Elastic retaining assembly for matable components and method of assembling

Information

  • Patent Grant
  • 9388838
  • Patent Number
    9,388,838
  • Date Filed
    Thursday, April 4, 2013
    11 years ago
  • Date Issued
    Tuesday, July 12, 2016
    8 years ago
Abstract
An elastic retaining assembly for matable components includes a first component having a first surface. Also included is a second component having a second surface and a third surface, wherein the second component is configured to be mated with the first component. Further included is a receiving feature formed proximate an engagement side of the second component and defining a pin perimeter surface. Yet further included is an elastically deformable pin operatively coupled to, and extending away from, the first surface, wherein the elastically deformable pin is formed of an elastically deformable material to elastically deform proximate the pin perimeter surface upon contact with the receiving feature.
Description
FIELD OF THE INVENTION

The present invention relates to matable components, and more particularly to an elastic retaining assembly for matable components, as well as a method of assembling matable components.


BACKGROUND

Currently, components which are to be mated together in a manufacturing process are subject to positional variation based on the mating arrangements between the components. One common arrangement includes components mutually located with respect to each other by 2-way and/or 4-way male alignment features; typically undersized structures which are received into corresponding oversized female alignment features such as apertures in the form of openings and/or slots. Alternatively, double-sided tape, adhesives or welding processes may be employed to mate parts. Irrespective of the precise mating arrangement, there is a clearance between at least a portion of the alignment features which is predetermined to match anticipated size and positional variation tolerances of the mating features as a result of manufacturing (or fabrication) variances. As a result, occurrence of significant positional variations between the mated components is possible, which may contribute to the presence of undesirably large and varying gaps and otherwise poor fit. The clearance between the aligning and attaching features may lead to relative motion between mated components, which contribute to poor perceived quality. Additional undesirable effects may include squeaking and rattling of the mated components, for example.


SUMMARY OF THE INVENTION

In one exemplary embodiment, an elastic retaining assembly for matable components includes a first component having a first surface. Also included is a second component having a second surface and a third surface, wherein the second component is configured to be mated with the first component. Further included is a receiving feature formed proximate an engagement side of the second component and defining a pin perimeter surface. Yet further included is an elastically deformable pin operatively coupled to, and extending away from, the first surface, wherein the elastically deformable pin is formed of an elastically deformable material and configured to elastically deform proximate the pin perimeter surface upon contact with the receiving feature.


In another exemplary embodiment, a method of assembling matable components is provided. The method includes inserting an elastically deformable pin of a first component into a receiving feature of a second component, wherein the elastically deformable pin comprises a pin perimeter and the receiving feature comprises a receiving feature perimeter. The method also includes contacting a pin perimeter surface of the elastically deformable pin with the receiving feature to impose a contact interference condition between the first component and the second component. The method further includes elastically deforming the elastically deformable pin proximate the pin perimeter surface upon contacting the receiving feature.


The above features and advantages and other features and advantages of the invention are readily apparent from the following detailed description of the invention when taken in connection with the accompanying drawings.





BRIEF DESCRIPTION OF THE DRAWINGS

Other features, advantages and details appear, by way of example only, in the following detailed description of embodiments, the detailed description referring to the drawings in which:



FIG. 1 is a perspective view of a portion of a front end of a vehicle;



FIG. 2 is a side elevational view of an elastic retaining assembly;



FIG. 3 is a top plan view of the elastic retaining assembly of FIG. 2;



FIG. 4 is a partial, cross-sectional view of another embodiment of the elastic retaining assembly;



FIG. 5 is a cross-sectional view taken along line 5-5 of FIG. 3 of a lead-in portion of a second component of the elastic retaining assembly; and



FIG. 6 is a flow diagram illustrating a method of assembling matable components.





DESCRIPTION OF THE EMBODIMENTS

Referring to FIGS. 1-3, an elastic retaining assembly 10 is illustrated. The elastic retaining assembly 10 comprises matable components, such as a first component 12 and a second component 14 that are configured to be mated and aligned with respect to each other. In one embodiment, the elastic retaining assembly 10 is employed in a vehicle application. However, it is to be understood that the components may be associated with numerous other applications and industries, such as home appliance and aerospace applications, for example. In an exemplary embodiment such as the aforementioned vehicle application, the first component 12 comprises an automotive fascia and the second component 14 comprises an automotive spoiler.


Although illustrated in a specific geometry, the first component 12 and the second component 14 may be configured in countless geometries. Regardless of the precise geometry of the first component 12 and the second component 14, the first component 12 is configured to align and fittingly mate with the second component 14, which will be described in detail below. In an alternative embodiment, rather than two components comprising the elastic retaining assembly 10, additional or intermediate layers or components may be included. It is to be appreciated that the elastic retaining assembly 10 is to be employed for providing a self-aligning relationship between components, such as the first component 12 and the second component 14, to each other, while also assisting in securely mating the components to each other. It is also to be understood that this embodiment could be used along a singular side or a specific location while other elastically averaged features could be utilized on an alternate side or location.


The first component 12 includes a main portion 16 having a first surface 18 that is typically a substantially planar surface. The first component 12 also includes an elastically deformable pin 20 extending from the main portion 16 in a direction relatively orthogonal from a plane that the first surface 18 is disposed in. The elastically deformable pin 20 is operatively coupled to the main portion 16 and may be integrally formed with the main portion 16. The elastically deformable pin 20 includes a pin portion 22 and a head portion 24. The second component 14 includes a receiving feature 26 extending inwardly from an engagement side 28 as a cutout portion that is configured to engage and receive the elastically deformable pin 20 upon mating of the first component 12 and the second component 14. Although a single elastically deformable pin and a single receiving feature are referenced, embodiments of the elastic retaining assembly 10 may include a plurality of elastically deformable pins and a plurality of receiving features, as will be described in detail below.


