Eddy current inspection is a technique that can be used to determine the presence of flaws, such as cracks, in conductive materials. Eddy current inspection utilizes electromagnetic induction, where a drive coil of an eddy current probe is placed proximate to a test specimen that is formed from conductive materials. The drive coil is energized via a current to create a magnetic field. The magnetic field induces eddy currents in the conductive materials of the test specimen, which generate a secondary magnetic field. The nature of the secondary magnetic field, such as its magnitude or directionality, at least partially depends on the structural features of the test specimen. For example, cracks, dents, or other structural irregularities may induce perturbations in the secondary magnetic field.
Sensing coils of the eddy current array probe, which are placed proximate to the test specimen, may sense these perturbations in the secondary magnetic field. The secondary magnetic field may induce a potential and/or a potential difference in the sensing coils, and the potential and/or potential difference may change depending on the perturbations generated by structural abnormalities. Specifically, the sensing coils generate signals relating to the change, and these signals are analyzed to detect flaws in the test specimen. Unfortunately, the ability of a typical eddy current probe to detect flaws via these potential changes is highly dependent on the orientation of the coils in the probe in relation to the orientation of the flaws, such as the orientation of a crack in the test specimen. Therefore, to ensure that most of the possible flaws of the test specimen are detected, the test specimen may be repeatedly scanned with the eddy current probe in different directions. These repeated scans may be time-consuming for a technician or similar personnel.
In one embodiment, an eddy current array probe is provided that includes a plurality of eddy current channels. Each eddy current channel has a first sense coil and a second sense coil, wherein the first and second sense coils are offset from one another in a first direction and a second direction, and the first and second sense coils overlap with one another in either or both of the first and second directions, and wherein the first and second sense coils are configured to be placed at opposite polarities. Each eddy current channel also includes a drive coil positioned proximate to the first and second sense coils, wherein the drive coil is configured to generate a probing magnetic field to induce an eddy current in a test specimen. The eddy current array probe also includes a conductive bus electrically coupled to the drive coil of each of the eddy current channels and configured to supply a current to the drive coil to generate the probing magnetic field. The conductive bus has an orientation that is substantially parallel with respect to a width of the eddy current array probe, and at least a portion of the eddy current channels have inclined orientations with respect to the conductive bus to enable the eddy current array probe to detect flaws having a length greater than a size of each of the eddy current channels.
In another embodiment, an eddy current array probe is provided that includes at least a first layer and a second layer, and an eddy current channel disposed on the first and second layers. The eddy current channel includes a drive coil disposed on the first layer and configured to generate a probing magnetic field in response to an applied current to induce an eddy current in a conductive material. The probe also includes a second layer disposed on the first layer, and a sensing coil disposed on the second layer in an area corresponding to a position of the drive coil on the first layer and configured to generate a signal in response to coupling with a secondary magnetic field generated by the eddy current in the surface conductive material. The sensing coil is an absolute coil or is one of a differential pair of sensing coils.
In a further embodiment, a system includes an eddy current array probe having a first plurality of eddy current channels disposed in a first row and a second plurality of eddy current channels disposed in a second row. The first plurality and second plurality of eddy current channels overlap in a first direction but do not overlap in a second direction. Each of the first plurality and second plurality of eddy current channels include at least one sense coil configured to generate a signal in response to a magnetic field generated by an eddy current in a surface of a conductive test specimen. The probe also includes a semi-circular drive coil disposed proximate to the first plurality and second plurality of eddy current channels and configured to generate a probing magnetic field for each sense coil in response to an applied current.
These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
As noted above, the surfaces and/or interiors of test specimens may have flaws that are oriented in a number of directions, which may require a technician performing eddy current inspection to perform a large number of passes with an eddy current probe in different directions over the test specimen to ensure that all potential flaws are detected. Such testing techniques may be time-consuming and inefficient. Accordingly, the present disclosure provides embodiments for enabling an eddy current array probe (ECAP) to be sensitive to flaws, such as dents, cracks, or the like, in any orientation with respect to the probe. Accordingly, the time needed to perform eddy current inspection may be reduced. Furthermore, the present disclosure also provides embodiments for detecting long and short flaws using differential sensing coils, which are typically only able to detect short flaws in all orientations by an offset of another sense coil in a different row. For example, a short flaw may have a length that is less than the size of a sensing coil, and a long flaw may have a size that is approximately equal to or larger than the size of a sensing coil. For example, with a 5 mm probe, a short flaw may be 2 millimeters (mm) and a long flaw may be 10 mm. When a differential coil passing a long crack in a way that the two sense coils of the differential pair detect same response to the long crack, the differential coil produces zero output thus missing the detection.
