1. Field of the Invention
The present invention relates to air purification systems for manufacturing cleanrooms, and in particular to an air purification system which utilizes acidic mist and alkaline mist.
2. Description of the Related Art
Generally, integrated circuit manufacturing involves deposition of a thin dielectric or conductive film on the wafer using oxidation or any of a variety of chemical vapor deposition processes; formation of a circuit pattern on a layer of photoresist material by photolithography; placement of a photoresist mask layer corresponding to the circuit pattern on the wafer; etching of the circuit pattern in the conductive layer on the wafer; and stripping of the photoresist mask layer from the wafer. Each of these steps, particularly the photoresist stripping step, provides abundant opportunity for organic, metal, and other circuit-contamination sources.
In the semiconductor fabrication industry, minimization of particle contamination on semiconductor wafers is getting more and more important as the integrated circuit devices on the wafers decrease in size. With the reduced size of the devices, a contaminant having a particular size occupies a relatively larger percentage of the available space for circuit elements on the wafer compared to larger devices in the past. Moreover, the presence of particles in the integrated circuit affects the functional integrity of the devices in the finished electronic product. To achieve an ultraclean wafer surface, particles must be removed from the environment, and particle-removing methods are therefore of utmost importance in the fabrication of semiconductors.
Because minimization of particles on wafers throughout the IC manufacturing process is critical, the environment within which the IC manufacturing process is carried out must be subjected to stringent controls of airborne particles which would otherwise enter the manufacturing environment from the sources outside the IC manufacturing facilities. Currently, mini-environment based IC manufacturing facilities are equipped to control airborne particles much smaller than 1.0 μm. Accordingly, modern semiconductor manufacturing is carried out in a complex facility known as a cleanroom. The cleanroom is isolated from the outside environment and subjected to a stringent control of contaminants including airborne particles, metals, organic molecules and electrostatic discharges (ESDs), as well as environmental parameters such as temperature, relative humidity, oxygen and vibration. Along with a sophisticated system of filters and equipment, a comprehensive and strictly-enforced set of procedures and practices are imposed on facility personnel in order to maintain a delicate balance of these clean air requirements and parameters for optimal IC fabrication.
A modern cleanroom used in the fabrication of integrated circuits includes one large fabrication room having a service access corridor that extends around the perimeter of the cleanroom and a main manufacturing access corridor that extends across the center of the cleanroom. Production bays, which accommodate the semiconductor fabrication tools, are located on respective sides of the main manufacturing access corridor. The outside air enters the cleanroom through an air purification system, which is located above the ceiling of the cleanroom and includes particulate filters, typically HEPA (high-efficiency particulate air) filters. Through openings in the ceiling, the air is drawn downwardly in a continuous laminar flow path from the air purification system, through the cleanroom and openings in the floor into an air recirculation system. The air recirculation system may turn the air over every six seconds in order to achieve ultraclean conditions during disturbances such as changes in personnel shifts. An exhaust system removes heat and chemicals generated during the fabrication processes.
U.S. Pat. No. 6,059,866 teaches an air scrubber that eliminates dust or harmful gases in air, reduces the supply of pure water used as clean water, and performs humidification with high saturation efficiency. Moreover, U.S. Pat. No. 6,387,165 teaches an airborne molecular contaminant removal apparatus applied to remove airborne chemical contaminants such as particulate contaminants or airborne molecular contaminants from the outside air.
In
An object of the invention is to provide a purification system for removing acidic AMCs and alkaline AMCs from a flowing gas without any precise pH value control device.
Another object of the invention is to provide an air purification system suitable for purifying the outside air and introducting the outside air into a cleanroom for the manufacture of semiconductor integrated circuits.
Still another object of the invention is to provide an air purification system efficient and to reduce the quantity of required water.
The invention provides an air purification system for treating pollutants in a gas stream. The air purification system includes a housing with a plurality of nozzles, an acidic water supply device and an alkaline water supply device. The housing introduces the gas stream, the acidic water supply device supplies acidic water for first nozzles to spray acidic mist. The alkaline water supply device supplies alkaline water for second nozzles to spray alkaline mist. The acidic mist and alkaline mist neutralize acidic gas and alkaline gas contained in the gas stream.
In a preferred embodiment, the air scrubber system further includes a porous layer disposed in the housing between the first nozzles and the second nozzles. The porous layer covers a cross section of the housing. The first and second nozzles spray toward the porous layer to remove corrosive gas and particles.
Moreover, the housing has a drain pan to collect water in the housing. The acidic water supply device and the alkaline water supply device are individually connected to the drain pan of the housing, recycling water therefrom. The acidic water supply device is a tower with cation-exchanging resin to reduce cations in the recycled water, forming acidic water pumped by a first pump to the first nozzles. The alkaline water supply device is a tower with anion-exchanging resin to reduce anions in the recycled water, forming alkaline water pumped by a second pump to the second nozzles.
Moreover, the pH value of acidic water supplied by the acidic water supply device is between 4.5 and 6.5. The pH value of alkaline water supplied by the alkaline water supply device is between 7.5 and 9.5.