The elastically deformable pin 20 and the receiving feature 26 may be formed of numerous contemplated embodiments. In the exemplary embodiment, the pin portion 22 of the elastically deformable pin 20 is formed as a relatively tubular member and it is to be appreciated that the pin portion 22 may comprise a solid tubular member or a tubular member having a hollow portion. The head portion 24 of the elastically deformable pin 20 is formed of a bulbous structure that smoothly blends with the pin portion 22. The head portion 24 includes a maximum diameter 30 that is greater than a pin width 32 of the pin portion 22.


The receiving feature 26 comprises a notched cutout that includes a slot portion 34 that extends inwardly from the engagement side 28 and is defined by a first edge 36 and a second edge 38. The first edge 36 and the second edge 38 each extend from the engagement side 28 to a neck region 40. As the first edge 36 and the second edge 38 extend inwardly from the engagement side 28 toward the neck region 40, each is angled inwardly toward each other, as well as toward axis 42. The receiving feature 26 also includes a pin retaining portion 44 that is disposed at a position of the second component 14 that is radially inward of the slot portion 34 at a location immediately adjacent the neck region 40. The pin retaining portion 44 is defined by a pin retaining portion surface 46 (also may be referred to as a receiving feature perimeter surface) that geometrically corresponds substantially to the pin portion 22 of the elastically deformable pin 20. The receiving feature 26 effectively forms an opening extending through the second component 14 from a second surface 47 to a third surface 49.


As will be apparent from the description herein, the elastically deformable nature of the pins, in combination with the particular orientations described above, facilitates precise alignment of the first component 12 relative to the second component 14 by accounting for positional variation of the retaining and/or locating features of the first component 12 and the second component 14 inherently present due to manufacturing processes. The self-aligning benefits associated with the elastic retaining assembly 10 will be described in detail below.


The elastically deformable pin 20 of the first component 12 is positioned and engaged with the receiving feature 26 of the second component 14 upon translation of the first component 12 toward the second component 14 (or vice versa). In this way, the first component 12 is press fit into the second component 14 upon engagement of the elastically deformable pin 20 with the receiving feature 26. More particularly, a pin perimeter surface 48 of the pin portion 22 engages the first edge 36 and the second edge 38 at a location between the engagement side 28 and the neck region 40 (i.e., within the slot portion 34). Subsequent translation results in an elastic deformation of the pin portion 22. Specifically, the neck region 40 includes a neck width that is smaller than the pin width 32, thereby ensuring contact between the pin portion 22 and the receiving feature 26. Elastic deformation of the pin portion 22 may be further facilitated by embodiments comprising a hollow pin portion 22. The void of material proximate the hollow portion enhances the flexibility of the pin portion 22. Regardless of whether the pin portion 22 is solid or hollow, the pin portion 22 is further translated through the neck region 40 and into the pin retaining portion 44.


Any suitable elastically deformable material may be used for the elastically deformable pin 20. The term “elastically deformable” refers to components, or portions of components, including component features, comprising materials having a generally elastic deformation characteristic, wherein the material is configured to undergo a resiliently reversible change in its shape, size, or both, in response to application of a force. The force causing the resiliently reversible or elastic deformation of the material may include a tensile, compressive, shear, bending or torsional force, or various combinations of these forces. The elastically deformable materials may exhibit linear elastic deformation, for example that described according to Hooke's law, or non-linear elastic deformation.


Numerous examples of materials that may at least partially form the components include various metals, polymers, ceramics, inorganic materials or glasses, or composites of any of the aforementioned materials, or any other combinations thereof Many composite materials are envisioned, including various filled polymers, including glass, ceramic, metal and inorganic material filled polymers, particularly glass, metal, ceramic, inorganic or carbon fiber filled polymers. Any suitable filler morphology may be employed, including all shapes and sizes of particulates or fibers. More particularly any suitable type of fiber may be used, including continuous and discontinuous fibers, woven and unwoven cloths, felts or tows, or a combination thereof Any suitable metal may be used, including various grades and alloys of steel, cast iron, aluminum, magnesium or titanium, or composites thereof, or any other combinations thereof. Polymers may include both thermoplastic polymers or thermoset polymers, or composites thereof, or any other combinations thereof, including a wide variety of co-polymers and polymer blends. An example of a suitable polymer includes acetal (e.g., POM). In one embodiment, a preferred plastic material is one having elastic properties so as to deform elastically without fracture, as for example, a material comprising an acrylonitrile butadiene styrene (ABS) polymer, and more particularly a polycarbonate ABS polymer blend (PC/ABS), such as an ABS acrylic. The material may be in any form and formed or manufactured by any suitable process, including stamped or formed metal, composite or other sheets, forgings, extruded parts, pressed parts, castings, or molded parts and the like, to include the deformable features described herein. The material, or materials, may be selected to provide a predetermined elastic response characteristic of the elastically deformable pin 20. The predetermined elastic response characteristic may include, for example, a predetermined elastic modulus and/or coefficient of friction.