For example, embodiments in accordance with the present disclosure may include differential sensing coils that are oriented in such a way so as to enable the ECAP to detect both long and short flaws. Additionally, drive coil configurations are provided that may be multiplexed and/or semi-circular so as to reduce crosstalk, reduce circuit complexity, and reduce sensitivity variation. For example, embodiments of drive coils are provided that may drive the adjacent channels at different time to reduce interference between eddy current channels (i.e., sets of drive coils and sensing coils) or avoid local drive current concentration (i.e., a “hot spot”), which causes a higher response to a defect than other location. Additionally or alternatively, drive coils in accordance with present embodiments may be disposed in separate layers from sensing coils, or may be twisted with sensing coils to reduce interference. Therefore, the present disclosure enables a higher signal-to-noise ratio for ECAP sensing coils, and also increases sensitivity of the same to structural flaws having a variety of orientations and lengths. Further, it should be noted that any of the approaches described herein may be used alone or in any combination.
With the foregoing in mind,
The system 10 includes an eddy current array probe (ECAP) 14, which may be a single-layer or multi-layer structure, as discussed in further detail below with respect to
The ECI 16 may include and, additionally or alternatively, may be operatively connected to, a processing unit 18. The processing unit 18 may be an application-specific or a general purpose computer having one or more processors. The processing unit 18 may be configured to access and perform one or more routines for performing eddy current inspection of the test specimen 12. For example, the processing unit 18 may analyze the differential and/or absolute signals collected by the probe 14 to determine the presence of structural defects in the test specimen 12. The results of such analysis, as well as any information pertinent to the analysis of the test specimen 12 may be visually displayed on a monitor 20, which may also be configured to provide user-perceivable indications or warnings as a crack or other deformation is detected.
The processing unit 18 may also be connected to a probe positioner 22. In certain embodiments, the probe positioner 22 may automatically, under the control of the processing unit 18, position the ECAP 14 at various points along a surface of the test specimen 12. Alternatively or additionally, the probe positioner 22 may position the ECAP 14 as a result of a user input. The probe positioner 22 may also provide feedback to the processing unit 18 to provide an indication of the position of the ECAP 14.
As noted above, the present approaches enable the detection of structural deformations in parts having non-regular (e.g., curved or toothed) surfaces, such as a turbine wheel. To enable the system 10 to perform such analyses, the ECAP 14 may be configured to conform to a variety of contours such that the ECAP 14 is capable of being positioned over a variety of test specimens. Furthermore, flexibility of the ECAP 14 may be desirable to enable efficient coupling of the probing magnetic field with the conductive surfaces of the test specimen 12, which generates the eddy currents that are monitored. As illustrated in
A plurality of eddy current (EC) channels 32, which includes a plurality of drive coils 34 and a plurality of sensing coils 36, are formed on the main substrate 30. A plurality of conductors 38 are connected to the sensing coils 36 to enable the ECI 16 (
The coils 34, 36, the conductors 38, 40, the shielding strips 42, and any electrical connections may be formed on the main substrate 30 using any suitable photolithographic techniques known in the art. Indeed, any one or a combination of conductive materials may be used in performing such techniques, such as copper, silver, gold, and the like. Furthermore, the ECAP 14 may include multiple layers formed by such techniques. For example, in certain configurations, it may be desirable to have a plurality, such as more than two, layers to enhance sensitivity. Accordingly, in certain embodiments, the present disclosure provides configurations in which the use of one or two flexible layers (e.g., less than three layers) are suitable for detecting surface deformations oriented in any direction and with sufficient signal-to-noise ratio. Thus, the ECAP 14 embodiments described herein may be configured to be omnidirectional probes. Approaches that enable a reduction in the number of layers suitable for an omnidirectional ECAP, such as ECAP 14, are described in detail below.
As noted above, the ECAP 14 may be configured to perform differential and/or absolute sensing. One embodiment of a differential configuration in accordance with present embodiments is illustrated in
Each differential pair 50 includes a first sensing coil 58 and a second sensing coil 60, which are operatively connected via the electrical connection 56. The first and second sensing coils 58, 60, are of opposite polarities, which is represented as “+” and “−” in the illustrated embodiment, respectively. During operation of the ECAP 14 over a substrate having no cracks or other deformities, the responses generated by the first and second sensing coils 58, 60 cancel each other, such that signals carried away from each differential pair 50 have a voltage of approximately 0 volts (V). In other words, when no surface abnormalities are present, there is no voltage output by the differential pair 50. However, in embodiments where there is a surface imperfection, such as a crack, the secondary magnetic field generated by the eddy currents in the surface may deviate from its usual or expected orientation, which may cause the differential pair 50 to output a signal having a voltage that is analyzed by the ECI 16 or similar module. The deviation of the secondary magnetic field may depend on the orientation of the surface flaw, which may affect the magnitude and the polarity of the signal produced by the differential pair 50.
