Elastic membrane for semiconductor wafer polishing

Abstract

Description

FIG. 1 is a front view of an elastic membrane for semiconductor wafer polishing showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a plain view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a cross section view taken along the line 7-7 of FIG. 2 thereof;

FIG. 8 is a enlarged view of part 8 of FIG. 7 thereof; and,

FIG. 9 is an enlarged view taken of portion 9-9′ of FIG. 8 thereof.

The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims

The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.