1. Field of the Invention
The present invention relates to thermal management of computer systems, and more specifically to the movement of air in a computer chassis.
2. Background of the Related Art
Computer systems are generally provided inside a chassis to provide physical support and air circulation for each of the individual components. A typical chassis will include a motherboard, one or more data storage device, a power supply and one or more chassis fan. The motherboard itself may include any number of standard heat-generating components, such as a processor, memory, basic input/output system (BIOS) and interconnecting circuitry. However, a motherboard may also include one or more expansion slots, such as a peripheral component interface (PCI) connector that allows the capability or capacity of the computer system to be expanded.
When a high power expansion card is installed on the motherboard, the chassis fans may not be sufficient to deal with the amount of localized heat-generation caused by operation of the expansion card. Accordingly, an expansion card, such as a high end video card, may include a heat sink and a fan (collectively referred to as an “active heatsink”) to provide the amount of dedicated cooling necessary to operate the expansion card. Some of these active heatsinks direct airflow in the same direction as the chassis fan. However, it is not uncommon that an expansion card may direct airflow opposite to the direction of the chassis fan. For example, a front-mounted video card may draw cool air through an air inlet on the front end of the chassis and exhaust hot air through an exhaust outlet that is on the front end of the chassis immediately adjacent to the air inlet.
One embodiment of the present invention provides an apparatus that substantially prevents recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the front end of the chassis. The apparatus comprises a chassis including at least one chassis fan directed to move air in a first direction through the chassis from a front end to a back end, a motherboard disposed within the chassis and having an expansion slot adjacent the front end of the chassis, and an expansion card having an edge connector in communication with the expansion slot and a mounting bracket secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through an air inlet in the front end, move the cooling air across a portion of the expansion card to take on heat, and direct the heated air to an exhaust outlet in the front end. In addition, the apparatus includes an air duct having a first end secured in direct communication with the exhaust outlet, wherein the air duct redirects the heated air toward the back end of the chassis to a second end of the air duct that opens into communication with the at least one chassis fan, wherein the air duct substantially prevents recirculation of the heated air from the exhaust outlet to the air inlet and causes the heated air to exit through the at least one chassis fan.
Another embodiment of the invention provides a method comprising the steps of operating a card fan to cool an expansion card in a chassis by drawing in cool air from a front end of the chassis and exhausting heated air out the front of the chassis, preventing the heated air from recirculating into the expansion card, redirecting the heated air into a separate passageway of the chassis, and operating a chassis fan to move the heated air out a back end of the chassis.
One embodiment of the present invention provides an apparatus that substantially prevents recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the front end of the chassis. The apparatus comprises a chassis including at least one chassis fan directed to move air in a first direction through the chassis from a front end to a back end, a motherboard disposed within the chassis and having an expansion slot adjacent the front end of the chassis, and an expansion card having an edge connector in communication with the expansion slot and a mounting bracket secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through an air inlet in the front end, move the cooling air across a portion of the expansion card to take on heat, and direct the heated air to an exhaust outlet in the front end. In addition, the apparatus includes an air duct having a first end secured in direct communication with the exhaust outlet, wherein the air duct redirects the heated air toward the back end of the chassis to a second end of the air duct that opens into communication with the at least one chassis fan, wherein the air duct substantially prevents recirculation of the heated air from the exhaust outlet to the air inlet and causes the heated air to exit through the at least one chassis fan. In an optional implementation, the expansion slot is a PCI expansion slot and the expansion card in a PCI card.
In another embodiment, the air inlet to the expansion card, the exhaust outlet from the expansion card, or both are formed in the mounting bracket that secures the expansion card to the chassis. As a non-limiting example of such an embodiment, the air inlet is formed in the front end of the chassis and the exhaust outlet is formed in the mounting bracket. While the chassis fan or fan assembly directs air through the chassis in a first direction from front to back, such an exhaust outlet directs the heated air in a second direction that is generally opposite to the first direction.
In a further embodiment, the air duct includes a lateral duct segment and a longitudinal duct segment. A preferred longitudinal duct segment is a channel formed inside the chassis and a preferred lateral duct segment is selectively attachable to the front end of the chassis to direct heated air from the exhaust outlet into the longitudinal duct segment. Although the air inlet to the expansion card may be positioned immediately adjacent the exhaust outlet from the expansion card, the lateral duct segment prevents hot air exhaust from mixing the cool air being drawn into the air inlet. The longitudinal duct segment receives the hot air exhaust from the lateral duct segment and directs the hot air into the chassis to be moved out the back of the chassis according to the operation of the chassis fan assembly. It is preferable that the longitudinal duct segment is formed in an expansion module adjacent a compute module that secures the motherboard and the expansion card, wherein both the expansion module and the compute module are received within the chassis. Optionally, a riser card may be interposed between the expansion card and the expansion slot to position the expansion card in a generally parallel orientation with respect to the motherboard.
Yet another embodiment of the invention provides a method comprising the steps of operating a card fan to cool an expansion card in a chassis by drawing in cool air from a front end of the chassis and exhausting heated air out the front of the chassis, preventing the heated air exiting the front of the card from recirculating into the expansion card, redirecting the heated air into a separate passageway of the chassis, and operating at least one chassis fan to move the heated air out a back end of the chassis. Preferably, the expansion card has an edge connector received in an expansion slot on a motherboard. It is also preferable that the step of redirecting the heated air into the chassis includes selectively securing a lateral duct segment to the front of the chassis.
