circuits may need a current (i.e., IPTAT), proportional to voltage VPTAT, to bias one or more transistors in a manner that maintains a fixed transconductance for the transistors.
With respect to reference current generation circuits, process variations between integrated circuits typically prevent conventional integrated circuits from internally generating a sufficiently accurate reference current. For example, an internal reference current derived from an internal resistor (RCHIP) within one integrated circuit (e.g., VPTAT/RCHIP) may vary by ±15% or more relative to an internal reference current derived from an internal resistance RCHIP within a different integrated circuit having an exact same configuration. Such variations are not suitable for many high-precision, high-speed and high-bandwidth applications.
An integrated circuit requiring an accurate reference current can be produced using a reference voltage (e.g., VPTAT or VBG) and an external, more accurate resistance (REXT). Such a reference current requires a separate terminal connection and an additional external resistor. Additional terminals and resistors are generally expensive (i.e., terminals on an integrated circuit are an expense and require additional manufacturing cost to produce and, similarly, additional external components add to the cost of a given circuit with attending cost increases due to mounting and coupling the external component). Further, terminals also consume valuable die area and increase package size (i.e., unnecessary terminals waste valuable resource space).
This disclosure generally describes a current generation circuit and a method of current generation. In general, in one aspect, the current generation circuit includes: a first source to generate a first reference current that is a ratio of a first reference voltage and an external resistance; and a current control circuit in communication with the first source, the current control circuit configured to control a second reference current that is a ratio of a second reference voltage and the external resistance, the current control circuit configured to control the second reference current without a source of the second reference current being directly coupled to the external resistance.
Particular implementations can include one or more of the following features. The current control circuit of can be configured to receive the second reference current. The current generation circuit can further comprise a second source, coupled to the second reference current and sourcing a current that is proportional to the second reference current. The current generation circuit can further comprise a closed voltage loop to control the second reference current in conjunction with one or more internal resistances such that the second reference current is substantially unaffected by an accuracy level of the one or more internal resistances. The current generation circuit can be configured to produce the second reference current such that the second reference current is substantially unaffected by one or more conditions associated with the circuit. The one or more conditions can include at least one of temperature, process variation, and voltage supply level. The current generation circuit can include the first reference voltage provided by a substantially constant voltage source. The current generation circuit can include the second reference voltage provided by a proportional-to-absolute-temperature voltage (VPTAT) source that remains substantially constant except for a linear dependence on a temperature of the circuit. The external resistance can include an external resistor having a predetermined accuracy level.
In general, in another aspect, the current generation circuit includes: an external resistance; a first source to generate a first reference current that is a ratio of a first reference voltage and the external resistance; a second source to generate a second reference current that is a ratio of a second reference voltage and the external resistance; a third source to generate a first internal reference current that is a ratio of the first reference voltage and a first internal resistance; a fourth source to generate a second internal reference current that is a ratio of the second reference voltage and a second internal resistance having a value substantially similar to a value of the first internal resistance; and a current control circuit operable to control the second reference current including substantially equating a proportional relationship between the first and second reference currents and the second and first internal reference currents.
In general, in another aspect, the method of current generation comprises: generating a first reference current that is a ratio of a first reference voltage and an external resistance; and generating a second reference current that is a ratio of a second reference voltage and the external resistance without directly coupling to the external resistance.
Particular implementations may include one or more of the following features. The method can further comprise receiving the second reference current. The method can further comprise sourcing a current that is proportional to the second reference current. Generating the second reference current can comprise controlling the second reference current in conjunction with one or more internal resistances such that the second reference current is substantially unaffected by an accuracy level of the one or more internal resistances. Generating the second reference current can comprise producing the second reference current such that the second reference current is substantially unaffected by one or more conditions associated with the circuit. The one or more conditions can include at least one of temperature, process variation, and voltage supply level. The first reference voltage can be a substantially constant voltage. The second reference voltage can remain substantially constant except for a linear dependence on a temperature of the circuit. The external resistance can include an external resistor having a predetermined accuracy level.
In general, in another aspect, the method of current generation can comprise: generating a first reference current that is a ratio of a first reference voltage and an external resistance; generating a second reference current that is a ratio of a second reference voltage and the external resistance; generating a first internal reference current that is a ratio of the first reference voltage and a first internal resistance; generating a second internal reference current that is a ratio of the second reference voltage and a second internal resistance having a value substantially similar to a value the first internal resistance; and controlling the second reference current including substantially equating a proportional relationship between the first and second reference currents and the second and first internal reference currents.
In general, in another aspect, the current generation circuit comprises: means for generating a first reference current that is a ratio of a first reference voltage and an external resistance; means, in communication with the means for generating, for controlling a second reference current that is a ratio of a second reference voltage and the external resistance, the means for controlling operable to control the second reference current without a source of the second reference current being directly coupled to the external resistance.