The precise position where engagement between the pin portion perimeter surface 48 and the receiving feature 26 occurs will vary depending on positional variance imposed by manufacturing factors. Due to the elastically deformable properties of the elastic material comprising the elastically deformable pin 20, the criticality of the initial location of engagement is reduced. Further insertion of the elastically deformable pin 20 into the receiving feature 26 ultimately leads to a fully engaged position of the elastically deformable pin 20. In the fully engaged position, a tight, fitted engagement between the elastically deformable pin 20 and the receiving feature 26 is achieved by contact interface between the pin portion perimeter surface 48 and the retaining portion surface 46. Such a condition is ensured by sizing a pin perimeter to be larger than a retaining feature perimeter. The interference between the pin portion 22 and the retaining portion surface 46 causes elastic deformation proximate pin portion perimeter surface 48. The malleability of the materials reduces issues associated with positional variance. More particularly, in contrast to a rigid insert that typically results in gaps between the insert and receiving structure at portions around the perimeter of the insert, the elastically deformable pin 20 advantageously deforms to maintain alignment of the first component 12 and the second component 14, while also reducing or eliminating gaps associated with manufacturing challenges. The assembly also advantageously reduces the number of mechanical fasteners, such as threaded fasteners required for attachment of the components, thereby reducing cost and component degradation.


Elastic deformation of the pin portion 22 may also occur as a bending deformation to further enhance the elastic averaging between the mating components. As with compression of the pin portion 22, as described above, and stretching of the pin portion 22, as described in detail below, bending of the pin portion 22 accounts for positional variation and provides elastic averaging by allowing compliance in directions requiring bending of the pin portion 22.


Referring to FIGS. 2-4, in addition to retaining the second component 14 in a first direction 50 and a second direction 52 upon contact interference between the pin portion 22 of the elastically deformable pin 20 with the receiving feature perimeter surface 46, in a fully engaged position, the second component 14 is retained in a third direction 54. Retaining in the third direction 54 is achieved by imposing a contact interference condition between the head portion 24 of the elastically deformable pin 20 and the third surface 49 of the second component 14. A lead-in region 89 (FIG. 5) may be included to facilitate insertion of the head portion 24 proximate the third surface 49. Contact between the first surface 18 of the first component 12 and the second surface 47 of the second component 14 may be made by intermediate structural members, referred to as standoffs 56, operatively coupled to the first surface 18 and/or the second surface 47. Translation of the first component 12 toward and into the second component 14 results in contact with each other proximate the standoffs 56. The length of the pin portion 22 of the elastically deformable pin 20 is dimensioned to ensure engagement of the third surface 49 of the second component 14 with the head portion 24 of the first component 12 to achieve the contact interference referenced above. Specifically, the elastically deformable pin 20 is configured to elastically stretch during insertion. Upon engagement, the head portion 24 elastically deforms to achieve a tight, fitted engagement, as well as retaining of the second component 14 with respect to the third direction 54, thereby putting the elastically deformable pin 20 in a tension condition. In the stretched, tension condition, the pin portion 22 may deform proximate the standoffs 56, between the first surface 18 and the second surface 47. An example of this deformation is illustrated as an “S-shaped” curve portion that accounts for positional variation of the components (FIG. 4).


The first component 12 may include a plurality of elastically deformable pins 20, while the second component 14 may include a plurality of receiving features 34. The plurality of receiving features is positioned to correspondingly receive respective pins in a manner described in detail above. The elastic deformation of the plurality of elastically deformable pins elastically averages any positional errors of the first component 12 and the second component 14. In other words, gaps that would otherwise be present due to positional errors associated with portions or segments of the first component 12 and the second component 14, particularly locating and retaining features, are eliminated by offsetting the gaps with an over-constrained condition of other elastically deformable pins. Specifically, the positional variance of each pin and/or receiving feature is offset by the remaining pins to average in aggregate the positional variance of each pin. Elastic averaging provides elastic deformation of the interface(s) between mated components, wherein the average deformation provides a precise alignment, the manufacturing positional variance being minimized to Xmin, defined by Xmin=X/√N, wherein X is the manufacturing positional variance of the locating features of the mated components and N is the number of features inserted. To obtain elastic averaging, an elastically deformable component is configured to have at least one feature and its contact surface(s) that is over-constrained and provides an interference fit with a mating feature of another component and its contact surface(s). The over-constrained condition and interference fit resiliently reversibly (elastically) deforms at least one of the at least one feature or the mating feature, or both features. The resiliently reversible nature of these features of the components allows repeatable insertion and withdrawal of the components that facilitates their assembly and disassembly. Positional variance of the components may result in varying forces being applied over regions of the contact surfaces that are over-constrained and engaged during insertion of the component in an interference condition. It is to be appreciated that a single inserted component may be elastically averaged with respect to a length of the perimeter of the component. The principles of elastic averaging are described in detail in commonly owned, co-pending U.S. patent application Ser. No. 13/187,675, the disclosure of which is incorporated by reference herein in its entirety. The embodiments disclosed above provide the ability to convert an existing component that is not compatible with the above-described elastic averaging principles to an assembly that does facilitate elastic averaging and the benefits associated therewith.


A method 100 of assembling matable components is also provided, as illustrated in FIG. 6, and with reference to FIGS. 1-5. The elastic retaining assembly 10, and more specifically the elastically deformable nature of the elastically deformable pins 20, has been previously described and specific structural components need not be described in further detail. The method 100 includes inserting 102 the elastically deformable pin 20 into the receiving feature 26. The method 100 also includes contacting 104 the pin perimeter surface 48 with the receiving feature 26 to impose a contact interference condition between the first component 12 and the second component 14. The method 100 further includes elastically deforming 106 the elastically deformable pin 20 proximate the pin perimeter surface 48 upon contacting 104 the receiving feature 26.


