This applications claims priority to United Kingdom patent application No. GB 1113075.4, filed Jul. 29, 2011, the entire contents of which are herein incorporated by reference.
The present invention relates to earphone arrangements, and it relates in particular to such arrangements as are configured to accommodate an acoustically-resistant couple within critical spatial constraints of the kind dictated by the compact dimensions of ear-bud type earphones.
Acoustically-resistant couples play a significant role in determining and adjusting the acoustic characteristics and performance of earphones, especially when a particular frequency response characteristic is required. This is especially the case in the design of earphones which feature electronic ambient noise-cancellation (ANC) technology, and specifically to those utilising “ear-bud” type thin rubber flanges that seal the outlet conduit of the earphone into the entrance of the listener's ear-canal. Such earphones are sometimes referred to as “in-ear” earphones, or “ear-bud type” earphones, and they are now widely used for portable communications and entertainment applications whilst the listener is travelling, including listening to music and, in conjunction with cellular telephone handsets, for hands-free calls and conversations.
Although the thin rubber ear-bud flanges might appear to effectively “seal” the earphone assembly into the listener's ear-canal, an earphone thus positioned and located does not provide an effective acoustic seal between the listener's ear canal and the ambient environment, because low-frequency sound vibrations can still pass through the rubber flanges themselves. In addition, as already mentioned, and as disclosed for example in U.S. Pat. No. 4,852,177, acoustically-resistant couples are often incorporated into acoustic coupling pathways that are provided in earphone structures so as to adjust the acoustic performance for a desired frequency response at the listener's ear, and such pathways allow external sound energy to be transmitted directly through the actual structure of the earphone and into the ear-canal. Acoustic coupling pathways are often implemented as small apertures, with acoustical resistance provided by an acoustically resistive mesh material overlying an aperture. Such pathways are usually situated to provide an acoustic connection either between the outer ambient air and the internal space situated at the front surface of an internal microspeaker (or in the space behind it), or between these two internal spaces themselves, or some combination thereof, and these pathways contribute to the complexity of the acoustic structure of the earphone.
The general structure of a prior-art ear-bud type earphone 10 is shown in
As already mentioned, it is usual to provide the earphone 10 with one or more vents or acoustically-resistant couples, such as that shown at 32, in order to modify the frequency response to provide, for example, high-quality sound reproduction. Such couples usually include acoustic resistors, formed by sealing a thin, acoustically resistant nylon mesh (or similar) over a small diameter (<1 mm), short length (<1 mm) aperture in the housing. This is often done by means of small, double-sided adhesive tape discs, as illustrated in
Typically, the disc 34/36 has an outer diameter of 3 mm, and a central aperture of 1 mm. It is beneficial to deploy such a resistance either between the front volume 28 and the ambient, as shown in
Further, the provision of a pathway between the ear-canal and the ambient (either directly or via the rear volume 30) allows air to escape from the ear-canal when the ear-bud 10 is inserted. This prevents damage to the microspeaker 12 as, without such a pathway, the air in the canal and front volume 28 would be momentarily compressed, and this could force the diaphragm of the microspeaker 12 beyond its mechanical limits, potentially buckling the diaphragm and causing permanent damage.
In practise, only one of these acoustic couples is required to avoid the above problems: either a front volume-to-ambient couple, or a front volume to rear volume couple (assuming that the rear volume itself is also vented). The present invention utilises an acoustic couple between the front volume and the rear volume.
When it is required to implement a front volume to rear volume acoustic couple, such as in the acoustic module design disclosed in GB-A-2,475,526, it is convenient to position the elements of the acoustic couple directly adjacent to the microspeaker 12. This is illustrated in
In
It is one object of the present invention to provide an earphone which incorporates a front volume to rear volume acoustic couple, without requiring significant addition to the lateral dimensions of the earphone.
According to the invention from one aspect there is provided an earphone arrangement comprising an earphone housing having an elongate sound outlet port dimensioned and configured to locate into a listener's ear canal and bearing an external flange of resilient material thereon for intimate contact with said ear canal; the housing bearing, internally thereof, a support surface formed with an aperture there-through communicating with said outlet port; the arrangement further including a microspeaker supported on said support surface and located to project sound through said aperture and toward said outlet; the housing comprising a front cavity in front of said microspeaker and in communication with said outlet port and a rear cavity behind said microspeaker; said support surface being further formed with a recess therein communicating with said front cavity, said recess accommodating an acoustic resistor; wherein the microspeaker overlies at least a substantial part of said recess, and the arrangement further comprises a channel linking said front and rear cavities acoustically by way of said acoustic resistor.
By having the microspeaker overlay, at least to a substantial extent, the recess containing the acoustic resistor, the invention facilitates the provision of acoustically resistant couple between the first (front) and second (rear) cavities without significantly increasing the lateral dimensions of the earphone housing.
Preferably, the recess and the acoustic resistor therein are completely overlain by the microspeaker.
In some preferred embodiments of the invention, said channel comprises a first portion formed partly in the base of said recess underlying said acoustic resistor, and a second portion, substantially orthogonal to the first, running past an edge of said microspeaker and linking the first portion to the rear cavity.
In some such embodiments, the first portion of said channel is substantially linear, thereby minimising the overall length of the channel. In other preferred embodiments, the first portion of said channel is extended to follow an arcuate path beneath an edge of said microspeaker, thereby to extend the overall length of said channel.
Preferably, the microspeaker has a circular footprint on said support surface.
Preferably, the said aperture is circular in plan, and further preferably said recess and said acoustic resistor are also circular in plan. In other preferred embodiments, however, the recess and/or the acoustic resistor may be non-circular (e.g. square) in plan.
