Elastic membrane for semiconductor wafer polishing apparatus

Abstract

Description

FIG. 1 is a top plan view of a first embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a cross sectional view taken along section line 6-6 in FIG. 1;

FIG. 7 is an enlarged perspective view of a portion labeled FIG. 7 in FIG. 1;

FIG. 8 is an opposite side view of FIG. 7;

FIG. 9 is a top plan view of a second embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 10 is a bottom plan view thereof;

FIG. 11 is a front side view thereof;

FIG. 12 is a right side view thereof;

FIG. 13 is a left side view thereof;

FIG. 14 is a cross sectional view taken along section line 14-14 in FIG. 9;

FIG. 15 is an enlarged perspective view of a portion labeled FIG. 15 in FIG. 9; and,

FIG. 16 is an opposite side view of FIG. 15.

The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design. The dashed-dot-dashed lines represent the boundary lines of the claimed design.

All surfaces not shown form no part of the claimed design.

Claims

The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.