While the invention has been described with reference to exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the application.

Claims
  • 1. An elastic retaining assembly for matable components comprising: a first component having a first surface, the first component comprising a fascia of an automobile;a second component having a second surface and a third surface, wherein the second component is configured to be mated with the first component, the second component comprising a spoiler of the automobile;a receiving feature formed proximate an engagement side of the second component and defining a pin perimeter surface; andan elastically deformable pin operatively coupled to, and extending away from, the first surface, wherein the elastically deformable pin is formed of an elastically deformable material and configured to elastically deform proximate the pin perimeter surface upon contact with the receiving feature, the elastically deformable pin comprises a pin portion and a head portion, the pin portion extending from the first surface to the head portion, the head portion being a spherical member having a diameter greater than a diameter of the pin perimeter surface of the receiving feature.
  • 2. The elastic retaining assembly of claim 1, wherein the receiving feature comprises a notch extending inwardly from the engagement side.
  • 3. The elastic retaining assembly of claim 1, wherein the receiving feature comprises a slot portion and a pin retaining portion.
  • 4. The elastic retaining assembly of claim 3, wherein the slot portion is defined by a first edge and a second edge, and wherein the slot portion extends from the engagement side to a neck region.
  • 5. The elastic retaining assembly of claim 4, wherein the first edge and the second edge each taper toward each other from the engagement side to the neck region.
  • 6. The elastic retaining assembly of claim 4, wherein the elastically deformable pin comprises a pin width, and wherein the neck region comprises a neck width smaller than the pin width.
  • 7. The elastic retaining assembly of claim 3, wherein the pin retaining portion comprises a receiving feature perimeter surface having a receiving feature perimeter geometry substantially corresponding to a pin geometry of the pin perimeter surface.
  • 8. The elastic retaining assembly of claim 1, wherein the pin portion comprises a solid tubular member.
  • 9. The elastic retaining assembly of claim 1, wherein the pin portion comprises a hollow tubular member.
  • 10. The elastic retaining assembly of claim 1, wherein the head portion is disposed in contact interference with the receiving feature proximate the third surface of the second component, and wherein the pin portion is disposed in a stretched, elongated condition.
  • 11. The elastic retaining assembly of claim 1, further comprising at least one standoff extending from at least one of the first surface of the first component and the second surface of the second component.
  • 12. The elastic retaining assembly of claim 1, further comprising: a plurality of elastically deformable pins operatively coupled to the first component, the elastically deformable pin being one of the plurality of elastically deformable pins; anda plurality of receiving features defined by the second component and configured to receive the plurality of elastically deformable pins, the receiving feature being one of the plurality of receiving features.
  • 13. The elastic retaining assembly of claim 12, further comprising a fully engaged position of the first component, wherein the fully engaged position comprises contact interference between the pin perimeter surface of each of the plurality of elastically deformable pins and the receiving structure, wherein an amount of deformation of the plurality of elastically deformable pins is averaged in aggregate.
US Referenced Citations (428)
Number Name Date Kind