For example, in embodiments where the orientation of the flaw is aligned with the orientation of the first and second sensing coils 58, 60, the signals generated by the coils 58, 60 are substantially the same magnitude, but of opposite polarity. Accordingly, in such embodiments, the signals will cancel and the flaw may remain undetected by the ECAP 14. Thus, in accordance with present embodiments, the first and second sensing coils 58, 60 are offset in a first direction 62 (i.e., an x direction) and a second direction 64 (i.e., a y direction) and also partially overlap in the first and second directions 62, 64. This configuration enables the coils 58, 60 to complement coils in other rows, which are oriented orthogonally to the differential pair of the sensing coils 58, 60. It should be noted that the first and second directions 62, 64 may be generally oriented with reference to the length and height of the ECAP 14. Specifically, the first direction 62 may be substantially parallel with the length of the main substrate 30 (
Each of the EC channels 50 may have an inclined orientation with respect to the bus 54 (i.e., the first direction 62). As defined herein, an inclined orientation denotes orientations greater than 0° but less than 90°. Thus, the EC channels 50 have orientations that are between 0° and 90°, exclusive, such as between approximately 5° and 85°, 10° and 80°, 20° and 70°, 30 and 60°, or approximately 45°. In the illustrated embodiment, the ECAP 14 includes a first row 66 of EC channels 50 and a second row 68 of complementary EC channels 50. The first row 66 includes EC channels 50 having a first inclined, angular orientation 70 with respect to the bus 54. In accordance with present embodiments, the first angular orientation 70 may be between approximately 5° and 85°, 10° and 80°, 20° and 70°, 30° and 60°, or 40° and 50°. Indeed, in one embodiment, the first angular orientation 70 may be approximately 45°. A second inclined, angular orientation 72 of the second row may be perpendicular to the first angular orientation. Further, the second angular orientation 72 of the EC channels 50 in the second row 68 may have substantially the same magnitude as the first angular orientation 70, but a different directionality. Indeed, the second angular orientation 72 may be between approximately 5° and 85°, 10° and 80°, 20° and 70°, 30° and 60°, or 40° and 50°, such as approximately 45° with respect to the bus 54 (i.e., the first direction 62). Such a configuration of the coils may enable channels of ECAP 14 to detect long cracks in addition to short cracks, rather than only detecting short cracks as in configurations where the two angular orientations are substantially the same. As noted above, long cracks or flaws may generally be noted as those having a length that is longer than a length traversing the differential sensing pair along its directional orientation with respect to the first direction 62.
While the embodiment illustrated in
In
Additionally or alternatively, the differential pair 50 may include a configuration where the first and second sensing coils 58, 60 are semicircular such that the differential pair 50 forms a circle. Such a configuration is illustrated with respect to
Each of the first and second sensing coils 58, 60 include a respective curved or arcuate portion 98, and a substantially straight portion 100. The first and second sensing coils 58, 60 are offset with respect to one another in the first and second directions 62, 64, and also overlap in both directions 62, 64. Further, the first and second sensing coils 58, 60 are oriented with respect to one another such that their respective straight portions 100 have an angular orientation 102 that is approximately 45° with respect to the first direction 62, such as between approximately 20 and 70°, 30 and 60°, or 40 and 50°. Again, the first and second sensing coils 58, 60 may complement differential pairs having orthogonal orientations in other rows, and this configuration enables the differential pair 50 to detect flaws having any orientation, and also enables the detection of both short and long flaws (e.g., cracks).
As noted above, in addition to the orientation of each differential pair 50, the relative orientation of differential pairs 50, for example those in the first row 66 relative to those in the second row 88 of
Specifically,
The orientation of the first differential pair 130 is configured such that the first pair may be sensitive to long flaws having an orientation that is angled with respect to the second direction 64, including flaws that are substantially aligned with the first direction 62. However, the first differential pair 130 may not be sensitive to, or may have low sensitivity to, long flaws having an orientation that is substantially aligned with the second direction 64. Conversely, the second differential pair 132 may be able to detect long flaws having an orientation that is substantially aligned with the second direction 64, and angled with respect to the first direction 62. However, the second differential pair 132 may have a limited sensitivity to long flaws having an orientation that is substantially aligned with the second direction 64. Accordingly, the first and second differential pairs 130 and 132 are complementary, such that flaws that may not be detected by one of the pairs are detected by the other pair.