Aspects of the invention can provide one or more of the following advantages. The circuit can generate two accurate reference currents based on a single external reference, thereby saving expense from additional terminals and resistors, and consumption of valuable die area. Furthermore, a reference current can be produced that, when biased by a temperature dependent voltage source such as reference voltage VPTAT, yields a fixed transconductance in bipolar junction transistors (BJTs) in a circuit.
Circuit 210 can be (or included in), for example, a semiconductor device or integrated circuit formed from silicon, gallium arsenide, and the like. External resistance REXT 341 can be, for example, a resistor with a predetermined level of accuracy (i.e. a low error tolerance). Input 241 can be a terminal, a chip interface, or any other signal input device. At a high level, circuit 210 generates a first reference current (IREF1) and a second reference current (IIREF2). Both currents IREF1 and IREF2 are related to external resistance REXT 341 even though current IREF2 is not directly coupled to external resistance REXT 341.
In one implementation, circuit 210 includes a current control circuit 220, sources 230, 240, 250 and 260, internal resistors RCHIP1 326a and RCHIP2 326b, and circuit components 211a, b.
Current control circuit 220 can be implemented using, for example, bipolar junction transistors (BJTs) as shown in
In the implementation shown, source 230 includes a current mirror comprising transistors 331a,b. Transistors 331a,b are coupled to a supply voltage VDD. Transistor 331b produces (i.e., sources) a current I that is provided to circuit components 211a. Current I mirrors—i.e., is controlled by—current IREF2, and, as will be described below, is equal to a ratio of a varying reference voltage VPTAT and the external resistance REXT 341 (i.e., I=VPTAT/REXT). Current I, based on varying voltage VPTAT, can produce a constant transconductance in a transistor having temperature varying properties as discussed in more detail below. In one implementation, transistors 331a,b are equally sized and accordingly, current I=IREF2. Source 230 generates a substantially constant reference current value for current IREF2 related to the external resistance REXT 341.
In an alternative implementation, source 230 is not required. In this implementation, rather than providing a current source (i.e., source 230), current control circuit 220 sinks an amount of current (IREF2) that is controlled as discussed below.
In one implementation, source 240 is a device that includes two inputs, and an output (as summarized below in Table 1) and is coupled to a supply voltage VDD.
As shown in
Source 250 can be a device that includes a nominally constant reference voltage VBG as an input as described above with respect to Table 1. Source 250 is coupled to a resistor RCHIP1 326a which is also coupled to a reference voltage (preferably ground). The output of source 250 is coupled to current control circuit 220 and may be coupled to other components requiring a constant reference source (not shown). Source 250 operates to provide at its output a reference current I3 that is defined by a ratio of the constant reference voltage and the internal resistance (I3=VBG/RCHIP1).
Source 260 can include a varying reference voltage, proportional-to-absolute-temperature voltage (VPTAT), which varies with temperature as an input. Source 260 is coupled to an internal resistor RCHIP2 326b which is also coupled to a reference voltage (preferably ground). The output of source 260 is coupled to current control circuit 220 and may be coupled to other components requiring a varying reference source (not shown). Source 260 operates to provide a reference current I4 that is defined by a ratio of the varying reference voltage and the internal resistance (I4=VPTAT/RCHIP2). Contrary to a dependence on the external resistance REXT 341 by sources 230 and 240, sources 250 and 260 generate potentially varying values for currents I3 and I4 by using internal resistors RCHIP1 326a and RCHIP2 326b. In one implementation, both currents I3 and I4 depend on the same type of internal resistor (i.e., same type, size and layout).
Internal resistors RCHIP1 326a and RCHIP2 326b can be, for example, resistors without a predetermined level of accuracy (i.e., a high error tolerance). Preferably internal resistance RCHIP1 326a matches (e.g., by being cast from the same die), or is substantially similar to, internal resistance RCHIP2 326b.
Current control circuit 220 has inputs to receive currents IREF1, IREF2, I3 and I4. Current control circuit 220 controls current IREF2 in accordance with fixed ratios established for the currents IREF1 and IREF2, and the currents I3 and I4. In one implementation, the proportional relationship of reference currents IREF1/IREF2 is equivalent to the proportional relationship of reference currents I4/I3. The proportional relationships can be realized through a variety of circuit configurations, such as a translinear circuit discussed below with respect to
Closed voltage loop 329 includes BJTs 322-324, and 327. A base of BJT 323 is in communication with a base of BJT 324, a base of BJT 322 is in communication with a base of BJT 327, an emitter of BJT 322 is in communication with an emitter of BJT 323, and an emitter of BJT 324 is in communication with an emitter of 327. A collector of BJT 323 receives current IREF1, a collector of BJT 322 receives current IREF2, a collector of BJT 324 receives current I3, and a collector of BJT 327 receives current I4.