1219398 Huntsman Mar 1917 A
1261036 Kerns Apr 1918 A
1301302 Nolan Apr 1919 A
1556233 Maise Oct 1925 A
1819126 Scheibe Aug 1931 A
1929848 Neely Oct 1933 A
1968168 Place Jul 1934 A
1982076 Spahn Nov 1934 A
2006525 Thal Jul 1935 A
2267558 Birger et al. Dec 1941 A
2275103 Gooch et al. Mar 1942 A
2275900 Hall Mar 1942 A
2385180 Allen Sep 1945 A
2482488 Franc Sep 1949 A
2560530 Burdick Jul 1951 A
2612139 Collins Sep 1952 A
2688894 Modrey Sep 1954 A
2693014 Monahan Nov 1954 A
2707607 O'Connor May 1955 A
2778399 Mroz Jan 1957 A
2780128 Rapata Feb 1957 A
2862040 Curran Nov 1958 A
2902902 Slone Sep 1959 A
2946612 Ahlgren Jul 1960 A
2958230 Haroldson Nov 1960 A
3005282 Christiansen Oct 1961 A
3014563 Bratton Dec 1961 A
3087352 Daniel Apr 1963 A
3089269 McKiernan May 1963 A
3130512 Van Buren, Jr. Apr 1964 A
3152376 Boser Oct 1964 A
3168961 Yates Feb 1965 A
3169004 Rapata Feb 1965 A
3169439 Rapata Feb 1965 A
3188731 Sweeney Jun 1965 A
3194292 Borowsky Jul 1965 A
3213189 Mitchell et al. Oct 1965 A
3230592 Hosea Jan 1966 A
3233358 Dehm Feb 1966 A
3233503 Birger Feb 1966 A
3244057 Mathison Apr 1966 A
3248995 Meyer May 1966 A
3291495 Liebig Dec 1966 A
3310929 Garvey Mar 1967 A
3413752 Perry Dec 1968 A
3473283 Meyer Oct 1969 A
3531850 Durand Oct 1970 A
3551963 Long Jan 1971 A
3643968 Horvath Feb 1972 A
3680272 Meyer Aug 1972 A
3800369 Nikolits Apr 1974 A
3841044 Brown Oct 1974 A
3842565 Brown et al. Oct 1974 A
3845961 Byrd, III Nov 1974 A
3847492 Kennicutt et al. Nov 1974 A
3860209 Strecker Jan 1975 A
3868804 Tantlinger Mar 1975 A
3895408 Leingang Jul 1975 A
3897967 Barenyl Aug 1975 A
3905570 Nieuwveld Sep 1975 A
3972550 Boughton Aug 1976 A
3988808 Poe et al. Nov 1976 A
4035874 Liljendahl Jul 1977 A
4039215 Minhinnick Aug 1977 A
4042307 Jarvis Aug 1977 A
4043585 Yamanaka Aug 1977 A
4158511 Herbenar Jun 1979 A
4169297 Weihrauch Oct 1979 A
4193588 Doneaux Mar 1980 A
4213675 Pilhall Jul 1980 A
4237573 Weihrauch Dec 1980 A
4300851 Thelander Nov 1981 A
4313609 Clements Feb 1982 A
4318208 Borja Mar 1982 A
4325574 Umemoto et al. Apr 1982 A
4363839 Watanabe et al. Dec 1982 A
4364150 Remington Dec 1982 A
4384803 Cachia May 1983 A
4394853 Lopez-Crevillen et al. Jul 1983 A
4406033 Chisholm et al. Sep 1983 A
4477142 Cooper Oct 1984 A
4481160 Bree Nov 1984 A
4527760 Salacuse Jul 1985 A
4575060 Kitagawa Mar 1986 A
4599768 Doyle Jul 1986 A
4605575 Auld et al. Aug 1986 A
4616951 Maatela Oct 1986 A
4648649 Beal Mar 1987 A
4654760 Matheson et al. Mar 1987 A
4745656 Revlett May 1988 A
4757655 Nentoft Jul 1988 A
4767647 Bree Aug 1988 A
4805272 Yamaguchi Feb 1989 A
4807335 Candea Feb 1989 A
4817999 Drew Apr 1989 A
4819983 Alexander et al. Apr 1989 A
4843975 Welsch Jul 1989 A
4865502 Maresch Sep 1989 A
4881764 Takahashi et al. Nov 1989 A
4973212 Jacobs Nov 1990 A
4977648 Eckerud Dec 1990 A
5005265 Muller Apr 1991 A
5039267 Wollar Aug 1991 A
5139285 Lasinski Aug 1992 A
5154479 Sautter, Jr. Oct 1992 A
5165749 Sheppard Nov 1992 A
5170985 Killworth et al. Dec 1992 A
5180219 Geddie Jan 1993 A
5208507 Jung May 1993 A
5212853 Kaneko May 1993 A
5234122 Cherng Aug 1993 A
5297322 Kraus Mar 1994 A
5339491 Sims Aug 1994 A
5342139 Hoffman Aug 1994 A
5368427 Pfaffinger Nov 1994 A
5368797 Quentin et al. Nov 1994 A
5397206 Sihon Mar 1995 A
5407310 Kassouni Apr 1995 A
5446965 Makridis Sep 1995 A
5507610 Benedetti et al. Apr 1996 A
5513603 Ang et al. May 1996 A
5524786 Skudlarek Jun 1996 A
5538079 Pawlick Jul 1996 A
5556808 Williams et al. Sep 1996 A
5566840 Waldner Oct 1996 A
5575601 Skufca Nov 1996 A
5577301 Demaagd Nov 1996 A
5577779 Dangel Nov 1996 A
5580204 Hultman Dec 1996 A
5586372 Eguchi et al. Dec 1996 A
5593265 Kizer Jan 1997 A
5601453 Horchler Feb 1997 A
5629823 Mizuta May 1997 A
5634757 Schanz Jun 1997 A
5657516 Berg et al. Aug 1997 A
5667271 Booth Sep 1997 A
5670013 Huang et al. Sep 1997 A
5698276 Mirabitur Dec 1997 A
5736221 Hardigg et al. Apr 1998 A
5765942 Shirai et al. Jun 1998 A
5775860 Meyer Jul 1998 A
