This application is related to U.S. design patent application Ser. Nos. 29/245,216 and 29/245,231 both filed concurrently herewith.
FIG. 1 is an upper left front perspective view of an earpiece for a communications headset showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a right side elevation view thereof; and,
FIG. 7 is a left side elevation view thereof.
The ornamental design that is claimed is shown in solid lines in the drawings. The broken line outline of a headset microphone boom in the drawings is shown for environmental purposes only, and forms no part of the claimed design.