Elastic membrane for semiconductor wafer polishing apparatus

FIG. 1 is a bottom view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view, observed from below thereof,

FIG. 8 is a perspective view, observed from above thereof;

FIG. 9 is a cross-section view taken along the line 9—9 of FIG. 1 thereof; and,

FIG. 10 is a enlarged view of part 10 of FIG. 9 thereof.

The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

Number	Date	Country	Kind
2009-19715	Aug 2009	JP	national

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