In the embodiment of
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components and/or groups, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The terms “preferably,” “preferred,” “prefer,” “optionally,” “may,” and similar terms are used to indicate that an item, condition or step being referred to is an optional (not required) feature of the invention.
The corresponding structures, materials, acts, and equivalents of all means or steps plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but it not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Number | Name | Date | Kind |
---|---|---|---|
4035711 | Piller | Jul 1977 | A |
5297005 | Gourdine | Mar 1994 | A |
5424915 | Katooka et al. | Jun 1995 | A |
5440450 | Lau et al. | Aug 1995 | A |
5446619 | Madsen et al. | Aug 1995 | A |
5473507 | Schwegler et al. | Dec 1995 | A |
5493457 | Kawamura et al. | Feb 1996 | A |
5502869 | Smith et al. | Apr 1996 | A |
5544012 | Koike | Aug 1996 | A |
5694294 | Ohashi et al. | Dec 1997 | A |
5892654 | Worden, Jr. | Apr 1999 | A |
5946188 | Rochel et al. | Aug 1999 | A |
5949646 | Lee et al. | Sep 1999 | A |
5956227 | Kitaoka | Sep 1999 | A |
6011689 | Wrycraft | Jan 2000 | A |
6108203 | Dittus et al. | Aug 2000 | A |
6113485 | Marquis et al. | Sep 2000 | A |
6330152 | Vos et al. | Dec 2001 | B1 |
6400567 | McKeen et al. | Jun 2002 | B1 |
6459578 | Wagner | Oct 2002 | B1 |
6466448 | Baik | Oct 2002 | B1 |
6483699 | Salmonson et al. | Nov 2002 | B1 |
6525937 | Yanagida | Feb 2003 | B2 |
6556440 | Jensen et al. | Apr 2003 | B2 |
6618248 | Dalheimer | Sep 2003 | B1 |
6639794 | Olarig et al. | Oct 2003 | B2 |
6643132 | Faneuf et al. | Nov 2003 | B2 |
6678157 | Bestwick | Jan 2004 | B1 |
6704196 | Rodriguez et al. | Mar 2004 | B1 |
6704199 | Wiley | Mar 2004 | B2 |
6735081 | Bishop et al. | May 2004 | B1 |
6742583 | Tikka | Jun 2004 | B2 |
6804115 | Lai | Oct 2004 | B2 |
6934161 | Kim et al. | Aug 2005 | B2 |
6970353 | Brovald et al. | Nov 2005 | B2 |
6991533 | Tsai et al. | Jan 2006 | B2 |
6999312 | Garnett et al. | Feb 2006 | B1 |
7019969 | Foster, Sr. et al. | Mar 2006 | B2 |
7023697 | Pokharna et al. | Apr 2006 | B2 |
7054157 | Hirota et al. | May 2006 | B2 |
7061761 | Tucker et al. | Jun 2006 | B2 |
7064954 | Wu et al. | Jun 2006 | B1 |
7068505 | Kosugi | Jun 2006 | B2 |
7120018 | Shen et al. | Oct 2006 | B2 |
7187561 | Chang | Mar 2007 | B2 |
7209356 | Lee et al. | Apr 2007 | B2 |
7212403 | Rockenfeller | May 2007 | B2 |
7245485 | Morrell | Jul 2007 | B1 |
7248471 | Wabiszczewicz | Jul 2007 | B2 |
7272004 | Hirota et al. | Sep 2007 | B2 |
7309279 | Sharp et al. | Dec 2007 | B2 |
7403385 | Boone et al. | Jul 2008 | B2 |
7468884 | Carr et al. | Dec 2008 | B2 |
7508664 | Holland | Mar 2009 | B2 |
7609517 | Sun | Oct 2009 | B2 |
20030016496 | Kim et al. | Jan 2003 | A1 |
20030021088 | Jensen et al. | Jan 2003 | A1 |
20030095381 | Lee et al. | May 2003 | A1 |
20050111200 | Hardt et al. | May 2005 | A1 |
20050174737 | Meir | Aug 2005 | A1 |
20050195568 | Shyr | Sep 2005 | A1 |
20050259392 | Vinson et al. | Nov 2005 | A1 |
20050259393 | Vinson et al. | Nov 2005 | A1 |
20060104027 | Vinson et al. | May 2006 | A1 |
20060120043 | Wolford et al. | Jun 2006 | A1 |
20070064387 | Matsumoto et al. | Mar 2007 | A1 |
20070119573 | Mahalingam et al. | May 2007 | A1 |
20070133167 | Wagner et al. | Jun 2007 | A1 |
20070230114 | Bartell et al. | Oct 2007 | A1 |
20070236882 | Chen | Oct 2007 | A1 |
20070242432 | Campbell et al. | Oct 2007 | A1 |
20080007912 | Matsushima et al. | Jan 2008 | A1 |
20080023283 | Sutker et al. | Jan 2008 | A1 |
20080024985 | Lee et al. | Jan 2008 | A1 |
20080151491 | Baldwin et al. | Jun 2008 | A1 |
20080192429 | Woolsey et al. | Aug 2008 | A1 |
20080253076 | Chen | Oct 2008 | A1 |
20080285232 | Claassen et al. | Nov 2008 | A1 |
Number | Date | Country | |
---|---|---|---|
20090262497 A1 | Oct 2009 | US |