Current control circuit 220 includes a number of additional components specific to the implementation. These components include BJTs 334-338 and resistor 333.
Closed voltage loop 329 controls current IREF2 in accordance with the proportions discussed above. To implement the proportional relationships, BJTs 322-324, and 327 are biased into the active region. BJTs 337, 338 are commonly referred to as beta boosters that provide base current to BJTs 322, 323, 324 and 327 (providing base current to the four transistors so that the base currents are not subtracted from the respective reference currents which could cause inaccuracies in the closed voltage loop). BJTs 337, 338 also serve to keep BJTs 324 and 327 in the active region. A feedback loop, including BJTs 334, 336 and resistor 333 biases BJT 323 into the active region. More particularly, BJTs 334 and 336 ensure that the collector voltage of BJT 323 stays above the saturation voltage for the device. BJT 335 provides a common mode DC bias for the circuit.
The relationship of closed voltage loop 329 is derived as follows:
VBE322−VBE323+VBE324−VBE327=0 (1)
Equation (1) results from applying Kirchhoff's voltage law to base-emitter voltages (VBEs of the respective transistors) around closed loop 329. Equation (2) expresses VBEs in terms of the subject collector currents (i.e., currents IREF1, IREF2, I3, and I4) along with thermal voltages (VTs) and saturation currents (ISs). Assuming that BJT 322 matches BJT 323, and that BJT 324 matches BJT 327, IS1=IS2 and IS3=IS4. Accordingly, equation (2) reduces to an expression of currents in equation (3). Since currents IREF1, I3 and I4 are available from sources 240, 250 and 260 (as shown in
More particularly, current control circuit 220 is also able to generate current IREF2 in a manner such that current IREF2 is substantially unaffected by inaccuracies in physical properties of internal resistors RCHIP1 326a and RCHIP2 326b, such as temperature, supply voltage, or process variation (providing that the two resistors RCHIP1 326a and RCHIP2 326b have matching layouts, and hence, vary together). Variations are cancelled as illustrated in the following equations:
Equation (4) expresses the subject currents in terms of biasing voltages (i.e., VBG and VPTAT) and associated resistors (i.e., REXT, RCHIP1 and RCHIP2). As discussed above, since that internal resistance RCHIP1 326a matches internal resistance RCHIP2 326b (although the absolute values can be inaccurate relative to an absolute value), variations between the resistors cancel out of the denominators, yielding the equality of equation (5). Therefore, current control circuit 220 can generate (i.e., sink, in the configuration shown) a temperature varying current IREF2 (and source a corresponding current I) from voltage VPTAT based on a constant, temperature independent current IREF1 generated from voltage VBG.
Advantageously, current control circuit 220 can produce a fixed transconductance (gm) in circuit component 211a including a BJT. Because current IREF2 is associated with voltage VPTAT, temperature variations affecting voltage VPTAT similarly affect transconductance gm. Transconductance gm relates to voltage VPTAT as follows:
Equation (6) expresses transconductance gm in terms of collector current Ic (or current IREF2 in
Current control circuit 220 can also produce a fixed gain (Av) in circuit component 211a including a power amplifier (e.g., an inductively loaded RF amplifier, mixer, low noise amplifier, or open collector drive amplifier) where the load RL is constant. Gain Av relates to transconductance gm of equation (6) as follows:
Equation (7) expresses gain Av in terms of the reliable, external resistance REXT 341. As a result, current control circuit 220 is able to maintain a substantially constant gain Av drawn from varying voltage VPTAT.
The proportional relationships and sustaining thereof can be realized through a variety of circuit configurations, such as the translinear circuit discussed above. Any circuit that produces the described relationships can be substituted for closed voltage loop 329. Current control circuit 220 can be implemented using for example, BJTs, metal oxide semiconductor field effect transistors (MOSFETs) digital circuit components and the like. In addition, current control circuit 220 can be located within a same integrated circuit as circuit 210, or alternatively, off chip.
A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. For example, though one aspect of the invention has been described as controlling a particular reference current (i.e., IREF2), the circuits and principles disclosed can be used to control any of the reference currents (IREF1, I3, or I4) when the corresponding other three currents are available (e.g., a current loop included in a current control circuit can be used to control current IREF1, when IREF2, I3 and I4 are available). Accordingly, other implementations are within the scope of the following claims.
The present application claims priority to U.S. Provisional Patent Application No. 60/534,863, filed on Jan. 8, 2004, which is incorporated herein by reference in its entirety. The present application is related to U.S. application Ser. No. 11/029,194, filed Jan. 3, 2005, entitled “VARIABLE GAIN AMPLIFICATION USING TAYLOR EXPANSION”, now issued as U.S. Pat. No. 7,199,661, the contents of which is incorporated herein by reference.
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