The invention also provides another air purification system for treating corrosive gases exhausted from semiconductor devices. The air purification system includes a housing with a plurality of filtration modules, a condenser, an acidic water supply device and an alkaline water supply device. Each of the filtration modules includes a porous layer, a plurality of first nozzles and second nozzles. The first nozzles are connected to the acidic water supply device, spraying acidic mist toward the porous layer. The second nozzles are disposed in the housing opposite the first nozzles and connected to the alkaline water supply device, spraying alkaline mist toward the porous. The acidic mist and alkaline mist neutralize acidic gas and alkaline gas contained in the gas stream. The condenser is disposed in the housing at the downstream side with respect to the filtration modules to condense water from the gas stream.
In a preferred embodiment, the housing has a drain pan to collect water in the housing. The acidic water supply device and the alkaline water supply device are individually connected to the drain pan of the housing, recycling water therefrom. The acidic water supply device is a tower with cation-exchanging resin to reduce cations in the recycled water, forming acidic water pumped by a first pump to the first nozzles. The alkaline water supply device is a tower with anion-exchanging resin to reduce anions in the recycled water, forming alkaline water pumped by a second pump to the is second nozzles.
Moreover, the pH value of acidic water supplied by the acidic water supply device is between 4.5 and 6.5. The pH value of alkaline water supplied by the alkaline water supply device is between 7.5 and 8.5.
Further scope of the applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention, wherein:
The present invention has particularly beneficial utility in removing acidic and alkaline AMCs from air before the air enter into a cleanroom used in the fabrication of semiconductor integrated circuits. However, the invention and is also generally applicable to the removal of acidic and alkaline AMCs from gas or air in a variety of industrial and mechanical applications.
In
In
According to the present invention, at least one filtration module 59 is provided in the housing 52 between the upstream cooling coil 60 and the downstream cooling coil 72. The filtration module 59 includes a first nozzle conduit 66 and a second nozzle conduit 61, individually having a plurality of first spray nozzles 67 and second spray nozzles 62, disposed in the housing 52 downstream of the upstream cooling coil 60. A water droplet trap 71 is disposed between the first nozzle conduit 66 and second nozzle conduit 61. The water droplet trap 71 is a very low-density eliminator made of fabric material, such as a mesh or non-woven sheet.
Furthermore, an acidic water supply device 68 is connected to the first nozzle conduit 66 and supplies acidic water for first nozzles 67 through a first pump 69 to spray acidic mist. An alkaline water supply device 63 is connected to the second nozzle conduit 61 and supplies alkaline water for second nozzles 62 through a second pump 64 to spray alkaline mist. The first nozzles 67 of the first nozzle conduit 66 and the second nozzles 62 of the second nozzle conduit 61 are both directed toward the water droplet trap 71. The acidic mist 70 and alkaline mist 65 neutralize acidic and alkaline AMCs contained in the gas stream 88. The downstream cooling coil 72 is positioned downstream of the second nozzle conduit 61. A chemical filter 76 and a HEPA filter 78 are provided in the housing 52, downstream of the heating coil 74.
In
In order to improve the removal efficiency of acidic and alkaline AMCs, the pH value of acidic water supplied by the acidic water supply device is between 4.5 and 6.5, and the pH value of alkaline water supplied by the alkaline water supply device is between 7.5 and 8.5.
Moreover, the acidic water supply device 68 also can be a resin tower or dopes gas, such as CO2, in the recycled water to lower the pH value thereof.
After passing through at least one filtration module 59, the air 88 is devoid of all or most acidic/alkaline AMCs and airborne particles present therein upon entry of the air into the intake end 54 of the housing 52. The air 88 next flows through the cooling coil 72, further condensing water and then through the heating coil raising the temperature of the air 88 to room temperature. Before exiting the outlet end 80 of the housing 52, the air 88 passes though the chemical filter 76, further removing organic or any other chemical residues remaining in the air 88. Finally, the air passes through the HEPA filter 78, removing remaining particles and emerges from the outlet end 80 of the housing 52 as purified air 90 which meets cleanroom standards for air purity.
The purification system of the present invention uses anion-exchanging tower to produce alkaline water and cation-exchanging tower to produce acidic water, and to neutralize acidic and alkaline AMCs in the outside air. The chemical removal efficiency of the air purification system is increased, while avoiding any precise pH value control. Thus, the cost of the system is also reduced.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to covers various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Number | Name | Date | Kind |
---|---|---|---|
3907523 | Melin, Jr. | Sep 1975 | A |
4579569 | Sheng et al. | Apr 1986 | A |
5626820 | Kinkead et al. | May 1997 | A |
5643797 | Schmidt et al. | Jul 1997 | A |
5660615 | Neumann et al. | Aug 1997 | A |
6059866 | Yamagata et al. | May 2000 | A |
6387165 | Wakamatsu | May 2002 | B1 |
6451096 | Kim | Sep 2002 | B1 |
6623546 | Bourdel | Sep 2003 | B1 |
20020011150 | Wakamatsu et al. | Jan 2002 | A1 |
Number | Date | Country | |
---|---|---|---|
20050126393 A1 | Jun 2005 | US |