Claims
- 1. A method for the production of an electrolytic electrode, comprising the steps of preparing a substrate of a conducting metal, depositing a solution containing salts of Ti and/or Sn, Ta and Pt on said substrate to provide a coated substrate, heating the coated substrate with the solution under an oxidizing atmosphere thereby forming an intermediate layer comprising metallic Pt dispersed in a conducting metal mixed oxide of at least one metal selected from the group consisting of Ti and Sn and an oxide of Ta on said substrate, and subsequently coating said intermediate layer with a layer of an electrode active substance.
- 2. A method according to claim 1, wherein said coating of the intermediate layer with said electrode active substance is carried out by a thermal decomposition method.
- 3. A method according to claim 1, wherein said intermediate layer is formed by heating the coated substrate under an oxidizing atmosphere at about 350.degree. to 600.degree. C.
- 4. A method according to claim 1, wherein said substrate is titanium, tantalum, or zirconium or an alloy thereof.
- 5. A method according to claim 1, wherein said intermediate layer comprises platinum dispersed in a conducting mixed oxide consisting of TiO.sub.2 and/or SnO.sub.2 and Ta.sub.2 O.sub.5.
- 6. A method according to claim 1, wherein said electrode active substance contains a platinum-group metal or an oxide thereof.
- 7. A method according to claim 1, wherein the amount of said platinum dispersed in said mixed oxide is in the range of 1 to 50 mol% based on the total amount of substance making up the intermediate layer.
- 8. A method according to claim 1, wherein the oxide of at least one metal selected from the group consisting of titanium and tin and the oxide of tantalum are present in a ratio of about 95:5 to 10:90 by metal mole.
- 9. A method according to claim 1, wherein said intermediate layer is present in an amount exceeding 0.1.times.10.sup.-2 mol/m.sup.2 calculated as metal.
- 10. A method according to claim 1, wherein the substrate of a conducting metal is provided with a coating of a platinum-group metal or a valve metal before the step of forming said intermediate layer.
Priority Claims (1)
Number |
Date |
Country |
Kind |
58-12919 |
Jan 1983 |
JPX |
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Parent Case Info
This is a division of application Ser. No. 575,602, filed Jan. 31, 1984, U.S. Pat. No. 4,481,097 11-6-84.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3950240 |
Cookfair et al. |
Apr 1976 |
|
4212725 |
Habermann et al. |
Jul 1980 |
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Foreign Referenced Citations (1)
Number |
Date |
Country |
1206863 |
Sep 1970 |
GBX |
Divisions (1)
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Number |
Date |
Country |
Parent |
575602 |
Jan 1984 |
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