The present embodiments also provide, in addition to or in lieu of the sensing coil configurations described above, various drive coil configurations that are adapted to reduce interference and hot spots in the ECAP 14.
The first drive coils 148 of the first EC channels 144 are each connected via a conductor 160 to a first bus 162 disposed on the first layer (e.g., the bottom layer) of the ECAP 14. The first bus 162 is configured to deliver a current to the first driver coil 148 of each of the first EC channels 144. Each of the second drive coils 154, which are disposed in the second layer of the ECAP 14, are coupled via second conductors 164 to a second bus 166 configured to provide a current. The second bus 166 is disposed on the second layer, represented as dashed lines. Therefore, the first bus 162 is disposed on a first layer of the ECAP 14 and the second bus 166 is disposed on a second layer of the ECAP 14. Such a configuration enables the separation of current flowing through the buses 162, 166 for adjacent EC channels, which reduces interference and hot spots.
While the embodiment illustrated in
In addition to or in lieu of the approaches described above, interference and crosstalk between EC channels may be reduced by multiplexing the drive coils or using different frequencies in the different drive coils used to generate the probing magnetic field. Such embodiments are described in detail below with respect to
In accordance with an embodiment, the first layer configuration 202 may be stacked over or under the second layer configuration 208. The first and second semi-circular drive coils 206, 212 may interleave with one another across the first and second layers of the ECAP 14. Further, the first and second semi-circular drive coils 206, 212 may be complementary to form single loop drive coils over each of the EC channels (i.e., over each of the sensing coils). Multiplexing the first and second semi-circular drive coils 206, 212 in this way may reduce interference, reduce hot spots, and may reduce crosstalk.
The embodiment illustrated in
The first semi-circular drive coil 222 is illustrated as being positioned within first and second layers of the ECAP 14, which are illustrated as solid and dashed lines, respectively. That is, the first semi-circular drive coil 222 is disposed in a first layer of the ECAP 14 at an area proximate to the first row of differential pairs 226, and is disposed in a second layer of the ECAP 14 at an area proximate to the second row of differential pairs 228. Conversely, second semi-circular drive coil 224 is illustrated as being positioned within first and second layers of the ECAP 14, which is illustrated as dashed and solid lines, respectively. The second semi-circular drive coil 224 is disposed in a first layer of the ECAP 14 at an area proximate to the second row of differential pairs 228, and is disposed in a second layer of the ECAP 14 at an area proximate to the first row of differential pairs 226. In other words, the first and second semi-circular drive coils 222, 224 are disposed within different layers for each channel. Multiplexing the drive coils in this way reduces the complexity of the ECAP circuitry, reduces interference, and also may reduce or eliminate crosstalk between EC channels.
The approaches described above include multiplexed semi-circular drive coils, which may reduce crosstalk between EC channels and may reduce hot spots in the ECAP 14. In other embodiments, however, it may be desirable to use a drive coil disposed in a single layer. Accordingly, the present disclosure also provides embodiments in which a semi-circular drive coil is configured for use in a single layer, while simultaneously enabling the ECAP 14 to detect flaws in any direction.
In accordance with certain embodiments, the semi-circular single layer drive coils described herein may include a series of spatial and complementary relationships across two or more rows. For example, as illustrated in
In a similar manner, the first and third shapes 232, 236, when used in combination, enable the ECAP 14 to detect flaws having a diagonal (i.e., +45 and −45° with respect to the first direction 62). The second and fourth shapes 234, 238 also have this relationship. Thus, when used in combination, the first through fourth shapes 232-238 enable omnidirectional sensitivity to flaws. It should be noted that these shapes may be used along a series of rows, as depicted with respect to