5795118 Osada et al. Aug 1998 A
5797170 Akeno Aug 1998 A
5797714 Oddenino Aug 1998 A
5803646 Weihrauch Sep 1998 A
5806915 Takabatake Sep 1998 A
5810535 Fleckenstein et al. Sep 1998 A
5820292 Fremstad Oct 1998 A
5846631 Nowosiadly Dec 1998 A
5934729 Baack Aug 1999 A
5941673 Hayakawa et al. Aug 1999 A
6073315 Rasmussen Jun 2000 A
6079083 Akashi Jun 2000 A
6095594 Riddle et al. Aug 2000 A
6103987 Nordquist Aug 2000 A
6109882 Popov Aug 2000 A
6152436 Sonderegger et al. Nov 2000 A
6164603 Kawai Dec 2000 A
6193430 Culpepper et al. Feb 2001 B1
6199248 Akashi Mar 2001 B1
6202962 Snyder Mar 2001 B1
6209175 Gershenson Apr 2001 B1
6209178 Wiese et al. Apr 2001 B1
6254304 Takizawa et al. Jul 2001 B1
6264869 Notarpietro et al. Jul 2001 B1
6299478 Jones et al. Oct 2001 B1
6321495 Oami Nov 2001 B1
6336767 Nordquist et al. Jan 2002 B1
6345420 Nabeshima Feb 2002 B1
6349904 Polad Feb 2002 B1
6351380 Curlee Feb 2002 B1
6354815 Svihla et al. Mar 2002 B1
6378931 Kolluri et al. Apr 2002 B1
6398449 Loh Jun 2002 B1
6484370 Kanie et al. Nov 2002 B2
6485241 Oxford Nov 2002 B1
6523229 Severson Feb 2003 B2
6523817 Landry, Jr. Feb 2003 B1
6533391 Pan Mar 2003 B1
6543979 Iwatsuki Apr 2003 B2
6557260 Morris May 2003 B1
6568701 Burdack et al. May 2003 B1
6579397 Spain et al. Jun 2003 B1
6591801 Fonville Jul 2003 B1
6609717 Hinson Aug 2003 B2
6637095 Stumpf et al. Oct 2003 B2
6658698 Chen Dec 2003 B2
6662411 Rubenstein Dec 2003 B2
6664470 Nagamoto Dec 2003 B2
6677065 Blauer Jan 2004 B2
6692016 Yokota Feb 2004 B2
6712329 Ishigami et al. Mar 2004 B2
6746172 Culpepper Jun 2004 B2
6757942 Matsui Jul 2004 B2
6799758 Fries Oct 2004 B2
6821091 Lee Nov 2004 B2
6840969 Kobayashi et al. Jan 2005 B2
6857676 Kawaguchi et al. Feb 2005 B2
6857809 Granata Feb 2005 B2
6908117 Pickett, Jr. et al. Jun 2005 B1
6932416 Clauson Aug 2005 B2
6948753 Yoshida et al. Sep 2005 B2
6951349 Yokota Oct 2005 B2
6959954 Brandt et al. Nov 2005 B2
6966601 Matsumoto et al. Nov 2005 B2
6971831 Fattori et al. Dec 2005 B2
6997487 Kitzis Feb 2006 B2
7000941 Yokota Feb 2006 B2
7008003 Hirose et al. Mar 2006 B1
7014094 Alcoe Mar 2006 B2
7017239 Kurily et al. Mar 2006 B2
7036779 Kawaguchi et al. May 2006 B2
7055785 Diggle, III Jun 2006 B1
7055849 Yokota Jun 2006 B2
7059628 Yokota Jun 2006 B2
7073260 Jensen Jul 2006 B2
7089998 Crook Aug 2006 B2
7097198 Yokota Aug 2006 B2
7121611 Hirotani et al. Oct 2006 B2
7144183 Lian et al. Dec 2006 B2
7172210 Yokota Feb 2007 B2
7178855 Catron et al. Feb 2007 B2
7198315 Cass et al. Apr 2007 B2
7234852 Nishizawa et al. Jun 2007 B2
7306418 Kornblum Dec 2007 B2
7322500 Maierholzner Jan 2008 B2
7344056 Shelmon et al. Mar 2008 B2
7360964 Tsuya Apr 2008 B2
7369408 Chang May 2008 B2
7435031 Granata Oct 2008 B2
7454105 Yi et al. Nov 2008 B2
7487884 Kim Feb 2009 B2
7493716 Brown Feb 2009 B2
7547061 Horimatsu Jun 2009 B2
7557051 Ryu et al. Jul 2009 B2
7568316 Choby et al. Aug 2009 B2
7591573 Maliar et al. Sep 2009 B2
D602349 Andersson Oct 2009 S
7614836 Mohiuddin Nov 2009 B2
7672126 Yeh Mar 2010 B2
7677650 Huttenlocher Mar 2010 B2
7727667 Sakurai Jun 2010 B2
7764853 Yi Jul 2010 B2
7793998 Matsui et al. Sep 2010 B2
7802831 Isayama et al. Sep 2010 B2
7828372 Ellison Nov 2010 B2
7862272 Nakajima Jan 2011 B2
7869003 Van Doren et al. Jan 2011 B2
7883137 Bar Feb 2011 B2
7922415 Rudduck et al. Apr 2011 B2
7946684 Drury et al. May 2011 B2
8029222 Nitsche Oct 2011 B2
8061861 Paxton et al. Nov 2011 B2
8101264 Pace et al. Jan 2012 B2
8136819 Yoshitsune et al. Mar 2012 B2
8162375 Gurtatowski et al. Apr 2012 B2
8203496 Miller et al. Jun 2012 B2
8203843 Chen Jun 2012 B2
8228640 Woodhead et al. Jul 2012 B2
8249679 Cui Aug 2012 B2
8261581 Cerruti et al. Sep 2012 B2
8276961 Kwolek Oct 2012 B2
8291553 Moberg Oct 2012 B2
8297137 Dole Oct 2012 B2
8297661 Proulx et al. Oct 2012 B2
8312887 Dunn et al. Nov 2012 B2
8371788 Lange Feb 2013 B2
8414048 Kwolek Apr 2013 B1
8444199 Takeuchi et al. May 2013 B2
8572818 Hofmann Nov 2013 B2
