Elastic membrane for semiconductor wafer polishing apparatus

Abstract

Description

FIG. 1 is a bottom view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view, observed from above thereof enlarged for ease of illustrations;

FIG. 8 is a cross-section view taken along the line 8—8 of FIG. 2 thereof;

FIG. 9 is a enlarged view of part 9 of FIG. 8 thereof;

FIG. 10 is a bottom view thereof;

FIG. 11 is a top view thereof;

FIG. 12 is a front view thereof;

FIG. 13 is a right side view thereof;

FIG. 14 is a rear view thereof;

FIG. 15 is a left side view thereof;

FIG. 16 is a perspective view, observed from above thereof enlarged for ease of illustrations;

FIG. 17 is a cross-section view taken along the line 17—17 of FIG. 11 thereof;

FIG. 18 is a enlarged view of part 18 of FIG. 17 thereof;

FIG. 19 is a bottom view thereof;

FIG. 20 is a top view thereof;

FIG. 21 is a front view thereof; (rear view is omit since it is identical with the front)

FIG. 22 is a right side view thereof; (left side view is omitted since it is identical with the right side view)

FIG. 23 is a perspective view, observed from above thereof enlarged for ease of illustrations;

FIG. 24 is a cross-section view taken along the line 24—24 of FIG. 20 thereof; and,

FIG. 25 is a enlarged view of part 25 of FIG. 24 thereof.

The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims

The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.