Preferably, the housing is apertured to provide a port venting said rear cavity to the ambient. Such a port may be fitted with an acoustic resistor.
In some preferred embodiments, the said venting port is located at a significant distance from an opening into the rear cavity of said second portion of the acoustic channel.
In preferred embodiments of the invention, the earphone arrangement is further provided with a microphone means for detecting ambient noise, and with electrical connections to and from an ambient noise cancelling device.
In order that the invention may be clearly understood and readily carried into effect, embodiments thereof will now be described, by way of example only, with reference to the accompanying drawings of which:
in
in
in
a) and 4(b) show, in partially exploded cross-section and in plan views respectively, part of an earphone arrangement in accordance with one example of the invention;
a), 6(b) and 6(c) show, all in similar perspective view, various stages in the assembly of the front portion of an earphone housing of the kind described with reference to
a) is a replication of
As required, detailed embodiments are disclosed herein; however, it is to be understood that the disclosed embodiments are merely examples and that the systems and methods described below can be embodied in various forms. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present subject matter in virtually any appropriately detailed structure and function. Further, the terms and phrases used herein are not intended to be limiting, but rather, to provide an understandable description of the concepts.
The terms “a” or “an”, as used herein, are defined as one or more than one. The term plurality, as used herein, is defined as two or more than two. The term another, as used herein, is defined as at least a second or more. The terms “including” and “having,” as used herein, are defined as comprising (i.e., open language). The term “coupled,” as used herein, is defined as “connected,” although not necessarily directly, and not necessarily mechanically.
One embodiment of the invention will now be described, by way of example only, with reference to
a) shows, in somewhat simplified form, an exploded cross-section through the front housing 50 of an earphone 52 in accordance with one example of the invention.
Referring now to
The support surface 54 is also formed, beside the aperture 56, with a recess 66 which underlies a portion of the microspeaker 62 and the base of the recess 66 is formed with, and acoustically coupled to, an upwardly-open, U-shaped channel 68a, running underneath the ring 64 outwards to beyond the outermost edge of the ring 64. This can best be seen in the plan-view of
A preferred method of assembly is as follows.
The entire operation takes only a few seconds, and forms reliable acoustic seals. It will be appreciated that a rear housing (not shown) is attached to the front housing 50, similarly to the manner in which the prior art front and rear housings 16 and 18, referenced earlier, were attached; and that the rear housing is provided with a vent, similar to the prior art vent 26 described earlier.
a), 6(b) and 6(c) show similar perspective views looking into the front housing 50 at different stages of the assembly process described.
a) shows the front housing 50 ready for the addition of components as will be described. This view shows the shape and extent of the substantially flat support surface 54, and it shows the location and relative sizes of the outlet port aperture 56 and the recess 66 for the acoustic resistor. In the base of recess 66 can be seen the channel 68a. It can also be seen that, in practise, the front housing 50 is slightly non-circular, in that it is formed with a slight bulge as shown at 78; this being needed to accommodate the run of channel 68b.
b) shows the front housing 50 as above, but with the acoustic resistor 70 in place and partially overlying the channel 68a.
In the example of the invention described above, the channel 68a, 68b has been shown with a minimal length. This is desirable, and preferred in many circumstances, because it minimises the acoustic inertance of the channel, which reduces any consequent resonant effects on the frequency response of the earphone.
However, a further aspect of the invention, valuable in its own right, is the capability of extending the length of the channel, thereby extending the acoustic path-length of the couple between the rear volume of the earphone and the listener's ear-canal. This facilitates the structured incorporation of a pre-determined time delay into the ambient-to-ear path, which the inventors have discovered can be particularly advantageous for ambient noise-cancelling applications.
a) and 7(b) illustrate this aspect of the invention; with
b) shows an alternative embodiment, in which the coupling channel, identified as channel 80a and shown in dashed outline, has been lengthened by extending it around anticlockwise, underneath the microspeaker adhesive mounting ring 64, in a one-quarter circumference arc. As before, the channel 80a links directly to an orthogonal channel 80b, running up the inside wall 72 of the housing 50, but it will be appreciated that the exposed upper termination of channel 80b is thus located in a different position compared to that of channel 68b. It will also be appreciated that the bulge shown at 78 in
In terms of absolute dimensions, those currently employed are based on a miniature, 10 mm diameter microspeaker 62. The arc of channel 80a is constructed on an 8 mm diameter circle, and, subtending an angle of 90°, its length is nominally 6.3 mm, which corresponds to a sound-wave propagation time of 18.3 μs. At a frequency of 1 kHz, a propagation delay of 18.3 μs corresponds to a phase delay of 6.6°. This arcuate path-length is incremental to the other propagation paths in the system.
The acoustic resistor 82 associated with the extended channel 80a is shown in
It will be appreciated by persons skilled in the art that the present disclosure is not limited to what has been particularly shown and described herein above. In addition, unless mention was made above to the contrary, it should be noted that all of the accompanying drawings are not to scale. A variety of modifications and variations are possible in light of the above teachings without departing from the scope and spirit of the disclosure.
All references cited herein are expressly incorporated by reference in their entirety. In addition, unless mention was made above to the contrary, it should be noted that all of the accompanying drawings are not to scale. There are many different features to the present disclosure and it is contemplated that these features may be used together or separately. Thus, the disclosure should not be limited to any particular combination of features or to a particular application of the disclosure. Further, it should be understood that variations and modifications within the spirit and scope of the disclosure might occur to those skilled in the art to which the disclosure pertains. Accordingly, all expedient modifications readily attainable by one versed in the art from the disclosure set forth herein that are within the scope and spirit of the present disclosure are to be included as further embodiments of the present disclosure.
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20130028434 A1 | Jan 2013 | US |