8619504 Wyssbrod Dec 2013 B2
8677573 Lee Mar 2014 B2
8695201 Morris Apr 2014 B2
8720016 Beaulieu May 2014 B2
8726473 Dole May 2014 B2
8746801 Nakata Jun 2014 B2
8826499 Tempesta Sep 2014 B2
8833771 Lesnau Sep 2014 B2
8833832 Whipps Sep 2014 B2
8834058 Woicke Sep 2014 B2
8905812 Pai-Chen Dec 2014 B2
8910350 Poulakis Dec 2014 B2
9003891 Frank Apr 2015 B2
9039318 Mantei et al. May 2015 B2
9050690 Hammer et al. Jun 2015 B2
9061403 Colombo et al. Jun 2015 B2
9061715 Morris Jun 2015 B2
9062991 Kanagaraj Jun 2015 B2
9067625 Morris Jun 2015 B2
9194413 Christoph Nov 2015 B2
20010030414 Yokota Oct 2001 A1
20010045757 Hideki et al. Nov 2001 A1
20020045086 Tsuji et al. Apr 2002 A1
20020060275 Polad May 2002 A1
20020092598 Jones et al. Jul 2002 A1
20020136617 Imahigashi Sep 2002 A1
20030007831 Lian et al. Jan 2003 A1
20030059255 Kirchen Mar 2003 A1
20030080131 Fukuo May 2003 A1
20030082986 Wiens et al. May 2003 A1
20030087047 Blauer May 2003 A1
20030108401 Agha et al. Jun 2003 A1
20030180122 Dobson Sep 2003 A1
20040028503 Charles Feb 2004 A1
20040037637 Lian et al. Feb 2004 A1
20040131896 Blauer Jul 2004 A1
20040139678 Pervan Jul 2004 A1
20040140651 Yokota Jul 2004 A1
20040208728 Fattori et al. Oct 2004 A1
20040262873 Wolf et al. Dec 2004 A1
20050016116 Scherff Jan 2005 A1
20050031946 Kruger et al. Feb 2005 A1
20050054229 Tsuya Mar 2005 A1
20050082449 Kawaguchi et al. Apr 2005 A1
20050109489 Kobayashi May 2005 A1
20050156409 Yokota Jul 2005 A1
20050156410 Yokota Jul 2005 A1
20050156416 Yokota Jul 2005 A1
20050244250 Okada et al. Nov 2005 A1
20060092653 Tachiiwa et al. May 2006 A1
20060102214 Clemons May 2006 A1
20060110109 Yu May 2006 A1
20060113755 Yokota Jun 2006 A1
20060125286 Horimatsu et al. Jun 2006 A1
20060141318 MacKinnon et al. Jun 2006 A1
20060163902 Engel Jul 2006 A1
20060170242 Forrester et al. Aug 2006 A1
20060197356 Catron et al. Sep 2006 A1
20060202449 Yokota Sep 2006 A1
20060237995 Huttenlocher Oct 2006 A1
20060249520 DeMonte Nov 2006 A1
20060264076 Chen Nov 2006 A1
20070034636 Fukuo Feb 2007 A1
20070040411 Dauvergne Feb 2007 A1
20070113483 Hernandez May 2007 A1
20070113485 Hernandez May 2007 A1
20070126211 Moerke et al. Jun 2007 A1
20070137018 Aigner et al. Jun 2007 A1
20070144659 De La Fuente Jun 2007 A1
20070205627 Ishiguro Sep 2007 A1
20070227942 Hirano Oct 2007 A1
20070251055 Gerner Nov 2007 A1
20070274777 Winkler Nov 2007 A1
20070292205 Duval Dec 2007 A1
20080014508 Van Doren et al. Jan 2008 A1
20080018128 Yamagiwa et al. Jan 2008 A1
20080073888 Enriquez Mar 2008 A1
20080094447 Drury et al. Apr 2008 A1
20080128346 Bowers Jun 2008 A1
20080217796 Van Bruggen et al. Sep 2008 A1
20080260488 Scroggie et al. Oct 2008 A1
20090028506 Yi et al. Jan 2009 A1
20090072591 Baumgartner Mar 2009 A1
20090091156 Neubrand Apr 2009 A1
20090093111 Buchwalter et al. Apr 2009 A1
20090126168 Kobe et al. May 2009 A1
20090134652 Araki May 2009 A1
20090141449 Yeh Jun 2009 A1
20090174207 Lota Jul 2009 A1
20090243172 Ting et al. Oct 2009 A1
20090265896 Beak Oct 2009 A1
20090309388 Ellison Dec 2009 A1
20100001539 Kikuchi et al. Jan 2010 A1
20100021267 Nitsche Jan 2010 A1
20100061045 Chen Mar 2010 A1
20100102538 Paxton Apr 2010 A1
20100134128 Hobbs Jun 2010 A1
20100147355 Shimizu et al. Jun 2010 A1
20100232171 Cannon Sep 2010 A1
20100247034 Yi et al. Sep 2010 A1
20100263417 Schoenow Oct 2010 A1
20100270745 Hurlbert et al. Oct 2010 A1
20100307848 Hashimoto Dec 2010 A1
20110012378 Ueno et al. Jan 2011 A1
20110036542 Woicke Feb 2011 A1
20110076588 Yamaura Mar 2011 A1
20110083392 Timko Apr 2011 A1
20110103884 Shiomoto et al. May 2011 A1
20110119875 Iwasaki May 2011 A1
20110131918 Glynn Jun 2011 A1
20110154645 Morgan Jun 2011 A1
20110175376 Whitens et al. Jul 2011 A1
20110183152 Lanham Jul 2011 A1
20110191990 Beaulieu Aug 2011 A1
20110207024 Bogumil et al. Aug 2011 A1
20110239418 Huang Oct 2011 A1
20110296764 Sawatani et al. Dec 2011 A1
20110311332 Ishman Dec 2011 A1