As will be appreciated with reference to
In another example, a combination of the shape of the drive coil 240 in the first and third rows 244, 248 may enable the detection of flaws that are oriented approximately 45° with respect to the first direction 62 (i.e., +45° and −45°). A combination of the shape of the drive coil in the second and fourth rows 246, 250 may also provide this capability. Accordingly, a combination of all of the shapes of the drive coil 240 in the first through fourth rows 244-250 enables omnidirectional sensitivity to flaws in the test specimen 12. It should be noted that while the embodiment illustrated in
As discussed above, multiple rows of sensing coils complement each other to provide different coverage over the surface of the ECAP 14. For example, sensing coils within each row may overlap with sensing coils in an adjacent row in the first direction 62 but not in the second direction 64. The overlap may be between 0 and 100%, such as between approximately 10% and 100%, 20% and 100%, 30% and 95%, 40% and 90%, or 50% and 85%. Example embodiments of such overlapping are described below with respect to
A greater degree of overlap may be possible with a greater number of rows, as depicted in
This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
Number | Name | Date | Kind |
---|---|---|---|
4706020 | Viertl et al. | Nov 1987 | A |
5006800 | Hedengren et al. | Apr 1991 | A |
5182513 | Young et al. | Jan 1993 | A |
5237271 | Hedengren | Aug 1993 | A |
5262722 | Hedengren et al. | Nov 1993 | A |
5315234 | Sutton, Jr. et al. | May 1994 | A |
5345514 | Mahdavieh et al. | Sep 1994 | A |
5371461 | Hedengren | Dec 1994 | A |
5371462 | Hedengren et al. | Dec 1994 | A |
5389876 | Hedengren et al. | Feb 1995 | A |
5399968 | Sheppard et al. | Mar 1995 | A |
5418457 | Hedengren et al. | May 1995 | A |
5442286 | Sutton, Jr. et al. | Aug 1995 | A |
5463201 | Hedengren et al. | Oct 1995 | A |
5506503 | Cecco et al. | Apr 1996 | A |
5510709 | Hurley et al. | Apr 1996 | A |
5537334 | Attaoui et al. | Jul 1996 | A |
5629621 | Goldfine et al. | May 1997 | A |
5659248 | Hedengren et al. | Aug 1997 | A |
5737445 | Oppenlander et al. | Apr 1998 | A |
5793206 | Goldfine et al. | Aug 1998 | A |
5793889 | Bushman | Aug 1998 | A |
5801532 | Patton et al. | Sep 1998 | A |
5822450 | Arakawa et al. | Oct 1998 | A |
5835223 | Zwemer et al. | Nov 1998 | A |
5841277 | Hedengren et al. | Nov 1998 | A |
5903147 | Granger, Jr. et al. | May 1999 | A |
5966011 | Goldfine et al. | Oct 1999 | A |
5969819 | Wang | Oct 1999 | A |
5990677 | Goldfine et al. | Nov 1999 | A |
6144206 | Goldfine et al. | Nov 2000 | A |
6165542 | Jaworowski et al. | Dec 2000 | A |
6188218 | Goldfine et al. | Feb 2001 | B1 |
6198279 | Goldfine | Mar 2001 | B1 |
6252393 | Hedengren | Jun 2001 | B1 |
6252398 | Goldfine et al. | Jun 2001 | B1 |
6327921 | Hsu et al. | Dec 2001 | B1 |
6344739 | Hardy et al. | Feb 2002 | B1 |
6351120 | Goldfine | Feb 2002 | B2 |
6377039 | Goldfine et al. | Apr 2002 | B1 |
6380747 | Goldfine et al. | Apr 2002 | B1 |
6414483 | Nath et al. | Jul 2002 | B1 |
6420867 | Goldfine et al. | Jul 2002 | B1 |
6433542 | Goldfine et al. | Aug 2002 | B2 |
6486673 | Goldfine et al. | Nov 2002 | B1 |
6545467 | Batzinger et al. | Apr 2003 | B1 |
6608478 | Dziech et al. | Aug 2003 | B1 |
6670808 | Nath et al. | Dec 2003 | B2 |
6696830 | Casarcia et al. | Feb 2004 | B2 |
6888347 | Batzinger et al. | May 2005 | B2 |
7015690 | Wang et al. | Mar 2006 | B2 |
7026811 | Roney, Jr. et al. | Apr 2006 | B2 |
7190162 | Tenley et al. | Mar 2007 | B2 |
7206706 | Wang et al. | Apr 2007 | B2 |
7233867 | Pisupati et al. | Jun 2007 | B2 |
7235967 | Nishimizu et al. | Jun 2007 | B2 |
7352176 | Roach et al. | Apr 2008 | B1 |
7402999 | Plotnikov et al. | Jul 2008 | B2 |
7589526 | Goldfine et al. | Sep 2009 | B2 |
7759831 | Yagi | Jul 2010 | B2 |
20070222439 | Wang et al. | Sep 2007 | A1 |
20100085045 | Sheila-Vadde et al. | Apr 2010 | A1 |
Entry |
---|
Obeid et al.,“Rotational GMR Magnetic Sensor Based Eddy Current Probes for Detecting Buried Corner Cracks at the Edge of Holes in Metallic Structures”, IEEE SoutheastCon 2008, pp. 314-317, Apr. 3-6, 2008, Huntsville, Alabama. |
Number | Date | Country | |
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20130106409 A1 | May 2013 | US |