Claims
- 1. A multilayer mold for molding thermoplastic into finished parts, comprising:
- a metal core having a mold area and adjacent elevated land area; an insulating layer of temperature-resistant polymer having low thermal conductivity deposited in the mold area; said temperature-resistant polymer being selected from filled or unfilled polyimides, polyamideimides, polyamides, polysulfones, polyether sulfones or polytetrafluoroethylenes, and at least one metal layer deposited on the insulating layer in the mold area, a juncture being formed by said one metal layer and said elevated land area, said metal layer being selected from nickel, carbon steel, stainless steel, aluminum, brass, copper, or ferronickel alloy, and another metal layer extending over said one metal layer, said juncture, and said land area to form a cohesive metal coating.
- 2. A mold according to claim 1 further comprising an intermediate primer layer between the insulating layer and the at least one metal layer.
- 3. A mold according to claim 1 wherein the intermediate layer comprises:
- a metal-containing primer layer comprising a suspension of metal particles in a temperature-resistant polymer having low thermal conductivity, deposited on said insulating layer.
- 4. A mold according to claim 1 wherein the polymer is a polyimide or polyamideimide.
- 5. A mold according to claim 4 wherein the metal particles are nickel.
- 6. A mold according to claim 1 wherein the other metal layer extends over the land area and exterior sides of the mold core.
- 7. A mold according to claim 1 wherein the other metal layer extends up to the land and is coplanar therewith.
Parent Case Info
This is a divisional of application Ser. No. 08/167,491 filed on Dec. 14, 1993 now abandoned.
US Referenced Citations (11)
Foreign Referenced Citations (6)
Number |
Date |
Country |
0489335 |
Jun 1992 |
EPX |
EU 0 489 335 A1 |
Jun 1992 |
EPX |
2319477 |
Feb 1977 |
FRX |
2151697 |
Apr 1972 |
DEX |
3137598 |
Jun 1983 |
DEX |
62207-358-A |
Sep 1987 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
167491 |
Dec 1993 |
|