20120000291 Christoph Jan 2012 A1
20120020726 Jan Jan 2012 A1
20120073094 Bishop Mar 2012 A1
20120112489 Okimoto May 2012 A1
20120115010 Smith et al. May 2012 A1
20120240363 Lee Sep 2012 A1
20120251226 Liu et al. Oct 2012 A1
20120261951 Mildner et al. Oct 2012 A1
20120301067 Morgan Nov 2012 A1
20120311829 Dickinson Dec 2012 A1
20120321379 Wang et al. Dec 2012 A1
20130019454 Colombo et al. Jan 2013 A1
20130019455 Morris Jan 2013 A1
20130027852 Wang Jan 2013 A1
20130055822 Frank Mar 2013 A1
20130071181 Herzinger et al. Mar 2013 A1
20130157015 Morris Jun 2013 A1
20130212858 Herzinger et al. Aug 2013 A1
20130269873 Herzinger et al. Oct 2013 A1
20130287992 Morris Oct 2013 A1
20140033493 Morris et al. Feb 2014 A1
20140041176 Morris Feb 2014 A1
20140041185 Morris et al. Feb 2014 A1
20140041199 Morris Feb 2014 A1
20140042704 Polewarczyk Feb 2014 A1
20140047691 Colombo et al. Feb 2014 A1
20140047697 Morris Feb 2014 A1
20140080036 Smith et al. Mar 2014 A1
20140132023 Watanabe May 2014 A1
20140157578 Morris Jun 2014 A1
20140175774 Kansteiner Jun 2014 A1
20140202628 Sreetharan et al. Jul 2014 A1
20140208561 Colombo et al. Jul 2014 A1
20140208572 Colombo et al. Jul 2014 A1
20140264206 Morris Sep 2014 A1
20140298638 Colombo et al. Oct 2014 A1
20140298962 Morris et al. Oct 2014 A1
20140301103 Colombo et al. Oct 2014 A1
20140301777 Morris et al. Oct 2014 A1
20150069779 Morris et al. Mar 2015 A1
Foreign Referenced Citations (99)
Number Date Country
842302 Sep 1976 BE
1036250 Oct 1989 CN
1129162 Aug 1996 CN
2285844 Jul 1998 CN
1205285 Jan 1999 CN
1328521 Dec 2001 CN
1426872 Jul 2003 CN
2661972 Dec 2004 CN
2679409 Feb 2005 CN
1670986 Sep 2005 CN
100573975 Sep 2005 CN
1693721 Nov 2005 CN
1771399 May 2006 CN
1774580 May 2006 CN
1933747 Mar 2007 CN
2888807 Apr 2007 CN
1961157 May 2007 CN
2915389 Jun 2007 CN
101250964 Apr 2008 CN
201259846 Jun 2009 CN
201268336 Jul 2009 CN
201310827 Sep 2009 CN
201540513 Aug 2010 CN
101821534 Sep 2010 CN
101930253 Dec 2010 CN
201703439 Jan 2011 CN
201737062 Feb 2011 CN
201792722 Apr 2011 CN
201818606 May 2011 CN
201890285 Jul 2011 CN
102144102 Aug 2011 CN
102235402 Nov 2011 CN
202079532 Dec 2011 CN
102313952 Jan 2012 CN
202132326 Feb 2012 CN
102756633 Oct 2012 CN
102803753 Nov 2012 CN
102869891 Jan 2013 CN
202686206 Jan 2013 CN
102939022 Feb 2013 CN
202987018 Jun 2013 CN
103201525 Jul 2013 CN
1220673 Jul 1966 DE
2736012 Feb 1978 DE
3704190 Dec 1987 DE
3711696 Oct 1988 DE
3805693 Feb 1989 DE
3815927 Nov 1989 DE
9109276 Jul 1991 DE
4002443 Aug 1991 DE
4111245 Oct 1991 DE
9201258 Mar 1992 DE
29714892 Oct 1997 DE
29800379 May 1998 DE
69600357 Dec 1998 DE
10234253 Apr 2004 DE
102008005618 Jul 2009 DE
102008047464 Apr 2010 DE
102010028323 Nov 2011 DE
102011050003 Oct 2012 DE
102012212101 Jul 2013 DE
0118796 Sep 1984 EP
1132263 Sep 2001 EP
1243471 Sep 2002 EP
1273766 Jan 2003 EP
1293384 Mar 2003 EP
1384536 Jan 2004 EP
1388449 Feb 2004 EP
1452745 Sep 2004 EP
2166235 Mar 2010 EP
2450259 May 2012 EP
2458454 May 2012 EP
1369198 Aug 1964 FR
2009941 Feb 1970 FR
2750177 Dec 1997 FR
2942749 Sep 2010 FR
2958696 Oct 2011 FR
2281950 Mar 1995 GB
2000010514 Jan 2000 JP
2001141154 May 2001 JP
2001171554 Jun 2001 JP
2005268004 Sep 2005 JP
2006205918 Aug 2006 JP
2008307938 Dec 2008 JP
2009084844 Apr 2009 JP
2009187789 Aug 2009 JP
2011085174 Apr 2011 JP
2012060791 Mar 2012 JP
2012112533 Jun 2012 JP
20030000251 Jan 2003 KR
9602963 Feb 1996 WO
0055517 Mar 2000 WO
0132454 Nov 2001 WO
2004010011 Jan 2004 WO
2008140659 Nov 2008 WO
2010105354 Sep 2010 WO
2011025606 Mar 2011 WO
2013088447 Jun 2013 WO
2013191622 Dec 2013 WO
Non-Patent Literature Citations (1)
Entry
“Coupling Types—Elastic Averaging.” MIT. Aug. 3, 2012, [online], [retrieved on Nov. 12, 2014]. Retrieved from the Internet <URL:https://web.archive.org/web/20120308055935/http://pergatory.mit.edu/kinematiccouplings/html/about/elastic—averaging.html>.
Related Publications (1)
Number Date Country
20140298640 A1 Oct 2014 US